KR20050113936A - Apparatus and method for picking up semiconductor die - Google Patents

Abstract

The present invention relates to a semiconductor die pick-up apparatus and method for picking up a semiconductor die. The semiconductor die pick-up apparatus according to the present invention includes a transfer head for picking up a semiconductor die, a collet formed at a lower end of the transfer head to vacuum-suction the semiconductor die, and a heat generating means for heating the transfer head. It is characterized by. In addition, the semiconductor die pick-up method according to the present invention includes a first step in which the adhesive tape is preheated, a second step in which the heated transfer head is picked up, and a semiconductor die vacuum-adsorbed and heated by the collet. And a fourth step of picking up the semiconductor die by the transfer head. According to this, when the adhesive force only on the portion of the adhesive tape to which the semiconductor die to be picked up is locally lost, the semiconductor dies that are not picked up are not disturbed on the adhesive tape, whereby the semiconductor die cannot be picked up by the semiconductor die pickup device. Is prevented from occurring or being contaminated and damaged.

Description

Apparatus and Method for Picking Up Semiconductor Die

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor die pick-up apparatus and method, and more particularly, to a semiconductor die having a sawing process of cutting a wafer to a predetermined size using a semiconductor die pickup apparatus. A semiconductor die pickup apparatus and method for picking up are provided.

In general, a wafer has semiconductor dies that have undergone various processes constituting an integrated circuit arranged vertically and horizontally on the entire surface, and regions having constant axes, called scribe lines, are formed between the semiconductor dies. In the cutting process, a blade cuts through this area.

The cutting process is performed by first cutting the scribe line in one direction of the entire surface of the wafer, and then rotating the wafer chuck on which the wafer is mounted by 90 ° to cut the wafer in the vertical direction again with the cut scribe line. It is a process. At this time, the adhesive tape is attached to the lower surface of the wafer so that the wafer is not disturbed even after being separated into the respective semiconductor dies. In addition, due to the high speed rotation of the blade, contaminants such as high frictional heat and fine cutting debris are generated by friction between the blade and the wafer when cutting the wafer. Water) Cutting water and washing water are sprayed.

When this cutting process is completed, the semiconductor dies separated from the wafer are picked up by the semiconductor die pick-up apparatus for the next process and transferred to the semiconductor apparatus for the later process.

Hereinafter, a semiconductor die pickup method using a semiconductor die pickup apparatus according to the related art will be described with reference to the accompanying drawings.

1A is a configuration diagram schematically illustrating a state in which a semiconductor die pick-up apparatus according to the prior art is moved to an upper portion of a semiconductor die to be picked up, and FIG. 1B is a semiconductor die in a state in which the plunger of the semiconductor die pick-up apparatus according to the prior art is raised. Is a schematic diagram showing a state in which vacuum is sucked by a collet, and FIG. 1C is a schematic diagram showing a state in which a semiconductor die is picked up by a collet while a plunger of a semiconductor die pickup apparatus according to the prior art is returned. to be. 2 is a flowchart illustrating an example of a semiconductor die pickup method according to the related art.

1A, 1B, 1C, and 2, the semiconductor die pick-up apparatus 100 according to the prior art is connected to a driving device to move the semiconductor die 103 sheet by sheet to a process facility for a later process. A transfer head 101 and a collet 102 formed of a rubber material and formed at a lower end of the transfer head 101 to suck the semiconductor die 103 under vacuum.

1A, 1B, and 1C, the semiconductor die 103 is fixed on the vacuum stage 104 with the lower surface bonded to the adhesive tape 108, wherein the adhesive tape 108 used at this time is used. ) Has the property of losing adhesive strength when heated to a predetermined temperature.

In addition, the vacuum stage 104 is connected to a vacuum pump and has a structure in which the air inside is discharged to the outside when the vacuum pump is driven, and includes a plunger 105 having a plurality of plunger pins 106 formed thereon. It is. In addition, a plurality of holes are formed in the upper surface of the vacuum stage 104 to allow the plunger pin 106 to penetrate and the adhesive tape 108 to be vacuum-adsorbed, and a plurality of holes in the lower portion thereof to heat the vacuum stage 104. The heating plate 107 is provided with two UV lamps.

On the other hand, the transfer head 101 has a suction force to adsorb the object as the collet 102 formed at the lower end is connected to the vacuum pump and the air inside is discharged to the outside when the vacuum pump is operated, In order to transfer the adsorbed semiconductor die 103 from the preprocess semiconductor device to the postprocess semiconductor device, the semiconductor die 103 may be driven up, down, left, and right.

