JPH10289892A - Substrate retaining apparatus and substrate treatment apparatus using substrate retaining apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate retaining apparatus generating less dusts and having a wide allowance for dispersion in substrate supply positions. SOLUTION: Retention rollers 13, 33 is formed of generally double enveloping shape, with a constricted side portion near the center thereof being a cylindrical surface 101 having a vertical width d1 slightly larger than the thickness t of a wafer W. The lower end periphery of the cylindrical surface 101 is continuous to a lower conical surface 102 which is wider downward. The upper end periphery of the cylindrical surface 101 is continuous to an upper conical surface 103 which is wider upward. The wafer W to be cleaned is retained by the retention rollers 13, 33 with the end face of the wafer W contacting the cylindrical surface 101 formed at the retention rollers 13, 33.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate for holding a substantially circular substrate among substrates such as a semiconductor wafer, a glass substrate for a liquid crystal display and a PDP (plasma display panel) substrate. The present invention relates to a holding apparatus and a substrate processing apparatus using the substrate holding apparatus.

[0002]

2. Description of the Related Art A semiconductor device manufacturing process includes a process of forming a fine pattern by repeatedly performing processes such as film formation and etching on the surface of a semiconductor wafer (hereinafter, simply referred to as "wafer"). . For fine processing, the surface of the wafer itself and the surface of the thin film formed on the wafer surface must be kept clean. Therefore, the wafer is cleaned as necessary. For example, after a thin film formed on the surface of a wafer is polished with an abrasive, the slurry (slurry) needs to be removed because the abrasive (slurry) remains on the wafer surface.

A conventional apparatus for cleaning a wafer as described above is disclosed in, for example, Japanese Patent Application Laid-Open No. 1-259536. The device disclosed in this publication is
As shown in FIGS. 9 and 10, three holding rollers 201, 202, and 203 for holding a substrate, and cleaning water are sprayed on both surfaces of the wafer W held along the vertical plane by the holding rollers 201 to 203. Nozzles 204 and 2
05. When cleaning the wafer W, the driving force of a driving motor (not shown) is transmitted to the holding roller 201, and the holding roller 201 is rotated, whereby the wafer W is rotated in a certain direction. Then, the cleaning water from the nozzles 204 and 205 is sprayed on the rotating wafer W,
Contaminant foreign matter is removed from both surfaces of the wafer W.

[0004]

However, in the above-described conventional apparatus, the peripheral surfaces of the holding rollers 201 to 203 for holding the wafer W have a substantially V-shaped cross section as shown in an enlarged view in FIG. The wafer W is held in a state where its peripheral edge is held between the conical surfaces 206 and 207 of the holding rollers 201 to 203. Therefore, when the wafer W is rotated, the edge portions 208 and 209 of the wafer W rub against the conical surfaces 206 and 207 of the holding rollers 200 to 203, and particles are generated.

Further, the wafer W is held by holding rollers 201 to 20.
3, when the supply position of the wafer W is slightly deviated in the left-right direction from a predetermined position (the position of the wafer W shown in FIG. 10), the wafer W is held between the conical surfaces 206 and 207 of the holding rollers 201 to 203. There is a possibility that it will not fall into the state of being carried out and fall off from the holding rollers 201 to 203. Therefore, in the above-described conventional apparatus, the wafer W needs to be accurately supplied to a predetermined supply position.

[0006] The above problems are not limited to the apparatus configured to hold the wafer W along the vertical plane as in the conventional apparatus, but use a roller that holds the end face of the wafer W on the V-shaped side surface. This is a problem that also occurs in an apparatus configured to hold the wafer W horizontally. Therefore, an object of the present invention is to solve the above-mentioned technical problems, reduce dust generation,
Further, it is an object of the present invention to provide a substrate holding device having a wide allowable range with respect to a variation in a supply position of a substrate and a substrate processing apparatus using the same.

[0007]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for rotating a substantially circular substrate while horizontally holding the substrate, the substrate processing apparatus comprising a substantially vertical substrate. At least three with a central axis parallel to the direction
A rotatable holding roller, a side surface of the holding roller having a vertical width equal to or greater than the thickness of the substrate to be held, and a cylindrical surface on which an end surface of the substrate to be held is abutted; A lower conical surface is formed which extends downward from the lower peripheral edge of the cylindrical surface.

