JP2004523128A5
(enrdf_load_stackoverflow )
2005-08-04
RU99110949A
(ru )
2001-03-27
Термоэлектрическое устройство
WO2005057674A3
(en )
2005-11-10
Thermoelectric module with directly bonded heat exchanger
MY122959A
(en )
2006-05-31
Stacked microelectronic packages
JPH0492462A
(ja )
1992-03-25
半導体装置
KR980006184A
(ko )
1998-03-30
반도체 집적회로장치
JP2002110865A5
(enrdf_load_stackoverflow )
2005-06-16
KR920003485A
(ko )
1992-02-29
전력용 반도체 장치
JP2006507688A5
(enrdf_load_stackoverflow )
2009-03-05
US4314270A
(en )
1982-02-02
Hybrid thick film integrated circuit heat dissipating and grounding assembly
JPH10261756A5
(enrdf_load_stackoverflow )
2004-10-21
JPH11135842A5
(enrdf_load_stackoverflow )
2005-08-18
JPH10270506A5
(enrdf_load_stackoverflow )
2005-02-24
SE9900446L
(sv )
2000-08-11
Halvledaranordning med djupa substratkontakter
RU98107842A
(ru )
2000-02-27
Модуль интегральной схемы
JPH077187A
(ja )
1995-01-10
熱電変換装置
JPH01132146A
(ja )
1989-05-24
半導体装置
JP2001015770A5
(enrdf_load_stackoverflow )
2005-03-03
JPS6441054U
(enrdf_load_stackoverflow )
1989-03-10
JPH1065224A
(ja )
1998-03-06
サーモモジュール
RU99105581A
(ru )
2004-05-10
Термоэлектрический модуль
JPH03101256A
(ja )
1991-04-26
半導体装置
JPH01146548U
(enrdf_load_stackoverflow )
1989-10-09
JPS63137961U
(enrdf_load_stackoverflow )
1988-09-12
JPS5575228A
(en )
1980-06-06
Manufacturing pressure-contact-type semiconductor device