JPH10145038A - Pallet for transfer - Google Patents

Pallet for transfer

Info

Publication number
JPH10145038A
JPH10145038A JP8300292A JP30029296A JPH10145038A JP H10145038 A JPH10145038 A JP H10145038A JP 8300292 A JP8300292 A JP 8300292A JP 30029296 A JP30029296 A JP 30029296A JP H10145038 A JPH10145038 A JP H10145038A
Authority
JP
Japan
Prior art keywords
pallet
pallet body
mesh plate
reflow furnace
flatness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8300292A
Other languages
Japanese (ja)
Inventor
Tadao Ogino
忠夫 荻野
Tsuneaki Komazawa
恒明 駒澤
Taro Matsuoka
太郎 松岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP8300292A priority Critical patent/JPH10145038A/en
Publication of JPH10145038A publication Critical patent/JPH10145038A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To maintain the flatness of a pallet body even when it is transferred through a reflow furnace by forming the pallet with a flat type pallet body providing many holes and an external frame for placing the pallet body and then providing a guide section to the external frame for guiding the pallet body in the flat surface and then placing the pallet body to the guide section for expansion and contraction purpose. SOLUTION: When a pallet 11 for transfer passes through a reflow furnace, positional relationship between a mesh plate 12 and external frame 13 is changed due to difference of heat capacity of mesh plate 12 and external frame 13. In this case, since the mesh plate 12 is fixed at the point P, it is guided by the guide section 15 and can be expanded and contacted without limitation in the diagonal direction of the point P. Therefore, the mesh plate 12 can be expanded and contracted keeping the flatness without generating warp in the vertical direction. Thereby, even when the pallet is transferred through the reflow furnace, flatness of the pallet body can be maintained.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子部品を配線基
板に半田付けするため、電子部品を搭載した配線基板を
コンベアでリフロー炉内を搬送する際に用いる搬送用パ
レットに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer pallet used for transferring a wiring board on which electronic components are mounted in a reflow furnace by a conveyor in order to solder the electronic components to the wiring board.

【0002】[0002]

【従来の技術】電子部品を搭載した配線基板をコンベア
でリフロー炉に通して、電子部品を配線基板に半田付け
する場合、配線基板の下面の部品のない箇所を選択的に
支持するパレットを使用し、このパレットに配線基板を
載せて、コンベアによりリフロー炉内を搬送する。これ
に用いるパレット1は、例えば、図2(a)、(b)に
示すように、パレット1の下面から供給される熱がパレ
ット1に載置された配線基板を効率よく加熱するよう
に、貫通する複数の孔2が設けられたパレット本体3
と、パレット本体3が載置、固定される外枠4とからな
る。パレット本体3は四辺が外枠4に固定されている。
また、図3に示すように、パレット本体3の孔2に支持
ピン5を立て、この支持ピン5の上端で配線基板6の下
面の部品7のない箇所を選択的に支持する。このパレッ
ト1は、配線基板6の加熱による反りを防止することが
目的であるため、リフロー炉内を通過した後も、パレッ
ト本体3は平坦度を保つことが重要である。
2. Description of the Related Art When a wiring board on which electronic components are mounted is passed through a reflow furnace by a conveyer and the electronic components are soldered to the wiring board, a pallet for selectively supporting a part without parts on the lower surface of the wiring board is used. Then, a wiring board is placed on this pallet and transported in a reflow furnace by a conveyor. The pallet 1 used for this purpose is, for example, as shown in FIGS. 2A and 2B, such that heat supplied from the lower surface of the pallet 1 efficiently heats the wiring board placed on the pallet 1. Pallet body 3 provided with a plurality of through holes 2
And an outer frame 4 on which the pallet body 3 is placed and fixed. The pallet body 3 has four sides fixed to the outer frame 4.
As shown in FIG. 3, a support pin 5 is set up in the hole 2 of the pallet body 3, and an upper end of the support pin 5 selectively supports a portion of the lower surface of the wiring board 6 where there is no component 7. Since the purpose of the pallet 1 is to prevent the wiring board 6 from warping due to heating, it is important that the pallet body 3 maintain flatness even after passing through the reflow furnace.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記パ
レット1をリフロー炉に通すと、パレット本体3は熱膨
張や収縮により上下に歪む。従来のパレットはパレット
本体3が外枠4に固定されているために、パレット本体
3の熱歪みの逃げがなく、配線基板6に電子部品を半田
付けするには、リフロー炉内を一定の条件で通過させな
ければならない。そのためにパレット本体3がリフロー
炉内で変形せず、平坦度を保つことが重要である。
However, when the pallet 1 is passed through a reflow furnace, the pallet body 3 is distorted up and down due to thermal expansion and contraction. In the conventional pallet, since the pallet body 3 is fixed to the outer frame 4, there is no escape of the thermal distortion of the pallet body 3. Must be passed through. Therefore, it is important that the pallet main body 3 is not deformed in the reflow furnace, and that the pallet main body 3 keeps its flatness.

