JP3617283B2 - 半導体装置の製造方法およびこれを用いた半導体装置 - Google Patents

半導体装置の製造方法およびこれを用いた半導体装置 Download PDF

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Publication number
JP3617283B2
JP3617283B2 JP30764197A JP30764197A JP3617283B2 JP 3617283 B2 JP3617283 B2 JP 3617283B2 JP 30764197 A JP30764197 A JP 30764197A JP 30764197 A JP30764197 A JP 30764197A JP 3617283 B2 JP3617283 B2 JP 3617283B2
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Prior art keywords
insulating film
semiconductor device
film
manufacturing
wiring
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Expired - Fee Related
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JP30764197A
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Japanese (ja)
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JPH11145284A (ja
JPH11145284A5 (enExample
Inventor
利昭 長谷川
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Sony Corp
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Sony Corp
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Priority to JP30764197A priority Critical patent/JP3617283B2/ja
Publication of JPH11145284A publication Critical patent/JPH11145284A/ja
Publication of JPH11145284A5 publication Critical patent/JPH11145284A5/ja
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Publication of JP3617283B2 publication Critical patent/JP3617283B2/ja
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP30764197A 1997-11-10 1997-11-10 半導体装置の製造方法およびこれを用いた半導体装置 Expired - Fee Related JP3617283B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30764197A JP3617283B2 (ja) 1997-11-10 1997-11-10 半導体装置の製造方法およびこれを用いた半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30764197A JP3617283B2 (ja) 1997-11-10 1997-11-10 半導体装置の製造方法およびこれを用いた半導体装置

Publications (3)

Publication Number Publication Date
JPH11145284A JPH11145284A (ja) 1999-05-28
JPH11145284A5 JPH11145284A5 (enExample) 2004-12-02
JP3617283B2 true JP3617283B2 (ja) 2005-02-02

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JP30764197A Expired - Fee Related JP3617283B2 (ja) 1997-11-10 1997-11-10 半導体装置の製造方法およびこれを用いた半導体装置

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JP (1) JP3617283B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3769426B2 (ja) 1999-09-22 2006-04-26 東京エレクトロン株式会社 絶縁膜形成装置
KR20010066380A (ko) * 1999-12-31 2001-07-11 박종섭 다층 배선을 갖는 반도체장치의 제조방법
JP3926588B2 (ja) * 2001-07-19 2007-06-06 キヤノンマーケティングジャパン株式会社 半導体装置の製造方法
US6919101B2 (en) * 2003-02-04 2005-07-19 Tegal Corporation Method to deposit an impermeable film on porous low-k dielectric film
JP2009170544A (ja) * 2008-01-11 2009-07-30 Rohm Co Ltd 半導体装置
JP4865829B2 (ja) * 2009-03-31 2012-02-01 シャープ株式会社 半導体装置およびその製造方法
JP2012530362A (ja) * 2009-06-19 2012-11-29 アイメック 金属／有機誘電体界面でのクラックの低減
JP2012213873A (ja) * 2011-03-31 2012-11-08 Fujifilm Corp 撥水膜の形成方法、ノズルプレート、インクジェットヘッド、および、インクジェット記録装置
GB201304611D0 (en) * 2013-03-14 2013-05-01 Univ Surrey A carbon fibre reinforced plastic

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Publication number Publication date
JPH11145284A (ja) 1999-05-28

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