According to the first aspect of the present invention, the substrate is horizontally held by at least three holding rollers, with the end surface of the substrate abutting on the cylindrical surface formed on the holding roller. As a result, the substrate comes into line contact with the holding roller, so that the edge portion of the substrate and the conical surface are rubbed as in the conventional device in which the substrate is held in a state sandwiched by the two conical surfaces. There is no generation of many particles.

Further, since the substrate held by the holding roller is restricted from being displaced downward by the lower conical surface, the substrate does not fall down from the holding roller. Further, since the substrate is held horizontally, the substrate can be stably held and rotated without being displaced above the upper end of the holding roller and falling off. Furthermore, even if the end surface of the substrate is in contact with any part of the cylindrical surface, the substrate is reliably held by the holding roller, so that the supply position of the substrate to the holding roller is within the vertical width of the cylindrical surface. Good.
Therefore, since the cylindrical surface is formed, the tolerance of the holding roller with respect to the variation in the supply position of the substrate is widened, and the alignment between the substrate and the holding roller is facilitated.

According to a second aspect of the present invention, an upper conical surface which extends upward from the upper peripheral edge of the cylindrical surface is further formed on a side surface of the holding roller. 1 is a substrate holding device. According to the configuration of the second aspect, the substrate held by the holding roller is restricted from being displaced downward by the lower conical surface, and is further restricted from being displaced upward by the upper conical surface. Therefore, it is possible to further eliminate the possibility that the substrate will fall off the holding roller.

The invention according to claim 3 is the substrate holding device according to claim 1 or 2, wherein the vertical width of the cylindrical surface is 1 mm or less. According to the configuration of the third aspect, when the substrate held by the substrate holding device is a semiconductor wafer, the thickness is usually 0.6 m.
m, the substrate can be held and rotated at substantially the same vertical position by setting the vertical width of the cylindrical surface to 1 mm or less.

The invention according to claim 4 is the substrate holding device according to claim 1, wherein the cylindrical surface is formed continuously to an upper end of the holding roller. According to the configuration of the fourth aspect, since the cylindrical surface is formed up to the upper end of the holding roller, the substrate is set to the supply position from above the holding roller waiting near the holding position for holding the substrate. It is possible to do. Therefore, when the substrate is set at the supply position, it is not necessary to retreat the holding roller largely from the holding position, so that the size of the apparatus can be reduced. In addition, the same operation as the configuration described in claim 1 can be achieved.

According to a fifth aspect of the present invention, there is provided the substrate holding device according to any one of the first to fourth aspects, and a rotary drive source for rotating at least one of the holding rollers. Is a substrate processing apparatus. According to the fifth aspect of the present invention, since the substrate holding device according to the first to fourth aspects generates less dust as described above, a substrate using any one of these substrate holding devices is provided. The processing apparatus can manufacture a high-quality substrate.

According to a sixth aspect of the present invention, there is provided a pair of scrub cleaning members provided so as to face each other with the substrate held by the substrate holding device interposed therebetween, and the pair of scrub cleaning members is used to clean the substrate. The substrate processing apparatus according to claim 5, further comprising a double-sided scrub cleaning means for scrub-cleaning both surfaces. According to the configuration described in claim 6, the substrate is stably held by the substrate holding device, so that the scrub cleaning member can be pressed against the upper and lower surfaces of the substrate with a constant and uniform force. Therefore, the surface of the substrate can be favorably scrub-cleaned without causing uneven cleaning on the surface of the substrate.

[0015]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a configuration of a wafer cleaning apparatus as a substrate processing apparatus according to one embodiment of the present invention. FIG. 2 is a cross-sectional view of FIG.
It is II sectional drawing, a part is abbreviate | omitted and a part is shown notionally. First, a schematic configuration of the entire wafer cleaning apparatus will be described with reference to FIGS.

The wafer cleaning apparatus is, for example, a CMP (Chemical Mech) for polishing a thin film formed on the surface of a wafer W.
This is for removing slurry and unnecessary thin films remaining on the surface of the wafer W after the processing is performed. This apparatus has a processing chamber 5 that is substantially rectangular in a plan view surrounded by side walls 1, 2, 3, and 4, holds a wafer W horizontally in the processing chamber 5, and rotates the wafer W in this state. Wafer holding device 6
And a double-side cleaning device 7 for scrubbing the upper and lower surfaces of the wafer W held by the wafer holding device 6 to remove slurry and the like.