Referring to FIG. 2, in the semiconductor die pick-up method using the semiconductor die pick-up apparatus 100 according to the related art having such a configuration, first, a first step in which the adhesive tape 108 attached to the upper surface of the vacuum stage 104 is heated. 201, the second step 202 of moving the upper portion of the semiconductor die 103 from which the transfer head 101 is picked up, and the plunger 105 are raised so that the semiconductor die 103 is vacuumed into the collet 102. A third step 203 to be adsorbed, and a fourth step 204 where the plunger 105 is returned and the semiconductor die 103 is picked up by the transfer head 101.

The first step 201 applies the adhesive force of the adhesive tape 108 so that the semiconductor die 103 adhered to the adhesive tape 108 on the vacuum stage 104 can be separated without damage when separated from the adhesive tape 108. As a step for reducing, first, the UV lamp of the heat generating plate 107 is activated to heat the heat generating plate 107, and the vacuum stage 104 is heated by the conductive heat generated thereby to heat the adhesive tape 108 attached to the upper surface. do. At this time, the heating temperature of the adhesive tape 108 is 120 ° C to 150 ° C, which is a temperature at which the adhesive force is lost depending on the type, and the air inside the vacuum stage 104 is continuously drawn out by the vacuum pump.

1A and 2, the second step 202 is a semiconductor in which the transfer head 101 is picked up to pick up the semiconductor die 103 fixed on the adhesive tape 108 on the top of the vacuum stage 104. The step of moving to a position spaced a predetermined distance from the top of the die 103. At this time, the collet 102 at the bottom of the transfer head 101 is a state in which the internal air is continuously discharged to the outside by the operation of the vacuum pump, the air inside the vacuum stage 104 is continuously drawn out by the vacuum pump It is in a state.

On the other hand, the distance between the transfer head 101 and the semiconductor die 103 in the second step 202 is the plunger 105 to vacuum suction the semiconductor die 103 into the collet 102 in the third step 203. Is a distance at which the semiconductor die 103 is not damaged when the semiconductor die 103 and the collet 102 contact each other.

1B and 2, a third step 203 is performed in which the semiconductor die 103 is moved above the semiconductor die 103 picked up through the second step 202 as the plunger 105 is raised. Contacting the collet 102 of the transfer head 101 is a step of vacuum suction. Here, if the entire lower surface of the semiconductor die 103 is brought into contact with the adhesive tape 108, the semiconductor die 103 is picked up by the transfer head 101 after vacuum adsorption to the collet 102 and the vacuum stage 104. When separated from the adhesive tape 108 on the top, it may be damaged by the adhesive force of the adhesive tape 108 and the vacuum suction force of the vacuum stage 104.

Accordingly, in the third step 203, the plunger 105 is raised to lift the semiconductor die 103 by the plunger pin 104, thereby reducing the contact area between the adhesive tape 108 and the semiconductor die 103. The adhesion of the adhesive tape 108 to the semiconductor die 103 is reduced. In addition, the vacuum suction force on the semiconductor die 103 of the vacuum stage 104 is reduced by being placed at a position spaced apart from the vacuum stage 104 by a predetermined distance. Here, the inside of the vacuum stage 104 is a state where air is continuously drawn out by the vacuum pump.

1C and 2, in a fourth step 204, the plunger 105 is lowered and returned while the semiconductor die 103 is vacuum-adsorbed to the collet 102 in the second step 202. The transfer head 101 is driven up and the semiconductor die 103 is separated from the adhesive tape 108 and picked up.

In the semiconductor die pick-up method according to the prior art having such a configuration, the transfer head 101 heats the entire vacuum stage 104 in order to pick up the semiconductor die 103 from the adhesive tape 108 without damage. The entirety of the adhesive tape 108 is heated by the generated conductive heat.

However, this method reduces the adhesion of all the portions on the adhesive tape 108 such that the semiconductor die 103 is separated from the adhesive tape 108 and scattered on the adhesive tape 108 due to unexpected variables such as inattention of an operator. Therefore, a semiconductor die 103 may be generated that cannot be picked up from the transfer head 101 which automatically picks up the semiconductor die 103 according to the positional coordinates of the semiconductor die 103. Can be generated.

In addition, there may occur a case where the semiconductor die 103 is separated from the adhesive tape 108 and falls onto the vacuum stage 104 when the plunger 105 is driven up, and the semiconductor die 103 itself and Micro cracks and damage may be generated inside the semiconductor die 103. This may further lead to product defects when the damaged semiconductor die 103 is commercialized.

