JPH10173008A - Adhesive-coated tape for tab, tab tape and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the reliability of the insulation of a TAB tape or adhesion of TAB leads by strictly controlling the fluidity of adhesive so that the max. overhang of an adhesive-coated tape for TAB is at most a specified value. SOLUTION: An adhesive-coated tape for TAB is a laminate of an insulation film 1, adhesive 2 and protective film as a basic structure. The protective film is used for the dust proofing and handling purpose. The adhesive-coated tape has a max. overhang(OH) of 20μm, pref. 2-20μm at a Cu foil laminating process. If an adhesive-coated tape having an OH value of over 20μm, foams are produced in the adhesive heating to cure step and thermally broken into defective connections or resulting in peel because of poor adhesion of TAB leads when the IC mounting or connection to a circuit board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a TAB (tape / tape).
The present invention relates to a tape with an adhesive used for a tape for mounting a semiconductor integrated circuit (hereinafter, abbreviated as a TAB tape) called an "automated bonding" method. More specifically, regarding the fluidity of the adhesive of the tape, a tape with an adhesive for TAB which is excellent in processability and productivity without extruding the adhesive or inferior connection or adhesion of the TAB lead in a TAB tape manufacturing process. Related to providing.

[0002]

2. Description of the Related Art In general, TAB tape is formed on a flexible organic insulating film such as a polyimide film.
It has a three-layer structure in which a polyester film having releasability is laminated as an adhesive layer and a protective film layer.

[0003] TAB tapes include (1) perforation of sprocket and device holes, (2) thermal lamination with copper foil,
It is processed into a TAB tape (pattern tape) through processing steps such as (3) adhesive curing, (4) pattern formation (resist coating, etching, and resist removal), and (5) tin or gold plating. FIG. 1 shows the shape of the pattern tape. FIG. 2 is a cross-sectional view of one embodiment of a semiconductor device. The inner lead portion 6 of the pattern tape is thermocompression-bonded (inner lead bonding) to the gold bump 10 of the semiconductor integrated circuit 8 to mount the semiconductor integrated circuit (IC). Next, a semiconductor device is manufactured through a resin sealing step using a sealing resin 9. Such a semiconductor device is called a tape carrier package (TCP) type semiconductor device. The TCP type semiconductor device is connected to a circuit board or the like on which other components are mounted via outer leads 7 (outer lead bonding), and is mounted on an electronic device.

On the other hand, as electronic devices have become smaller and lighter in recent years, a semiconductor package has a QFP (quad flat flat) in which conventional connection terminals (outer leads) are arranged on the side of the package for the purpose of high-density mounting. Package), S
Instead of OPs (small outline packages), BGAs (ball grid arrays), in which connection terminals are arranged on the back surface of the package, and CSPs (chip scale packages) have been used in part. BGA, C
The biggest difference between SP and QFP and SOP in terms of structure is that the former requires a substrate called an interposer, whereas the latter does not necessarily require a substrate by using a metal lead frame. On the point. As the interposer referred to here, one obtained by laminating a copper foil on an organic insulating film such as a glass epoxy substrate or polyimide is generally used. Therefore, these BGAs,
The tape with an adhesive for TAB of the present invention can also be used for semiconductor devices such as CSP, and the obtained BGA, CS
P is also included in the semiconductor device of the present invention. 3 and 4 are cross-sectional views of one embodiment of the semiconductor device (BGA, CSP) of the present invention.

[0005] Since the TAB tape ultimately remains inside the high-density package, it is required to have insulation properties, heat resistance, adhesion to copper foil, dimensional stability, and flatness.

In recent years, with the miniaturization, high performance, and high density of electronic devices, semiconductor devices mounted on them have become more sophisticated, highly integrated, and slimmer. For this reason, the miniaturization of the pitch of the electrodes of semiconductor devices and the TAB leads is progressing rapidly, and as a result, the insulating properties, the adhesive strength with the copper foil of the TAB tape, the smoothness of the adhesive surface, and the fine workability have been improved. It has become even more important.

