JP6450633B2 - Foreign matter detection method, foreign matter detection device and peeling device - Google Patents

Description

  The disclosed embodiment relates to a foreign matter detection method, a foreign matter detection device, and a peeling device.

  In recent years, for example, in semiconductor device manufacturing processes, semiconductor substrates such as silicon wafers and compound semiconductor wafers have become larger and thinner. A large-diameter and thin semiconductor substrate may be warped or cracked during transportation or polishing. For this reason, after a support substrate is bonded to a semiconductor substrate and reinforced, a transport and polishing process for a TSV (Through-silicon via) process is performed, and then a process of peeling the support substrate from the semiconductor substrate is performed. .

  For example, in Patent Document 1, the first holding unit is used to hold the semiconductor substrate, the second holding unit is used to hold the support substrate, and the second holding unit is moved away from the semiconductor substrate. A technique for peeling a support substrate from a semiconductor substrate is disclosed.

  Here, as the first holding unit for holding the semiconductor substrate, for example, an adsorption holding unit such as a porous chuck is used.

JP 2014-165281 A

  However, when the semiconductor substrate is adsorbed to the adsorption holding unit, if foreign matter adheres to the holding surface of the adsorption holding unit, the foreign substance may cause stress on the semiconductor substrate and cause a defect such as a crack.

  Note that the above-described problem is not limited to the case where the support substrate is peeled off from the semiconductor substrate, but may be a problem that may occur when the semiconductor substrate is held by the suction holding unit in the semiconductor manufacturing apparatus.

  An object of one embodiment of the present invention is to provide a foreign matter detection method, a foreign matter detection device, and a peeling device that can detect foreign matter attached to a holding surface of a suction holding portion.

  A foreign matter detection method according to an aspect of an embodiment includes a light projecting step and a light receiving step. In the light projecting step, light is irradiated from an oblique direction to the holding surface of the suction holding unit that holds the substrate by suction. In the light receiving step, the reflected light of the light applied to the holding surface is received from an oblique direction with respect to the holding surface.

  According to one aspect of the embodiment, foreign matter attached to the holding surface of the suction holding unit can be detected.

FIG. 1 is a schematic side view showing the configuration of the foreign matter removing apparatus according to the first embodiment. FIG. 2 is a schematic plan view showing the configuration of the foreign matter removing apparatus according to the first embodiment. FIG. 3 is a schematic side view illustrating the configuration of the detection unit. FIG. 4 is a schematic enlarged view of a portion H shown in FIG. FIG. 5 is a schematic cross-sectional view showing the configuration of the removal unit. FIG. 6 is a schematic diagram illustrating a configuration of a device connected to the removal unit. FIG. 7 is a flowchart showing a processing procedure of foreign matter removal processing executed by the foreign matter removing apparatus. FIG. 8 is an explanatory diagram of the foreign object detection method according to the second embodiment. FIG. 9 is an explanatory diagram of a modified example of the foreign object detection processing according to the second embodiment. FIG. 10 is an explanatory diagram of a modified example of the foreign object detection processing according to the second embodiment. FIG. 11 is a flowchart showing the processing procedure of the initial image acquisition processing. FIG. 12 is a flowchart illustrating a processing procedure of foreign object detection processing according to the modification. FIG. 13 is a schematic cross-sectional view illustrating a configuration of a removing unit according to the fourth embodiment. FIG. 14 is a schematic side view showing the configuration of the foreign matter removing apparatus according to the fifth embodiment. FIG. 15 is a schematic cross-sectional view showing the configuration of the pre-suction unit. FIG. 16 is a schematic plan view showing the configuration of the peeling apparatus according to the sixth embodiment. FIG. 17 is a schematic side view of a superposed substrate held on a dicing frame. FIG. 18 is a schematic side view showing the configuration of the peeling apparatus according to the seventh embodiment. FIG. 19 is a schematic side view showing the configuration of the peeling apparatus according to the seventh embodiment. FIG. 20 is a diagram illustrating an operation example of the foreign object detection processing according to the seventh embodiment. FIG. 21 is a diagram illustrating an operation example of the foreign object detection processing according to the seventh embodiment. FIG. 22 is a diagram illustrating an operation example of the foreign object detection processing according to the seventh embodiment.

  Hereinafter, embodiments of a foreign matter detection method, a foreign matter detection device, and a peeling device disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

(First embodiment)
<Overall configuration of foreign matter removing apparatus>
First, the overall configuration of the foreign matter removing apparatus according to the first embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic side view showing the configuration of the foreign matter removing apparatus according to the first embodiment. FIG. 2 is a schematic plan view showing the configuration of the foreign matter removing apparatus according to the first embodiment. In the following, in order to clarify the positional relationship, the X-axis direction, the Y-axis direction, and the Z-axis direction that are orthogonal to each other are defined, and the positive direction of the Z-axis is the vertically upward direction.

  A foreign matter removing apparatus 70 shown in FIG. 1 detects and removes foreign matter adhering to a holding surface of a suction holding unit 80 that sucks and holds a semiconductor substrate (hereinafter simply referred to as “substrate”).

  The suction holding unit 80 is, for example, a porous chuck, and includes a main body unit 81, a support member 82, and a rotation mechanism 83.

  The main body 81 includes a suction pad 81a. The suction pad 81a has a diameter that is the same as or slightly larger than that of the substrate, and contacts the substantially entire lower surface of the substrate. The suction pad 81a is formed of a porous body such as silicon carbide, porous ceramic, or porous Teflon (registered trademark).

  A suction space 81b that communicates with the outside via a suction pad 81a is formed inside the main body 81. The suction space 81 b is connected to an intake device 85 such as a vacuum pump via an intake pipe 84. The suction holding unit 80 uses the negative pressure generated by the suction of the suction device 85 to suck the substrate to the suction pad 81a.

  The support member 82 is a member extending in the vertical direction, and supports the main body 81 at the tip. The rotation mechanism 83 rotates the column member 82 around the vertical axis. Thereby, the main-body part 81 supported by the support | pillar member 82 rotates integrally.

  The foreign matter removing apparatus 70 includes a detection unit 71 that detects foreign matter on the suction pad 81a and a removal unit 72 that removes foreign matter on the suction pad 81a.

  As shown in FIG. 2, the removing unit 72 includes an ejection unit 721 and a suction unit 722. The ejection unit 721 ejects fluid from the ejection port 723 to the suction pad 81 a of the suction holding unit 80. The suction unit 722 is disposed adjacent to the ejection unit 721 and sucks the fluid ejected from the ejection unit 721 from the suction port 724. Specific configurations of the detection unit 71 and the removal unit 72 will be described later.

  Further, the foreign matter removing device 70 includes a support member 74, a moving mechanism 75, a support member 76, and a rotary lifting mechanism 77. The support member 74 extends along the horizontal direction and supports the detection unit 71 and the removal unit 72 from above.

  The moving mechanism 75 is provided, for example, at the base end portion of the support member 74, and linearly moves the detection unit 71 and the removal unit 72 along a rail (not shown) provided on the support member 74.

  The support member 76 extends along the vertical direction and supports the moving mechanism 75 at the tip. The rotary elevating mechanism 77 rotates the column member 76 around the vertical axis. Moreover, the rotation raising / lowering mechanism 77 raises / lowers the support | pillar member 76 along a perpendicular direction.