Accordingly, the present invention does not lose the adhesive force of the entire portion of the adhesive tape when the semiconductor die is separated from the adhesive tape, but only locally reduces the adhesive force of the adhesive tape portion adhering the semiconductor die to be picked up. In providing.

The present invention provides a semiconductor die pickup device for picking up a plurality of semiconductor dies fixed to an adhesive tape on a vacuum stage provided with a heating plate by using a vacuum suction force, a transfer head connected to a driving device and driven up, down, left and right, and a transfer head. It is characterized in that it comprises a collet which is formed at the bottom to vacuum suction the semiconductor die, and the heat generating means coupled to the transfer head to heat the transfer head.

On the other hand, the semiconductor die pick-up method according to the present invention for achieving the above object using a semiconductor die pick-up apparatus for picking up a plurality of semiconductor die fixed to the adhesive tape on the vacuum stage with a heating plate using the vacuum suction force of the transfer head A semiconductor die pick-up method, comprising: a first step in which an adhesive tape is preheated to a predetermined temperature, a second step in which a transfer head heated above a predetermined temperature is moved above the semiconductor die to be picked up, and the semiconductor die is a lower end of the transfer head And a fourth step of vacuum adsorption and heating on the collet formed in the second step, and a fourth step in which the semiconductor die is separated from the adhesive tape and picked up by the drive of the transfer head.

In the semiconductor die pick-up method according to the present invention, the transfer head heating temperature is a temperature at which the adhesive force of the adhesive tape is lost, and preferably 120 ° C to 150 ° C depending on the type of the adhesive tape.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

3A is a configuration diagram schematically illustrating a state in which a transfer head of a semiconductor die pick-up apparatus according to the present invention is moved to an upper portion of a semiconductor die, and FIG. 3B illustrates a contact between the transfer head and the semiconductor die of the semiconductor die pick-up apparatus according to the present invention. Fig. 3B is a block diagram schematically showing a state in which a vacuum die is picked up by a transfer head of a semiconductor die pick-up apparatus according to the present invention.

3A, 3B, and 3C, the semiconductor die pick-up apparatus 10 according to the present invention is driven up, down, left and right, and a transfer head 1 for picking up the semiconductor die 3, and a semiconductor die 3. ) Is a collet (2) for vacuum adsorption, and heat generating means (9) for heating the transfer head (1).

Transfer head 1 has a collet (2) formed at the bottom is connected to the vacuum pump has a vacuum suction force that can suck the object by the air inside is discharged to the outside. Accordingly, the transfer head 1 picks up the semiconductor die 3 fixed by the adhesive tape 8 on the vacuum stage 4 by using the vacuum suction force of the collet 2, and then transfers it to the semiconductor device for later processing. It plays a role. Here, the transfer head 1 moves the semiconductor dies 3 by sheet while the positions of the semiconductor dies 3 are moved along the path of the input control program. On the other hand, the semiconductor die 3 is placed on the upper surface of the vacuum stage 4 in a state in which the lower surface is adhered to the adhesive tape 8, and is fixed. The semiconductor die 3 is manufactured through a wafer cutting process. In addition, the adhesive tape 8 has a property that the adhesive force is lost at a temperature of 120 ℃ to 150 ℃ depending on the type, the vacuum stage 4 is by the heating plate 7 with a plurality of UV lamps formed at the bottom It is a structure to be heated.

The collet 2 is connected to the vacuum pump and formed at the bottom of the transfer head 1 so that the semiconductor die 3 is vacuum-adsorbed by the vacuum suction force when the transfer head 1 picks up the semiconductor die. Here, the collet 2 is a material that does not cause scratches on the semiconductor die 3 when it is in contact with the semiconductor die 3, and it is preferable to use a material having high heat conduction efficiency.

The heat generating means 9 has a cylindrical shape in which a hole having a predetermined size is formed at the center thereof, and the transfer head 1 is inserted into and fixed to the hole to be coupled with the transfer head 1 so that the transfer head 1 vacuums the semiconductor die 3. When it is separated from the adhesive tape 8 after adsorption, it serves to lose the adhesive force of the adhesive tape 8 so that the semiconductor die 3 is not damaged by the adhesive force of the adhesive tape 8. Here, it is preferable that the heat generating means 9 is a heat generating element which generates heat by applying a voltage.

