JPH10186005A - 実装済み回路基板のガイド付きプローブ試験用取付具 - Google Patents
実装済み回路基板のガイド付きプローブ試験用取付具Info
- Publication number
- JPH10186005A JPH10186005A JP9296507A JP29650797A JPH10186005A JP H10186005 A JPH10186005 A JP H10186005A JP 9296507 A JP9296507 A JP 9296507A JP 29650797 A JP29650797 A JP 29650797A JP H10186005 A JPH10186005 A JP H10186005A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- test
- fixture
- target
- tester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 360
- 239000000523 sample Substances 0.000 claims abstract description 484
- 238000010618 wire wrap Methods 0.000 claims description 39
- 241001149900 Fusconaia subrotunda Species 0.000 claims description 6
- 230000002860 competitive effect Effects 0.000 abstract description 2
- 238000013519 translation Methods 0.000 description 58
- 239000007787 solid Substances 0.000 description 43
- 230000006835 compression Effects 0.000 description 38
- 238000007906 compression Methods 0.000 description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 8
- 230000004907 flux Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000000712 assembly Effects 0.000 description 6
- 238000000429 assembly Methods 0.000 description 6
- 230000007704 transition Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000000284 resting effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009527 percussion Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000013468 resource allocation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 206010026749 Mania Diseases 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 235000012773 waffles Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US739387 | 1996-10-29 | ||
| US08/739,387 US5945836A (en) | 1996-10-29 | 1996-10-29 | Loaded-board, guided-probe test fixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10186005A true JPH10186005A (ja) | 1998-07-14 |
| JPH10186005A5 JPH10186005A5 (enExample) | 2005-06-23 |
Family
ID=24972051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9296507A Pending JPH10186005A (ja) | 1996-10-29 | 1997-10-29 | 実装済み回路基板のガイド付きプローブ試験用取付具 |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US5945836A (enExample) |
| EP (5) | EP0840131B1 (enExample) |
| JP (1) | JPH10186005A (enExample) |
| DE (1) | DE69734866T2 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6194908B1 (en) | 1997-06-26 | 2001-02-27 | Delaware Capital Formation, Inc. | Test fixture for testing backplanes or populated circuit boards |
| JP2007271631A (ja) * | 2007-06-04 | 2007-10-18 | Mitsubishi Electric Corp | ウエハテスト用プローブカード |
| KR102193447B1 (ko) * | 2019-12-09 | 2020-12-21 | (주)티에스이 | 테스트 소켓 |
| KR20220041716A (ko) * | 2020-09-25 | 2022-04-01 | 에세, 아이엔씨. | 이중 각도 공동을 갖는 집적 회로 디바이스 테스트 툴링 |
Families Citing this family (117)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6380751B2 (en) | 1992-06-11 | 2002-04-30 | Cascade Microtech, Inc. | Wafer probe station having environment control enclosure |
| US5345170A (en) | 1992-06-11 | 1994-09-06 | Cascade Microtech, Inc. | Wafer probe station having integrated guarding, Kelvin connection and shielding systems |
| US5561377A (en) | 1995-04-14 | 1996-10-01 | Cascade Microtech, Inc. | System for evaluating probing networks |
| US6232789B1 (en) | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
| US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
| US6002263A (en) | 1997-06-06 | 1999-12-14 | Cascade Microtech, Inc. | Probe station having inner and outer shielding |
| JPH1164426A (ja) * | 1997-08-25 | 1999-03-05 | I C T:Kk | プリント基板の検査装置およびプリント基板の検査 装置の組み立てキット |
| US6066957A (en) * | 1997-09-11 | 2000-05-23 | Delaware Capital Formation, Inc. | Floating spring probe wireless test fixture |
| JPH1197494A (ja) * | 1997-09-18 | 1999-04-09 | Hitachi Ltd | 半導体装置およびその製造方法 |
| US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
| IT1309343B1 (it) * | 1999-02-09 | 2002-01-22 | Tecno Test Di De Rossi Michele | Sistema di accoppiamento e centraggio particolarmente perl'allineamento di circuiti stampati durante le procedure |