  The foreign substance removing device 70 and the suction holding unit 80 are connected to the control device 60. The control device 60 is, for example, a computer and includes a control unit 61 and a storage unit 62. The storage unit 62 stores a program for controlling various processes executed in the foreign substance removing device 70 and the suction holding unit 80. The control unit 61 is, for example, a CPU (Central Processing Unit), and controls the operations of the foreign matter removing device 70 and the suction holding unit 80 by reading and executing a program stored in the storage unit 62.

  Note that such a program may be recorded on a computer-readable storage medium and may be installed in the storage unit 62 of the control device 60 from the storage medium. Examples of the computer-readable storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card. The control unit 61 may be configured only by hardware without using a program.

<Configuration of detection unit>
Next, the structure of the detection part 71 with which the foreign material removal apparatus 70 is provided is demonstrated with reference to FIG. 3 and FIG. FIG. 3 is a schematic side view showing the configuration of the detection unit 71. FIG. 4 is a schematic enlarged view of a portion H shown in FIG.

  As shown in FIG. 3, the detection unit 71 includes a light projecting unit 711 and a light receiving unit 712. The detecting unit 71 is supported by the support member 74 (see FIG. 1) in a state where the light projecting unit 711 and the light receiving unit 712 are inclined at a predetermined angle with respect to the surface of the suction pad 81a.

  The light projecting unit 711 irradiates the surface of the suction pad 81a from an oblique direction. As the light projecting unit 711, for example, ring illumination can be used. The light projecting unit 711 as ring illumination includes a plurality of light emitting elements arranged in a ring around the lens 712 a included in the light receiving unit 712. By using such a light projecting unit 711, the detection target area can be illuminated uniformly.

  The light receiving unit 712 is, for example, a CCD (Charge Coupled Device) camera. The light receiving unit 712 is supported in a state where the optical axis of the lens 712a is inclined at a predetermined angle with respect to the suction pad 81a, and the reflected light of the light irradiated to the suction pad 81a is inclined with respect to the suction pad 81a. By receiving light from the direction, the target area on the suction pad 81a is imaged. An image captured by the light receiving unit 712 is output to the control unit 61. And the control part 61 detects the foreign material which exists on the suction pad 81a based on the captured image acquired from the light-receiving part 712. FIG.

  Here, as shown in FIG. 4, the suction pad 81 a is a porous body, and thus has a large number of voids V. Therefore, when light is irradiated from a direction perpendicular to the suction pad 81a, the light is irregularly reflected by the gap V, and is likely to be noise during image analysis. Further, when an image is taken from a direction perpendicular to the suction pad 81a, the foreign matter P is picked up in a plane, and therefore it is difficult to determine whether the foreign matter P is a porous structure of the suction pad 81a. As described above, it is difficult to accurately detect the foreign matter P present on the suction pad 81a which is a porous body by projection and imaging from a direction perpendicular to the suction pad 81a.

  On the other hand, since the detection unit 71 according to the first embodiment irradiates the suction pad 81a with light from an oblique direction, irregular reflection due to the gap V can be reduced. In addition, since the detection unit 71 according to the first embodiment captures an image from the oblique direction with respect to the suction pad 81a, the foreign matter P existing with a predetermined height on the suction pad 81a is perforated by the suction pad 81a. It becomes easy to distinguish it from the quality structure.

  Therefore, according to the detection unit 71 according to the first embodiment, it is possible to accurately detect the foreign matter P present on the suction pad 81a that is a porous body. In addition, it is preferable that the inclination angle with respect to the suction pad 81a of the light projection part 711 and the light-receiving part 712 is 45 degrees or less.

<Configuration of removal unit>
Next, the configuration of the removing unit 72 will be described with reference to FIG. FIG. 5 is a schematic cross-sectional view showing the configuration of the removal unit 72. As shown in FIG. 5, the removing unit 72 includes an ejection unit 721 that ejects fluid to the suction pad 81 a and an aspiration unit 722 that attracts fluid ejected from the ejection unit 721.

  Here, as a method of removing the foreign matter P from the suction pad 81a, a method of sucking out the foreign matter P using a suction force is conceivable. However, when the foreign matter P has a strong adhesive force, the removal is difficult. Although a method of blowing off the foreign matter P by injecting gas is also conceivable, there is a risk that the surroundings may be contaminated or reattached to the suction pad 81a by blowing off the foreign matter P to the surroundings, both of which have high removal efficiency. I couldn't say that.

  Therefore, the removal unit 72 according to the first embodiment removes the foreign matter P on the suction pad 81a by a synergistic effect of the force of the fluid ejected from the ejection unit 721 and the suction force by the suction unit 722. did.

  Specifically, in the removal unit 72 according to the first embodiment, the ejection unit 721 and the suction unit 722 are disposed adjacent to each other. Thereby, the flow from the ejection part 721 to the suction part 722 can be formed. With this flow, it is possible to simultaneously apply a force pushing the foreign substance P from the side and a force sucking upward. Therefore, the foreign matter P can be strongly removed from the suction pad 81a. Further, although the ejection part 721 alone may blow off the foreign matter P around, the suction part 722 prevents the foreign matter P removed from the suction pad 81a from being blown away around by sucking the foreign matter P. You can also.

  Moreover, since the suction pad 81a is porous, the fluid ejected from the ejection part 721 may enter the gap V, and a flow from the lower side of the foreign matter P toward the suction part 722 may be formed. In this case, the foreign matter P can be more strongly removed from the suction pad 81a.

  The ejection port 723 of the ejection part 721 and the suction port 724 of the suction part 722 have a slit shape extending along the moving direction of the removal part 72 (see FIG. 2). Moreover, the opening area (slit width L1) of the suction port 724 is formed larger than the opening area (slit width L2) of the ejection port 723. With such a configuration, it is possible to prevent the foreign matter P from being clogged in the suction port 724 while increasing the flow rate of the fluid ejected from the ejection port 723. Note that the flow rate of the fluid ejected by the ejection unit 721 and the fluid flow rate of the fluid sucked by the suction unit 722 are the same.

  When the maximum height dimension of the foreign matter P is assumed to be 300 μm, the slit width L1 of the suction port 724 is set to about 2 mm, for example, and the slit width L2 of the ejection port 723 is set to about 0.5 to 1 mm, for example. . In addition, a distance L3 between the ejection port 723 and the suction port 724 is set to about 1 mm, for example.

  Moreover, it is preferable that the gap G1 between the ejection port 723 and the suction port 724 and the suction pad 81a is larger than the assumed maximum height dimension of the foreign matter P. When the maximum height dimension of the foreign matter P is assumed to be 300 μm, the gap G1 is set to about 300 μm to 2 mm, for example. The gap between the suction pad 81a and the detection unit 71 is set larger than the gap G1.

  Here, an example in which the ejection port 723 and the suction port 724 have a slit shape is shown; however, the ejection port 723 and the suction port 724 do not necessarily have a slit shape. For example, the ejection port 723 and the suction port 724 may be configured by a plurality of continuous holes. In this case, the diameter of the hole formed as the suction port 724 is preferably larger than the maximum dimension of the foreign matter P.

  Next, the configuration of the device connected to the removal unit 72 will be described with reference to FIG. FIG. 6 is a schematic diagram illustrating a configuration of a device connected to the removal unit 72.

