JPH10189438A - 半導体製造用の自動シンナー供給装置及び供給方法 - Google Patents

半導体製造用の自動シンナー供給装置及び供給方法

Info

Publication number
JPH10189438A
JPH10189438A JP9298363A JP29836397A JPH10189438A JP H10189438 A JPH10189438 A JP H10189438A JP 9298363 A JP9298363 A JP 9298363A JP 29836397 A JP29836397 A JP 29836397A JP H10189438 A JPH10189438 A JP H10189438A
Authority
JP
Japan
Prior art keywords
thinner
supply tank
supply
automatic
auxiliary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9298363A
Other languages
English (en)
Japanese (ja)
Inventor
Zaiei U
在 永 禹
Keiso Sai
圭 相 崔
Yuretsu Sai
佑 烈 崔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JPH10189438A publication Critical patent/JPH10189438A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
JP9298363A 1996-12-23 1997-10-30 半導体製造用の自動シンナー供給装置及び供給方法 Pending JPH10189438A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1996-70676 1996-12-23
KR1019960070676A KR19980051761A (ko) 1996-12-23 1996-12-23 반도체 제조용 자동시너공급장치 및 자동시너공급방법

Publications (1)

Publication Number Publication Date
JPH10189438A true JPH10189438A (ja) 1998-07-21

Family

ID=19490447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9298363A Pending JPH10189438A (ja) 1996-12-23 1997-10-30 半導体製造用の自動シンナー供給装置及び供給方法

Country Status (3)

Country Link
JP (1) JPH10189438A (ko)
KR (1) KR19980051761A (ko)
TW (1) TW352451B (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008539078A (ja) * 2005-04-25 2008-11-13 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 空検出機能付きライナ式液体保存・分配システム
JP2009027165A (ja) * 2007-07-23 2009-02-05 Asml Netherlands Bv 少量レジストディスペンサ
JP2009130031A (ja) * 2007-11-21 2009-06-11 Fujitsu Microelectronics Ltd 半導体装置の製造方法
JP2009524515A (ja) * 2006-01-27 2009-07-02 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード 複数種の前駆体のディスペンサ装置
US9079758B2 (en) 2005-06-06 2015-07-14 Advanced Technology Materials, Inc. Fluid storage and dispensing systems and processes

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050022430A (ko) * 2003-08-30 2005-03-08 동부아남반도체 주식회사 매엽식 습식세정장치의 탈이온수 공급 시스템 및 그 방법
KR100790736B1 (ko) * 2003-11-13 2007-12-31 동부일렉트로닉스 주식회사 웨이퍼 세정 장비의 세정수 공급 장치 및 방법
KR101390808B1 (ko) * 2010-08-18 2014-04-30 세메스 주식회사 약액 공급 장치
KR102612181B1 (ko) * 2016-08-01 2023-12-12 세메스 주식회사 기판 처리 장치 및 탱크 유닛
CN109890494B (zh) * 2016-12-28 2021-10-19 奥加诺株式会社 稀释液制造装置及稀释液制造方法
KR102305899B1 (ko) * 2019-04-23 2021-09-29 주식회사 에이아이코리아 전해질 이송 장치 및 이를 포함하는 안전 시스템

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008539078A (ja) * 2005-04-25 2008-11-13 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 空検出機能付きライナ式液体保存・分配システム
US8322571B2 (en) 2005-04-25 2012-12-04 Advanced Technology Materials, Inc. Liner-based liquid storage and dispensing systems with empty detection capability
US9073028B2 (en) 2005-04-25 2015-07-07 Advanced Technology Materials, Inc. Liner-based liquid storage and dispensing systems with empty detection capability
JP2015157286A (ja) * 2005-04-25 2015-09-03 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 空検出機能付きライナ式液体保存・分配システム
JP2015163401A (ja) * 2005-04-25 2015-09-10 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 空検出機能付きライナ式液体保存・分配システム
US9802749B2 (en) 2005-04-25 2017-10-31 Entegris, Inc. Liner-based liquid storage and dispensing systems with empty detection capability
US9079758B2 (en) 2005-06-06 2015-07-14 Advanced Technology Materials, Inc. Fluid storage and dispensing systems and processes
US9802808B2 (en) 2005-06-06 2017-10-31 Entegris, Inc. Fluid storage and dispensing systems and processes
JP2009524515A (ja) * 2006-01-27 2009-07-02 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード 複数種の前駆体のディスペンサ装置
JP2009027165A (ja) * 2007-07-23 2009-02-05 Asml Netherlands Bv 少量レジストディスペンサ
JP2009130031A (ja) * 2007-11-21 2009-06-11 Fujitsu Microelectronics Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
TW352451B (en) 1999-02-11
KR19980051761A (ko) 1998-09-25

Similar Documents

Publication Publication Date Title
KR100780718B1 (ko) 도포액 공급장치를 구비한 슬릿코터
JPH10189438A (ja) 半導体製造用の自動シンナー供給装置及び供給方法
US7944363B2 (en) Apparatus and method of sensing leakage of chemical liquid
US20170087507A1 (en) Tail gas treatment device and tail gas treatment method
US6024249A (en) Fluid delivery system using an optical sensor to monitor for gas bubbles
JP2000223393A (ja) 処理液供給装置
KR100507617B1 (ko) 웨이퍼 코팅용 약액 공급감시방법 및 그 공급감시와 공급제어용 유량계측시스템
JP3032428B2 (ja) 液体供給装置
JP2004128441A (ja) 半導体コーティング設備のフォトレジストパージ制御装置及びフォトレジストパージ制御方法
CN207502908U (zh) 一种光阻供应系统
US20230021980A1 (en) Cleaning machine and cleaning method of photomask pellicle
KR100436550B1 (ko) 반도체 제조 공정에서 사용되는 약액 공급 장치
CN108580079A (zh) 喷涂光阻的系统
KR100780936B1 (ko) 화학용액 내에 포함된 기포를 제거하기 위한 기포제거장치및 이를 이용한 기포제거방법
CN208848033U (zh) 供给系统
CN112435941A (zh) 单片湿法清洗机台的防滴液装置
JP3175394U (ja) 処理液の脱気装置
JP2004247509A (ja) ウェット処理装置およびウェット処理方法
KR100940405B1 (ko) 포토레지스트 노즐팁 세정장치
JP2003017380A (ja) フォトレジスト吐出し監視装置
KR20220099091A (ko) 액 공급 장치, 액 공급 방법 및 컴퓨터 기억 매체
KR20070007450A (ko) 케미컬 필터상태 검출장치
KR100940486B1 (ko) 약액 디스펜싱 상태 감시방법
JP6672719B2 (ja) 洗浄システム及び洗浄方法
JP4037696B2 (ja) スプレーガン及びスプレー条件の管理方法およびその管理に用いるエア測定装置