The wafer holding device 6 has a direction A (hereinafter, referred to as a “holding direction”) perpendicular to the side walls 2 and 4 of the processing chamber 5.
Are provided with a pair of holding hands 10 and 30 opposed to each other. The holding hands 10 and 30 are arranged above the base mounting portions 11 and 31, the base portions 12 and 32 mounted on the base mounting portions 11 and 31, and the base portions 12 and 32, and hold the wafer W. And three holding rollers 13 and 33 are provided. The holding rollers 13 and 33 are arranged on a circumference corresponding to the shape of the end surface of the wafer W.
Is held in a state where its end face is in contact with the side face of the.

The base mounting portions 11 and 31 have a holding direction A
One ends of hand shafts 15 and 35 provided along are connected. The hand shafts 15 and 35 extend through holes 14 and 34 formed in the side walls 2 and 4 to the outside of the side walls 2 and 4, and have cylinders fixed on mounting plates 16 and 36 at the other ends. The rods 18, 38 of 17, 37 are connected to the connecting plate 1
It is attached via 9, 39. Cylinder 17,
37 is fixed on the mounting plates 16 and 36 such that the rods 18 and 38 advance and retreat along the holding direction A. With this configuration, by driving the cylinders 17 and 37, the holding hands 10 and 30 can be advanced and retracted in opposite directions along the holding direction A, and the wafer W can be held between the holding rollers 13 and 33. , This pinching can be released.

Reference numerals 20 and 40 denote bellows which can expand and contract with the movement of the holding hands 10 and 30.
The cleaning liquid supplied to the wafer W from the double-sided cleaning device 7 and its atmosphere affect the hand shafts 15 and 35,
This is for preventing leakage to the outside of the processing chamber 5. The bellows 20, 40 are connected to the cylinder 17,
Particles generated from the rods 18 and 38 of the 37 and the hand shafts 15 and 35 are prevented from entering the processing chamber 5.

The holding rollers 13 and 33 are used to rotate the wafer W while holding the wafer W horizontally.
2 is provided rotatably. Specifically, the holding rollers 13 and 33 are roller shafts 21 and 41 supported by the base portions 12 and 32 so as to be rotatable around a vertical axis.
Is fixed to the upper end. The driving force required to rotate the wafer W is applied to the holding roller 33 on the holding hand 30 side. More specifically, a motor M is provided outside the side wall 4 as a rotation drive source that generates a driving force for rotating the holding roller 33. The motor M is fixed on a motor mounting plate 42 provided outside the side wall 4, and a pulley 53 is mounted on the output shaft 52. On the other hand, near the lower end of the central holding roller 33b of the three holding rollers 33,
Pulleys 49, 50, and 51 are mounted side by side in the vertical direction, and an endless belt 43 is wound between an upper pulley 49 and a pulley 53 mounted on the output shaft 52 of the motor M. I have. A belt 44 is provided between the middle pulley 50 and the roller shaft 41 of the holding roller 33a.
Is wound around, and a belt 45 is wound between the lower pulley 51 and the roller shaft 41 of the holding roller 33c.

With this configuration, the motor M
Is driven to rotate, the driving force of the motor M is transmitted to the holding roller 33b via the belt 43, and the holding roller 33b is driven.
b is driven to rotate. Further, the driving force transmitted to the holding roller 33b is transmitted to the other two holding rollers 33a and 33c via the belts 44 and 45, and
a and 33c are rotationally driven. As a result, the holding roller 1
The wafer W held by the holding hands 3 and 33 rotates in the rotation direction B, and the holding roller 13 on the holding hand 10 rotates following the rotation of the wafer W. The wafer W is rotated at a low speed, for example, at about 10 to 20 (rotation / minute).

The double-side cleaning device 7 includes an upper surface cleaning unit 60 and a lower surface cleaning unit 80 disposed above and below the wafer W held by the wafer holding device 6. The upper surface cleaning unit 60 and the lower surface cleaning unit 80 are provided at positions not interfering with the holding hands 10 and 30, respectively, so as to cover the surface area of the wafer W from the center to the peripheral edge of the wafer W. 86 is provided.