  As shown in FIG. 6, a fluid supply pipe 41 is connected to the ejection portion 721, and a gas supply source 42 that supplies a gas such as dry air or N 2 gas is supplied to the fluid supply pipe 41 and a gas supply source 42. And a static elimination unit 43 such as an ionizer that ionizes the gas to be ionized. The fluid supply pipe 41 is provided with an opening / closing valve 44 and a flow rate adjusting unit (not shown).

  A branch pipe 45 is connected to the middle of the fluid supply pipe 41. The branch pipe 45 is a liquid such as pure water, alcohol, or an organic solvent (for example, adhesive for bonding substrates such as P-menthane). A liquid supply source 46 is connected. Further, the branch pipe 45 is provided with an opening / closing valve 47 and a flow rate adjusting unit (not shown).

  As described above, the gas supply source 42 and the liquid supply source 46 are connected to the ejection portion 721. And the ejection part 721 can selectively eject gas or a liquid with respect to the adsorption pad 81a, when the control part 61 controls the on-off valves 44 and 47 and the flow volume adjustment part which is not shown in figure.

  In the case of the foreign matter P that is solid and has a weak adhesion, it can be sufficiently removed using gas. In addition, the removal efficiency of the charged foreign matter P can be improved by ionizing the gas by the charge removal unit 43.

  On the other hand, in the case of the foreign matter P having strong adhesion, it is preferable to use a liquid. Since the specific gravity of the liquid is higher than that of the gas, the removal force accompanying the lateral flow to the foreign matter P can be greatly increased. In particular, in the case of the suction pad 81a that is a porous body, the liquid that soaks into the suction pad 81a covers the lower surface of the foreign matter P, so that the suction force by the suction part 722 can be directly applied to the foreign matter P via the liquid. The removal power of the foreign matter P can be improved. Further, if a highly volatile liquid such as alcohol or IPA is used, the suction pad 81a can be immediately dried.

  A suction pipe 51 is connected to the suction part 722, and a trap tank 52 is connected to the suction pipe 51. A discharge pipe 53 is connected to the trap tank 52, and an open / close valve 54 is provided in the discharge pipe 53. A suction pipe 55 is connected to the trap tank 52, and a suction mechanism 56 such as a vacuum pump is connected to the suction pipe 55. The suction part 722 is configured as described above, and the foreign matter P and liquid sucked by the suction part 722 are collected in the trap tank 52 and discharged from the discharge pipe 53.

<Specific operation of foreign matter removing apparatus>
Next, a specific operation of the foreign matter removing apparatus 70 will be described with reference to FIG. FIG. 7 is a flowchart showing a processing procedure of foreign matter removal processing executed by the foreign matter removing device 70. Each processing procedure shown in FIG. 7 is executed by the control unit 61 controlling the foreign matter removing device 70 and the suction holding unit 80.

  As shown in FIG. 7, the control unit 61 controls the rotation mechanism 83 of the suction holding unit 80 to rotate the main body 81 of the suction holding unit 80 (step S101). Subsequently, the control unit 61 controls the rotation elevating mechanism 77 of the foreign matter removing device 70 to position the detecting unit 71 and the removing unit 72 on the outer peripheral portion of the suction pad 81a. Further, the control unit 61 adjusts the height of the support member 74 by controlling the rotary lifting mechanism 77 so that the distance from the suction pad 81a to the removal unit 72 becomes the gap G1 (see FIG. 5). And the control part 61 controls the moving mechanism 75, and starts the movement (scan) of the detection part 71 and the removal part 72 from the outer peripheral part of the suction pad 81a to the center part (step S102). The detection unit 71 is disposed on the front side of the removal unit 72 in the scanning direction in step S102.

  As described above, the detection unit 71 and the removal unit 72 are moved from the outer peripheral portion of the suction pad 81a toward the central portion while rotating the main body portion 81 of the suction holding portion 80, thereby sucking the detection and removal of the foreign matter P. It can be performed on the entire surface of the pad 81a. Further, by performing the detection and removal of the foreign matter P in parallel, the processing time required for the detection and removal of the foreign matter P can be shortened.

  As shown in FIG. 2, in the removing unit 72, the ejection unit 721 and the suction unit 722 are arranged side by side in a direction orthogonal to the moving direction by the moving mechanism 75. And as for the removal part 72, the suction part 722 is arrange | positioned ahead of the ejection part 721 with respect to the rotation direction of the suction pad 81a. With this arrangement, the rotational force of the suction pad 81a is added to the force of the flow from the ejection portion 721 to the suction portion 722 (the flow from the upper side to the lower side in FIG. 2). The foreign matter P on the suction pad 81a can be removed more effectively. Note that the processing of steps S101 and S102 may be started simultaneously.

  Subsequently, the control unit 61 determines whether or not the detection unit 71 has detected a foreign substance P having a size equal to or larger than the gap G1 (see FIG. 5) (step S103). And when it determines with having detected the foreign material P which has a dimension more than the gap G1 (step S103, Yes), the control part 61 controls the moving mechanism 75, and stops the scanning of the detection part 71 and the removal part 72. (Step S104). Thereby, it is possible to prevent the removing unit 72 from colliding with the foreign matter P.

  Note that the control unit 61 may raise the removal unit 72 when it is determined that the foreign matter P having a dimension equal to or larger than the gap G1 has been detected. Accordingly, the foreign matter P can be removed by the remover 72 while preventing the collision between the remover 72 and the foreign matter P. Moreover, the control part 61 may generate an alarm.

  On the other hand, when the foreign substance P having a dimension equal to or larger than the gap G1 is not detected (step S103, No), the control unit 61 determines whether or not the detection unit 71 and the removal unit 72 have reached the center of the suction pad 81a. Determination is made (step S105). In this determination, when the detection unit 71 and the removal unit 72 have not reached the central portion of the suction pad 81a (No at Step S105), the control unit 61 determines that the detection unit 71 and the removal unit 72 are the central portion of the suction pad 81a. Steps S103 to S105 are repeated until reaching.

  If the control unit 61 determines that the detection unit 71 and the removal unit 72 have reached the center of the suction pad 81a (Yes in step S105), the detection of the foreign matter P on the entire surface of the suction pad 81a detected by the detection unit 71. The result is acquired as “initial foreign matter information” (step S106), and the obtained initial foreign matter information is stored in the storage unit 62.

  Subsequently, the control unit 61 controls the moving mechanism 75 to move (back scan) the detection unit 71 and the removal unit 72 from the central portion of the suction pad 81a toward the outer peripheral portion (step S107). In this way, the foreign matter removing apparatus 70 detects and removes the foreign matter P in both the forward path and the backward path by reciprocating the detection unit 71 and the removal unit 72 between the outer peripheral portion and the central portion of the suction pad 81a. .

  Here, when moving the detection unit 71 and the removal unit 72 (scanning and backscanning), the control unit 61 changes the moving speed of the detection unit 71 and the removal unit 72 according to the position on the suction pad 81a. Also good. Specifically, the control unit 61 controls the moving mechanism 75 so that the moving speed of the detecting unit 71 and the removing unit 72 in the central part of the suction holding unit 80 is faster than the moving speed of the outer peripheral part of the suction holding unit 80. May be. Thereby, the range in which the detection unit 71 and the removal unit 72 detect and remove the foreign matter P per unit time can be made uniform, and the time required for the foreign matter removal processing can be shortened.

