TW352451B - Automatic thinner supplying apparatus and method for semiconductor manufacturing process - Google Patents

Automatic thinner supplying apparatus and method for semiconductor manufacturing process

Info

Publication number
TW352451B
TW352451B TW086109473A TW86109473A TW352451B TW 352451 B TW352451 B TW 352451B TW 086109473 A TW086109473 A TW 086109473A TW 86109473 A TW86109473 A TW 86109473A TW 352451 B TW352451 B TW 352451B
Authority
TW
Taiwan
Prior art keywords
manufacturing process
semiconductor manufacturing
supplying apparatus
automatic
automatic thinner
Prior art date
Application number
TW086109473A
Other languages
Chinese (zh)
Inventor
Jae-Young Woo
Kyue-Sang Choi
Woo-Youl Choi
Original Assignee
Samsung Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electron Co Ltd filed Critical Samsung Electron Co Ltd
Application granted granted Critical
Publication of TW352451B publication Critical patent/TW352451B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

An automatic thinner supply apparatus is used to clean wafer rinsing nozzle, including: a main supply tank; an auxuiliary supply tank connected to the main supply tank by the supply pipe; and a manifold connected to the auxiliary tank and having spray nozzle at the end.
TW086109473A 1996-12-23 1997-07-03 Automatic thinner supplying apparatus and method for semiconductor manufacturing process TW352451B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960070676A KR19980051761A (en) 1996-12-23 1996-12-23 Automatic thinner supply device and automatic thinner supply method for semiconductor manufacturing

Publications (1)

Publication Number Publication Date
TW352451B true TW352451B (en) 1999-02-11

Family

ID=19490447

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086109473A TW352451B (en) 1996-12-23 1997-07-03 Automatic thinner supplying apparatus and method for semiconductor manufacturing process

Country Status (3)

Country Link
JP (1) JPH10189438A (en)
KR (1) KR19980051761A (en)
TW (1) TW352451B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI759381B (en) * 2016-12-28 2022-04-01 日商奧璐佳瑙股份有限公司 Diluted solution producing device and diluted solution producing method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050022430A (en) * 2003-08-30 2005-03-08 동부아남반도체 주식회사 System and method for emergency de-ionized water supply in a single wet station
KR100790736B1 (en) * 2003-11-13 2007-12-31 동부일렉트로닉스 주식회사 Apparatus and method for supplying cleansing water of wafer cleaning equipment
MY172404A (en) 2005-04-25 2019-11-23 Entegris Inc Liner-based liquid storage and dispensing systems with empty detection capability
JP5475990B2 (en) 2005-06-06 2014-04-16 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド Liquid medium supply system and liquid medium supply method
US20070175392A1 (en) * 2006-01-27 2007-08-02 American Air Liquide, Inc. Multiple precursor dispensing apparatus
NL1035684A1 (en) * 2007-07-23 2009-01-27 Asml Netherlands Bv Small Volume Resist Dispenser.
JP2009130031A (en) * 2007-11-21 2009-06-11 Fujitsu Microelectronics Ltd Manufacturing method of semiconductor device
KR101390808B1 (en) * 2010-08-18 2014-04-30 세메스 주식회사 Solution supplying apparatus
KR102612181B1 (en) * 2016-08-01 2023-12-12 세메스 주식회사 Substrate treating apparatus and tank unit
KR102305899B1 (en) * 2019-04-23 2021-09-29 주식회사 에이아이코리아 Apparatus for transferring electrolyte and safety system including the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI759381B (en) * 2016-12-28 2022-04-01 日商奧璐佳瑙股份有限公司 Diluted solution producing device and diluted solution producing method

Also Published As

Publication number Publication date
JPH10189438A (en) 1998-07-21
KR19980051761A (en) 1998-09-25

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