More specifically, the upper surface cleaning unit 60 and the lower surface cleaning unit 80 include base portions 62 and 82 having cleaning brushes 66 and 68 mounted on mounting surfaces 61 and 81 on the side facing the wafer W, respectively. And rotating shafts 63 and 83 attached to the base portions 62 and 82. Rotation drive units 64 and 84 are coupled to the rotation shafts 63 and 83, respectively.
When the driving force is applied to 83, the upper surface cleaning unit 60 and the lower surface cleaning unit 80 are rotated in the rotation direction C about the rotation axis O extending in the vertical direction.

Further, the upper and lower cleaning units 60 and 80 are coupled to elevation driving units 65 and 85, respectively. During wafer cleaning, the upper and lower cleaning units 60 and 80 are moved by the lifting / lowering driving units 65 and 85 in directions approaching each other, and the wafer W is sandwiched between the upper and lower cleaning units 60 and 80. Also, the wafer W
After the completion of the cleaning, the upper and lower cleaning units 60 and 80 are moved by the lifting / lowering driving units 65 and 85 in a direction in which the upper and lower cleaning units 80 and 80 are separated from each other.

The upper base 62 and the lower base 82
Cleaning liquid supply nozzles 71 and 91 for supplying a cleaning liquid to the wafer W are arranged near the centers of the cleaning brushes 66 and 86 respectively attached to the wafers W. One ends of cleaning pipes 67 and 87 inserted in the rotating shafts 63 and 83 are connected to the cleaning liquid supply nozzles 71 and 91, respectively. The other ends of the cleaning pipes 67, 87 are connected to three-way valves 68, 88, respectively.
Are supplied with chemical solution supply paths 69 and 89 through which chemical solutions such as hydrofluoric acid, nitric acid, hydrochloric acid, phosphoric acid, acetic acid, and ammonia are guided from a chemical solution tank (not shown), and pure water supply from which pure water is guided from a pure water tank (not shown). The roads 70 and 90 are connected.
With such a configuration, by controlling the switching of the three-way valves 68 and 88, the chemical liquid or pure water can be selectively supplied to the cleaning pipes 67 and 87. As a result, the chemical liquid or pure water can be supplied from the cleaning liquid supply nozzles 71 and 91. Water can be selectively discharged.

Next, an operation of scrub cleaning the wafer W by the wafer cleaning apparatus will be described. Before the cleaning, the holding hands 10 and 30 stand by at a standby position retracted from the holding position (the position shown in FIG. 1) for holding the wafer W, and the upper surface cleaning unit 60 and the lower surface cleaning unit 80 are also separated from the wafer W. Waiting in a state where When the CMP process, which is the preceding process, is completed, the wafer W after the CMP process is supplied to a predetermined supply position in the processing chamber 5 by a transfer arm (not shown). Then, cylinders 17 and 37
Of the holding hands 10, 38
30 are brought closer together. As a result, the wafer W is held by the holding rollers 13 and 33 at its end face.

When the wafer W is held by the holding rollers 13 and 33, the rotation driving units 64 and 84 are driven, and the upper surface cleaning unit 60 and the lower surface cleaning unit 80 are driven to rotate.
At the same time, the three-way valves 68 and 88 are switched to connect the chemical supply paths 69 and 89 with the cleaning pipes 67 and 87, and the chemicals are supplied to the upper and lower surfaces of the wafer W from the cleaning liquid supply nozzles 71 and 91, respectively. You.

Thereafter, the motor M is driven to rotate the holding roller 33. Along with this, the wafer W rotates at a low speed. Further, the elevation drive units 65 and 85 are driven, and the upper surface cleaning unit 60 and the lower surface cleaning unit 80 are moved in directions approaching each other. As a result, the holding rollers 13, 33
The cleaning brushes 66 and 86
The upper and lower surfaces are rubbed by the cleaning brushes 66 and 86 while the chemical solution is supplied, and scrub cleaning is performed. Thereby, the slurry remaining on the upper surface and the lower surface of the wafer W is removed.

