JPH01110415A - Substrate transfer device - Google Patents

Abstract

PURPOSE:To prevent warpage due to thermal expansion during transfer, in a substrate transfer device in a hot atmosphere, by interposing a spring halfway in each transfer claw of a transfer member so that thermal expansion can be absorbed. CONSTITUTION:A substrate 1 is head between transfer claws 24, 25 on both sides, and is transferred while being lightly pushed and held by an initial load of a spring 30. When it is transferred to a soldering layer to receive soldering heat, the substrate 1 performs thermal expansion, and pushes outward the lower part 27 of the claw in the arrow direction. In this case, the spring 30 deforms outward to absorb the outward pushing force. Accordingly, the warpage of the substrate 1 can be prevented.

Description

[Detailed Description of the Invention] [Summary] A device for conveying substrates such as printed boards, which includes two rails arranged in parallel and a large number of conveyors facing each other that are arranged to move along these rails. A device comprising a conveyance member consisting of a claw and a drive means for moving the conveyance members on both sides at the same speed, and conveys a substrate by supporting both side edges of the substrate in the groove at the tip of the conveyance claw in the direction of movement. Regarding this, when transporting a board while exposing it to a thermal atmosphere, such as when passing through a solder layer, it is necessary to prevent the board supported between the transport claws from "warping" due to thermal expansion, and to prevent the board from warping due to thermal expansion. In order to cope with variations in the width of the board, each of the transport claws of the transport member on at least one side of the two rails is connected to each other via a spring. do.

[Industrial application field]

The present invention relates to a device for transporting substrates such as printed boards, and in particular, a transport member consisting of two parallel rails and a large number of mutually facing transport claws that are provided to move along these rails. and a driving means for moving the conveying members on both sides at the same speed, the present invention relates to an apparatus for conveying a substrate by supporting both side edges of the substrate in the groove of the tip of the conveying claw in the direction of movement.

[Conventional technology]

An example of a conventional substrate transfer device of this type is schematically shown in FIG. This board transport device is used to transport a board 1 such as a printed board to a carrier-less type jet solder layer (not shown), and has two rails 1 arranged in parallel.
1.12 are provided and a transport member 21.22 consisting of a continuous series of transport pawls 24 is provided movable along each rail 1112. Rails 111 of conveyance members 21 and 22
The inner part of 2 is the part that transports the board 1, and the rail 11
．． The outer part of 12 is the return part.

The individual transport claws 25 are made of metal fittings made of stainless steel or the like, and the tips of the transport claws 24 face each other inwardly on the inside of the rail 11. The substrate 1 is supported by fitting both side edges of the substrate 1 from both sides. Then, when the transport members 21 and 22 on both sides are moved at the same speed by a known drive means (not shown), the board 1 with a large number of electronic components 2 mounted on the upper surface is transferred to the transport claw 2.
4 and is transported to a solder layer (not shown).

[Problem that the invention seeks to solve]

In the conventional substrate transfer device as described above, when the substrate 1 reaches the solder layer, it receives the heat of the solder dip from below and tries to expand, but since the substrate 1 is held down from both sides by the transfer claws 24. , it warps downward (towards the solder dip) as shown by arrow Q in FIG. Board 1 after solder dip
Although the substrate 1 shrinks to some extent when cooled, some of the warpage that has occurred in the substrate 1 remains even after cooling, and there is a problem in that the ease of assembling the printed board package and the ease of mounting the board after completion are impaired.

Therefore, an object of the present invention is to prevent the substrate supported between the transport claws from "warping" due to thermal expansion when the substrate is transported while being exposed to a thermal atmosphere.

Further, the prevention of warping is just one example, and it can also be used in devices using general conveyance claws. For example, it can be used when transporting a phenol substrate whose width varies widely, when changing the width of the transport claw manually, or when easily adjusting the width.

[Means for solving problems]

In order to solve such problems, according to the present invention,
Two rails arranged parallel to each other, a conveying member configured to move along these rails and consisting of a large number of mutually facing conveying claws, and a drive means for moving the conveying members on both sides at the same speed. In the device for transporting a substrate by supporting both side edges of the substrate in the traveling direction in the grooves at the tips of the transport claws, each transport claw of at least one of the transport members is connected via a spring in the middle thereof. A substrate transfer device is provided.

[Effect]

In a thermal atmosphere such as a solder layer, the substrate thermally expands, and as a result, the dimensions of the substrate in the front-rear direction and width direction tend to increase. However, in the present invention, each of the conveyance claws of one conveyance member is connected via a spring, so that the spring deforms to absorb the increase in the widthwise dimension of the substrate, thereby preventing the substrate from warping. Prevented.