[0007] In order to satisfy these properties, it is particularly important to control the fluidity of the adhesive. If the fluidity of the adhesive is not appropriate, insufficient adhesive strength of the TAB lead and poor connection at the time of IC mounting will occur.

That is, if the fluidity of the adhesive is large, foaming occurs in the adhesive heating and curing step, and this portion is rejected by heat during IC mounting or connection to a circuit board, resulting in poor connection or insufficient adhesion of the TAB lead. Causes peeling. In addition, since the adhesive protrudes into the device hole in which the IC is mounted, it becomes an obstacle when the IC is thermocompression-bonded, and the yield is reduced.

As a method for improving these, a method in which the weight average molecular weight of a polyamide resin as an adhesive component is specified (Japanese Patent Application Laid-Open No. 2-143447) has been proposed.

[0010]

However, although the above method has an effect of improvement, it has not been sufficient to cope with the rapid progress of miniaturization of TAB leads accompanying the recent reduction in the size and weight of electronic devices.

[0011] Accordingly, the present invention improves the reliability of the TAB tape, such as the insulating properties and the adhesive strength of the TAB lead, by strictly controlling the fluidity of the adhesive. An object of the present invention is to provide an attached tape, a TAB tape obtained therefrom, and a semiconductor device.

[0012]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a TAB adhesive tape in which an insulating film, an adhesive layer and a protective film are laminated in this order, the largest overhang (OH) of the tape. This is achieved by an adhesive tape for TAB, wherein the amount is in the range of 20 μm or less.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The tape with an adhesive for TAB of the present invention has a basic structure in which an insulating film, an adhesive and a protective film are laminated in this order.

The protective film used in the present invention is used for the purpose of preventing dust or handling.

As the protective film of the present invention, polyethylene terephthalate, polyphenylene sulfide, polyethylene, polypropylene and the like can be used. Among them, polyethylene terephthalate and polyphenylene sulfide are particularly preferable because they have a tensile modulus of elasticity and a tensile elongation suitable for punching and can form a sharp hole cross section. The thickness of the protective film may be from 10 to 100 μm, but is preferably from 20 to 40 μm.

As the insulating film used in the present invention, a so-called heat-resistant film such as polyimide, polyetherimide, or aromatic polyamide, or a composite material such as flexible epoxy / glass cloth can be used. Among them, a polyimide film is particularly preferable from the viewpoint of thermal dimensional stability.

The adhesive layer used in the present invention is preferably a thermosetting adhesive and a semi-cured adhesive. For example, it contains a polyamide resin, a phenol resin and the like. More preferably, it contains an epoxy resin, a curing agent and the like. Fine particles such as silica and alumina may be added as long as the properties of the adhesive are not deteriorated.

The polyamide resin, which is a component of the adhesive layer,
Any one obtained by thermally polymerizing a mixture of an acid and a diamine, which can be dissolved in a mixed solvent containing an alcohol such as methanol as a main component, can be used. In particular, as a raw material of the polyamide resin, a resin containing a dicarboxylic acid having 36 carbon atoms (so-called “dimer acid”) as a main component (commonly called “dimer acid polyamide”) is preferable. The polyamide resin generally has a high water absorption and thus tends to have a low insulation resistance. However, the use of dimer acid makes it possible to reduce the water absorption and increase the electrical insulation.

The dimer acid polyamide can be obtained by thermally polymerizing an equimolar mixture of dimer acid and diamine. As the dicarboxylic acid component, not only dimer acid but also other dicarboxylic acids such as azelaic acid and sebacic acid may be contained as copolymer components. At this time, the dimer acid content is more preferably 70 mol% or more in the acid component. Among the dimer acid polyamides,
Those having a high degree of polymerization are preferred because they have a relatively low water absorption rate and tend to have high electrical insulation even in a high humidity atmosphere.