The cleaning brushes 66 and 86 of the upper surface cleaning unit 60 and the lower surface cleaning unit 80 are arranged so as to cover the surface area of the wafer W from the center to the periphery of the wafer W. By being rotated, the wafer W
Can be scrub-cleaned over the entire upper and lower surfaces of the substrate. When the scrub cleaning with the chemical solution ends, the elevation drive units 65 and 85 are driven, and the upper surface cleaning unit 60 and the lower surface cleaning unit 80 are moved in a direction away from the wafer W. After that, the three-way valves 68 and 88 are switched, and the cleaning pipes 67 and 87 and the pure water supply paths 70 and 90 are connected.
As a result, pure water is supplied from the cleaning liquid supply nozzles 71 and 91 to the upper and lower surfaces of the wafer W, and the chemicals and the like remaining on the upper and lower surfaces of the wafer W are washed away.

When sufficient pure water is supplied to remove the chemical,
The three-way valves 68 and 88 are switched so that the discharge of the pure water from the cleaning liquid supply nozzles 7 and 8 is stopped, and the driving of the rotary driving units 64 and 84 is stopped, and the upper surface cleaning unit 60 and the lower surface cleaning unit 80 are stopped. Is stopped. Further, the driving of the motor M is stopped, and the rotation of the wafer W is stopped.
FIG. 3 is a perspective view showing the configuration of the holding rollers 13 and 33. FIG. 4 is a side view showing the configuration of the holding rollers 13 and 33.

Each of the holding rollers 13 and 33 is formed substantially in the shape of a drum.
The width d1 in the vertical direction is a cylindrical surface 101 slightly larger than the thickness t of the wafer W. The lower peripheral edge of the cylindrical surface 101 is connected to a lower conical surface 102 that spreads downward, and the upper peripheral edge of the cylindrical surface 101 is connected to an upper conical surface 103 that spreads upward.

The wafer W to be cleaned is held by the holding rollers 13 and 33 with its end face in contact with the cylindrical surface 101 formed on the holding rollers 13 and 33.
Thereby, the downward displacement of the wafer W held by the holding rollers 13 and 33 is regulated by the lower conical surface 102, and the upward displacement is regulated by the upper conical surface 103. Therefore, the wafer W does not fall off the holding rollers 13 and 33.

Further, the end face of the wafer W is
Since the wafer W comes into contact with the cylindrical surface 101 of the holding roller 33, the wafer W comes into line contact with the holding rollers 13 and 33. Therefore, unlike the configuration of the conventional apparatus in which the wafer W is held in a state sandwiched by the two conical surfaces, the wafer W
There is no problem of dust generation due to the friction between the edge portion of the holding roller and the conical surface of the holding roller, and the generation of particles can be reduced.

Further, since the upper and lower conical surfaces 103 and 102 restrict the vertical displacement of the wafer W, the wafer W is rotated while being held at a constant height. Thus, the cleaning brush 66 of the upper surface cleaning unit 60 and the cleaning brush 86 of the lower surface cleaning unit 80 are pressed against the upper surface and the lower surface of the wafer W with a constant force. Therefore, without causing uneven cleaning on the surface of the wafer W,
The surface of the wafer W can be favorably scrub-cleaned.

In order to clean the surface of the wafer W evenly, the width d1 of the cylindrical surface 101 must be equal to the thickness t of the wafer W.
Is preferably formed substantially equal to However, considering the error of the supply position by the transfer arm (not shown) for supplying the wafer W to the processing chamber 5 (see FIG. 1), the wafer W is surely held by the holding rollers 13 and 33. In other words, the width d1 of the cylindrical surface 101 must be larger than the thickness t of the wafer W. Therefore, the inventor of the present application has set the width d1 of the cylindrical surface of the holding rollers 13 and 33 to be 0.6 (mm) <d1 ≦ 1 (mm) when the thickness t of the wafer W is 0.6 (mm). Was concluded to be preferable.

Thus, the surface of the wafer W can be favorably cleaned, and the wafer W can be reliably held by the holding rollers 13 and 33 even if the supply position of the wafer W slightly shifts. . FIG. 5 is a perspective view illustrating a configuration of a holding roller according to another embodiment of the present invention.
FIG. 6 is a side view of the holding roller shown in FIG.
5 and 6, parts corresponding to the respective parts shown in FIGS. 3 and 4 are denoted by the same reference numerals.

