JPH1050584A - マスク保持装置 - Google Patents

マスク保持装置

Info

Publication number
JPH1050584A
JPH1050584A JP8208023A JP20802396A JPH1050584A JP H1050584 A JPH1050584 A JP H1050584A JP 8208023 A JP8208023 A JP 8208023A JP 20802396 A JP20802396 A JP 20802396A JP H1050584 A JPH1050584 A JP H1050584A
Authority
JP
Japan
Prior art keywords
mask
holding
mask holding
holding device
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP8208023A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1050584A5 (enExample
Inventor
Noriyuki Hirayanagi
徳行 平柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP8208023A priority Critical patent/JPH1050584A/ja
Priority to US08/908,529 priority patent/US5847813A/en
Publication of JPH1050584A publication Critical patent/JPH1050584A/ja
Publication of JPH1050584A5 publication Critical patent/JPH1050584A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electron Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP8208023A 1996-08-07 1996-08-07 マスク保持装置 Withdrawn JPH1050584A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP8208023A JPH1050584A (ja) 1996-08-07 1996-08-07 マスク保持装置
US08/908,529 US5847813A (en) 1996-08-07 1997-08-07 Mask holder for microlithography exposure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8208023A JPH1050584A (ja) 1996-08-07 1996-08-07 マスク保持装置

Publications (2)

Publication Number Publication Date
JPH1050584A true JPH1050584A (ja) 1998-02-20
JPH1050584A5 JPH1050584A5 (enExample) 2004-08-12

Family

ID=16549401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8208023A Withdrawn JPH1050584A (ja) 1996-08-07 1996-08-07 マスク保持装置

Country Status (2)

Country Link
US (1) US5847813A (enExample)
JP (1) JPH1050584A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6433346B1 (en) 1999-10-19 2002-08-13 Nikon Corporation Electrostatic reticle chucks, charged-particle-beam microlithography apparatus and methods, and semiconductor-device manufacturing methods comprising same
US20060098185A1 (en) * 2002-02-21 2006-05-11 Byun Yong S Mask holder for irradiating UV-rays
WO2008007521A1 (en) * 2006-07-11 2008-01-17 Nikon Corporation Reticle holding member, reticle stage, exposure apparatus, projection exposure method and device manufacturing method
US7394640B2 (en) 2004-03-26 2008-07-01 Advantest Corp. Electrostatic chuck and substrate fixing method using the same
KR101061997B1 (ko) 2009-03-17 2011-09-05 세양전자 주식회사 엘씨디 레티클 케이스
JP2013254769A (ja) * 2012-06-05 2013-12-19 Renesas Electronics Corp 半導体装置の製造方法およびマスク
JP2014167963A (ja) * 2013-02-28 2014-09-11 Toshiba Corp 静電チャック、レチクル、および静電チャック方法
JP2019516866A (ja) * 2016-05-24 2019-06-20 イマジン・コーポレイション シャドーマスク堆積システム及びその方法
JP2019517623A (ja) * 2017-05-17 2019-06-24 イマジン・コーポレイション 高精度シャドーマスク堆積システム及びその方法
KR20190081169A (ko) * 2017-12-29 2019-07-09 주식회사 테스 정전척
US11275315B2 (en) 2016-05-24 2022-03-15 Emagin Corporation High-precision shadow-mask-deposition system and method therefor

