JPS59113624A - In-line type exposing device - Google Patents

In-line type exposing device

Info

Publication number
JPS59113624A
JPS59113624A JP57224278A JP22427882A JPS59113624A JP S59113624 A JPS59113624 A JP S59113624A JP 57224278 A JP57224278 A JP 57224278A JP 22427882 A JP22427882 A JP 22427882A JP S59113624 A JPS59113624 A JP S59113624A
Authority
JP
Japan
Prior art keywords
mask
substrate
printed
exposure
masks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57224278A
Other languages
Japanese (ja)
Other versions
JPS6330777B2 (en
Inventor
Kenichi Oku
健一 奥
Masaki Suzuki
正樹 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57224278A priority Critical patent/JPS59113624A/en
Publication of JPS59113624A publication Critical patent/JPS59113624A/en
Publication of JPS6330777B2 publication Critical patent/JPS6330777B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741Handling masks outside exposure position, e.g. reticle libraries
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor

Abstract

PURPOSE:To obtain the small-sized device, through which masks are exchanged automatically, by carrying a substrate to be baked in the direction parallel with a mask carrying means and baking a circuit pattern for exposure printed on the mask to the substrate to be baked. CONSTITUTION:The masks 8 are fed to a mask conveyor belt 10 from a mask supply means 11, carried up to an exposing section 9, and fixed to the exposing section 9. The substrates to be baked 7 are fed to a substrate conveyor belt 13 from a substrate supply means 14, and carried up to the exposing section 9. The substrates are positioned with the masks 8 in the exposing section 9 and exposed. Exposure is completed, and the substrates to be baked 7 are carried by the substrate conveyor belt 13, and encased in a substrate encasing means 15. On the other hand, the masks 8 are carried by the mask conveyor belt 10, and encased in a mask encasing means 12.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、半導体や回路基板の露光に使用するマスクを
自動的に交換するインライン型露光装置に関するもので
ある。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an in-line exposure apparatus that automatically exchanges masks used for exposing semiconductors and circuit boards.

従来例の構成とその問題点 従来のインライン型露光装置は、第1図にその具体構成
を示すように、基板供給部1から基板搬送部2へ被焼付
基層3が供給され、露光部4へ搬送される。露光部4で
、被焼付基板3はマスク6との間で位置合わせが行なわ
れ、次いで露光が行なわれる。露光が終了後、被焼付基
板3は基板3は基板搬送部2により搬送され、基板収納
部6へ収納されるというような構成となっていた。
Structure of the conventional example and its problems In the conventional in-line exposure apparatus, as shown in the concrete structure in FIG. transported. In the exposure section 4, the substrate 3 to be printed is aligned with the mask 6, and then exposed. After the exposure is completed, the substrate 3 to be printed is transported by the substrate transport section 2 and stored in the substrate storage section 6.

しかしながら、上記のような構成では、マスク6の自動
交換機能がないので、マスクの交換は人手によって行な
わなければならないため省力化が計りにぐいという欠点
を有5していた。
However, the above-mentioned configuration has the disadvantage that there is no automatic exchange function for the mask 6, and therefore the mask must be exchanged manually, making it difficult to save labor.

発明の目的 本発明は上記欠点に鑑み、マスクの交換を自動的に行な
う小型のインライン型露光装置を提供するものである。
OBJECTS OF THE INVENTION In view of the above-mentioned drawbacks, the present invention provides a compact in-line exposure apparatus that automatically exchanges masks.