| US6191601B1 (en) * | 1999-02-22 | 2001-02-20 | Delaware Capital Formation, Inc. | Test fixture for matched impedance testing |
| US6578264B1 (en) | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
| US6445202B1 (en) | 1999-06-30 | 2002-09-03 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
| US6838890B2 (en) | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
| US6650134B1 (en) * | 2000-02-29 | 2003-11-18 | Charles A. Schein | Adapter assembly for connecting test equipment to a wireless test fixture |
| US6424164B1 (en) * | 2000-06-13 | 2002-07-23 | Kulicke & Soffa Investment, Inc. | Probe apparatus having removable beam probes |
| US6914423B2 (en) | 2000-09-05 | 2005-07-05 | Cascade Microtech, Inc. | Probe station |
| US6965226B2 (en) | 2000-09-05 | 2005-11-15 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| DE20114544U1 (de) | 2000-12-04 | 2002-02-21 | Cascade Microtech, Inc., Beaverton, Oreg. | Wafersonde |
| US6885205B2 (en) * | 2000-12-13 | 2005-04-26 | Seagate Technology Llc | Test fixture assembly for printed circuit boards |
| US6970634B2 (en) * | 2001-05-04 | 2005-11-29 | Cascade Microtech, Inc. | Fiber optic wafer probe |
| US20020180469A1 (en) * | 2001-05-31 | 2002-12-05 | Jichen Wu | Reusable test jig |
| US6628130B2 (en) * | 2001-07-18 | 2003-09-30 | Agilent Technologies, Inc. | Wireless test fixture for printed circuit board test systems |
| AU2002327490A1 (en) | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
| US6836135B2 (en) * | 2001-08-31 | 2004-12-28 | Cascade Microtech, Inc. | Optical testing device |
| US6777964B2 (en) | 2002-01-25 | 2004-08-17 | Cascade Microtech, Inc. | Probe station |
| WO2003085988A1 (en) * | 2002-04-04 | 2003-10-16 | Grass Valley (U.S.) Inc. | Modular broadcast television products |
| EP1509776A4 (en) | 2002-05-23 | 2010-08-18 | Cascade Microtech Inc | PROBE TO TEST ANY TESTING EQUIPMENT |
| US7059046B2 (en) * | 2002-06-24 | 2006-06-13 | Delaware Capital Formation, Inc. | Method for producing a captive wired test fixture and fixture therefor |
| US6784675B2 (en) * | 2002-06-25 | 2004-08-31 | Agilent Technologies, Inc. | Wireless test fixture adapter for printed circuit assembly tester |
| US6677772B1 (en) | 2002-08-21 | 2004-01-13 | Micron Technology, Inc. | Contactor with isolated spring tips |
| US6847219B1 (en) | 2002-11-08 | 2005-01-25 | Cascade Microtech, Inc. | Probe station with low noise characteristics |
| US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
| US7250779B2 (en) | 2002-11-25 | 2007-07-31 | Cascade Microtech, Inc. | Probe station with low inductance path |
| US6861856B2 (en) | 2002-12-13 | 2005-03-01 | Cascade Microtech, Inc. | Guarded tub enclosure |
| US7100273B2 (en) * | 2003-03-03 | 2006-09-05 | Hewlett-Packard Development Company, L.P. | Interconnect validation instruments |
| US7221172B2 (en) | 2003-05-06 | 2007-05-22 | Cascade Microtech, Inc. | Switched suspended conductor and connection |
| US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
| US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| WO2006017078A2 (en) | 2004-07-07 | 2006-02-16 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
| US7250626B2 (en) | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
| US7187188B2 (en) | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
| DE112004002554T5 (de) | 2003-12-24 | 2006-11-23 | Cascade Microtech, Inc., Beaverton | Active wafer probe |
| US7733101B2 (en) * | 2004-05-21 | 2010-06-08 | Microprobe, Inc. | Knee probe having increased scrub motion |
| US9476911B2 (en) | 2004-05-21 | 2016-10-25 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
| USRE43503E1 (en) | 2006-06-29 | 2012-07-10 | Microprobe, Inc. | Probe skates for electrical testing of convex pad topologies |
| US8988091B2 (en) | 2004-05-21 | 2015-03-24 | Microprobe, Inc. | Multiple contact probes |
