JPH1065331A - Chip repairing device and method of repairing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip repairing device and a method of repairing, capable of easily taking off a chip bonded on the substrate. SOLUTION: A chip 3 is bonded on a substrate 1 with bond 2. A pusher 12 are lowered and the both top sides of the chip substrate 1 are pushed, and the undersurface of the substrate 1 is pushed up by a salient 26 and the substrate 1 is bent upward. By this, the bond 2 is taken off from the substrate 1. The nozzle 17 is pushed down and the chip 3 is vacuum chucked and picked up, and taken off from the substrate 1. Desirably, heating makes it possible to easily take the bond 2 off from the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip repair apparatus and a chip repair method for peeling a chip bonded to a substrate from the substrate.

[0002]

2. Description of the Related Art After an electronic component (hereinafter referred to as a chip) is bonded to a substrate by bonding or soldering, product inspection is performed. Then, as a result of the product inspection, a chip determined to be defective due to, for example, a large displacement or a solder bridge is peeled off from the substrate.

FIG. 3 is an explanatory diagram of a conventional chip repair method. A chip 3 is bonded to the upper surface of the substrate 1 by a bond 2. If the chip 3 is defective as a result of the product inspection, the operator holds the spatula 4 in his hand,
By pushing the upper surface of the substrate 1 with the spatula 4 in the direction of the arrow,
The chip 3 and the bond 2 are peeled off from the substrate 1.

[0004]

However, the above-mentioned conventional chip repair method places a considerable labor burden on the operator. In the case where the chip 3 is a weak bare chip cut out of a wafer, when the chip 3 is cut off with a spatula 4, the chip 3 is broken and its fragments are easily scattered around. There has been a problem that the circuit pattern on the upper surface is easily damaged by the spatula 4.

Accordingly, it is an object of the present invention to provide a chip repair apparatus and a chip repair method capable of easily peeling off a chip bonded to a substrate from the substrate.

[0006]

According to the first aspect of the present invention,
A chip repair device for peeling a chip bonded to an upper surface of a substrate from a substrate, comprising: pressing means for pressing an upper surface of a substrate on a side portion of the chip from above; and a lower surface of the substrate at a bonding position of the chip. A push-up unit for bending the substrate by pushing up from below and a pickup unit for performing a vertical operation to pick up a chip from the substrate are provided.

A second aspect of the present invention is a method for repairing a chip for peeling off a chip bonded to the upper surface of the substrate from the substrate, wherein the pressing means presses the upper surface of the substrate on the side of the chip from above. A step of pressing the chip by the attaching means, a step of bending the substrate by pushing up the lower surface of the substrate at the bonding position of the chip by the pushing means, and a step of chucking the chip by the pickup means and picking up the chip from the substrate. .

[0008]

According to the first and second aspects of the present invention, the chip can be easily peeled off the substrate without damaging the chip or the substrate.

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a chip repair device according to an embodiment of the present invention, and FIG. 2 is an explanatory diagram of a chip repair method.

First, the structure of a chip repair device will be described with reference to FIG. A chip 3 is bonded to the upper surface of the substrate 1 by a bond 2. This chip 3 is a weak bare chip cut out from the wafer. Substrate 1
Is clamped and fixed from right and left by a clamper 10. The clamper 10 also serves as a guide rail,
The substrate 1 is transported along a line along a clamper 10.

A pressing means 11 is provided above the substrate 1. The pressing means 11 includes a gate-shaped pressing member 12. The rod 15 of the first cylinder 14 is connected to a tongue 13 extending rearward from the center of the upper surface of the pressing member 12. Rod 1 of first cylinder 14
When 5 is retracted, the pressing member 12 moves up and down. That is, the first cylinder 14 is a means for vertically moving the pressing member 12.

A shaft 16 is inserted into the center of the upper surface of the pressing member 12, and a nozzle 17 is provided at the lower end of the shaft 16. A heater 21 for heating the bond 2 is mounted on the nozzle 17. Shaft 1
Reference numeral 6 denotes a pipe, which is connected to a pneumatic unit 18 through a piping system (not shown). Pneumatic unit 18
Is driven to vacuum suction the inside of the shaft 16, so that the nozzle 17 vacuum chucks the chip 3. Further, the shaft 16 is connected to a rod 20 of a second cylinder 19, and when the rod 20 protrudes and retracts, the shaft 16 and the nozzle 17 move up and down. That is, the second cylinder 19 is a means for vertically moving the nozzle 17. Therefore, the nozzle 3 picks up the chip 3 by vacuum chucking the chip 3 and moving up.
The shaft 16, the nozzle 17, the pneumatic unit 18, the cylinder 19, and the like constitute chip pickup means.

A push-up means 22 is provided below the substrate 1. The push-up means 22 includes a third cylinder 23
And a block 25 coupled to the upper end of the rod 24 of the cylinder 23, and a spherical projection 26 protrudes from the upper surface of the block 25. When the rod 24 of the third cylinder 23 projects, the block 25 rises and pushes the lower surface of the substrate 1 at the bonding position of the chip 3 locally from below. The substrate 1 has elasticity like a glass epoxy substrate, for example.

The chip repair apparatus is configured as described above. Next, a chip repair method will be described with reference to FIG. First, as shown in FIG. 2A, the substrate 1 is positioned between the pressing means 11 and the lifting means 22. Next, as shown in FIG. 2B, the pressing member 12 is lowered to press the upper surface of the substrate 1 on both sides of the chip 3, and the nozzle 17 is lowered to vacuum chuck the upper surface of the chip 3.

Next, as shown in FIG.
Is raised, the substrate 1 is pushed up from below by the spherical projection 26, and the substrate 1 is bent upward to bond the substrate 2 to the substrate 1.
Peeled off. In this case, if the bond 2 is heated by the heater 21 mounted on the nozzle 17, the bond 2 is easily separated from the substrate 1.

Next, as shown in FIG.
Is raised, the chip 3 is picked up by the nozzle 17 and completely peeled off from the substrate 1. Before or after this, the pressing member 12 is raised, and
Is lowered to return to the original position. Thus, the chip repair work is completed.

The present invention is not limited to the above embodiment. For example, a heater for heating the bond 2
It may be built in the block 25 or the projection 26. Further, in the above-described embodiment, an example in which a chip is bonded to a substrate by a bond has been described as an example, but the present invention can also be applied to a device in which a chip is bonded to a substrate by soldering.

[0018]

According to the present invention, a chip can be easily peeled off from a substrate without damaging the chip or the substrate.

[Brief description of the drawings]

FIG. 1 is a perspective view of a chip repair device according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a chip repair method according to an embodiment of the present invention.

FIG. 3 is an explanatory diagram of a conventional chip repair method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Bond 3 Chip 11 Holding means 12 Holding member 14 First cylinder 16 Shaft 17 Nozzle 18 Pneumatic unit 19 Second cylinder 22 Pushing means 23 Third cylinder 25 Block 26 Projection

Claims (2)

[Claims] 1. A chip repair apparatus for peeling off a chip bonded to an upper surface of a substrate from the substrate,
Pressing means for pressing the upper surface of the substrate on the side of the chip from above, pressing means for bending the substrate by lifting the lower surface of the substrate at the bonding position of the chip from below, and performing the up and down operation to move the chip from the substrate. A chip repair device comprising a pickup means for picking up. 2. A chip repair method for peeling a chip bonded to an upper surface of a substrate from the substrate, comprising:
Pressing the upper surface of the substrate on the side of the chip by pressing means from above, pressing the lower surface of the substrate at the bonding position of the chip by pressing means to bend the substrate; Chucking the chip and picking up the chip from the substrate.