JPH0383400A - Automatic component mounting apparatus - Google Patents

Abstract

PURPOSE:To shorten mounting time of a circuit component by providing a plurality of positions for mounting circuit components by stopping a board on a rail, and mounting the component at a stopping position where the moving distance of a head is shortest in the case of mounting the components. CONSTITUTION:A chip mounter is provided to stop a board 2 at two positions on a rail 3. A mechanical origin O of an automatic component mounting apparatus is set, the position data F of a feeder 1 for supplying a chip component is inputted, and origin positions G1, G2 of the board 2 are inputted to first and second stations. The mount data A of the component is inputted to obtain the moving distance of a head in each station. The moving distances of both the stations are compared, and the component is mounted in the station having a shorter moving distance.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application 9f] The present invention relates to a circuit component mounting method for an automatic component mounting apparatus that automatically mounts circuit components on a board.

1. Japanese technology 1 Automatic component mounting devices include automatic insertion machines that mount circuit components with leads onto a board, and chip mounters that mount chip-shaped circuit components onto a board. These automatic component mounting apparatuses use so-called taping components in which a plurality of circuit components of the same type are attached to tape and connected together.

FIG. 6 shows an example of a conventional chip mounter.

This chip mounter is equipped with only one head for mounting chip components on a substrate 2, and a figure cheple is arranged on the side of a rail 3 on which the substrate 2 is conveyed, and taping is applied to the top of this feeder table. A plurality of feeders 1 loaded with chip components are arranged in a plurality of rows along the direction in which the substrate 2 is conveyed. In this chip mounter, the board 2 carried by the rail 3 is stopped at the center of the figure chip to mount the chip component. That is, the head of the chip mounter moves to the position of the feeder 1 loaded with the desired chip component, picks up the chip component, and mounts the chip component at a predetermined position on the substrate 2. Note that this chip component is mounted at a predetermined position on the board 2 according to a program input in advance. Then, the board 2 on which the chip components are mounted is transported and stocked in a stocker (not shown) or the like.

[Problems to be Solved by the Invention] However, in such a chip mounter, when mounting a chip component on a feeder 1 that is far away from the substrate 2 (for example, A or E9 in the figure), it is necessary to mount a chip component on a feeder 1 that is close to the substrate 2. (For example, C in the figure) The moving distance of the head is longer than when mounting chip components, so the overall moving distance of the head to mount all the chip components is longer.
There was a problem in that it took time to mount the chip components.

The present invention has been made in view of the above points, and an object of the present invention is to provide an automatic component mounting apparatus that can shorten the mounting time of circuit components.

Means for Solving the Problem] In order to achieve the above object, the present invention provides a plurality of positions where the board is stopped on the rail and the circuit components are mounted, and the head is moved when mounting each circuit component. The circuit component is mounted on the board at a stop position of the board where the distance is shortened.

[Function 1] As described above, the present invention provides a plurality of positions where the board is stopped on the rail and the circuit components are mounted, and the board is stopped at the board stop position where the moving distance of the head is shortened when mounting each circuit component. By mounting circuit components on the board, the overall travel distance of the head when all circuit components are mounted is shortened.
This is designed to shorten the mounting time of circuit components.

[Example] An embodiment of the present invention is shown in FIGS. 1 to 5.

In this embodiment, the present invention is applied to a chip mounter with one head, and the chip mounter of this embodiment is designed so that the board 2 can be stopped at two positions on the rail 3 as shown in FIG. It is. Note that the substrate 2 is conveyed from right to left in FIG. 1, and in the following explanation, the stopping position on the front side in the conveying direction of the substrate 2 will be referred to as the first stage, and the stopping position on the rear side will be referred to as the second station. call. Furthermore, the chip components mounted on the substrate 2 are placed on the feeder 1 shown by A-E in FIG.
shall be supplied from In this embodiment, the first
and a simulation of mounting all the chip components on the board 2 in each of the second stages a,
The moving distance of the head is determined for each chip component, and the chip component is placed in a predetermined position on the substrate 2 at the station where the head has a shorter moving distance, as shown by the arrow connecting the feeder 1 and the substrate 2 in Fig. 1. Implement.

The method for determining which stage tongue to mount one chip component in this embodiment is shown in FIGS. 2 and 3.
This will be explained according to the diagram. Note that in this method, the magnitude of the moving distance of the head is determined in the moving direction of the substrate 2 (hereinafter referred to as the X direction).

) The determination is made based on the distance between the position of the feeder 1 and the mounting position of the chip component on each stage tongue, and FIG. 2 shows each position data, and FIG. 3 shows the process 70 for the determination. - In making this determination, first set the machine origin O of the automatic component mounting apparatus, then input the position data F of the feeder 1 that supplies the chip components, and then input the origin position fiG 1 , G of the board 2.
2 for each first and second station. and,
By inputting the chip component mounting data (data indicating the position on the substrate 2 where the chip component is mounted) A, the moving distance of the head on each stage tongue is determined. Here, in this embodiment, as described above, the mount data A
When input, this mount data A is first converted into a distance from the machine origin 0. In the case shown in Figure 2, the first
The data converted in Stacylan is G 1 +A,
The data converted in the second stage 5 becomes G2+A. In addition, each of the above position data sets the position of the machine origin O to 0.
It is expressed as a positive or negative value, with the front side of the machine origin O in the substrate transport direction being positive and the rear side being negative. Then, data indicating the distance between the position of feeder 1 and the mounting position of each chip component at each station (hereinafter referred to as X data)
, ) is calculated. In this case, the X data of the first stage 3 is I (G 1 +A)-F l , and the X data of the second stage 3 is +(G2+A)-F+.