発明の構成 本発明は、露光用回路バタンか印刷されたマスクを直線
的に搬送するマスク搬送手段と、上記マスフ搬送手段の
下方に位置し、前記マスク搬送手段と平行を方向に被焼
付基板を搬送する基板搬送手段と、前記マスク搬送手段
及び前記基板搬送手段上に位置し、前記マスクに印刷さ
れた露光用回路バタン金上記被焼付基板に焼き付ける露
光手段と、前記マスク搬送手段に上方から順次下降しな
がらマスクを供給するマスク供給手段と、前記マスク搬
送手段の下方から順次上昇しながらマスクを収納するマ
スク収納手段とを構成されておりマスクの交換が自動的
に行なえる小型の露光装置を提供するものである。
Structure of the Invention The present invention comprises a mask transport means for linearly transporting a mask printed with an exposure circuit button, and a mask transport means located below the mask transport means, for transporting a substrate to be printed in a direction parallel to the mask transport means. A substrate transporting means for transporting, an exposure means located on the mask transporting means and the substrate transporting means and printing an exposure circuit stamp printed on the mask onto the substrate to be printed, and an exposure means for printing onto the substrate to be printed; A small exposure apparatus is provided, which is composed of a mask supply means for supplying masks while descending, and a mask storage means for storing masks while ascending sequentially from below the mask transport means, and in which masks can be replaced automatically. This is what we provide.

実施例の説明 以下本発明の一実施例について図面を参照しながら説明
する。
DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

第2図は本発明の第一の実施例におけるインライン型露
光装置の斜視図を示すものである。第2図において、7
は被焼付基板、81露光用回路バタンか印刷されたマス
ク、9は上記被焼付基板7と上記マスク8を位置合わせ
し、上記マスク8[印刷された露光用回路バタンを上記
被焼付基板7に焼きつける露光部、10は上記マスク8
を搬送するマスク搬送ベルト、11は上記マスク搬送ベ
ルト10に上方から順次下降しながら上記マスク8を供
給するマスク供給手段、12は上記マスク搬送ベルト1
0の下方から順次上昇しながらマスク8を収納するマス
ク収納手段、13は上記マスク搬送手段10の下方に位
置し、上記マスク搬′送ベルト1oと平行な方向に上記
被焼付基板7を搬送する基板搬送ベルト、14は上記被
焼付基板7を上方から順次下降しながら基鈑搬送ベルト
3に供給する基板供給手段、16は上記基板搬送ベルト
13の下方から順次上昇しながら被焼付基板7を収納す
る基板収納手段で〜ある。
FIG. 2 shows a perspective view of an in-line exposure apparatus in a first embodiment of the present invention. In Figure 2, 7
81 is a substrate to be printed; 81 is a mask on which an exposure circuit button is printed; 9 is a mask on which the substrate 7 to be printed and the mask 8 are aligned; The exposed area to be printed, 10 is the mask 8 mentioned above.
11 is a mask supplying means for supplying the mask 8 to the mask conveying belt 10 while descending sequentially from above; 12 is a mask conveying belt 1;
A mask storage means 13 for storing the masks 8 while ascending sequentially from below 0 is located below the mask transport means 10, and transports the substrate 7 to be printed in a direction parallel to the mask transport belt 1o. A substrate conveyance belt 14 is a substrate supply means for supplying the substrate 7 to be printed to the substrate conveyance belt 3 while descending from above sequentially; 16 is a means for storing the substrate 7 to be baked while being ascended sequentially from below the substrate conveyance belt 13; It is a board storage means.

以上のように構成されたインライン型露光装置について
以下にその動作を説明する。まず、マスク供給手段11
からマスク搬送ベルト10にマスク8が供給され、露光
部9まで搬送されて、露光部9に固定される。次に基板
供給手段14から被焼付基板7が基板搬送ベルト13に
供給され、露光部9まで搬送され、露光部9で上記マス
ク8との間で位置合わせが行なわれ露光が行なわれる。
The operation of the in-line exposure apparatus configured as described above will be described below. First, the mask supply means 11
The mask 8 is supplied to the mask conveying belt 10 from the mask conveying belt 10, conveyed to the exposure section 9, and fixed to the exposure section 9. Next, the substrate 7 to be printed is supplied from the substrate supply means 14 to the substrate conveyance belt 13 and conveyed to the exposure section 9, where it is aligned with the mask 8 and exposed.

露光完了後、被焼付基板7は基板搬送ベルト13により
搬送され、基板収納手段15に収納される。
After the exposure is completed, the substrate 7 to be printed is transported by the substrate transport belt 13 and stored in the substrate storage means 15.

一方マスク8はマスク搬送ベルト10により搬送されマ
スク収納手段12に収納される。
On the other hand, the mask 8 is transported by a mask transport belt 10 and stored in a mask storage means 12.

次に基板搬送ベルトとマスク搬送ベルトの位置関係を第
3図に基づいて説明する。
Next, the positional relationship between the substrate conveyance belt and the mask conveyance belt will be explained based on FIG. 3.

第3図において、7aは被焼付基板、8aはマスク、1
3aは基板搬送ベルト、10aはマスク搬送ベルト、1
6はマスク搬送ベルト駆動モータ、17は基板搬送ベル
ト駆動モータである。マスク8aと被焼付基板7aは平
行な方向に搬送されるが、基板搬送ベルト るためマスク8aと被焼付基板は搬送途中で接触するこ
とはない。
In FIG. 3, 7a is a substrate to be printed, 8a is a mask, 1
3a is a substrate conveyance belt, 10a is a mask conveyance belt, 1
6 is a mask conveyance belt drive motor, and 17 is a substrate conveyance belt drive motor. The mask 8a and the substrate to be printed 7a are conveyed in parallel directions, but because of the substrate conveyance belt, the mask 8a and the substrate to be printed do not come into contact during the conveyance.

次にマスク供給手段の構造について説明する。Next, the structure of the mask supply means will be explained.

第4図で7bは被焼付基板、8bはマスク、13bは基
板搬送ベルト10bはマスク搬送ベルト、11bはマス
ク供給手段、18はマスク供給手段11aの内側に両方
から設けられた一対の突起である。上記一対の突起18
間の距離は、マスク搬送ベルト1obの幅よりも大きく
なっている。新しいマスク8bがマスク搬送ベル)10
bに供給されるときには、マスク供給手段11aが下降
し突起18がマスク搬送ベルト10bの位置にきたとき
、マスク8bは、マスク搬゛送ベルト1obに乗り、搬
送される。このとき1対の突起18間の距離はマスク搬
送ベルト10bの幅よりも大きいため、マスク供給手段
11aとマスク搬送ベルト1obは接触しない。壕だ、
マスクを収納する手段も同様の構造であるが、この場合
マスクが搬送されてくると、マスク収納手段が一段ずつ
上昇してマスクを収納する。
In FIG. 4, 7b is a substrate to be printed, 8b is a mask, 13b is a substrate conveyance belt 10b is a mask conveyance belt, 11b is a mask supply means, and 18 is a pair of protrusions provided inside the mask supply means 11a from both sides. . The pair of protrusions 18
The distance between them is larger than the width of the mask conveying belt 1ob. New mask 8b is mask transport bell) 10
When the mask supply means 11a is lowered and the protrusion 18 comes to the position of the mask conveyance belt 10b, the mask 8b rides on the mask conveyance belt 1ob and is conveyed. At this time, since the distance between the pair of projections 18 is greater than the width of the mask conveyance belt 10b, the mask supply means 11a and the mask conveyance belt 1ob do not come into contact with each other. It's a trench.
The means for storing the mask has a similar structure, but in this case, when the mask is transported, the mask storing means rises one step at a time to store the mask.

