JPH10163209A5 - - Google Patents

Info

Publication number
JPH10163209A5
JPH10163209A5 JP1997198063A JP19806397A JPH10163209A5 JP H10163209 A5 JPH10163209 A5 JP H10163209A5 JP 1997198063 A JP1997198063 A JP 1997198063A JP 19806397 A JP19806397 A JP 19806397A JP H10163209 A5 JPH10163209 A5 JP H10163209A5
Authority
JP
Japan
Prior art keywords
wiring
layer
via hole
semiconductor device
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997198063A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10163209A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP19806397A priority Critical patent/JPH10163209A/ja
Priority claimed from JP19806397A external-priority patent/JPH10163209A/ja
Publication of JPH10163209A publication Critical patent/JPH10163209A/ja
Publication of JPH10163209A5 publication Critical patent/JPH10163209A5/ja
Pending legal-status Critical Current

Links

JP19806397A 1996-07-30 1997-07-24 半導体装置及び反射型液晶駆動半導体装置 Pending JPH10163209A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19806397A JPH10163209A (ja) 1996-07-30 1997-07-24 半導体装置及び反射型液晶駆動半導体装置

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP19998796 1996-07-30
JP21823396 1996-08-20
JP8-218233 1996-10-01
JP8-260431 1996-10-01
JP8-199987 1996-10-01
JP26043196 1996-10-01
JP19806397A JPH10163209A (ja) 1996-07-30 1997-07-24 半導体装置及び反射型液晶駆動半導体装置

Publications (2)

Publication Number Publication Date
JPH10163209A JPH10163209A (ja) 1998-06-19
JPH10163209A5 true JPH10163209A5 (enExample) 2005-05-12

Family

ID=27475891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19806397A Pending JPH10163209A (ja) 1996-07-30 1997-07-24 半導体装置及び反射型液晶駆動半導体装置

Country Status (1)

Country Link
JP (1) JPH10163209A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100319185B1 (ko) * 1998-07-31 2002-01-04 윤종용 반도체 장치의 절연막 형성 방법
JP3956143B2 (ja) 2004-09-10 2007-08-08 セイコーエプソン株式会社 半導体装置
JP2006216683A (ja) * 2005-02-02 2006-08-17 Seiko Epson Corp 半導体装置
US8999764B2 (en) * 2007-08-10 2015-04-07 International Business Machines Corporation Ionizing radiation blocking in IC chip to reduce soft errors
US9704839B2 (en) 2015-11-18 2017-07-11 Infineon Technologies Ag Semiconductor devices for integration with light emitting chips and modules thereof

Similar Documents

Publication Publication Date Title
JPH10274789A5 (enExample)
JPH11109385A5 (enExample)
JP2003172944A5 (enExample)
JP2003195330A5 (enExample)
KR940027154A (ko) 고체촬상소자 및 그 제조방법
KR100404203B1 (ko) 트리플 스캔 구조의 유기 ｅｌ 소자
US6027999A (en) Pad definition to achieve highly reflective plate without affecting bondability
CN1987572B (zh) 液晶显示装置及其制造方法
JPH10163209A5 (enExample)
CN107479259A (zh) 显示面板和显示装置
JP2019114534A (ja) 有機発光表示装置及びその製造方法
KR970060467A (ko) 반도체장치
JP2001265253A5 (enExample)
KR100537882B1 (ko) 액정표시장치및그제조방법
JPH0682832A (ja) 表示装置
US5559345A (en) Thin film transistor having redundant metal patterns
JPH08234225A (ja) 液晶表示装置
JP2003115593A5 (enExample)
JPH10270708A5 (enExample)
KR960043021A (ko) 반도체 집적 회로 및 그 제조 방법
JPWO2023106026A5 (enExample)
CN101477991B (zh) 电光器件基片、电光器件、电子器件和投影显示设备
US7279713B2 (en) Bonding pad and method for manufacturing the same
KR20000038604A (ko) 액정 표시 장치 및 그 제조 방법
JP2001142089A5 (enExample)