On the other hand, the heating means 9 will be described for the principle of losing the adhesive force of the adhesive tape 8, first the voltage is applied to the heat generating means 9 is the heating means 9 is lost the adhesive force of the adhesive tape 8 The temperature is raised, and the heat generated therefrom is transferred to the transfer head 1 coupled with the heat generating means 9 and then to the semiconductor die 3 in contact with the collet 2 of the transfer head 9. Therefore, the semiconductor die 3 picked up by the conductive heat generated by the heat generating means 9 is heated, and the portion of the adhesive tape 8 to which the semiconductor die 3 is bonded is heated, and the adhesive force of this portion is lost. Will be.

The semiconductor die pick-up method according to the present invention will be described by taking the case of using the semiconductor die pick-up apparatus 10 according to the present invention having such a configuration as an example.

4 is a flowchart illustrating a semiconductor die pickup method according to the present invention.

Referring to FIG. 4, the semiconductor die pick-up method according to the present invention includes a first step 301 in which the adhesive tape 8 is preheated to a predetermined temperature, and a transfer head 1 is placed on the semiconductor die 3 to be picked up. The second step 302 being moved, the third step 303 where the semiconductor die 3 is vacuum adsorbed and heated to a collet formed at the bottom of the transfer head 1, and the semiconductor die 3 is transferred A fourth step 304 is picked up and separated from the adhesive tape 8 by the drive of the head 1.

3A and 4, the first step 301 is a step in which the vacuum stage 4 is preheated to a predetermined temperature through conductive heat transferred from the heating plate 7 in advance. At this time, the preheating temperature is a temperature at which the semiconductor dies 3 are easily separated and are not disturbed. Here, the adhesive tape 8 is vacuum-adsorbed on the vacuum stage 4, and the semiconductor dies 3 are in a state where the entire rear surface of the semiconductor die 3 is adhered on the adhesive tape 8.

3A and 4, the second step 302 is a step in which the transfer head 1 is moved above the semiconductor die 3 to be picked up by the drive of the driving device. At this time, the vacuum pump connected to the collet 2 is operated so that the air inside the collet 1 is continuously discharged to the outside, whereby the collet generates a vacuum suction force capable of vacuum suction of the object. Here, the transfer head 1 is heated by the heat generating means 9 surrounding the outer circumferential surface, the adhesive tape 8 is vacuum adsorbed on the vacuum stage 4, and the semiconductor dies 3 are bonded The entire back surface is adhered on the tape 8.

3B and 4, in a third step 303, the heated transfer head 1 is lowered by the driving device so that the semiconductor die 3 is in contact with the collet 2, whereby the semiconductor die 3 is connected. Is a step of vacuum adsorption and heating by the vacuum suction force in the collet (2). At this time, the semiconductor die 3 is heated by the conduction heat transmitted from the transfer head 1 heated by the heat generating means 1, whereby the adhesive tape 8 at the portion where the semiconductor die 3 is bonded is Adhesion will be lost. Here, the adhesive tape 8 is vacuum-adsorbed on the vacuum stage 4, and the semiconductor dies 3 which are not in contact with the collet 2 are adhered to the entire rear surface of the adhesive tape 8 with the adhesive force. It is in a state.

Referring to FIGS. 3C and 4, the fourth step 304 includes a third step 303 as the semiconductor die 3 vacuum-adsorbed to the collet 2 is driven upward by the transfer head 1 by the driving device. In this step, the semiconductor die 3 is separated and picked up from the adhesive tape 8 whose adhesive force is lost. Here, the adhesive tape 8 is in a vacuum suction state on the vacuum stage 4.

Accordingly, the semiconductor die pick-up apparatus 10 and the method according to the present invention stress the semiconductor die 3 due to the adhesive force of the adhesive tape 8 when the semiconductor die 3 is separated from the adhesive tape 8 and picked up. Unlike the prior art in which the vacuum stage 4 is heated to prevent it from being applied so that all parts on the adhesive tape 8 are lost, the semiconductor die picked up by the conduction heat generated using the heating device 9. By heating (3), only the portion to which the heated semiconductor die 3 on the adhesive tape 8 is adhered is locally heated so that the adhesive force is lost.

Therefore, the semiconductor die pick-up apparatus 10 and the method according to the present invention adhere to the semiconductor die 3 due to unexpected variables such as inadvertent operator's carelessness when the entire adhesive tape 8 is heated and the adhesive force of the entire region is lost. The case where the semiconductor die 3, which is separated from the tape 8 and is disturbed, is prevented from being picked up from the transfer head 1 does not occur.