  Moreover, the control part 61 may change the moving speed of the detection part 71 and the removal part 72 based on the initial foreign material information acquired in step S106. For example, based on the initial foreign matter information, the control unit 61 may slow down the moving speed of the detection unit 71 and the removal unit 72 in a region where the foreign matter P is present on the suction pad 81a.

  In addition, although the example in the case of reciprocating the detection part 71 and the removal part 72 was shown here, after the control part 61 arrange | positions the detection part 71 and the removal part 72 in the center part of the suction pad 81a, it adsorb | sucks. Only the movement of the pad 81a from the central portion to the outer peripheral portion may be performed. Further, the control unit 61 may move the detection unit 71 and the removal unit 72 from one end of the outer peripheral portion of the suction pad 81a toward the other end.

  As described above, the ejection port 723 of the ejection unit 721 and the suction port 724 of the suction unit 722 have a slit shape extending along the moving direction of the removal unit 72 (see FIG. 2). For this reason, the time required for the processing of steps S102 to S107 can be shortened.

  Subsequently, when the detection unit 71 and the removal unit 72 reach the outer periphery of the suction pad 81a, the control unit 61 acquires the detection result of the foreign matter P at the time of back scan as “post-removal foreign matter information” (step S108). And the control part 61 determines whether a foreign material residue exists based on the foreign material information after removal (step S109). For example, when the foreign matter P having a predetermined size or more remains on the suction pad 81a, it is determined that there is a foreign matter residue.

  If the controller 61 determines that there is a foreign substance residue (Yes in step S109), the control unit 61 returns the process to step S102 and repeats the processes in steps S102 to S109.

  Here, the control unit 61 causes the first reciprocal movement while ejecting the “gas” from the ejection unit 721, and when it is determined in step S109 that there is a foreign substance residue, the “liquid” is ejected from the ejection unit 721. The second reciprocation may be performed while jetting. As a result, the foreign matter P that could not be removed in the first reciprocation can be strongly removed by the liquid having a stronger removing force than the gas.

  When the detection unit 71 and the removal unit 72 are reciprocated, the control unit 61 may eject gas from the ejection unit 721 toward the suction pad 81a in the forward path and eject liquid in the return path. Thereby, the foreign matter P that could not be removed in the forward path can be strongly removed by the liquid having a stronger removing power than gas in the return path.

  Further, the control unit 61 may eject liquid from the ejection unit 721 to the suction pad 81a in the forward path and eject gas in the return path. In this way, by supplying the gas in the return path, the liquid supplied on the suction pad 81a in the forward path can be quickly dried.

  When no foreign substance residue is present in the determination in step S109 (No in step S109) or when the process in step S104 is completed, the control unit 61 controls the rotation mechanism 83 to rotate the main body 81 of the suction holding unit 80. It stops (step S110), and a series of foreign matter removal processing is completed.

  As described above, the foreign substance removal apparatus 70 according to the first embodiment includes the detection unit 71, the removal unit 72, and the moving mechanism 75. The detection unit 71 detects the foreign matter P attached to the surface of the suction pad 81a included in the suction holding unit 80. The removing unit 72 removes the foreign matter P adhering to the surface of the suction pad 81a using a fluid. The moving mechanism 75 moves the detection unit 71 and the removal unit 72.

  Further, the removing unit 72 (corresponding to an example of the “foreign substance removing device”) according to the first embodiment includes a jetting unit 721 and a suction unit 722. The ejection part 721 ejects fluid to the surface of the suction pad 81a provided in the suction holding part 80. The suction part 722 is disposed adjacent to the ejection part 721 and sucks fluid.

  The detection unit 71 according to the first embodiment (corresponding to an example of a “foreign matter detection device”) includes a light projecting unit 711 and a light receiving unit 712. The light projecting unit 711 irradiates light on the surface of the suction pad 81 a included in the suction holding unit 80 from an oblique direction. The light receiving unit 712 receives the reflected light of the light applied to the surface of the suction pad 81a from an oblique direction with respect to the surface of the suction pad 81a.

  Therefore, according to the foreign matter detection apparatus 70 according to the first embodiment, the foreign matter P adhering to the surface of the suction pad 81a can be detected and removed, thereby preventing the substrate from being damaged due to the presence of the foreign matter P. Can be prevented.

  Further, according to the foreign matter detection device 70 according to the first embodiment, the foreign matter P on the entire surface of the suction pad 81a is moved by moving the detection portion 71 and the removal portion 72 while rotating the main body portion 81 of the suction holding portion 80. Can be detected and removed in a short time.

(Second Embodiment)
Next, a foreign object detection method according to the second embodiment will be described with reference to FIG. FIG. 8 is an explanatory diagram of the foreign object detection method according to the second embodiment.

  As shown in FIG. 8, the foreign matter detection device 70 may perform the foreign matter removal processing shown in FIG. 7 after placing the film FL on the suction pad 81a and sucking the film FL with the suction pad 81a. .

  By covering the suction pad 81a, which is a porous body, with the film FL, irregular reflection of light due to the gap V can be suppressed.

  Further, the upper surface of the film FL has a gentle curved surface with respect to the irregular foreign material. Thereby, since the high reflection area | region with respect to the light irradiated from diagonally by the light projection part 711 increases, the contrast of a captured image can be improved and the detection precision of the foreign material P can be improved.

  For the film FL, the thickness and elastic modulus can be selected according to the size of the foreign matter P to be detected. For example, in the case of a foreign substance P that is smaller than the gap V of the suction pad 81a and is buried in the gap V and has a size that does not affect the substrate, the thickness of the film FL is set to a predetermined thickness or the elastic modulus of the film FL is By setting it to a predetermined value or more, the rise of the film FL due to the foreign matter P can be made substantially zero. Accordingly, the foreign matter P having a size that does not affect the substrate can be excluded from the detection target by the detection unit 71.

  As such a film FL, for example, a resin film is preferably used. The material of the resin film is preferably a material capable of obtaining metal contamination, low dust generation, and film thickness uniformity. For example, a material such as a dicing tape or a back grind tape can be selected.

  Moreover, it is preferable that the film FL is provided with a highly reflective coating. By using the film FL on which the highly reflective coating is applied, the contrast of the captured image can be further improved. As the film FL, for example, a film having a surface coated with a metal film such as Si, Al, or W can be used. As the metal coating, it is preferable to use a metal coating that has an elongation that does not break against deformation of the film FL and that has high adhesion.

  Further, as the film FL, a metal foil film such as an Al foil, a Si single crystal film, or the like can be used. These are effective when it is desired to detect a fine foreign substance P (for example, 10 μm or less).

  The film FL is preferably attached to a dicing frame. Thereby, film FL can be easily conveyed using a substrate conveyance device. In this case, the film FL is preferably stored in, for example, an apparatus in which the suction holding unit 80 is accommodated.

  When the film FL is used, even when light is applied perpendicularly to the suction pad 81a, a strong contrast is produced at the boundary between the surface without the foreign matter P and the surface with the foreign matter P. Detection accuracy can be improved.

  Next, a modified example of the foreign object detection process using the above-described film FL will be described with reference to FIGS. 9 and 10 are explanatory diagrams of a modified example of the foreign object detection processing according to the second embodiment.

