JPH0228945A - Surface treating apparatus for semiconductor device - Google Patents

Abstract

PURPOSE:To make it possible to perform continuous treatments of burning and deburring by constituting an apparatus with a supplying part which supplies a semiconductor device that is not treated into the next step, a burning part which treats the surface of the semiconductor device that is supplied from the supplying part, a deburring part, and a containing part which contains the semiconductor device whose surface is treated. CONSTITUTION:A semiconductor device 1 which is contained in a magazine 2A of a supplying part A is moved into a burning part B with a sucking pad 3A. When the semiconductor device 1 is made to pass under a flame 10 jetted from a burner 9, the surface of the resin part of the semiconductor device 1 is burned. Then, the semiconductor device 1 is moved on a conveyer 5 of a deburring part C and passed through a lower water-pressure nozzle 4A and an upper water-pressure nozzle 4B which jet high pressure water. Thus deburring is performed. The semiconductor device whose deburring has been finished is contained in a magazine 2B with a sucking pad 3B of a containing part D. In this way, the burning and deburring can be performed continuously.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a surface treatment apparatus for plastic semiconductor devices.

[Conventional technology]

An example of a conventional device of this kind is shown in FIG. 2(a).

(b) will be explained. FIG. 2(a) shows a schematic structure of a deburring device, and FIG. 2(b) shows a schematic structure of a burning processing device. In FIG. 2, 1 is a semiconductor device;
2A is an inloader magazine for storing the semiconductor device 1 on the supply side, 2B is an outloader magazine for taking out the semiconductor device 1, 3A is an inloader suction pad, 3B is an outloader suction pad, 4A is a sewage pressure nozzle, and 4B is an upper a water pressure nozzle; 5 a conveyor for transporting the semiconductor device 1; 6;
is a drive motor that drives the conveyor 5, and 7 is a high-pressure supply pump. 8 is hydrogen gas tank, 9 is burner, 10
indicates a flame caused by hydrogen gas combustion. Further, 11 indicates a cover rail.

Next, the operation will be explained.

In FIG. 2(a), the semiconductor device 1 housed in the inloader magazine 2A is transferred onto the transport conveyor 5 by the rotating inloader suction pad 3A. Next, the water is sent by the conveyor 5 to a sewage pressure nozzle 4A section that injects high-pressure water, and the lower portion of the semiconductor device 1 is deburred. At this time, the semiconductor device 1 is positioned by the cover rail 11 so that it does not jump out from the conveyor 5. Next, it is transferred to the water pressure nozzle 4B section, and the upper portion is deburred. Next, the semiconductor device 1 that has been deburred is attached to the outloader magazine 2B using the outloader suction pad 3B.
and the deburring work is completed. After this, the semiconductor device 1 is subjected to a plating process. After that, Fig. 2(b)
The burning process is performed using the burning device shown in . That is, in FIG. 2(b), the semiconductor device 1 transferred by the conveyor 5 is subjected to a burning process by the flame 10 caused by combustion of hydrogen gas in the burner 9. The burning process burns off mold release agent, dirt, etc. adhering to the surface of the plastic body of the semiconductor device 1 and cleans it.

[Problem to be solved by the invention]

Conventional semiconductor device surface treatment equipment equipped with deburring equipment and burning processing equipment performs deburring work and burning work separately, so deburring work and burning work are processed in two operations and with two types of equipment. This requires a lot of man-hours. In addition, there were other problems such as the need for maintenance and management of two types of equipment.

This invention was made in order to solve the above-mentioned problems, and aims to provide a surface treatment device for semiconductor devices that performs deburring and burning in a series of work processes, and that facilitates maintenance management. do.

[Means to solve the problem]

The surface processing apparatus for semiconductor devices according to the present invention includes a supply section that supplies unprocessed semiconductor devices to the next process, a burning processing section and a deburring processing section that perform surface processing on the semiconductor devices supplied from the supply section, and a surface treatment section that processes the semiconductor devices supplied from the supply section. and a storage section for storing processed semiconductor devices.

[Effect]

In the present invention, since the burning treatment section for surface-treating the semiconductor device and the deburring section are configured into an integrated device, the burning treatment and the deburring treatment can be performed in a series of steps.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG.

In FIG. 1, the same reference numerals as in FIG. 2 indicate the same components, but in this embodiment, the deburring section and the burning section can be processed in a series of steps. That is, A indicates a supply section for the semiconductor device 1, B indicates a burning processing section, C indicates a deburring section, and D indicates a storage section for storing the processed semiconductor device 1.

Next, the operation will be explained.

In FIG. 1, a semiconductor device 1 housed in an inloader magazine 2A of a supply section A is attached to an inloader suction pad 3.
It is transferred to the burning processing section B by A. Then,
The surface of the resin portion of the semiconductor device 1 is subjected to a burning process by passing under the flame 10 ejected by burning hydrogen gas from the burner 9 of the burning process section B. Next, the semiconductor device 1 is transferred to the conveyor 5 of the deburring section C, where it is transferred to the sewage pressure nozzle 4A and the water pressure nozzle 4 that spray high-pressure water.
Pass through part B. At this point, the lower and upper parts of the semiconductor device 1 are deburred. Furthermore, the cover rail 11 is used to position the semiconductor device 1 so that it does not fall off the transport rail of the conveyor 5 by spraying high-pressure water. Next, the semiconductor device 1 that has undergone the deburring process is stored in the outloader magazine 2B by the outloader suction pad 3B in the storage section. With the above steps, the burning process and the deburring process can be performed in conjunction with each other.

In the above embodiment, the deburring process is performed after the burning process is completed, but the burning process may be performed after the deburring process.

〔Effect of the invention〕

As explained above, the present invention includes a supply section that supplies unprocessed semiconductor devices to the next process, a burning processing section and a deburring processing section that perform surface treatment on the semiconductor devices supplied from the supply section, and a surface IA buried processing section. Since it consists of a storage section for storing semiconductor devices, it is possible to carry out burning and deburring processes continuously, which has the effect of making the device cheaper and allowing assembly and processing of semiconductor devices with fewer man-hours. .

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an embodiment of the present invention, and FIG. 2 is a schematic diagram showing a conventional example. In the figure, 1 is a semiconductor device, 2A is an inloader magazine, 2B is an outloader magazine, 3A is an inloader suction pad, 3B is an outloader suction pad, 4A is a sewer pressure nozzle, 4B is a water pressure nozzle, 5 is a conveyor, and 6 is a drive motor, 7 is a high pressure supply pump, 8 is a hydrogen gas tank,
9 is a burner, 10 is a flame, 11 is a cover rail, A is a supply section, B is a burning processing section, C is a deburring section, and D is a storage section. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] a supply section for supplying unprocessed semiconductor devices to the next process; a burning processing section and a deburring processing section for surface-treating the semiconductor devices supplied from the supply section; and a storage section for storing the surface-treated semiconductor devices. A surface treatment apparatus for a semiconductor device, comprising: