JPH0563394A - Board conveyance apparatus - Google Patents

Abstract

PURPOSE:To prevent the warp of a mounting board which is being conveyed when a package for integrated circuit use is soldered to the mounting board by using an in-line type soldering apparatus. CONSTITUTION:The title apparatus is constituted in the following manner: pins 4 are installed so as to protrude on protrusion parts 1a, 1b at a chain 2 for conveyance use; springs 6 are installed on the protrusion parts 1b on one side; on the other hand, through holes 5 are arranged on both sides of a mounting board 3; the pins 4 are inserted into the through holes 5; and the mounting board 3 is conveyed by the movement of the chain for conveyance use while a tensile force is being applied to the outside of the mounting board 3 by means of the springs 6 in the protrusion parts 1b on one side. Thereby, when the board is energized so as to be pulled to outside, a warp stress which is generated in a soldering (reflow) operation is relaxed, and it is possible to prevent the warp of the board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer device in an in-line type soldering device used for soldering an integrated circuit package mounted on a mounting substrate.

[0002]

2. Description of the Related Art FIG. 8 is a perspective view showing a carrier chain of a conventional soldering apparatus of this type, and FIG. 9 is a front view showing a substrate carrying state by the carrier chain shown in FIG.
In the figure, 1 is a protrusion for mounting a substrate, 2 is a transport chain provided with this protrusion 1, 3 is a mounting substrate,
Both ends of the mounting substrate 3 are placed on the protrusions 1 and are conveyed.

Next, a substrate transfer method will be described. When the mounting substrate 3 is transported, the mounting substrate 3 has protrusions 1 at both ends thereof with respect to the transport chain 2 that is moving at a constant speed.
Send it in between. Then, the mounting board 3 is carried along with the movement of the carrying chain 2 while the mounting board 3 remains on the projection 1.

[0004]

The conventional substrate transfer device of the in-line type soldering device is constructed as described above, but since no force is applied to the substrate, the substrate is not subjected to soldering (reflow). There is a problem in that the warp stress caused by the difference in the coefficient of thermal expansion of each layer cannot be relaxed and the substrate warps.

The present invention has been made in order to solve the above problems, and an object thereof is to obtain a substrate transfer device capable of preventing the substrate from warping.

[0006]

According to another aspect of the present invention, there is provided a substrate transfer device, wherein a pin is provided on a protrusion of a carrier chain on which a substrate is placed, and a spring for biasing the pin outward is provided on one of the protrusions. The mounting board to be transported is provided with through holes at both ends for inserting the pins.

[0007]

According to the present invention, after the pins of the carrier chain are inserted into the through holes of the substrate, the pins are pinched on one side by a spring to carry the carrier while the carrier is carried, so that the warp of the substrate can be prevented. ..

[0008]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to the drawings. 1 is a perspective view showing one side of the transport chain, FIG. 2 is an enlarged side view showing the other side of the transport chain,
FIG. 3 is a plan view of the mounting board. In FIG. 3, 4 is a pin protruding from the protrusions 1a and 1b, 5 is a through hole provided at both ends of the mounting board 3, and the pin 4 is It is designed so that it can be carried while being inserted. Further, in FIG. 2, 6 is a spring provided on one of the protrusions 1b, and biases the pin 4 in the arrow direction (outside). Incidentally, 7 is a groove of a stopper described later.

In such a structure, the method of transporting the mounting substrate 3 along with the movement of the transport chain 2 is the same as the conventional method, but through holes 5 are provided at both ends of the mounting substrate 3 to transport the chain. The difference is that the pins 4 provided on the two protrusions 1a and 1b are inserted to carry.

FIG. 4 and FIG. 5 show a state in which the substrate is transported. Here, in the protruding portion 1b on one side, the spring 6 biases the pin 4 in the direction of the arrow as shown in FIG. A force pulling outward is applied to the mounting substrate 3, and this force prevents the substrate from warping during soldering (reflow). However, if the force of the spring 6 acts from the beginning, the pins 4 may not be properly inserted into the through holes 5 when the mounting substrate 3 is fed into the substrate transfer device. After being transported to some extent, the force of the spring is applied.

That is, FIGS. 6 and 7 show the structure of this stopper, in which 8 is a stopper and 7 is a groove for hooking this stopper. The force of the spring 6 is applied by engaging the stopper 8 with the groove 7. I try not to work. In addition,
By forming the stopper 8 into a shape as shown in FIG. 7, it is preferable that the force of the spring 6 starts to work as the conveyance progresses.

Example 2. In the above embodiment, the spring 6 is provided on the protruding portion 1b of the transport chain 2, but the transport chain 2 itself may be pulled outward by the spring.

Embodiment 3. In the above embodiment, the function of pulling the pin on one side to the outside is provided by the spring, but the conventional parallel transport chain 2 may be widened as the transport progresses.

Example 4. Further, in the above-mentioned embodiment, the case where the through holes 5 are provided at both ends of the mounting board 3 is shown, but the same effect can be obtained even if the jig having the through holes is attached to both ends of the mounting board.

[0015]

As described above, according to the present invention, the pin is provided on the conveying chain so that the pin is engaged with the substrate, and the substrate is conveyed while applying a pulling force to the substrate. Since it is configured, it is possible to prevent warpage of the substrate that occurs during soldering (reflow), and there is an effect that it greatly contributes to improvement of solderability.

[Brief description of drawings]

FIG. 1 is a perspective view showing a carrier chain on one side of a substrate carrier according to an embodiment of the present invention.

FIG. 2 is a partial side view of the other side transport chain according to the embodiment of the present invention.

FIG. 3 is a plan view of a mounting board having through holes according to an embodiment of the present invention.

FIG. 4 is a front view showing a substrate transfer state according to an embodiment of the present invention.

FIG. 5 is a perspective view showing a substrate transfer state according to an embodiment of the present invention.

FIG. 6 is a side view showing a structure of a stopper according to an embodiment of the present invention.

FIG. 7 is a front view showing the shape of a stopper according to an embodiment of the present invention.

FIG. 8 is a perspective view showing a transport chain on one side of a conventional substrate transport device.

FIG. 9 is a side view showing a state of substrate transfer in the conventional apparatus.

[Explanation of symbols]

 1a, 1b Projection 2 Transport chain 3 Mounting board 4 Pin 5 Through hole 6 Spring 7 Groove 8 Stopper

Claims (2)

[Claims] 1. An apparatus for carrying a substrate by placing it between the protrusions of a pair of carrier chains facing each other at a predetermined interval, wherein a pin is provided on the protrusion of the carrier chain on which the substrate is mounted, and one side thereof is provided. Is equipped with springs for urging the protruding part of the board to the outside, while the through holes are arranged at both ends of the board, and the board is pulled outward by the spring provided on the protruding part on one side with the pins inserted in the through holes. A substrate transfer device, which is adapted to transfer. 2. An apparatus for carrying a substrate by placing it between the protrusions of a pair of carrier chains facing each other at a predetermined interval, and providing a pin on the protrusion of the carrier chain on which the substrate is mounted, and carrying the carrier. Arrange so that it spreads out as the chain advances, and through holes are arranged at both ends of the board, and the pins are inserted into these through holes. The substrate transfer device is characterized in that a force for pulling the substrate to the outside is applied.