The holding roller 1 according to the second embodiment
Reference numeral 10 designates, instead of the holding rollers 13 and 33 shown in FIG.
It is to be used fixed to the upper ends of the roller shafts 21 and 41. The side surface of the holding roller 110 includes a cylindrical surface 111 with which the end surface of the wafer W is in contact, and a lower conical surface 102 that spreads downward from the lower peripheral edge of the cylindrical surface 111. The cylindrical surface 111 is formed continuously up to the upper end of the holding roller 110, and the circumferential surface of the holding roller 110 has the holding roller 1 according to the first embodiment described above.
No conical surface corresponding to the upper conical surface 103 of the side surfaces 3 and 33 is formed.

Even with such a configuration, the holding roller 1
Since the downward displacement of the wafer W held by the wafer 10 is regulated by the lower conical surface 102, the wafer W does not fall down from the holding roller 110. Also, the wafer W
Is held horizontally by the plurality of holding rollers 110, there is no possibility that the wafer W is displaced upward from the upper end of the cylindrical surface 111 and falls off.

The end face of the wafer W has a cylindrical surface 11.
No matter which part of the wafer 1 is brought into contact, the wafer W is reliably held by the holding roller 110, so that the position of supply of the wafer W by the transfer arm (not shown) may be within the vertical width d2 of the cylindrical surface 111. The tolerance of the holding roller 110 with respect to the variation in position can be widened. Further, the end surface of the wafer W is the cylindrical surface 111 of the holding roller 110.
As in the case of the holding rollers 13 and 33 according to the first embodiment, the generation of particles can be reduced.

Also, since the cylindrical surface 111 reaches the upper end of the holding roller 110, the holding hands 10, 30 are kept near the holding position (the position shown in FIG. 1).
The wafer W can be set at the supply position from above the holding roller 110. In this case, since it is not necessary to retreat the holding hands 10 and 30 from the holding position to set the wafer W, the size of the processing chamber 5 (see FIG. 1) can be reduced.

FIG. 7 is a side view showing the structure of a holding roller according to still another embodiment of the present invention. FIG.
FIG. 8 is a side view of the holding roller shown in FIG. 7. 7 and 8, parts corresponding to the respective parts shown in FIGS. 3 and 4 are denoted by the same reference numerals. The holding roller 120 according to the third embodiment is to be used by being fixed to the upper ends of roller shafts 21 and 41 instead of the holding rollers 13 and 33 shown in FIG. Near the center of the side surface of the holding roller 120, similar to the holding rollers 13 and 33 according to the first embodiment shown in FIGS.
A cylindrical surface 121 whose vertical width d3 is larger than the thickness t of the wafer W is formed, and the lower peripheral edge of the cylindrical surface 121 is connected to the lower conical surface 102 which spreads downward. The holding roller 120 is used as the holding roller 1
3 and 33 is that the upper peripheral edge of the cylindrical surface 121 is a tapered surface 122 which is a conical surface narrowing upward.
It is a point that is connected to.

That is, the holding roller 120 has no portion that extends beyond the cylindrical surface 121 in plan view above the cylindrical surface 121 with which the end surface of the wafer W is in contact. Therefore,
While holding the holding hands 10 and 30 near the holding position (the position shown in FIG. 1), the wafer W is held by the holding roller 120.
The same operation and effects as those of the holding roller 110 according to the above-described second embodiment can be achieved, for example, it can be set to the supply position from above. Further, since the tapered surface 122 is inclined with respect to the horizontal direction, even if a chemical solution containing slurry or pure water adheres to the tapered surface 122, it flows down quickly and there is no liquid pool in the holding roller 120. . Therefore, it is possible to prevent the slurry from remaining and adhering to the liquid pool and contaminating the wafer W.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. For example, in the description of the above-described embodiment, a case where a circular wafer W is cleaned is taken as an example. ) Even if it is a substrate or the like, it can be satisfactorily held as long as the substrate is formed in a substantially circular shape. Further, the substrate holding device according to the present invention is also applicable as a device for holding a substrate in a process other than the cleaning of the substrate.

Further, the substrate held by the substrate holding device does not need to be a perfect circle, but may have a notch such as an orientation flat or a notch formed on the periphery of the substrate, as long as it is substantially circular as a whole. In the first embodiment, the width of the cylindrical surface is preferably 1 mm or less. However, this value is obtained when the substrate to be held by the holding roller is a semiconductor wafer having a thickness of 0.6 mm. When other substrates are held, the upper limit value may be a value obtained by adding an error in the supply position of the substrate to the thickness of the other substrate.

