JPH10310631A5 - - Google Patents

Info

Publication number
JPH10310631A5
JPH10310631A5 JP1997154236A JP15423697A JPH10310631A5 JP H10310631 A5 JPH10310631 A5 JP H10310631A5 JP 1997154236 A JP1997154236 A JP 1997154236A JP 15423697 A JP15423697 A JP 15423697A JP H10310631 A5 JPH10310631 A5 JP H10310631A5
Authority
JP
Japan
Prior art keywords
epoxy resin
general formula
resins
group
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997154236A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10310631A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP15423697A priority Critical patent/JPH10310631A/ja
Priority claimed from JP15423697A external-priority patent/JPH10310631A/ja
Publication of JPH10310631A publication Critical patent/JPH10310631A/ja
Publication of JPH10310631A5 publication Critical patent/JPH10310631A5/ja
Pending legal-status Critical Current

Links

JP15423697A 1997-05-09 1997-05-09 半導体封止用エポキシ樹脂組成物 Pending JPH10310631A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15423697A JPH10310631A (ja) 1997-05-09 1997-05-09 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15423697A JPH10310631A (ja) 1997-05-09 1997-05-09 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPH10310631A JPH10310631A (ja) 1998-11-24
JPH10310631A5 true JPH10310631A5 (enrdf_load_stackoverflow) 2005-03-17

Family

ID=15579827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15423697A Pending JPH10310631A (ja) 1997-05-09 1997-05-09 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPH10310631A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6015289B2 (ja) * 2012-09-24 2016-10-26 Dic株式会社 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP6048734B2 (ja) * 2012-11-15 2016-12-21 Dic株式会社 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP6048738B2 (ja) * 2012-12-12 2016-12-21 Dic株式会社 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板

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