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US6157440A (en) * 1995-02-24 2000-12-05 Nikon Corporation Image input apparatus
JPH11307445A (ja) * 1998-04-23 1999-11-05 Nikon Corp 荷電粒子線露光装置及びその投影マスク
TR200000382T1 (tr) * 1998-06-12 2000-11-21 Fort James Corporation Yüksek bir ikincil iç boşluk hacmine sahip bir kağıt ağı yapma yöntemi ve bu işlem ile yapılan ürün
US6553644B2 (en) 2001-02-09 2003-04-29 International Business Machines Corporation Fixture, carrier ring, and method for processing delicate workpieces
JP2002305138A (ja) * 2001-04-05 2002-10-18 Nikon Corp 露光装置および露光方法
US6777143B2 (en) * 2002-01-28 2004-08-17 Taiwan Semiconductor Manufacturing Company Multiple mask step and scan aligner
US7362407B2 (en) * 2002-02-01 2008-04-22 Lg.Philips Lcd Co., Ltd. Method of fabricating liquid crystal display device
US6806943B2 (en) * 2002-08-09 2004-10-19 International Business Machines Corporation Mask clamping device
JP2004183044A (ja) * 2002-12-03 2004-07-02 Seiko Epson Corp マスク蒸着方法及び装置、マスク及びマスクの製造方法、表示パネル製造装置、表示パネル並びに電子機器
SG115678A1 (en) * 2003-04-22 2005-10-28 Asml Netherlands Bv Substrate carrier and method for making a substrate carrier
KR100530499B1 (ko) * 2003-12-26 2005-11-22 삼성전자주식회사 노광 방법 및 이를 수행하기 위한 레티클, 레티클어셈블리 및노광 장치
US7196775B2 (en) * 2004-08-23 2007-03-27 Asml Holding N.V. Patterned mask holding device and method using two holding systems
WO2006068461A1 (en) * 2004-12-23 2006-06-29 Asml Netherlands B.V. Support structure and lithographic apparatus
US7643130B2 (en) * 2005-11-04 2010-01-05 Nuflare Technology, Inc. Position measuring apparatus and positional deviation measuring method
US20080075842A1 (en) * 2006-09-22 2008-03-27 Cabot Corporation Processes, Framed Membranes and Masks for Forming Catalyst Coated Membranes and Membrane Electrode Assemblies
KR100828969B1 (ko) * 2007-06-29 2008-05-13 주식회사 디엠에스 실란트 경화장치의 마스크글라스 고정유닛
JP5112151B2 (ja) * 2008-04-08 2013-01-09 株式会社アルバック 光照射装置
DE102008037387A1 (de) * 2008-09-24 2010-03-25 Aixtron Ag Verfahren sowie Vorrichtung zum Abscheiden lateral strukturierter Schichten mittels einer magnetisch auf einem Substrathalter gehaltenen Schattenmaske
KR101030030B1 (ko) 2009-12-11 2011-04-20 삼성모바일디스플레이주식회사 마스크 조립체
TWI398639B (zh) * 2010-01-08 2013-06-11 Nat Univ Kaohsiung The carrier of the package
EP2397905A1 (en) * 2010-06-15 2011-12-21 Applied Materials, Inc. Magnetic holding device and method for holding a substrate
KR20130028165A (ko) * 2011-06-21 2013-03-19 삼성디스플레이 주식회사 마스크 유닛
USD702245S1 (en) * 2012-01-11 2014-04-08 Victor Susman Scanning frame
CN102717983A (zh) 2012-07-04 2012-10-10 深圳市华星光电技术有限公司 一种易碎板包装箱及其底部制作设备、制作方法
US8939289B2 (en) * 2012-12-14 2015-01-27 Shenzhen China Star Optoelectronics Technology Co., Ltd Packing box for liquid crystal display panel and waterproof structure thereof
US8997996B2 (en) * 2013-03-18 2015-04-07 Shenzhen China Star Optoelectronics Technology Co., Ltd. Drawer type cushioning packaging device for liquid crystal glass
US9443819B2 (en) 2014-02-13 2016-09-13 Apple Inc. Clamping mechanism for processing of a substrate within a substrate carrier
JP6314604B2 (ja) * 2014-03-31 2018-04-25 岩崎電気株式会社 照射装置
US10644239B2 (en) 2014-11-17 2020-05-05 Emagin Corporation High precision, high resolution collimating shadow mask and method for fabricating a micro-display
KR102366570B1 (ko) * 2015-06-19 2022-02-25 삼성디스플레이 주식회사 마스크 프레임 조립체 및 그 제조방법
CN105887010B (zh) * 2016-05-13 2018-10-26 京东方科技集团股份有限公司 掩膜集成框架及蒸镀设备
CN105839052A (zh) * 2016-06-17 2016-08-10 京东方科技集团股份有限公司 掩膜板以及掩膜板的组装方法
KR102584518B1 (ko) * 2018-07-04 2023-10-05 삼성디스플레이 주식회사 정전척 유닛 및 그것을 이용한 박막 증착 장치
CN210193986U (zh) * 2019-08-12 2020-03-27 京东方科技集团股份有限公司 掩模板组件
KR102724543B1 (ko) * 2020-07-23 2024-11-04 삼성디스플레이 주식회사 마스크 척 및 이를 포함하는 마스크 제조 장치
USD1002983S1 (en) * 2021-05-19 2023-10-24 Hector Gonzalez Mask holder