Furthermore, when transporting a substrate with poor external precision, such as a paper phenol board, by using transport claws connected via a spring, the spring deforms depending on the size of the board.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view showing one embodiment of the base Fi transport device of the present invention, and shows a slotted portion of the transport device. FIG. 2 is a cross-sectional view showing the substrate conveyance state in the apparatus of the present invention. In these figures, two rails 11.12 are installed on the IMI fixed frame 13 and the movable frame 14, respectively, and are arranged parallel to each other. The distance between the movable frame 14 and the corresponding fixed frame 13 is adjusted by rotating the shaft 15. As a result, the rail 1 can be adjusted according to the width dimension of the board 1 such as a printed board.
1.12 intervals can be adjusted. A transport member 21, 22 consisting of a large number of transport claws 25 is connected to each rail 11.
．． It is provided movably along 12. Conveying member 21.
The inner part of the rails 11.12 of 22 is the part for transporting the substrate 1, and the outer part of the rail 11.12 is the return part.

Each of the conveyance claws 24.25 is made of stainless steel or the like in the shape of an abbreviation, and inside the rail 11.12, the tips of the conveyance claws 24.25 face each other inwardly. Both side edges of the substrate 1 are fitted into the grooves from both sides to support the substrate 1. And motor 17.18
The transport members 21, 22 on both sides are driven to move at the same speed. Conveying claws 24 and 25 facing the substrate 1
The solder layer is conveyed in the direction of arrow P to the solder layer (not shown) while being supported by the groove at the tip of the solder layer. The above is generally the same as the conventional example.

In the substrate transfer device of the present invention, the respective transfer claws 25 on the movable rail 12 (movable frame 14) side are connected via springs 30.

FIG. 3 is an enlarged perspective view of the transport claw 25 used in the substrate transport apparatus shown in FIGS. 1 and 2. FIG.

As shown in the figure, the conveying claw 25 has an upper claw 26 extending vertically downward from the horizontal direction, and a claw upper part 26 extending horizontally inward from the vertical downward direction.
7, and a coil spring 3o is connected between the claw upper part 26 and the claw upper part 27 by welding or the like. Upper part of the nail 27
A horizontal groove 28 for sandwiching and supporting the side edges of the substrate 1 is provided at the tip of the horizontal portion, and a notch 29 is provided in a U-shape when viewed from above. This cutout 29 facilitates the gripping of the substrate 1 by the groove 28.

Each transport claw 2 on the fixed rail 11 (fixed frame 13) side
4 has approximately the same shape as the conveyance claw 125 on the movable rail 12 side, except that it does not have the spring 30.
For example, these have a width of about 10 mm and a thickness of about 3 mm. It is made of metal fittings made of stainless steel with a diameter of about 0 mm.

As shown in FIG. 2, the substrate 1 is held between the conveying claws 24 and 25 on both sides, and is supported so as to be lightly pressed by a predetermined initial load of a spring 30. Then, it is transported in the direction of arrow P toward a solder layer (not shown), and soldering heat of about 250° is applied to the solder layer. As a result, the substrate l expands thermally, pushing the claw upper part 27 outward and causing the spring 30 to bend, as shown in FIG. Therefore, the substrate 1 itself does not warp as shown in FIG. 6, and the thermal expansion is absorbed by the springs 30.

FIG. 5 shows another embodiment of the spring used for the conveyance claw 25.
The claw upper part 26 and the claw upper part 27 are connected by two thin leaf springs 31, and have the same effect as the coil spring 30.

In the above embodiment, the transport claw 25 having a spring is used only on the movable rail 12 side, but the transport claw 25 having the same spring on both the fixed rail side 11 and the movable rail 12 is used to transfer the substrate 1. Thermal expansion may be absorbed on both sides.

〔Effect of the invention〕

As described above, according to the present invention, even if the substrate thermally expands in a thermal atmosphere and increases in dimension in the width direction, the substrate can be transported without causing the substrate to warp. Furthermore, the springs provided in the transport claws allow the substrate to be sufficiently supported and transported even if there is some variation in the linearity of the large number of claw groups.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing one embodiment of the substrate transfer device of the present invention, FIG. 2 is a sectional view showing a substrate transfer state in the device of the present invention, and FIG. 3 is an embodiment of the transfer claw in the present invention. A perspective view of the example, FIG. 4 is a diagram showing a state in which the spring is deformed in one embodiment of the conveying claw of the present invention, FIG. 5 is a diagram showing a state in which the spring is deformed in another embodiment of the conveying claw, FIG. 6 is a diagram showing a state of substrate conveyance in a conventional example. 1... Board, 24.25... Conveyance claw, 11.
...Fixed rail, 28...Groove, 12...Movable rail, 29...Notch, 21.22...Transportation member, 30.31...Spring.

Claims (2)

[Claims] 1. A conveying member (21, 22) consisting of two parallel rails (11, 12) and a number of mutually facing conveying claws (24, 25) provided to move along these rails. , drive means (17, 18) for moving the conveyance members on both sides at the same speed, and both edges of the substrate (1) are supported in the grooves (28) at the tips of the conveyance claws in the direction of movement. A device for transporting a substrate, characterized in that the transport claws of at least one transport member (22) are connected in the middle via springs (30, 31). 2. Of the two rails, the first rail (11) is fixed, and the second rail (12) is configured so that the distance between it and the first rail can be adjusted. The conveying claw (25) of the conveying member (22) is connected to the spring (30, 3
1) The substrate transport device according to claim 1, wherein the substrate transport device is connected through the substrate transport device.