In addition, various changes can be made within the scope described in the claims.

[0046]

According to the first aspect of the present invention, when the substrate is
Dust generation can be reduced as compared with the configuration of the conventional device held in a state of being sandwiched by two conical surfaces. In addition, since the substrate held by the holding roller is restricted from being displaced downward by the lower conical surface, the substrate does not fall down from the holding roller. In addition, since the substrate is held horizontally, the substrate can be stably held and rotated without the substrate being displaced upward from the upper end of the holding roller and falling off. Further, since the supply position of the substrate to the holding roller may be within the vertical width of the cylindrical surface, the alignment between the substrate and the holding roller is facilitated.

According to the second aspect of the present invention, the substrate held by the holding roller is regulated by the lower conical surface so that the downward displacement is restricted, and the upper conical surface is further restricted by the upwardly displaced surface. The risk of falling off the rollers is further eliminated. According to the invention of claim 3, when the substrate held by the substrate holding device is a semiconductor wafer, the vertical width of the cylindrical surface is set to 1 mm or less,
The substrate can be held and rotated at a certain height.

According to the fourth aspect of the present invention, when the substrate is set at the supply position, it is not necessary to largely retract the holding roller from the holding position, so that the size of the apparatus can be reduced. According to the fifth aspect of the invention, a high-quality substrate can be manufactured. According to the invention of claim 6, without causing uneven cleaning on the surface of the substrate,
The surface of the substrate can be scrubbed well.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a wafer cleaning apparatus as a substrate processing apparatus according to the present invention.

FIG. 2 is a view conceptually showing a cross section taken along a cutting line II-II in FIG. 1;

FIG. 3 is a perspective view illustrating a configuration of a holding roller according to the first embodiment.

FIG. 4 is a side view of the holding roller shown in FIG.

FIG. 5 is a perspective view illustrating a configuration of a holding roller according to a second embodiment.

FIG. 6 is a side view of the holding roller shown in FIG.

FIG. 7 is a perspective view illustrating a configuration of a holding roller according to a third embodiment.

FIG. 8 is a side view of the holding roller shown in FIG. 7;

FIG. 9 is a front view showing a schematic configuration of a conventional substrate processing apparatus.

FIG. 10 is a side view of the conventional substrate processing apparatus shown in FIG.

FIG. 11 is a side view showing the shape of a conventional holding roller.

[Explanation of symbols]

 6 Wafer holding device (substrate holding device) 7 Double-sided cleaning device (double-sided scrub cleaning means) 13, 33, 110, 120 Holding roller 21, 41 Roller shaft (center shaft) 66, 86 Cleaning brush (scrub cleaning member) 101, 111, 121 Cylindrical surface 102 Lower conical surface 103 Upper conical surface

Claims (6)

[Claims] 1. A substrate holding device for rotating a substantially circular substrate while holding it horizontally, comprising at least three rotatable holding rollers having a center axis substantially parallel to a vertical direction, On the side surface of the roller, the vertical width is equal to or greater than the thickness of the substrate to be held, and the cylindrical surface on which the end surface of the substrate to be held abuts, and the lower surface which spreads downward from the lower peripheral edge of the cylindrical surface. A substrate holding device having a conical surface. 2. The substrate holding apparatus according to claim 1, wherein an upper conical surface extending upward from a peripheral edge of an upper end of the cylindrical surface is further formed on a side surface of the holding roller. 3. The substrate holding device according to claim 1, wherein the vertical width of the cylindrical surface is 1 mm or less. 4. The substrate holding apparatus according to claim 1, wherein said cylindrical surface is formed continuously to an upper end of said holding roller. 5. A substrate processing apparatus comprising: the substrate holding device according to claim 1; and a rotation drive source for rotating at least one of the holding rollers. apparatus. 6. A pair of scrub cleaning members provided to face each other with the substrate held by the substrate holding device interposed therebetween, and both surfaces of the substrate for scrub cleaning with the pair of scrub cleaning members. The substrate processing apparatus according to claim 5, further comprising a scrub cleaning unit.