  As illustrated in FIG. 9, the detection unit 71 </ b> A includes a light projecting unit 714 and a light receiving unit 715. The light projecting unit 714 irradiates the film FL on the suction pad 81a with light from an oblique direction. The light receiving unit 715 receives reflected light of the light irradiated to the film FL from an oblique direction with respect to the film FL.

  The light receiving unit 715 receives reflected light reflected from the film FL when it is assumed that no foreign matter P exists within the light irradiation range of the film FL (see FIG. 9), and the light irradiation range of the film FL. When it is assumed that a foreign material P having a predetermined shape is present, it is arranged at a position where it does not receive the reflected light reflected from the film FL (see FIG. 10). By arranging the light receiving portion 715 at such a position, the foreign matter P can be detected.

(Third embodiment)
Next, a foreign object detection method according to the third embodiment will be described with reference to FIGS. FIG. 11 is a flowchart showing the processing procedure of the initial image acquisition processing. FIG. 12 is a flowchart illustrating a processing procedure of foreign object detection processing according to the modification.

  As shown in FIG. 11, the control unit 61 first scans the entire surface of the suction pad 81a on which no foreign matter P exists, and detects the porous structure and surface roughness information of the suction pad 81a as an initial image. Process to get as.

  Specifically, as shown in FIG. 11, the control unit 61 scans the detection unit 71 over the entire surface of the suction pad 81a (step S201) and acquires a captured image (step S202). Subsequently, the control unit 61 determines whether or not the foreign matter P is present on the suction pad 81a based on the acquired captured image (step S203). When the foreign matter P does not exist (No at Step S203), the control unit 61 stores the captured image acquired at Step S202 in the storage unit 62 as an initial image (Step S204).

  In addition, when it determines with the foreign material P existing in step S203 (step S203, Yes), the control part 61 does not memorize | store a captured image. In this case, for example, after removing the foreign matter P on the suction pad 81a using the removal unit 72, the control unit 61 may execute the processes of steps S201 to S204 again.

  Subsequently, the control unit 61 performs a foreign object detection process using the initial image acquired by the initial image acquisition process. Specifically, the control unit 61 scans the detection unit 71 over the entire surface of the suction pad 81a (step S301), and acquires a captured image (step S302). Subsequently, the control unit 61 determines whether or not there is a change from the initial image in the captured image acquired in step S302 based on the difference between the captured image acquired in step S302 and the initial image acquired in the initial image acquisition process. Is determined (step S303).

  And when it determines with having changed from the initial image (step S303, Yes), the control part 61 determines with the foreign material P existing on the suction pad 81a (step S304). On the other hand, when there is no change from the initial image (step S303, No), the control unit 61 determines that there is no foreign matter P on the suction pad 81a (step S305).

  Thus, by comparing the captured image acquired in step S302 with the initial image, noise due to the porous structure and surface roughness of the suction pad 81a is removed, so that the foreign matter P can be detected with high accuracy.

  Note that the initial image acquisition process shown in FIG. 11 is preferably performed periodically. This is because the surface shape of the suction pad 81a changes with time, and it is possible to stabilize the foreign object detection process by periodically performing the initial image acquisition process and updating the initial image.

  Further, the film FL may be used in the initial image acquisition process. For example, after the film FL is attracted to the suction pad 81a, the detection unit 71 is scanned, and it is determined whether or not the foreign matter P exists based on the acquired captured image. And when it determines with the foreign material P not existing, the film FL may be removed, the detection part 71 may be scanned again, and the acquired captured image may be memorize | stored in the memory | storage part 62 as an initial image.

(Fourth embodiment)
Next, the structure of the removal part which concerns on 4th Embodiment is demonstrated with reference to FIG. FIG. 13 is a schematic cross-sectional view illustrating a configuration of a removing unit according to the fourth embodiment.

  As illustrated in FIG. 13, the removing unit 72A according to the fourth embodiment includes a jetting unit 721A and a suction unit 722. The configuration of the suction unit 722 is the same as that of the suction unit 722 according to the first embodiment described above.

  The ejection portion 721A according to the fourth embodiment ejects fluid in an oblique direction near the suction portion 722 with respect to the suction pad 81a.

  Thus, since the flow velocity between the ejection portion 721A and the suction portion 722 can be increased by inclining the ejection port 723A of the ejection portion 721A toward the suction port 724 of the suction portion 722, the removal efficiency of the foreign matter P can be increased. Can be improved. Moreover, since the fluid which leaks from the ejection part 721A to the opposite side of the suction part 722 can be reduced, the rolling-up of the foreign matter P can be suppressed.

(Fifth embodiment)
Next, a foreign matter removing apparatus 70B according to a fifth embodiment will be described with reference to FIGS. FIG. 14 is a schematic side view showing the configuration of the foreign matter removing apparatus according to the fifth embodiment. FIG. 15 is a schematic cross-sectional view showing the configuration of the pre-suction unit.

  As shown in FIG. 14, the foreign matter removing apparatus 70 </ b> B according to the fifth embodiment further includes a pre-suction unit 73. The pre-suction unit 73 sucks the fluid in the same manner as the suction unit 722 included in the removal unit 72. The pre-suction unit 73 is disposed on the front side in the traveling direction from the detection unit 71 and the removal unit 72 in the forward path of the reciprocating movement of the detection unit 71, the removal unit 72, and the pre-suction unit 73 by the moving mechanism 75.

  As shown in FIG. 15, a suction tube 731 is connected to the pre-suction unit 73, and a suction mechanism 732 such as a vacuum pump is connected to the suction tube 731. The suction pipe 731 is provided with an opening / closing valve 733 and a flow rate adjusting unit (not shown).

  The suction port 734 included in the pre-suction unit 73 is provided at a position farther from the suction pad 81 a than the ejection port 723 included in the ejection unit 721 of the removal unit 72 and the suction port 724 included in the suction unit 722. That is, the gap G2 between the suction pad 81a and the pre-suction part 73 is set larger than the gap G1 between the suction pad 81a and the removal part 72. The opening diameter L4 of the suction port 734 of the pre-suction unit 73 is formed larger than the slit width L1 of the suction port 724 of the suction unit 722.

  As a result, the foreign matter removing apparatus 70B according to the fifth exemplary embodiment uses the pre-suction portion 73 to preliminarily remove the foreign matter P having an unexpected size even when the foreign matter P having a size exceeding the gap G1 exists. It is possible to prevent the removal portion 72 from colliding with the foreign matter P by removing the surface.

(Sixth embodiment)
Next, the structure of a peeling apparatus provided with the foreign material removal apparatus mentioned above is demonstrated with reference to FIG. 16 and FIG. FIG. 16 is a schematic plan view showing the configuration of the peeling apparatus according to the sixth embodiment. FIG. 17 is a schematic side view of the superposed substrate held by the dicing frame. Here, as an example, an example in which the peeling device includes the foreign matter removing device 70 according to the first embodiment is shown.

  As shown in FIG. 16, the foreign matter removing device 70 is provided in the peeling device 5. The peeling apparatus 5 peels the superposed substrate T (see FIG. 17) in which the substrate to be processed W and the support substrate S are bonded with the adhesive G to the substrate to be processed W and the support substrate S.

