JPH10229101A - 超音波ワイヤボンディングツール - Google Patents

超音波ワイヤボンディングツール

Info

Publication number
JPH10229101A
JPH10229101A JP9049818A JP4981897A JPH10229101A JP H10229101 A JPH10229101 A JP H10229101A JP 9049818 A JP9049818 A JP 9049818A JP 4981897 A JP4981897 A JP 4981897A JP H10229101 A JPH10229101 A JP H10229101A
Authority
JP
Japan
Prior art keywords
wire
bonding
connection point
ultrasonic
pressing surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9049818A
Other languages
English (en)
Inventor
Noriaki Matsumoto
憲明 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daishinku Corp
Original Assignee
Daishinku Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daishinku Corp filed Critical Daishinku Corp
Priority to JP9049818A priority Critical patent/JPH10229101A/ja
Publication of JPH10229101A publication Critical patent/JPH10229101A/ja
Pending legal-status Critical Current

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    • H01—ELECTRIC ELEMENTS
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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  • Engineering & Computer Science (AREA)
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  • Wire Bonding (AREA)

Abstract

(57)【要約】 【課題】 ボンディング作業を向上させることのできる
超音波ワイヤボンディングツールを提供する。 【解決手段】 ボンディングツール１は硬質の金属材料
からなり、その先端部分にアルミニウムからなるワイヤ
Ｗを側面から底面の押圧面１２に斜めに導くガイド孔１
１が形成されている。前記押圧面はガイド孔の開口部１
２ａの全周にわたってリング状に形成されている。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は、例えば半導体素子、弾
性表面波素子等の製造において、素子（チップ）に形成
された電極パッドとパッケージの電極パッドとを電気的
に接合するワイヤボンディングに使用する超音波ワイヤ
ボンディングツールに関するものである。
【０００２】
【従来の技術】半導体素子等のパッケージへの実装は、
半導体素子をパッケージに固着（ダイボンディング）し
た後、素子上の例えばアルミニウム電極パッドとパッケ
ージの電極パッドとをボンディングワイヤによって接合
する。この接続には金線等を用いた熱超音波圧着法と、
アルミニウム線等を用いた超音波圧着法（超音波ボンデ
ィング法ともいう）等がある。
【０００３】熱超音波圧着法は、ツールに金ワイヤを通
し、ワイヤ先端を放電加熱等により溶融させ、金ボール
を形成し、ツールにより金ボールを電極パッドに圧着す
る。このようにして圧着されたボンディングワイヤはボ
ール部分から垂直に立ち上がっている構成であるため、
次の接続点へのワイヤの延伸は３６０度いずれの方向へ
も可能であり、ボンディングのハンドリングが良好であ
った。
【０００４】ところで、アルミニウム線は溶融時の酸化
速度がきわめて速く、金のようにボールの形成ができな
い。よって、上記熱圧着法を適用することは不可能であ
り、このような材料については超音波圧着法が適用され
る。
【０００５】従来の超音波圧着法に用いるツール部分の
構造は図４に示すような構成であった。図４（ａ）はツ
ールの側面図、図４（ｂ）はツールの正面図、図４
（ｃ）はツールの底面図である。図４各図から明らかな
とおり、ガイド孔の開口部から一方向に設けられた押圧
面により、アルミニウム線に押圧状態で超音波振動を与
えることにより、電極パッドに溶着される。図３に示す
ように素子側の電極パッドである第１接続点Ｏにワイヤ
接続し、続いてパッケージ側の電極パッドである第２接
続点Ｐへ接続する際、押圧面の構成により、ボンディン
グ方向が一方向にしかできない。すなわち、図４（ｃ）
に示すように開口部３１ａに対して、押圧面３２が一方
向にしか設けられていないので、ボンディング方向が限
定されてしまうのである。従って、ツールの押圧面の方
向とボンディング方向が一致していれば、第２接続点で
の接続は問題なくが行えるが、一致していない場合は１
ワイヤ毎にパッケージごと素子を回転させる必要があ
り、ボンディングスピードが低下する問題点を有してい
た。すなわち、図５に示すように複数の電極パッド６１
を有するパッケージ６に複数の電極パッド５１が形成さ
れた素子５をダイボンディングし、その後ワイヤボンデ
ィングを行うにあたり、第１の接続点Ｏから第２の接続
点Ｐにボンディングツールを移動させた時、パッケージ
６を所定角度Ｒを回転させ、その後ワイヤボンディング
を行う。続いて、隣接した次の第１の接続点に移動した