The diamine components include hexamethylenediamine, ethylenediamine, piperazine, bis (4-aminocyclohexyl) methane, and bis (4-amino-1,2-)
Dimethylcyclohexyl) methane and the like,
Particularly preferred is hexamethylenediamine.
A dimer acid-based polyamide containing hexamethylenediamine as a main component is particularly preferable because it exhibits excellent characteristics in overall performance. Further, not only one kind of diamine component but also a mixture of two or more kinds can be used.

As the epoxy resin which is a component of the adhesive layer, known epoxy resins such as bisphenol type, novolak type, cresol novolak type, polyfunctional type, biphenyl type, naphthalene type and dicyclopentadiene skeleton can be used. It is.

The phenol resin, which is a component of the adhesive layer,
Known phenolic resins such as polyparavinylphenol, including various types such as novolak type, resol type and cresol novolak type can be used.

As the curing agent which is a component of the adhesive layer, a general curing agent for epoxy resin can be used. For example, diamines, acid anhydrides, Lewis acid type epoxy curing agents, and the like.

The respective component ratios in the adhesive layer are as follows: when the polyamide resin is 100 parts by weight, the epoxy resin is 3 parts by weight.
0-80 parts by weight, phenolic resin 20-70
It is selected from the range of parts by weight. The curing agent is 0.1 to 0.1.
It is preferably used in a range of 10 parts by weight.

By dissolving each of the above components in a solvent, an adhesive resin mixed solution is obtained. Solvents for dissolving each component of the adhesive include aromatic solvents such as toluene, xylene, chlorobenzene, and benzyl alcohol, and alcohol solvents such as methanol, ethanol, isopropyl alcohol, and butyl alcohol. Can be used as a mixed solvent.

A tape with an adhesive for TAB is usually produced by any of the following methods.

First, an adhesive resin mixed solution is applied to a first release film, dried, and a second release film is attached to the first release film if necessary. Next, slitting is performed to a target width. The first or second release film is peeled off from a flexible insulating film made of polyimide or the like which has been slit to a desired width in advance, and the adhesive surface is adhered.
As another method, an adhesive resin mixed solution may be directly applied to a predetermined width on the insulating film, dried, and a release film (protective film) may be attached.

Usually, it is preferable that the width of the adhesive of the tape is set to be narrower than that of the insulating film as the base material so as not to cover the portion where the sprocket holes are to be formed.

The TAB tape for mounting the IC is the above-mentioned TAB tape.
An IC is mounted on the TAB tape obtained through the following steps using a tape with an adhesive.

(1) Punching process for sprocket holes, device holes, etc. (2) Removal of protective film, copper foil laminating process (3) Adhesive heating curing process (4) Photoresist coating, pattern exposure, developing process (5) Copper Foil pattern etching step (6) Photoresist stripping step (7) (Solder resist coating step if necessary) (8) Plating step (tin, solder, gold, etc.).

The TAB adhesive tape according to the present invention has a maximum overhang (OH) amount of 20 μm or less, preferably 2 to 20 μm in the above copper foil laminating step.
More preferably, it is important to be in the range of 2 to 15 μm. When a TAB adhesive tape with a maximum overhang (OH) amount larger than 20 μm is used, foaming occurs in the adhesive heating curing step, and the part is rejected by heat during IC mounting or connection to a circuit board, resulting in poor connection. Become
It is not preferable because the TAB lead is peeled off due to insufficient adhesion. In addition, the dimensional change due to the protrusion of the adhesive into the device hole on which the IC is mounted is unfavorable because it causes an obstacle when the IC is thermocompression-bonded and lowers the yield.

The amount of overhang (OH) is defined as T
A tape with an adhesive for AB and a 25 μm electrolytic copper foil were heated at a temperature of 1
Thermocompression bonding at 30 ℃, pressure 3kg / cm, speed 1m / min, 80 ℃
Heat curing was performed under the conditions of × 3 hours, 100 ° C. × 5 hours, and 150 ° C. × 5 hours, and after etching, the value of the size of the protruding adhesive was measured.

[0033]

EXAMPLES The contents of the present invention will be described in detail below with reference to examples. In addition, each test in this example was performed as follows.