  In the following, as shown in FIG. 17, among the plate surfaces of the substrate to be processed W, the plate surface on the side bonded to the support substrate S via the adhesive G is referred to as a “bonding surface Wj”. Is referred to as the “non-bonding surface Wn”. In addition, among the plate surfaces of the support substrate S, the plate surface on the side bonded to the substrate W to be processed via the adhesive G is referred to as “bonding surface Sj”, and the plate surface on the opposite side to the bonding surface Sj is referred to as “ This is referred to as “non-joint surface Sn”.

  The substrate W to be processed is a substrate in which a plurality of electronic circuits are formed on a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, and a plate surface on the side where the electronic circuits are formed is used as a bonding surface Wj. Further, the target substrate W is thinned by polishing the non-joint surface Wn, for example. Specifically, the thickness of the substrate W to be processed is about 20 to 200 μm.

  On the other hand, the support substrate S is a substrate having substantially the same diameter as the substrate W to be processed, and supports the substrate W to be processed. The thickness of the support substrate S is about 650 to 750 μm. As this support substrate S, a glass substrate etc. other than a silicon wafer can be used. Moreover, the thickness of the adhesive G which joins these to-be-processed substrate W and the support substrate S is about 40-150 micrometers.

  As described above, the substrate W to be processed is very thin and easily damaged, and thus is further protected by the dicing frame F. The dicing frame F is a substantially rectangular member having an opening having a diameter larger than that of the superposed substrate T in the center. As shown in FIG. 17, the superposed substrate T is held by the dicing frame F with the substrate W to be processed positioned on the lower surface and the support substrate S positioned on the upper surface.

  As shown in FIG. 16, the peeling device 5 includes a processing unit 100. A loading / unloading port (not shown) is formed on the side surface of the processing unit 100, and through this loading / unloading port, the superposed substrate T is loaded into the processing unit 100, and the target substrate W and the support substrate S after peeling are removed. Unloading from the processing unit 100 is performed.

  The peeling device 5 includes a first holding unit 110, a frame holding unit 120, a lower base unit 130, a rotary lifting mechanism 140, a second holding unit 150, and an upper base unit 160. These are arranged inside the processing unit 100.

  The first holding unit 110 is a suction holding unit such as a porous chuck, similar to the suction holding unit 80 described above, and a dicing tape in which the substrate to be processed W constituting the superposition substrate T is provided in the opening of the dicing frame F. It is adsorbed and held through.

  The first holding unit 110 includes a disk-shaped main body 111 and a support member 112 that supports the main body 111. The support member 112 is supported by the lower base portion 130.

  The main body 111 is made of a metal member such as aluminum. A suction pad 111 a is provided on the upper surface of the main body 111. The suction pad 111a has the same or slightly larger diameter as the superposed substrate T, and comes into contact with the lower surface of the superposed substrate T, that is, substantially the entire non-joint surface Wn of the substrate W to be processed.

  A suction space 111b that communicates with the outside through a suction pad 111a is formed inside the main body 111. The suction space 111b is connected to an intake device 114 such as a vacuum pump via an intake pipe 113.

  The first holding unit 110 uses the negative pressure generated by the intake air of the intake device 114 to adsorb the non-joint surface Wn of the substrate to be processed W to the adsorption pad 111a via the dicing tape. As a result, the first holding unit 110 holds the substrate W to be processed. In addition, although the example in case the 1st holding | maintenance part 110 is a porous chuck | zipper was shown here, the 1st holding | maintenance part may be an electrostatic chuck etc., for example.

  A frame holding unit 120 that holds the dicing frame F from below is disposed outside the first holding unit 110. The frame holding unit 120 is fixed to the plurality of suction pads 121 for holding the dicing frame F by suction, the support member 122 for supporting the suction pad 121, and the lower base portion 130, and the support member 122 is moved along the vertical direction. And a moving mechanism 123 for moving.

  The lower base part 130 is disposed below the first holding part 110 and the frame holding part 120 and supports the first holding part 110 and the frame holding part 120. The lower base portion 130 is supported by a rotary lifting mechanism 140 fixed to the floor surface of the processing unit 100.

  The rotation elevating mechanism 140 rotates the lower base portion 130 around the vertical axis. Thereby, the 1st holding | maintenance part 110 and the frame holding | maintenance part 120 which were supported by the lower side base part 130 rotate integrally. Further, the rotary lifting mechanism 140 moves the lower base portion 130 in the vertical direction. Thereby, the 1st holding | maintenance part 110 and the flame | frame holding part 120 supported by the lower side base part 130 raise / lower integrally.

  Above the first holding unit 110, the second holding unit 150 is disposed to face the first holding unit 110. The second holding unit 150 includes a first suction moving unit 190 and a second suction moving unit 200. The first suction moving unit 190 and the second suction moving unit 200 are supported by the upper base unit 160. The upper base portion 160 is supported by the fixing member 101 attached to the ceiling portion of the processing unit 100 via the support column 102.

  The first suction moving unit 190 sucks and holds the peripheral portion of the support substrate S. Further, the second suction moving unit 200 sucks and holds a region closer to the center portion of the support substrate S than the peripheral portion of the support substrate S. Then, the first suction moving unit 190 and the second suction moving unit 200 move the sucked and held regions independently from each other in the direction away from the plate surface of the substrate W to be processed.

  The first suction moving unit 190 includes a first suction pad 191, a support member 192, and a moving mechanism 193. The second suction moving unit 200 includes a second suction pad 201, a support member 202, and a moving mechanism 203.

  The first suction pad 191 and the second suction pad 201 are formed with air inlets (not shown), and the air inlets 195 such as a vacuum pump are connected to the respective air inlets through the intake pipes 194 and 204. 205 is connected.

  The support members 192 and 202 support the first suction pad 191 and the second suction pad 201 at the tip portion. The base ends of the support members 192 and 202 are supported by the moving mechanisms 193 and 203. The moving mechanisms 193 and 203 are fixed to the upper part of the upper base portion 160 and move the column members 192 and 202 in the vertical direction.

  The first suction moving unit 190 and the second suction moving unit 200 suck the support substrate S by using the negative pressure generated by the suction of the suction devices 195 and 205. Thereby, the first suction moving unit 190 and the second suction moving unit 200 hold the support substrate S. The first suction pad 191 included in the first suction moving unit 190 sucks the peripheral portion of the support substrate S, and the second suction pad 201 included in the second suction moving unit 200 sucks the center portion of the support substrate S. To do.

  In addition, the first suction moving unit 190 and the second suction moving unit 200 hold the support substrate S, and the support members 192 and 202, the first suction pad 191 and the second suction pad 201 are moved by the moving mechanisms 193 and 203, respectively. Is moved along the vertical direction. Thereby, the support substrate S is moved along the vertical direction.

  Further, the peeling device 5 includes a control device 90. The control device 90 is a device that controls the operation of the peeling device 5. The control device 90 is, for example, a PC, and includes a control unit 91 and a storage unit 92. The storage unit 92 is realized by, for example, a semiconductor memory element such as a RAM or a flash memory. The storage unit 92 stores a program for controlling various processes such as a peeling process. The control unit 91 is, for example, a CPU, and controls the operation of the peeling device 5 by reading and executing a program stored in the storage unit 92.