際、また方向修正の回転をさせる。このようにワイヤボ
ンディング作業と回転作業を交互に繰り返しながら超音
波圧着を進め必要があり、このような交互作業は全体と
してワイヤボンディング作業効率を低下させていた。
【０００６】
【発明が解決しようとする課題】本発明は上記問題点を
解決するためになされたものであり、超音波圧着時に３
６０度のボンディング方向を得ることができ、ボンディ
ング作業を向上させることのできる超音波ワイヤボンデ
ィングツールを提供することを目的とするものである。
【０００７】
【課題を解決するための手段】上記問題点を解決するた
めに、本発明はワイヤを超音波圧着するワイヤボンダの
超音波ワイヤボンディングツールにおいて、当該超音波
ワイヤボンディングツールのワイヤに超音波振動を与え
る押圧面が、ガイド孔の開口部周囲に形成されているこ
とを特徴としている。
【０００８】
【作用】ボンディングワイヤに超音波振動を与える押圧
面が、ガイド孔の開口部の全周囲にわたって形成された
構成である。従って、これにより従来のように第２接続
点における接続時に、素子自体を押圧面に対応した適切
な方向に回転させることなく、そのまま押圧面のいずれ
かの部分で超音波振動をワイヤに対して与えれば、良好
な超音波圧着を行うことができる。ガイド孔１１と同じ
方向でボンディングする場合はワイヤＷはＷ１の位置で
接続されるが、各接続点の位置の違いにより、例えば、
点線で表したＷ２，Ｗ３に示すような位置に接続され
る。
【０００９】
【発明の実施の形態】本発明の実施の形態について図
１，図２とともに説明する。図１は本発明によるボンデ
ィングツールの先端部分の側面図であり、図２は図１の
底面図である。
【００１０】ボンディングツール１は硬質の金属材料か
らなり、その先端部分にアルミニウムからなるワイヤＷ
を側面から底面の押圧面１２に斜めに導くガイド孔１１
が形成されている。図２に示すように前記押圧面はガイ
ド孔の開口部１２ａの全周にわたってリング状に形成さ
れており、そのリングの幅は例えば７０mm程度の寸法を
有している。この寸法は取り扱うボンディングワイヤの
径によっても異なってくる。
【００１１】このようなボンディングツールを用いた一
連の超音波圧着作業について説明する。ノズル２から供
給されたワイヤＷは前記ガイド孔１１を貫通し、前記開
口部１２ａから一部が吐出された状態で、ワイヤクラン
パ２１によりクランプ（矢印Ｃ方向）されている。この
ワイヤクランパ２１はノズル２の後段に配置されてい
る。そして第１接続点の電極パッドに上方から前記押圧
面を下降させることにより、ボンディングワイヤＷは前
記押圧面１２と電極パッドに挟まれた状態となり、この
状態で超音波振動を与え超音波溶着する。その後ワイヤ
クランパのクランプ状態を解放（矢印Ｄ方向）し、ボン
ディングワイヤを延伸させながら第２の接続点の電極パ
ッドに移動し、同様にして超音波溶着する。このとき第
１の接続点から第２の接続点への方向がいずれの方向で
あっても、押圧面１２がリング状に形成されているので
良好なボンディングを行うことができる。その後、ワイ
ヤをクランプした状態で第２の接続点からボンディング
ツールを引き上げることにより、接続点近傍が切断され
て、１つのワイヤボンディングが終了する。
【００１２】
【発明の効果】本発明によれば、ボンディングワイヤに
超音波振動を与える押圧面が、ガイド孔の開口部の全周
囲にわたって形成された構成である。従って、これによ
り従来のように第２接続点における接続時に素子自体を
押圧面に対応した適切な方向に回転させることなく、そ
のまま押圧面のいずれかの部分で超音波振動をワイヤに
対して与えれば、良好な超音波圧着を行うことができ
る。よって、ボンディング作業の速度を向上させること
ができ、生産性の高い超音波圧着を実施できる。
【図面の簡単な説明】
【図１】本発明の実施例を示す側面図。
【図２】本発明の実施例を示す底面図。
【図３】従来のワイヤボンディングを示す図。
【図４】従来例を示す図。
【図５】従来例を示す図。
【符号の説明】
１、３ ボンディングツール １１，３１ ガイド孔 １２，３２ 押圧面 Ｗ ワイヤ

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】 ワイヤを超音波ボンディングするワイヤ
    ボンダの超音波ワイヤボンディングツールにおいて、当
    該超音波ワイヤボンディングツールのワイヤに超音波振
    動を与える押圧面が、ガイド孔の開口部周囲に形成され
    ていることを特徴とする超音波ワイヤボンディングツー
    ル。
JP9049818A 1997-02-17 1997-02-17 超音波ワイヤボンディングツール Pending JPH10229101A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9049818A JPH10229101A (ja) 1997-02-17 1997-02-17 超音波ワイヤボンディングツール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9049818A JPH10229101A (ja) 1997-02-17 1997-02-17 超音波ワイヤボンディングツール

Publications (1)

Publication Number Publication Date
JPH10229101A true JPH10229101A (ja) 1998-08-25

Family

ID=12841705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9049818A Pending JPH10229101A (ja) 1997-02-17 1997-02-17 超音波ワイヤボンディングツール

Country Status (1)

Country Link
JP (1) JPH10229101A (ja)

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