In addition, the semiconductor die pick-up method according to the present invention stresses the semiconductor die 103 by the adhesive force of the adhesive tape 108 when the semiconductor die 103 is picked up in the semiconductor die pick-up method according to the prior art as shown in FIG. 1B. The driving step of the plunger 105, which was necessary to reduce the adhesive area on the adhesive tape 108 of the semiconductor die 103 so as not to be applied, is omitted.

Accordingly, the semiconductor die 103 on the plunger pin 106 is separated from the adhesive tape 108 by vacuum weakening of the adhesive tape 108 on the plunger pin 106 when the plunger 105 is driven up. Falling to the unpicked semiconductor die 103 on the stage 104 prevents contamination or damage of the semiconductor die 103.

As described above, the semiconductor die pick-up apparatus and method according to the present invention loses the adhesive force of the adhesive tape to which the semiconductor die picked up during the semiconductor die pick-up, thereby preventing stress from being applied to the semiconductor die by the adhesive force of the adhesive tape. This prevents the occurrence of micro cracks or damage inside the semiconductor die.

In addition, by locally losing only the adhesive force only on the portion of the adhesive tape to which the semiconductor die picked up by the heat generating means is bonded, the unpicked semiconductor die generated when the adhesive force on the entire surface of the adhesive tape is lost is lost to the adhesive force on the adhesive tape. It is not disturbed or caused to fail to be picked up from the semiconductor die pickup device.

Therefore, the semiconductor die pick-up apparatus and method according to the present invention allows the semiconductor die to be picked up without damaging the semiconductor die, thereby preventing the occurrence of product defects due to the production of the damaged semiconductor die, thereby reducing the product defect rate and producing efficiency. Is increased.

In particular, the semiconductor die pick-up apparatus and method according to the present invention show a greater effect when picking up a thin die that is applied to a very thin package or a multi chip package (MCP).

1A is a schematic view showing a state in which a semiconductor die pick-up apparatus according to the prior art is moved above a semiconductor die to be picked up;

1B is a schematic view showing a state in which a semiconductor die is vacuum-adsorbed by a collet in a state where a plunger of a semiconductor die pickup device according to the related art is raised;

1C is a schematic view showing a state in which a semiconductor die is picked up by a collet in a state in which a plunger of a semiconductor die pickup apparatus according to the prior art is returned;

2 is a flow chart illustrating a semiconductor die pickup method according to the prior art.

3A is a schematic view showing a state in which a transfer head of a semiconductor die pick-up apparatus according to the present invention is moved above a semiconductor die.

3B is a schematic view showing a state in which the transfer head and the semiconductor die of the semiconductor die pick-up apparatus according to the present invention are contacted and vacuum-adsorbed.

3B is a schematic view showing a state in which a transfer head of a semiconductor die pick-up apparatus according to the present invention picks up a semiconductor die;

4 is a flow chart illustrating a semiconductor die pickup method in accordance with the present invention.

<Explanation of symbols for the main parts of the drawings>

1, 101: transfer head 2, 102: collet

3, 103: semiconductor die 4, 104: vacuum stage

7, 107: heating plate 8, 108: adhesive tape

9: heating means 10, 100: semiconductor die pick-up apparatus

105: plunger 106: plunger pin

Claims (3)

A semiconductor die pick-up apparatus for picking up a plurality of semiconductor dies fixed to an adhesive tape on a vacuum stage provided with a heating plate by using a vacuum suction force, A transfer head connected to a driving device to move the semiconductor dies and driven up, down, left and right; A collet formed under the transfer head and connected to a vacuum pump to vacuum suck the semiconductor die; And And heat generating means coupled to the transfer head to heat the transfer head. A semiconductor die pick-up method using a semiconductor die pick-up apparatus for picking up a plurality of semiconductor dies fixed to an adhesive tape on a vacuum stage provided with a heating plate by using a vacuum suction force of a transfer head, A first step of preheating the adhesive tape to a predetermined temperature; A second step in which the transfer head heated above the predetermined temperature is moved by heat generating means coupled to an upper portion of the semiconductor die to be picked up; A third step in which the semiconductor die is vacuum adsorbed and heated to a collet formed at a lower end of the transfer head; And And a fourth step in which the semiconductor die is separated from the adhesive tape and picked up by the drive of the transfer head. The method of claim 2, wherein the transfer head heating temperature is a temperature at which the adhesive force of the adhesive tape is lost, and is 120 ° C. to 150 ° C. according to the type of the adhesive tape.