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4833051A (en) * 1984-08-20 1989-05-23 Nippon Kogaku K.K. Protective device for photographic masks
DE3600169A1 (de) * 1985-01-07 1986-07-10 Canon K.K., Tokio/Tokyo Maskenstruktur zur lithographie, verfahren zu ihrer herstellung und lithographisches verfahren
US4963921A (en) * 1985-06-24 1990-10-16 Canon Kabushiki Kaisha Device for holding a mask
US5012353A (en) * 1987-06-04 1991-04-30 Hitachi, Ltd. Apparatus for reading original
JPH0722112B2 (ja) * 1987-07-30 1995-03-08 キヤノン株式会社 マスクホルダ並びにそれを用いたマスクの搬送方法
DE69025692T2 (de) * 1989-10-11 1996-07-18 Fuji Photo Film Co Ltd Bildlesegerät
US5260151A (en) * 1991-12-30 1993-11-09 At&T Bell Laboratories Device manufacture involving step-and-scan delineation
JP2919158B2 (ja) * 1992-02-10 1999-07-12 キヤノン株式会社 基板保持装置
JP2979163B2 (ja) * 1992-04-13 1999-11-15 株式会社ニコン 電子線描画装置
US5608773A (en) * 1993-11-30 1997-03-04 Canon Kabushiki Kaisha Mask holding device, and an exposure apparatus and a device manufacturing method using the device
JP3244894B2 (ja) * 1993-11-30 2002-01-07 キヤノン株式会社 マスク保持方法、マスク及びマスクチャック、ならびにこれを用いた露光装置とデバイス製造方法
US5477310A (en) * 1994-05-09 1995-12-19 Polaroid Corporation Film package
US5621502A (en) * 1995-04-25 1997-04-15 Admotion Corporation Mosaic fabrication fixture and method of making mosaics

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6433346B1 (en) 1999-10-19 2002-08-13 Nikon Corporation Electrostatic reticle chucks, charged-particle-beam microlithography apparatus and methods, and semiconductor-device manufacturing methods comprising same
US20060098185A1 (en) * 2002-02-21 2006-05-11 Byun Yong S Mask holder for irradiating UV-rays
US8189167B2 (en) 2002-02-21 2012-05-29 Lg Display Co., Ltd. Mask holder for irradiating UV-rays
US7394640B2 (en) 2004-03-26 2008-07-01 Advantest Corp. Electrostatic chuck and substrate fixing method using the same
JPWO2008007521A1 (ja) * 2006-07-11 2009-12-10 株式会社ニコン レチクル保持部材、レチクル・ステージ、露光装置、投影露光方法およびデバイス製造方法
WO2008007521A1 (en) * 2006-07-11 2008-01-17 Nikon Corporation Reticle holding member, reticle stage, exposure apparatus, projection exposure method and device manufacturing method
KR101061997B1 (ko) 2009-03-17 2011-09-05 세양전자 주식회사 엘씨디 레티클 케이스
JP2013254769A (ja) * 2012-06-05 2013-12-19 Renesas Electronics Corp 半導体装置の製造方法およびマスク
JP2014167963A (ja) * 2013-02-28 2014-09-11 Toshiba Corp 静電チャック、レチクル、および静電チャック方法
JP2019516866A (ja) * 2016-05-24 2019-06-20 イマジン・コーポレイション シャドーマスク堆積システム及びその方法
US11275315B2 (en) 2016-05-24 2022-03-15 Emagin Corporation High-precision shadow-mask-deposition system and method therefor
JP2019517623A (ja) * 2017-05-17 2019-06-24 イマジン・コーポレイション 高精度シャドーマスク堆積システム及びその方法
KR20190081169A (ko) * 2017-12-29 2019-07-09 주식회사 테스 정전척

Also Published As

Publication number Publication date
US5847813A (en) 1998-12-08

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