以上のように本実施例によれは、マスク8をi線的に搬
送するマスク搬送ベルト10と、上記マスク搬送ベルト
10の下方に位置し、上記マスク搬送ベルト10と平行
な方向に被焼付基板7を搬送する基板搬送ベルト13と
、上記マスク8に印−刷された露光用回路パタンを上記
被焼付基板7に焼きつける露光手段9と、上記マスク搬
送ベルト10に上方から順次下降しながらマスク8を供
給する妥スク供給手段11と、上記マスク搬送ベルト1
0の下方から順次上昇しながらマスク8を収納するマス
ク収納手段12を設けることにより、マスクの交換を自
動的に行なうことができる。なお、本実施例において、
マスク搬送ベルト10、基板搬送ベルト13はそれぞれ
エアーコンベアなどにしてもよい。
As described above, this embodiment includes a mask conveying belt 10 that conveys the mask 8 in an i-line manner, and a substrate to be printed that is located below the mask conveying belt 10 and extends in a direction parallel to the mask conveying belt 10. 7, an exposure means 9 for printing the exposure circuit pattern printed on the mask 8 onto the substrate 7 to be printed, and a substrate conveying belt 13 that conveys the mask 8 while sequentially descending from above to the mask conveying belt 10. and the mask conveying belt 1.
By providing the mask storage means 12 that stores the masks 8 while ascending sequentially from below 0, the masks can be replaced automatically. In addition, in this example,
The mask conveyance belt 10 and the substrate conveyance belt 13 may each be an air conveyor or the like.

また一連の工程の中に露光装置を組み込む場合°には、
基板供給手段14及び基板収納手段16を取り除き、基
板搬送ベルト13を延長しベルトに−より前工程を連結
し、前工程を終えた被焼付基板7が基鈑搬送ベルト13
により露光部9へ搬送され露光完了後、基板搬送ベルト
13により後工程へ直接銀°送されるというような構成
も可能である。
Also, when incorporating exposure equipment into a series of processes,
The substrate supply means 14 and the substrate storage means 16 are removed, the substrate conveyance belt 13 is extended, and the previous process is connected to the belt by the belt.
It is also possible to construct a structure in which the substrate is transported to the exposure section 9 by the substrate transport belt 13, and after the exposure is completed, the silver is directly transported to the subsequent process by the substrate transport belt 13.

発明の効果 以上のように本発明は、露光用回路バタンか印刷された
マスクを直線的に搬゛送するマスク搬送手段と、上記マ
スク搬送手段の下方に位置し上記マスク搬送手段と平行
な方向に被焼付基板を搬送する基板搬送手段と、上記マ
スク搬送手段及び上記基板搬送手段上に位置し、上記マ
スクに印刷された露光用回路バタンを上記被焼付基板に
焼きつける露光手段と、上記マスク搬゛送手段に上方か
ら順次下降しながらマスクを供給するマスク供給手段と
、上記マスク搬送手段の下方から順次上昇しながらマス
クを収納するマスク収納手段とを備えることにより、自
動的にマスクを交換できる小型の露光装置を提供するも
のである。
Effects of the Invention As described above, the present invention includes a mask conveying means for linearly conveying a mask printed with an exposure circuit button, and a mask conveying means located below the mask conveying means in a direction parallel to the mask conveying means. a substrate transport means for transporting the substrate to be printed; an exposure means located on the mask transport means and the substrate transport means for printing an exposure circuit button printed on the mask onto the board to be printed; Masks can be exchanged automatically by providing a mask supply means for supplying masks to the transport means while descending from above, and a mask storage means for storing masks while ascending sequentially from below the mask transport means. This provides a compact exposure device.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のインライン型露光装置の斜視図、第2図
は本発明の〜実施例におけるインライン型露光装置の斜
視図、第3図は基板搬送ベルトとマスク搬送ベルトの斜
視図、第4図はマスク供給手段の断面図である。 1・・・・・基板供給手段、2・・・・・・基板搬送手
段、3・・・・・・被焼付基板、4・・・・・・露光部
、6・・・・・マスク、6・・・・・・基板収納手段、
7.了a、7b・・・・・被焼付基板、8.8a、8b
・・・・・・マ′スク、9・・・・・露光部、10.1
0a、10b・・・・・・マスク搬送ベルト、11゜1
18山中マスク供給手段、12・・・・・・マスク収納
手段、13,13a、13b・・曲基板搬送ベルト、1
4・・・・・基板供給手段、15・・川・基板収納手段
、16・川・・マスク搬送ベルト駆動モータ、17・・
・・・・基板搬送ベルト駆動モータ、18・・・・・・
突起。
FIG. 1 is a perspective view of a conventional in-line exposure apparatus, FIG. 2 is a perspective view of an in-line exposure apparatus according to embodiments of the present invention, FIG. 3 is a perspective view of a substrate conveyance belt and a mask conveyance belt, and FIG. The figure is a sectional view of the mask supply means. 1...Substrate supply means, 2...Substrate transport means, 3...Substrate to be printed, 4...Exposure section, 6...Mask, 6... Board storage means,
7. Completed a, 7b...Substrate to be baked, 8.8a, 8b
...Mask, 9...Exposure area, 10.1
0a, 10b...Mask conveyor belt, 11゜1
18 Yamanaka mask supply means, 12...mask storage means, 13, 13a, 13b... curved substrate conveyance belt, 1
4... Substrate supply means, 15... Substrate storage means, 16... Mask conveyance belt drive motor, 17...
...Substrate conveyor belt drive motor, 18...
protrusion.