[Method of measuring overhang (OH) amount] TA
Drill a 5 mm x 7 mm square hole in the tape with adhesive for B, remove the protective film, and remove the 25 µm electrolytic copper foil from the adhesive surface.
Lamination was performed at 0 ° C., 3 kg / cm, and 1 m / min. 80 ° C x 3 hours, 100 ° C x 5 hours, 150 ° C in an air oven
The adhesive was heated and cured under the conditions of × 5 hours to obtain a TAB tape with a copper foil. The entire copper foil surface of the obtained TAB tape with copper foil was etched, and the amount of the exuded adhesive (μm) at the hole was measured with a microscope (× 200).

[Measurement Method of Adhesive Strength] The protective film of the tape with an adhesive for TAB was removed, and a 25 μm electrolytic copper foil and an adhesive surface were laminated at 130 ° C., 3 kg / cm, 1 m / min.
The adhesive was heated and cured in an air oven at 80 ° C. × 3 hours, 100 ° C. × 5 hours, and 150 ° C. × 5 hours to obtain a TAB tape with copper foil. A photoresist film is formed on the copper foil surface of the obtained TAB tape with copper foil, etching and resist peeling are performed by a conventional method, and the conductor width is 50 μm.
m samples were obtained. 50mm / m in 90 ° direction
The film was peeled at a speed of in, and the adhesive strength was measured.

[Appearance Inspection Method] The protective film of the TAB adhesive tape was removed, and a 25 μm electrolytic copper foil and an adhesive surface were laminated at 130 ° C., 3 kg / cm, 1 m / min. 80 ° C. × 3 hours, 100 ° C. × 5 hours, 1 in air oven
The adhesive was heated and cured at 50 ° C. for 5 hours to obtain a TAB tape with a copper foil. TAB with copper foil obtained
The entire surface of the copper foil surface of the tape for etching was etched, and an appearance inspection such as foaming was performed with a microscope (× 20). The size of 150 cm ² was inspected, and when 5 or less foaming was good, when 6 or more foaming was bad.

Example 1 The following adhesive composition was dissolved in a mixed solution of methanol / monochlorobenzene so as to have a solid concentration of 20% by weight, and then subjected to a release treatment to a thickness of 25%.
It was applied to a μm polyethylene terephthalate film so as to have a dry film thickness of 18 μm, and dried at 100 ° C. for 1 minute and 150 ° C. for 2 minutes using an air oven. The adhesive surface of the film was thermocompression-bonded to a 75 μm-thick polyimide film (“UPILEX” 75S manufactured by Ube Industries, Ltd.) by roll lamination at 120 ° C., 2 kg / cm, 1 m / min.
A tape with an adhesive for AB was prepared.

<Adhesive Composition> Polyamide resin (Nylon “MACROM” manufactured by Henkel Co.)
ELT "6901): 100 parts by weight Thermosetting type alkylphenol resin (T by Nippon Ink Co., Ltd.)
D-2625): 75 parts by weight.

The TAB adhesive tape obtained above was heated and cured at 60 ° C. for 4 days. Table 1 shows the properties of the obtained tape with an adhesive for TAB.

[Example 2] [0040] Except that the heating and curing conditions of the TAB adhesive-attached tape were 60 ° C x 6 days,
A tape with the same adhesive for TAB as in Example 1 was produced. Table 1 shows the properties of the obtained tape with an adhesive for TAB.

[Example 3] A heating and curing condition of a TAB adhesive-attached tape was set to a treatment at 60 ° C for 8 days.
A tape with the same adhesive for TAB as in Example 1 was produced. Table 1 shows the properties of the obtained tape with an adhesive for TAB.

Example 4 A tape with an adhesive for TAB was prepared in exactly the same manner as in Example 1 except that the composition of the adhesive was as follows. Table 1 shows the properties of the obtained tape with an adhesive for TAB.

<Adhesive composition> Polyamide resin (nylon 6.36 "PR manufactured by Unichema")
IADIT "2053): 100 parts by weight Thermosetting alkylphenol resin (PS2 manufactured by Gunei Chemical Co., Ltd.)
780): 80 parts by weight.