【0004】[0004]

【課題を解決するための手段】本発明は上記問題点を解
決すべくなされたもので、多数の孔が設けられた平板状
のパレット本体と、前記パレット本体が載置される外枠
とからなり、前記外枠は前記パレット本体を平面状にガ
イドするガイド部を有し、前記パレット本体は前記ガイ
ド部に伸縮自在に載置されていることを特徴とする搬送
用パレットである。
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and comprises a flat pallet body provided with a large number of holes and an outer frame on which the pallet body is placed. The outer frame has a guide portion for guiding the pallet body in a planar shape, and the pallet body is mounted on the guide portion so as to be extendable and contractible.

【0005】本発明によれば、パレット本体は外枠のガ
イド部に伸縮自在に載置されているため、リフロー炉を
通過してパレット本体に熱膨張や収縮が生じても、パレ
ット本体には熱応力は発生せず、パレット本体はガイド
部にガイドされて平面内で伸縮し、パレット本体の平坦
度が維持される。
According to the present invention, since the pallet body is mounted on the guide portion of the outer frame so as to be extendable and contractible, even if the pallet body passes through the reflow furnace and undergoes thermal expansion or contraction, the pallet body remains in the pallet body. No thermal stress is generated, and the pallet body is guided by the guide portion and expands and contracts in a plane, so that the flatness of the pallet body is maintained.

【0006】[0006]

【発明の実施の形態】以下、図面に基づいて本発明の実
施の形態を詳細に説明する。図1(a)は本発明にかか
る搬送用パレットの一実施形態の平面図、(b)は
(a)のX−X線断面図である。本実施形態の搬送用パ
レット11は、パレット本体となるメッシュプレート1
2と外枠13からなる。メッシュプレート12は厚さ
0.8〜2.0mmで、四角形の平板状のステンレス板
からなり、基板を支持するピンを保持する多数の貫通し
た孔14が設けられている。また、外枠13は厚さ5〜
10mmで、四角形をなし、構造的な強度を有してい
る。この外枠13の内側に沿って、断面がコの字状の溝
が設けられ、この溝がメッシュプレート12のガイド部
15となる。メッシュプレート12は外枠13のガイド
部15内に載置されて、四角形状の角の点Pで固定され
ている。また、メッシュプレート12は点Pの両側の二
辺A、Bではガイド部15の内壁に接しており、他の二
辺C、Dではメッシュプレート12とガイド部15を構
成する内壁との間には余裕空間15aが生じている。こ
のP点はメッシュプレート12の位置決めの基準点とな
る。
Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1A is a plan view of one embodiment of a transport pallet according to the present invention, and FIG. 1B is a cross-sectional view taken along line XX of FIG. The transport pallet 11 of the present embodiment includes a mesh plate 1 serving as a pallet body.
2 and an outer frame 13. The mesh plate 12 has a thickness of 0.8 to 2.0 mm, is made of a rectangular flat stainless plate, and has a large number of through holes 14 for holding pins for supporting the substrate. The outer frame 13 has a thickness of 5 to 5.
It is 10 mm, square, and has structural strength. A groove having a U-shaped cross section is provided along the inside of the outer frame 13, and the groove serves as the guide portion 15 of the mesh plate 12. The mesh plate 12 is placed in the guide portion 15 of the outer frame 13 and is fixed at a square corner point P. The mesh plate 12 is in contact with the inner wall of the guide portion 15 on the two sides A and B on both sides of the point P, and between the mesh plate 12 and the inner wall forming the guide portion 15 on the other two sides C and D. Has an extra space 15a. This point P serves as a reference point for positioning the mesh plate 12.

