JPH1046339A - 基板ハンドリング方法 - Google Patents
基板ハンドリング方法Info
- Publication number
- JPH1046339A JPH1046339A JP8199174A JP19917496A JPH1046339A JP H1046339 A JPH1046339 A JP H1046339A JP 8199174 A JP8199174 A JP 8199174A JP 19917496 A JP19917496 A JP 19917496A JP H1046339 A JPH1046339 A JP H1046339A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- mask
- substrate holder
- center
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8199174A JPH1046339A (ja) | 1996-07-29 | 1996-07-29 | 基板ハンドリング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8199174A JPH1046339A (ja) | 1996-07-29 | 1996-07-29 | 基板ハンドリング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1046339A true JPH1046339A (ja) | 1998-02-17 |
| JPH1046339A5 JPH1046339A5 (enExample) | 2004-08-12 |
Family
ID=16403388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8199174A Pending JPH1046339A (ja) | 1996-07-29 | 1996-07-29 | 基板ハンドリング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1046339A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6413381B1 (en) | 2000-04-12 | 2002-07-02 | Steag Hamatech Ag | Horizontal sputtering system |
| US6874515B2 (en) * | 2001-04-25 | 2005-04-05 | Tokyo Electron Limited | Substrate dual-side processing apparatus |
| WO2006090749A1 (ja) * | 2005-02-23 | 2006-08-31 | Mitsui Engineering & Shipbuilding Co., Ltd. | 成膜装置における基板装着方法および成膜方法 |
| WO2021004331A1 (zh) * | 2019-07-05 | 2021-01-14 | 北京北方华创微电子装备有限公司 | 掩膜结构和fcva设备 |
-
1996
- 1996-07-29 JP JP8199174A patent/JPH1046339A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6413381B1 (en) | 2000-04-12 | 2002-07-02 | Steag Hamatech Ag | Horizontal sputtering system |
| WO2001079582A3 (en) * | 2000-04-12 | 2002-07-04 | Steag Hamatech Ag | Horizontal sputtering system |
| US6874515B2 (en) * | 2001-04-25 | 2005-04-05 | Tokyo Electron Limited | Substrate dual-side processing apparatus |
| WO2006090749A1 (ja) * | 2005-02-23 | 2006-08-31 | Mitsui Engineering & Shipbuilding Co., Ltd. | 成膜装置における基板装着方法および成膜方法 |
| WO2021004331A1 (zh) * | 2019-07-05 | 2021-01-14 | 北京北方华创微电子装备有限公司 | 掩膜结构和fcva设备 |
| US11408064B2 (en) | 2019-07-05 | 2022-08-09 | Beijing Naura Microelectronics Equipment Co., Ltd. | Mask structure and FCVA apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1283281C (en) | Apparatus and method for registration of shadow masked thin film patterns | |
| JP2002280443A (ja) | ディスクキャリヤ | |
| JP2004259598A (ja) | 真空蒸着方法及び真空蒸着装置、並びにこの真空蒸着方法により製造したelパネル | |
| JP2009043771A (ja) | チャックテーブル機構および被加工物の保持方法 | |
| TW201407713A (zh) | 基板保持環握持機構 | |
| WO2007099929A1 (ja) | 有機薄膜蒸着方法及び有機薄膜蒸着装置 | |
| JPH1046339A (ja) | 基板ハンドリング方法 | |
| KR20000076724A (ko) | 웨이퍼 수납 캐리어 및 웨이퍼 반송 장치 및 웨이퍼 반송방법 | |
| JPH1046339A5 (enExample) | ||
| JPH07201948A (ja) | 基板搬送治具 | |
| JP2017092063A (ja) | 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体 | |
| JP2007180125A (ja) | 露光装置、露光方法、及び表示用パネル基板の製造方法 | |
| JP2002184843A (ja) | 半導体基板保持装置 | |
| JPH09266166A (ja) | 露光装置 | |
| JP2002208625A (ja) | 半導体ウェハの薄化処理方法 | |
| JP4127038B2 (ja) | ウエハ吸着装置 | |
| CN114481085A (zh) | 气相沉积掩模和使用气相沉积掩模制造装置的方法 | |
| JPH0936211A (ja) | クランプリング | |
| US6733829B2 (en) | Anti-binding deposition ring | |
| JP2004281765A (ja) | 基板搬送具、基板搬送具への基板の着脱装置、基板搬送具への基板の着脱方法及び処理装置 | |
| JPH05144939A (ja) | 半導体保持装置及びダイシング方法 | |
| JP2020002424A (ja) | 基板支持機構 | |
| JPH08316287A (ja) | 基板取扱方法及びそれに用いる基板フレーム | |
| JPH08306711A (ja) | チップ剥離装置及びチップ剥離方法 | |
| JPH0557352B2 (enExample) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060608 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060613 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060809 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060905 |