  In the state in which the separation substrate 5 sucks and holds the substrate W to be processed by the first holding unit 110, sucks and holds the dicing frame F by the frame holding unit 120, and holds the support substrate S by the second holding unit 150. By sequentially moving the first suction moving unit 190 and the second suction moving unit 200 of the holding unit 150 upward, the support substrate S is pulled in a direction away from the target substrate W. As a result, the support substrate S is continuously peeled from the substrate W to be processed from the peripheral edge toward the center.

  Note that the peeling device 5 is configured so that a portion that causes the support substrate S to be peeled off from the substrate to be processed W by a sharp member (not shown) before moving the first suction moving unit 190 and the second suction moving unit 200. You may form in a side surface.

  The peeling device 5 includes a foreign matter removing device 70. The foreign substance removing device 70 is disposed on the side of the first holding unit 110 in the processing unit 100. The foreign matter removing device 70 detects and removes the foreign matter P present on the suction pad 111a of the first holding unit 110. Since the target substrate W held by the first holding unit 110 of the peeling apparatus 5 is thinned, when the foreign matter P exists in the first holding unit 110, the target substrate W has a defect such as a crack. May occur. On the other hand, the peeling device 5 detects that the foreign matter P existing on the suction pad 111a of the first holding unit 110 is detected and removed using the foreign matter removing device 70, so that a defect occurs in the substrate W to be processed. Can be prevented.

  In the first to sixth embodiments described above, the holding surface of the suction holding unit 80 or the first holding unit 110 faces upward, and the detection unit 71 and the removal unit 72 are arranged above the holding surface. However, the holding surface of the suction holding unit 80 or the first holding unit 110 faces downward, and the detection unit 71 and the removal unit 72 may be arranged below the holding surface. .

(Seventh embodiment)
Next, another configuration example of the peeling apparatus including the foreign matter removing apparatus will be described with reference to FIGS. 18 and 19 are schematic side views showing the configuration of the peeling apparatus according to the seventh embodiment.

  As shown in FIG. 18, the peeling apparatus 3 according to the seventh embodiment has a housing 300 that houses a plurality of devices therein. The housing 300 has a loading / unloading port (not shown), and an opening / closing shutter (not shown) is provided at each loading / unloading port.

  An exhaust port 301 for exhausting the internal atmosphere is formed on the bottom surface of the housing 300. An exhaust pipe 303 communicating with an exhaust device 302 such as a vacuum pump is connected to the exhaust port 301. Then, by exhausting the atmosphere inside the housing 300 from the exhaust port 301, an air flow is generated inside the housing 300 that is referred to as a downflow and is directed downward in the vertical direction.

  Inside the housing 300, a first holding unit 310 that holds the substrate W to be sucked and held on the lower surface, and a second holding unit 311 that places and holds the support substrate S on the upper surface are provided. The first holding unit 310 is provided above the second holding unit 311 and is disposed to face the second holding unit 311. That is, in the housing 300, the peeling process is performed on the superposed substrate T in a state where the substrate to be processed W is disposed on the upper side and the support substrate S is disposed on the lower side.

  The first holding unit 310 is a suction holding unit such as a porous chuck, like the suction holding unit 80 described above. The first holding part 310 has a flat body part 320. A suction pad 321 is provided on the lower surface side of the main body 320. The suction pad 321 has, for example, substantially the same diameter as the substrate to be processed W, and comes into contact with the non-joint surface Wn of the substrate to be processed W.

  A suction space 322 is formed inside the main body 320 and above the suction pad 321. The suction space 322 is formed so as to cover the suction pad 321, for example. A suction tube 323 is connected to the suction space 322. The suction pipe 323 is connected to a negative pressure generator (not shown) such as a vacuum pump. Then, the non-joint surface Wn of the substrate to be processed W is sucked from the suction pipe 323 through the suction space 322 and the suction pad 321, and the substrate to be processed W is sucked and held by the first holding unit 310.

  A heating mechanism 324 that heats the substrate W to be processed is provided inside the main body 320 and above the suction space 322. For the heating mechanism 324, for example, a heater is used.

  A support plate 330 that supports the first holding unit 310 is provided on the upper surface of the first holding unit 310. The support plate 330 is supported on the ceiling surface of the housing 300. Note that the first holding unit 310 may be supported in contact with the ceiling surface of the housing 300.

  A suction tube 340 for sucking and holding the support substrate S is provided inside the second holding unit 311. The suction pipe 340 is connected to a negative pressure generator (not shown) such as a vacuum pump.

  A heating mechanism 341 for heating the support substrate S is provided inside the second holding unit 311. For the heating mechanism 341, for example, a heater is used.

  Below the second holding unit 311, a moving mechanism 350 that moves the second holding unit 311 and the support substrate S in the vertical direction and the horizontal direction is provided. The moving mechanism 350 includes a vertical moving unit 351 that moves the second holding unit 311 in the vertical direction and a horizontal moving unit 352 that moves the second holding unit 311 in the horizontal direction.

  The vertical moving unit 351 includes a support plate 360 that supports the lower surface of the second holding unit 311, a drive unit 361 that moves the support plate 360 up and down, and a support member 362 that supports the support plate 360. The drive unit 361 includes, for example, a ball screw (not shown) and a motor (not shown) that rotates the ball screw. The support member 362 is configured to be extendable in the vertical direction, and is provided at, for example, three locations between the support plate 360 and a support body 371 described later.

  The horizontal moving unit 352 includes a rail 370 extending in the horizontal direction, a support 371 attached to the rail 370, and a drive unit 372 that moves the support 371 along the rail 370. The drive unit 372 includes, for example, a ball screw (not shown) and a motor (not shown) that rotates the ball screw.

  In addition, below the 2nd holding | maintenance part 311, the raising / lowering pin (not shown) for supporting and raising / lowering the superposition | polymerization board | substrate T or the support substrate S from the downward direction is provided. The elevating pin is inserted through a through hole (not shown) formed in the second holding portion 311 and can protrude from the upper surface of the second holding portion 311.

  The peeling apparatus 3 is configured as described above, and the substrate to be processed W and the support are supported by shifting the overlapped substrate T along the bonding surface between the substrate to be processed W and the support substrate S while heating the overlapped substrate T. Peel to substrate S.

  Specifically, the superposed substrate T carried into the peeling device 3 is adsorbed and held by the second holding unit 311. Thereafter, the second holding unit 311 is raised by the moving mechanism 350, and the superposed substrate T is sandwiched and held by the first holding unit 310 and the second holding unit 311. At this time, the non-bonding surface Wn of the substrate to be processed W is sucked and held by the first holding unit 310, and the non-bonding surface Sn of the support substrate S is sucked and held by the second holding unit 311.

  Thereafter, the superposed substrate T is heated to a predetermined temperature, for example, 200 ° C. by the heating mechanisms 324 and 341. If it does so, the adhesive agent G in the superposition | polymerization board | substrate T will soften.

  Subsequently, while the polymerization substrate T is heated by the heating mechanisms 324 and 341 and the softened state of the adhesive G is maintained, the second holding unit 311 and the support substrate S are moved vertically and horizontally, that is, obliquely downward, by the moving mechanism 350. Move to. Then, the target substrate W held by the first holding unit 310 and the support substrate S held by the second holding unit 311 are peeled off.