【0007】上述の搬送用パレット11がリフロー炉を
通過すると、メッシュプレート12と外枠13の熱容量
の差により、メッシュプレート12と外枠13との位置
関係が変化する。この際、メッシュプレート12は点P
で固定されているため、ガイド部15にガイドされて、
点Pの対角線方向に拘束されることなく熱伸縮する。従
って、メッシュプレート12は上下方向に反りを生ずる
ことなく、平坦度を保った状態で伸縮する。なお、本実
施形態では、メッシュプレート12は点Pで固定されて
いるため、孔14の配置は一定になっており、多数の搬
送用パレット11を用いた場合に、搬送用パレット11
毎の孔14の位置のばらつきを防ぐことができる。な
お、上記実施形態は、本発明を具体化した一例であっ
て、本願発明の技術的範囲を限定するものではない。
When the transport pallet 11 passes through the reflow furnace, the positional relationship between the mesh plate 12 and the outer frame 13 changes due to the difference in heat capacity between the mesh plate 12 and the outer frame 13. At this time, the mesh plate 12
Because it is fixed by the guide part 15
It thermally expands and contracts without being restricted in the diagonal direction of the point P. Accordingly, the mesh plate 12 expands and contracts while maintaining flatness without warping in the vertical direction. In this embodiment, since the mesh plate 12 is fixed at the point P, the arrangement of the holes 14 is constant, and when a large number of transport pallets 11 are used, the transport pallets 11
Variations in the position of each hole 14 can be prevented. Note that the above embodiment is an example in which the present invention is embodied, and does not limit the technical scope of the present invention.

【0008】[0008]

【発明の効果】本発明によれば、パレットをリフロー炉
に通しても、パレット本体の平坦度を維持することがで
きるという優れた効果がある。
According to the present invention, there is an excellent effect that the flatness of the pallet body can be maintained even when the pallet is passed through a reflow furnace.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(a)は本発明にかかる搬送用パレットの一実
施形態の平面図、(b)は(a)のX−X線断面図であ
る。
FIG. 1A is a plan view of an embodiment of a transport pallet according to the present invention, and FIG. 1B is a sectional view taken along line XX of FIG.

【図2】(a)、(b)はそれぞれ、従来の搬送用パレ
ットの一実施形態の平面図および側面図である。
FIGS. 2A and 2B are a plan view and a side view of an embodiment of a conventional transport pallet, respectively.

【図3】搬送用パレットに配線基板を載置した状態の側
面図である。
FIG. 3 is a side view showing a state where a wiring board is placed on a transport pallet.

【符号の説明】[Explanation of symbols]

11 搬送用パレット 12 メッシュプレート 13 外枠 14 孔 15 ガイド部 15a 余裕空間 DESCRIPTION OF SYMBOLS 11 Pallet for conveyance 12 Mesh plate 13 Outer frame 14 Hole 15 Guide part 15a Extra space

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 多数の孔が設けられた平板状のパレット
本体と、前記パレット本体が載置される外枠とからな
り、前記外枠は前記パレット本体を平面状にガイドする
ガイド部を有し、前記パレット本体は前記ガイド部に伸
縮自在に載置されていることを特徴とする搬送用パレッ
ト。
1. A flat pallet body provided with a large number of holes, and an outer frame on which the pallet body is placed, the outer frame having a guide portion for guiding the pallet body in a plane. The pallet body is mounted on the guide portion so as to be extendable and contractible.
JP8300292A 1996-11-12 1996-11-12 Pallet for transfer Pending JPH10145038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8300292A JPH10145038A (en) 1996-11-12 1996-11-12 Pallet for transfer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8300292A JPH10145038A (en) 1996-11-12 1996-11-12 Pallet for transfer

Publications (1)

Publication Number Publication Date
JPH10145038A true JPH10145038A (en) 1998-05-29

Family

ID=17883039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8300292A Pending JPH10145038A (en) 1996-11-12 1996-11-12 Pallet for transfer

Country Status (1)

Country Link
JP (1) JPH10145038A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007100977A (en) * 2005-09-30 2007-04-19 Matsushita Electric Ind Co Ltd Continuous heat treatment furnace
CN108839220A (en) * 2018-09-10 2018-11-20 张家港市华孚实业有限公司 A kind of maintenance pallet of expanded perlite thermal-nsulation plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007100977A (en) * 2005-09-30 2007-04-19 Matsushita Electric Ind Co Ltd Continuous heat treatment furnace
CN108839220A (en) * 2018-09-10 2018-11-20 张家港市华孚实业有限公司 A kind of maintenance pallet of expanded perlite thermal-nsulation plate

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Legal Events

Date Code Title Description
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