Claims (1)

【特許請求の範囲】[Claims] 露光用バタンか印刷されたマスクを直線的に搬送するマ
スク搬送手段と、このマスク搬送手段の下方に設けられ
、前記マスク搬送手段と平行な方向に被焼付基板を搬送
する基板搬゛送手段と、前記マスク搬送手段及び前記基
板搬゛送手股上に設けられ、前記マスクに印刷された露
光用バタンを前記被焼付基板に焼き付ける霧光手段と、
前記マスク搬送手段に上方から順次下降しながらマスク
を供給するマスク供給手段と、前記マスク搬送手段の下
方から順次上昇しながらマスクを収納するマスク収納手
段とを備えたインライン型露光装置。
a mask transport means for linearly transporting a mask printed with an exposure button; a substrate transport means provided below the mask transport means for transporting a substrate to be printed in a direction parallel to the mask transport means; , a fog light means provided on the crotch of the mask transport means and the substrate transporter for burning an exposure button printed on the mask onto the substrate to be printed;
An in-line exposure apparatus comprising: a mask supply means for supplying the mask to the mask transport means while descending sequentially from above; and a mask storage means for storing the mask while ascending sequentially from below the mask transport means.
JP57224278A 1982-12-20 1982-12-20 In-line type exposing device Granted JPS59113624A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57224278A JPS59113624A (en) 1982-12-20 1982-12-20 In-line type exposing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57224278A JPS59113624A (en) 1982-12-20 1982-12-20 In-line type exposing device

Publications (2)

Publication Number Publication Date
JPS59113624A true JPS59113624A (en) 1984-06-30
JPS6330777B2 JPS6330777B2 (en) 1988-06-21

Family

ID=16811264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57224278A Granted JPS59113624A (en) 1982-12-20 1982-12-20 In-line type exposing device

Country Status (1)

Country Link
JP (1) JPS59113624A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61177726A (en) * 1985-02-01 1986-08-09 Hitachi Ltd Wafer aligner for semiconductor device
EP0266760A2 (en) * 1986-11-05 1988-05-11 Svg Lithography Systems, Inc. High speed reticle change system
JP2003015308A (en) * 2001-06-28 2003-01-17 Dainippon Printing Co Ltd Exposure device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61177726A (en) * 1985-02-01 1986-08-09 Hitachi Ltd Wafer aligner for semiconductor device
EP0266760A2 (en) * 1986-11-05 1988-05-11 Svg Lithography Systems, Inc. High speed reticle change system
JP2003015308A (en) * 2001-06-28 2003-01-17 Dainippon Printing Co Ltd Exposure device

Also Published As

Publication number Publication date
JPS6330777B2 (en) 1988-06-21

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