  Further, the peeling device 3 includes a control device 95. The control device 95 is a device that controls the operation of the peeling device 3. The control device 95 is a PC, for example, and includes a control unit 96 and a storage unit 97. The storage unit 97 is realized by, for example, a semiconductor memory element such as a RAM or a flash memory. The storage unit 97 stores a program for controlling various processes such as a peeling process. The control unit 96 is, for example, a CPU, and controls the operation of the peeling apparatus 3 by reading and executing a program stored in the storage unit 97.

  The foreign matter removing device 70 </ b> C according to the seventh embodiment is provided, for example, on the support plate 360. As shown in FIG. 19, the foreign matter removing apparatus 70 </ b> C includes a detection unit 71, a removal unit 72, a support member 74, and a moving mechanism 75. The moving mechanism 75 is provided on the support plate 360. In addition, the support member 74 extends in a direction (X-axis direction) orthogonal to the moving direction (Y-axis direction) by the horizontal moving unit 352. The detection unit 71 and the removal unit 72 are supported from below by the support member 74.

  Next, a foreign object detection process using the foreign object removal apparatus 70C according to the seventh embodiment will be described with reference to FIGS. 20 to 22 are diagrams illustrating an operation example of the foreign object detection processing according to the seventh embodiment. 20 to 22 are schematic diagrams when the first holding unit 310 is viewed from below.

  As shown in FIGS. 20 to 22, the control unit 96 scans the detection unit 71 and the removal unit 72 over the entire surface of the suction pad 321 using the horizontal movement unit 352 and the movement mechanism 75.

  First, the control unit 96 adjusts the height of the support plate 360 by controlling the vertical movement unit 351 so that the distance from the suction pad 321 to the removal unit 72 becomes a predetermined gap. Subsequently, as illustrated in FIG. 20, the control unit 96 positions the detection unit 71 and the removal unit 72 on the outer periphery of the suction pad 321, and then controls the moving mechanism 75 to detect the detection unit 71 and the removal unit 72. Is moved in a direction orthogonal to the moving direction by the horizontal moving unit 352. As a result, the foreign matter P is detected and removed from a part of the suction pad 321.

  Subsequently, as shown in FIG. 21, the control unit 96 controls the horizontal moving unit 352 to move the suction pad 321 by a predetermined distance in the Y-axis positive direction. Then, as shown in FIG. 22, the control unit 96 controls the moving mechanism 75 to move the detection unit 71 and the removal unit 72 again in a direction orthogonal to the moving direction by the horizontal moving unit 352. The controller 96 can detect and remove the foreign matter P from the entire surface of the suction pad 321 by repeating these processes.

  In this way, a foreign matter detection device may be provided for the peeling devices 3 and 5 for peeling the superposed substrate T, which is the substrate to be processed W and the support substrate S, bonded to the substrate to be processed W and the support substrate S.

(Other embodiments)
In each embodiment mentioned above, the example in the case of moving the detection part 71 and the removal part 72 using the moving mechanism 75 was demonstrated. However, the present invention is not limited to this, and if the detection unit 71 and the removal unit 72 are longer than the diameters of the suction pads 81a and 111a, the rotation mechanism 83 or the removal unit 72 can be moved without moving the detection unit 71 and the removal unit 72. By rotating the suction pads 81a and 111a using the rotary elevating mechanism 140, the foreign matter P can be detected and removed from the entire surface of the suction pads 81a and 111a.

  In the sixth and seventh embodiments described above, an example in which the foreign matter removing device is provided in the peeling device has been described. However, the foreign matter removing device is not limited to the peeling device, and may be a porous chuck, an electrostatic chuck, or the like. You may provide in various semiconductor devices provided with an adsorption holding part. For example, the foreign substance removing device may be provided in a cleaning device that cleans a semiconductor substrate, a mounter that attaches a dicing frame to the semiconductor substrate, an inspection device that inspects the surface of the semiconductor substrate, a dicing device that cuts the semiconductor substrate into chips, and the like. Good.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

P Foreign matter V Gap FL film 70 Foreign matter removing device 71 Detection portion 72 Removal portion 73 Pre-suction portion 74 Support member 75 Moving mechanism 76 Supporting member 77 Rotating lift mechanism 80 Suction holding portion 81 Main body portion 81a Suction pad 82 Supporting member 83 Rotating mechanism 711 Light projecting unit 712 Light receiving unit 721 Ejecting unit 722 Suction unit

Claims (10)

An adsorption process for adsorbing a film to a holding surface of an adsorption holding unit for adsorbing and holding a substrate ;
A light projecting step of irradiating light from an oblique direction to the film adsorbed on the holding surface ;
And a light receiving step of receiving reflected light of the light irradiated to the film from an oblique direction with respect to the holding surface. The film is
The foreign matter detection method according to claim 1 , wherein the film has a highly reflective coating. The light receiving step includes
It is performed using a light receiving unit that receives reflected light of light irradiated to the film from an oblique direction with respect to the holding surface,
The light receiving unit is
When it is assumed that no foreign matter exists within the light irradiation range of the holding surface, the reflected light reflected from the film is received, and a predetermined shape of foreign matter exists within the light irradiation range of the holding surface. then foreign object detecting method according to claim 1 or 2, characterized in that it is arranged the light reflected from the film assuming the position not received. The light receiving step is a step of imaging the holding surface,
An acquisition step of acquiring an initial image of the holding surface;
2. A detection step of detecting a foreign matter attached to the holding surface based on a difference between the captured image captured by the light receiving step and the initial image acquired by the acquisition step. The foreign object detection method as described in any one of -3. The suction holding unit is
Foreign substance detecting method according to any one of claims 1-4, characterized in that the holding surface is porous. A light projecting unit that irradiates light from an oblique direction to the film adsorbed on the holding surface of the adsorption holding unit that adsorbs and holds the substrate;
A foreign matter detection apparatus comprising: a light receiving unit that receives reflected light of light irradiated to the film from an oblique direction with respect to the holding surface. The light receiving unit is
When it is assumed that no foreign matter exists within the light irradiation range of the holding surface, the reflected light reflected from the film is received, and a predetermined shape of foreign matter exists within the light irradiation range of the holding surface. The foreign object detection device according to claim 6 , wherein the foreign object detection device is disposed at a position where the reflected light reflected from the film is not received when it is assumed. The light projecting unit is
The foreign object detection device according to claim 6 , further comprising a plurality of light emitting elements arranged in a ring around the light receiving unit. A moving mechanism for moving the light projecting unit and the light receiving unit in a horizontal direction;
By controlling the moving mechanism, according to claim, characterized in that toward the one of the outer peripheral portion and the central portion of the holding surface which rotates to the other and a light projecting unit and the control unit for moving the light receiving section 6 foreign substance detecting device according to any one of 1-8. A peeling apparatus for peeling a superposed substrate having a substrate to be processed and a support substrate bonded to the substrate to be processed and the support substrate,
A first holding unit that holds the substrate to be processed among the superposed substrates;
A second holding unit for adsorbing and holding the support substrate among the superposed substrates;
A foreign matter detection device for detecting foreign matter adhering to the holding surface of the first holding portion,
The foreign object detection device includes:
A light projecting unit that irradiates light from an oblique direction to the film adsorbed on the holding surface of the first holding unit;
A peeling device comprising: a light receiving portion that receives reflected light of the light irradiated to the film from an oblique direction with respect to the holding surface.

Images