| US7659739B2 (en) * | 2006-09-14 | 2010-02-09 | Micro Porbe, Inc. | Knee probe having reduced thickness section for control of scrub motion |
| US7759949B2 (en) | 2004-05-21 | 2010-07-20 | Microprobe, Inc. | Probes with self-cleaning blunt skates for contacting conductive pads |
| US9097740B2 (en) | 2004-05-21 | 2015-08-04 | Formfactor, Inc. | Layered probes with core |
| EP1754072A2 (en) | 2004-06-07 | 2007-02-21 | CASCADE MICROTECH, INC. (an Oregon corporation) | Thermal optical chuck |
| US7330041B2 (en) | 2004-06-14 | 2008-02-12 | Cascade Microtech, Inc. | Localizing a temperature of a device for testing |
| DE202005021435U1 (de) | 2004-09-13 | 2008-02-28 | Cascade Microtech, Inc., Beaverton | Doppelseitige Prüfaufbauten |
| US7081869B2 (en) * | 2004-10-13 | 2006-07-25 | Research In Motion Limited | Test fixture for assembled wireless devices |
| US7071717B2 (en) * | 2004-10-28 | 2006-07-04 | Agilent Technologies, Inc. | Universal test fixture |
| US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
| US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
| US7030636B1 (en) | 2005-05-02 | 2006-04-18 | Fargo Assembly Company | Low pin testing system |
| US7298153B2 (en) * | 2005-05-25 | 2007-11-20 | Interconnect Devices, Inc. | Eccentric offset Kelvin probe |
| US7449899B2 (en) | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
| WO2006137979A2 (en) | 2005-06-13 | 2006-12-28 | Cascade Microtech, Inc. | Wideband active-passive differential signal probe |
| US7511517B2 (en) * | 2005-11-08 | 2009-03-31 | Qualitau, Inc. | Semi-automatic multiplexing system for automated semiconductor wafer testing |
| US7649367B2 (en) | 2005-12-07 | 2010-01-19 | Microprobe, Inc. | Low profile probe having improved mechanical scrub and reduced contact inductance |
| US7312617B2 (en) | 2006-03-20 | 2007-12-25 | Microprobe, Inc. | Space transformers employing wire bonds for interconnections with fine pitch contacts |
| US7616019B2 (en) | 2006-05-08 | 2009-11-10 | Aspen Test Engineering, Inc. | Low profile electronic assembly test fixtures |
| DE112007001399T5 (de) | 2006-06-09 | 2009-05-07 | Cascade Microtech, Inc., Beaverton | Messfühler für differentielle Signale mit integrierter Symmetrieschaltung |
| US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
| US7443186B2 (en) | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
| US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
| US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
| US7786740B2 (en) | 2006-10-11 | 2010-08-31 | Astria Semiconductor Holdings, Inc. | Probe cards employing probes having retaining portions for potting in a potting region |
| US8907689B2 (en) | 2006-10-11 | 2014-12-09 | Microprobe, Inc. | Probe retention arrangement |
| US20080106294A1 (en) * | 2006-11-02 | 2008-05-08 | Stephen William Smith | Apparatus and method for universal connectivity in test applications |
| US9766268B2 (en) * | 2006-12-21 | 2017-09-19 | Essai, Inc. | Contactor with angled spring probes |
| US11378588B2 (en) | 2006-12-21 | 2022-07-05 | Essai, Inc. | Contactor with angled depressible probes in shifted bores |
| US7479794B2 (en) * | 2007-02-28 | 2009-01-20 | Sv Probe Pte Ltd | Spring loaded probe pin assembly |
| US7514948B2 (en) | 2007-04-10 | 2009-04-07 | Microprobe, Inc. | Vertical probe array arranged to provide space transformation |
| CA2592901C (en) * | 2007-07-13 | 2012-03-27 | Martin Blouin | Semi-generic in-circuit test fixture |
| US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
| DE102007047269A1 (de) * | 2007-10-02 | 2009-04-09 | Atg Luther & Maelzer Gmbh | Vollrasterkassette für einen Paralleltester zum Testen einer unbestückten Leiterplatte, Federkontaktstift für eine solche Vollrasterkassette sowie Adapter für einen Paralleltester zum Testen einer unbestückten Leiterplatte |
| US8723546B2 (en) | 2007-10-19 | 2014-05-13 | Microprobe, Inc. | Vertical guided layered probe |
| US7671610B2 (en) * | 2007-10-19 | 2010-03-02 | Microprobe, Inc. | Vertical guided probe array providing sideways scrub motion |