Example 5 The conditions for heating the tape with the TAB adhesive were as follows:
The exactly same tape with an adhesive for TAB as in Example 4 was produced. Table 1 shows the properties of the obtained tape with an adhesive for TAB.

[Example 6] A heating and curing condition of a tape with an adhesive for TAB was set at 60 ° C x 8 days, except that
The exactly same tape with an adhesive for TAB as in Example 4 was produced. Table 1 shows the properties of the obtained tape with an adhesive for TAB.

[Comparative Example 1] A heating and curing condition of a tape with an adhesive for TAB was set to be a treatment at 60 ° C for 2 days.
A tape with the same adhesive for TAB as in Example 1 was produced. Table 1 shows the properties of the obtained tape with an adhesive for TAB.

[Comparative Example 2] Except that the heating and curing conditions of the tape with the TAB adhesive were set to 60 ° C x 3 days,
A tape with the same adhesive for TAB as in Example 1 was produced. Table 1 shows the properties of the obtained tape with an adhesive for TAB.

COMPARATIVE EXAMPLE 3 Except that the heating and curing conditions of the TAB adhesive tape were 60 ° C. × 2 days,
The exactly same tape with an adhesive for TAB as in Example 4 was produced. Table 1 shows the properties of the obtained tape with an adhesive for TAB.

[Comparative Example 4] Except that the heating and curing conditions for the TAB-attached tape were 60 ° C x 3 days,
The exactly same tape with an adhesive for TAB as in Example 4 was produced. Table 1 shows the properties of the obtained tape with an adhesive for TAB.

[0050]

[Table 1]

[0051]

The tape with an adhesive for TAB according to the present invention conventionally causes problems such as protrusion of the adhesive, poor connection of the TAB lead and poor adhesion in the process of processing the TAB tape, and the yield of the TAB tape is reduced. However, high-quality TAB tapes can be obtained with a high yield without causing these problems.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment of a pattern tape before mounting a semiconductor integrated circuit, obtained by processing a tape with an adhesive for TAB of the present invention.

FIG. 2 is a cross-sectional view of one embodiment of a semiconductor device using the tape with an adhesive for TAB of the present invention.

FIG. 3 is a cross-sectional view of one embodiment of a semiconductor device (BGA) using a tape with an adhesive for TAB of the present invention.

FIG. 4 is a cross-sectional view of one embodiment of a semiconductor device (CSP) using a tape with an adhesive for TAB of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating film which has flexibility 2,13,21 Adhesive 3 Sprocket hole 4 Device hole 5,14,22 Conductor for connecting a semiconductor integrated circuit 6 Inner lead part 7 Outer lead part 8,15,23 Semiconductor integrated circuit 9, 16, 24 Sealing resin 10, 17, 25 Gold bump 11 Protective film 18, 26 Solder ball 19 Reinforcement plate 27 Solder resist

Claims (8)

[Claims] 1. A TAB adhesive tape comprising an insulating film, an adhesive layer and a protective film laminated in this order, has a maximum overhang of 2 tapes.
A tape with an adhesive for TAB, which is in a range of 0 μm or less. 2. The tape with an adhesive for TAB according to claim 1, wherein the maximum amount of overhang is in the range of 2 to 20 μm. 3. The tape with TAB adhesive according to claim 1, wherein the maximum amount of overhang is in the range of 2 to 15 μm. 4. The tape with an adhesive for TAB according to claim 1, wherein the insulating film is a polyimide film. 5. The TA according to claim 1, wherein the adhesive layer contains a polyamide resin and a phenol resin.
Tape with adhesive for B. 6. A polyamide resin comprising a dicarboxylic acid having 36 carbon atoms as a constituent.
The adhesive tape for TAB according to the above. 7. A TAB tape using the tape with an adhesive for TAB according to claim 1. 8. A semiconductor device using the tape with an adhesive for TAB according to claim 1.