Therefore, by comparing the X data at both stages 3, it can be determined which station has a shorter distance between the feeder 1 and the chip component mounting position. In this way, it is determined whether each chip component should be mounted at a stage offset by one school. Note that in the above case, for simplicity,
Although the moving distance of the head has been determined from the data, it is of course possible to determine at which station the chip component is to be mounted based on the actual moving distance of the head itself.

The actual mounting state of chip components will be explained with reference to FIG. Here, it is assumed that the chip components supplied from feeders A-E are mounted on the substrate 2 at the positions indicated by black circles in FIG. 4(a), and the chip components supplied from feeders A-C are mounted on the second
The moving distance of the head is shorter when the chip components are mounted on the board 2 using the stage tongue, and the moving distance of the head is shorter when the chip components supplied from feet D and E are mounted on the substrate 2 using the first stage tongue. shall be. In this case, first the substrate 2
When the is transported and stopped at the first station, as shown in Fig. 4 (
As shown in b), the chip components supplied from feeders D and E are mounted on the substrate 2. After this mounting, the substrate 2 is conveyed to the second stage and stopped, and the chip components supplied from the feeders A-C are mounted on the substrate 2 as shown in FIG. 4(e). After all the chip components have been mounted, the board 2 is transported to a stocker or the like. In this way, the overall moving distance of the head when all the chip components are mounted is shortened, and the time for mounting the chip components can be shortened.

Incidentally, recently there has been a demand for a significant reduction in the mounting time, so it is necessary not only to shorten the above-mentioned mounting time but also to shorten the transportation time of the board 2. In order to satisfy this demand, the chip components may be mounted and the board 2 may be transported in the following manner. In other words,
In order to shorten the conveyance time in this way, three substrates 2 (note that more than three substrates may be used) are set on the rail 3 as shown in FIG. Three stations (three stations or more may be used).

)establish. Here, each station is numbered 1, !, from the frontmost side in the transport direction of the substrate 2. #2, called the third station. First, as shown in FIG. 5(a), the substrate 2,
is the third station and substrate 2, and is the second station and substrate 2. Starting from the state where the chip is located at the third stage tongue, first, a chip component is mounted on the substrate 2 shown in FIG. 5(,). Note that the chip components mounted at this stage tongue are the same as in the case of the two stations described above [Thus, the distance between the mounting position and the feeder 1 is closer than that of the other first and second stations, and the chip component b1 is mounted. Other chip components are mounted on this substrate 21 in advance at the first and second stations in the front. Also, regarding the board 2 □, a specific chip component is mounted in advance at the first station, and only the board 2 is in the -1 state with no chip component mounted thereon.

Said substrate 2. After mounting the chip components on the
Next, the mounting of the chip components on the board 22 at the second station is started, and during the mounting of the chip components on the board 22, as shown in FIG.
1 is transported to a stocker or the like.

Furthermore, once the mounting of the chip components on the board 2□ is completed, next is the board 2. At the first station, mounting of the chip components is started, and at the same time, the substrate 22 is transported to the third station as shown in FIG. 5(c). Note that in this case, a new board 24 is set on the rail 3.

Then, the substrate 2. When the mounting of the chip components on the first stage board is completed, the third stage mounting on the board 2□ is completed.
Mounting of chip components at the station starts, and at this time, as shown in FIG. 5(d), the board 2. ．． 2
．． are transported to the second and first stations. Thereafter, chip components are sequentially mounted and the substrate 2 is transported in the same manner as described above. In other words, by doing the above, the chip components continue to be mounted while the board 2 is being transported, so the time for transporting the board 2 is the same as when there is no transport time, and the mounting time can be significantly shortened. Become. In addition,
It goes without saying that the present invention can be similarly applied to automatic insertion machines.

E Effect of the invention 1 As described above, the present invention stops the board on the rail and rotates it.
There are multiple positions for mounting components, and when mounting each circuit component, the circuit component is mounted on the board at a stop position on the board where the head travels a short distance, so when all the circuit components are mounted, The total moving distance of the head can be shortened, and therefore the time required for mounting circuit components can be shortened. Moreover, the stopping position of the above board is set at 3 m or more, and three or more boards are set on the rail, and when one board is mounting circuit components at the stopping position, other boards are transported. By doing so, the board transport time is not included in the mounting time, and the mounting time can be significantly shortened.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing a mounting method according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of a determination method for determining a station for mounting the same chip component, and FIG. 3 is a process 70 for the above determination. -Charts, Figures 4 (a') to (e) are explanatory diagrams of the mounting procedure of the same chip components, Figures 5 (a) to (d)
FIG. 6 is an explanatory diagram of a mounting method and a transportation method in the case of shortening the transportation time, and FIG. 6 is an explanatory diagram of a conventional mounting method. 1 is a feeder, 2 is a board, and 3 is a rail.

Claims (1)

[Claims] (1) The board is transported along the rail, and a plurality of feeders each loaded with a plurality of types of circuit components to be mounted on the board are arranged along the board transport direction on the side of the rail, and the head is moved as desired. In an automatic component mounting device that picks up circuit components from a feeder and automatically mounts them on a board, there are multiple positions where the board is stopped on the rail and circuit components are mounted.
An automatic component mounting device that mounts each circuit component on a board at a stop position on the board where the moving distance of the head is shortened when mounting each circuit component.