| MY151561A (en) * | 2007-12-06 | 2014-06-13 | Test Tooling Solutions M Sdn Bhd | Eco contactor |
| US8230593B2 (en) | 2008-05-29 | 2012-07-31 | Microprobe, Inc. | Probe bonding method having improved control of bonding material |
| US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
| US8410806B2 (en) | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
| US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
| TWM378573U (en) * | 2009-09-15 | 2010-04-11 | Microelectronics Tech Inc | Low noise block converter |
| KR100994219B1 (ko) * | 2009-11-04 | 2010-11-12 | 리노공업주식회사 | 반도체 칩 검사용 소켓 |
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| US8829937B2 (en) | 2011-01-27 | 2014-09-09 | Formfactor, Inc. | Fine pitch guided vertical probe array having enclosed probe flexures |
| CN102495301B (zh) * | 2011-11-14 | 2014-07-09 | 福建联迪商用设备有限公司 | 一种pcb板上细间距排针的测试装置及其测试方法 |
| CN103837817B (zh) * | 2012-11-26 | 2016-08-10 | 昆山威典电子有限公司 | Pcb板推块两段式测试结构 |
| US20150054537A1 (en) * | 2013-08-22 | 2015-02-26 | Corad Technology Inc. | System and method for assembling a probe head |
| US9274166B2 (en) | 2013-08-26 | 2016-03-01 | Fujitsu Limited | Pin verification device and method |
| CN103529252B (zh) * | 2013-10-18 | 2016-09-28 | 上海华力微电子有限公司 | 直插式通用电气连接装置 |
| CN103792399A (zh) * | 2014-01-15 | 2014-05-14 | 中科华核电技术研究院有限公司北京分公司 | 多路输入输出电路板的测试夹具 |
| CN103983815A (zh) * | 2014-04-28 | 2014-08-13 | 昆山明创电子科技有限公司 | 一种pcb板小针测试治具 |
| WO2016043327A1 (ja) * | 2014-09-19 | 2016-03-24 | 日本発條株式会社 | プローブユニット |
| JP6619014B2 (ja) * | 2015-01-04 | 2019-12-11 | イル キム、 | 検査接触装置 |
| CN104931739B (zh) * | 2015-05-27 | 2017-12-12 | 苏州市职业大学 | 一种电路板测试接口的开合装置 |
| US10444260B2 (en) | 2016-07-12 | 2019-10-15 | International Business Machines Corporation | Low force wafer test probe |
| US10261108B2 (en) | 2016-07-12 | 2019-04-16 | International Business Machines Corporation | Low force wafer test probe with variable geometry |
| CN108427019B (zh) * | 2018-03-09 | 2020-06-09 | 梅州市展至电子科技有限公司 | 用于电路板故障检测的治具 |
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1997
- 1997-07-29 DE DE69734866T patent/DE69734866T2/de not_active Expired - Fee Related
- 1997-07-29 EP EP97113043A patent/EP0840131B1/en not_active Expired - Lifetime
- 1997-07-29 EP EP04027669A patent/EP1512978A3/en not_active Withdrawn
- 1997-07-29 EP EP04027686A patent/EP1512979A3/en not_active Withdrawn
- 1997-07-29 EP EP04027668A patent/EP1512977A3/en not_active Withdrawn
- 1997-07-29 EP EP04027687A patent/EP1512980A3/en not_active Withdrawn
- 1997-10-29 JP JP9296507A patent/JPH10186005A/ja active Pending
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1999
- 1999-07-07 US US09/348,523 patent/US6225817B1/en not_active Expired - Fee Related
-
2000
- 2000-06-02 US US09/586,947 patent/US6414502B1/en not_active Expired - Fee Related
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6194908B1 (en) | 1997-06-26 | 2001-02-27 | Delaware Capital Formation, Inc. | Test fixture for testing backplanes or populated circuit boards |
| JP2007271631A (ja) * | 2007-06-04 | 2007-10-18 | Mitsubishi Electric Corp | ウエハテスト用プローブカード |
| KR102193447B1 (ko) * | 2019-12-09 | 2020-12-21 | (주)티에스이 | 테스트 소켓 |
| KR20220041716A (ko) * | 2020-09-25 | 2022-04-01 | 에세, 아이엔씨. | 이중 각도 공동을 갖는 집적 회로 디바이스 테스트 툴링 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69734866T2 (de) | 2006-08-03 |
| EP1512979A3 (en) | 2005-06-15 |
| EP1512980A3 (en) | 2005-06-15 |
| US6225817B1 (en) | 2001-05-01 |
| EP0840131A2 (en) | 1998-05-06 |
| US6414502B1 (en) | 2002-07-02 |
| EP1512977A3 (en) | 2005-06-15 |
| EP0840131B1 (en) | 2005-12-14 |
| EP1512978A2 (en) | 2005-03-09 |
| EP1512979A2 (en) | 2005-03-09 |
| EP1512980A2 (en) | 2005-03-09 |
| EP0840131A3 (en) | 1999-06-09 |
| US6469531B1 (en) | 2002-10-22 |
| EP1512977A2 (en) | 2005-03-09 |
| DE69734866D1 (de) | 2006-01-19 |
| US5945836A (en) | 1999-08-31 |
| EP1512978A3 (en) | 2005-06-15 |
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