KR100413030B1 - Semiconductor wafer cleaning and drying apparatus - Google Patents

Semiconductor wafer cleaning and drying apparatus Download PDF

Info

Publication number
KR100413030B1
KR100413030B1 KR1020020059765A KR20020059765A KR100413030B1 KR 100413030 B1 KR100413030 B1 KR 100413030B1 KR 1020020059765 A KR1020020059765 A KR 1020020059765A KR 20020059765 A KR20020059765 A KR 20020059765A KR 100413030 B1 KR100413030 B1 KR 100413030B1
Authority
KR
South Korea
Prior art keywords
ipa
cleaning solution
cleaning
semiconductor wafer
tanks
Prior art date
Application number
KR1020020059765A
Other languages
Korean (ko)
Inventor
Joong Yeon Lee
Neung Goo Yoon
Chang Keun Lee
Original Assignee
Tech Ltd A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tech Ltd A filed Critical Tech Ltd A
Priority to KR1020020059765A priority Critical patent/KR100413030B1/en
Priority to TW092103876A priority patent/TW200303581A/en
Priority to EP03100480A priority patent/EP1351280A2/en
Priority to JP2003051446A priority patent/JP2003297795A/en
Priority to CN03104943A priority patent/CN1441466A/en
Priority to US10/373,684 priority patent/US20030159713A1/en
Application granted granted Critical
Publication of KR100413030B1 publication Critical patent/KR100413030B1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: A semiconductor wafer cleaning and drying apparatus is provided to be capable of completely carrying out a wafer cleaning and drying process, preventing the waste of a cleaning solution, and reducing environmental pollution. CONSTITUTION: A semiconductor wafer cleaning and drying apparatus is provided with a process bath(10) for receiving a cleaning solution supplied from the outside and carrying out a cleaning and drying process at a wafer, and a cleaning solution mixing unit(50). At this time, the cleaning solution mixing unit includes a pair of IPA tanks(18,19) for storing the IPA supplied from the outside, a pair of mixing tanks(24,25) connected through the IPA tanks for mixing the IPA and deionized water, and a flow sensing part for detecting the flow of the IPA and deionized water. The semiconductor wafer further includes a cleaning solution supply part(52) for connecting the mixing tanks with the process bath, and a return line(54) for returning the used cleaning solution of the process bath to the mixing tanks.
KR1020020059765A 2002-02-28 2002-10-01 Semiconductor wafer cleaning and drying apparatus KR100413030B1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020020059765A KR100413030B1 (en) 2002-10-01 2002-10-01 Semiconductor wafer cleaning and drying apparatus
TW092103876A TW200303581A (en) 2002-02-28 2003-02-25 Method and apparatus for cleaning and drying semiconductor wafer
EP03100480A EP1351280A2 (en) 2002-02-28 2003-02-27 Method and apparatus for cleaning and drying semiconductor wafers
JP2003051446A JP2003297795A (en) 2002-02-28 2003-02-27 Cleaner and dryer, and cleaning and drying method of semiconductor wafer
CN03104943A CN1441466A (en) 2002-02-28 2003-02-27 Method and device for cleaning and drying semiconductor crystal
US10/373,684 US20030159713A1 (en) 2002-02-28 2003-02-27 Method and apparatus for cleaning and drying semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020020059765A KR100413030B1 (en) 2002-10-01 2002-10-01 Semiconductor wafer cleaning and drying apparatus

Publications (1)

Publication Number Publication Date
KR100413030B1 true KR100413030B1 (en) 2003-12-31

Family

ID=37422979

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020059765A KR100413030B1 (en) 2002-02-28 2002-10-01 Semiconductor wafer cleaning and drying apparatus

Country Status (1)

Country Link
KR (1) KR100413030B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100693248B1 (en) 2004-11-12 2007-03-13 삼성전자주식회사 Drying apparatus used in manufacturing semiconductor devices
KR100862911B1 (en) * 2006-11-14 2008-10-13 무진전자 주식회사 Method for cleaning a substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722364A (en) * 1993-07-05 1995-01-24 Hitachi Ltd Method and equipment for cleaning wafer
JPH1041267A (en) * 1996-07-19 1998-02-13 Kaijo Corp Substrate cleaning and drying apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722364A (en) * 1993-07-05 1995-01-24 Hitachi Ltd Method and equipment for cleaning wafer
JPH1041267A (en) * 1996-07-19 1998-02-13 Kaijo Corp Substrate cleaning and drying apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100693248B1 (en) 2004-11-12 2007-03-13 삼성전자주식회사 Drying apparatus used in manufacturing semiconductor devices
KR100862911B1 (en) * 2006-11-14 2008-10-13 무진전자 주식회사 Method for cleaning a substrate

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