JPH07183688A - Electronic component mounting machine, printed board supply device connected thereto and printed board stock device - Google Patents

Abstract

PURPOSE:To mount electronic components simultaneously onto two kinds of printed boards, reduce stand-by time in an electronic component mounting device and production facility in subsequent processes, and realize efficient production. CONSTITUTION:Whether or not two boards have been carried onto a board A set position 11 and a board B set position 12 on a loader rail 10 is verified, and a board transfer unit 9 transfers the two boards onto an XY table. Then electronic components are mounted on the two boards with a predetermined piece of NC data. After the mounting is completed, the two boards are transferred to an unloader rail 13, where they stand by at a board set position 14 and a board set position 15 on the unloader rail 13, and when a subsequent stage is ready to receive the boards, the two boards are carried to the subsequent stage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting machine for mounting electronic components on a printed circuit board, a printed circuit board supply device for supplying the printed circuit board to the electronic component mounting machine, and a printed circuit board from the electronic component mounting machine. The present invention relates to a printed circuit board stocking device for stocking.

[0002]

2. Description of the Related Art In recent years, in electronic component mounting, the production form is changing from small-item mass-production to multi-item small-quantity production. However, the idea was to produce one type of printed circuit board within a certain period of time, and when the next product type came, set the NC data and printed circuit board transfer dimensions that match that model. .

Hereinafter, a form of printed circuit board production by mounting the above-mentioned electronic parts will be described with reference to FIG. The printed circuit board is supplied to the electronic component mounter 1 by the printed circuit board supply device 3. The supplied printed circuit board is set on the XY table 2 of the electronic component mounter 1.
The electronic component mounter 1 mounts electronic components on a printed circuit board according to preset NC data. When the board on which the electronic component is mounted is carried out from the XY table 2, it is carried into the printed board stocking device 4 and the printed board is stocked.

[0004]

However, the above structure has the following problems. As an example, when mounting an electronic component with an axial lead (hereinafter referred to as an axial component), an electronic component with a radial lead (hereinafter referred to as a radial component), and a chip component respectively, as the production model A, an axial component and a radial component are used. It is considered that two types of printed circuit boards are to be produced, one to be mounted and one to be manufactured as a production model B, one to mount an axial component and a chip component.

Normally, the production model A is produced first, and then the production model B is produced. When producing the production model A, an axial component mounting machine inserts an axial component mounter, and a radial component insertion machine inserts a radial component. When producing the production model B, after mounting the axial parts by the axial part insertion machine, the chip parts are mounted by the chip part mounting machine.

In the case of such a production method, the chip component mounting machine is in a waiting state while the radial component is inserted in the production model A, and the radial component insertion machine is in the standby state while the chip component is mounted in the production model B. It becomes in a waiting state and is inefficient.

In view of the above problems, the present invention reduces the waiting time of the production equipment in the subsequent process, such as the radial component inserting machine and the chip component mounting machine in this example, to efficiently produce an electronic device. The object is to provide a component mounter.

[0008]

In order to solve the above problems, an electronic component mounting machine, a printed circuit board supply device, and a printed circuit board stock device according to the present invention respectively supply two types of printed circuit boards at the same time, mount electronic components, With the configuration that it can be stocked, the electronic component mounting machine has a mechanism that allows two printed circuit boards to be installed in an XY table,
When each printed circuit board is A and B, the printed circuit board supply device is provided with a sequence control means for always setting the two printed circuit boards in the XY table in the order of A and B. For the boards A and B, a means for supplying the printed boards to the electronic component mounter in the order of A, B, A, B is provided, and the printed board stock device has A, B, and B for the printed boards A and B having different mounting patterns. It is provided with a means for correctly distributing the substrates supplied from the electronic component mounter in the order of A and B into two types, A and B, and taking in and stocking them.

[0009]

With the above-described structure, the printed circuit board supplying apparatus can print the printed circuit boards A and B having different mounting patterns,
In the order of A and B, it is loaded onto the loader rail of the electronic component mounting machine, and the electronic component mounting machine always transports the loaded printed circuit board onto the XY table in the order of A and B, and then by the sequence control decided. Electronic components are mounted on two printed circuit boards. After the mounting is completed, the two printed circuit boards A and B are conveyed onto the unloader rail and
Are carried out in the order of A, B, A, B, and the printed circuit board stocking device correctly distributes and stocks the printed circuit boards into two kinds of AB. By simultaneously producing two types of substrates as described above, it is possible to reduce the waiting time of the production facility in the subsequent process and efficiently produce the substrates.

[0010]

【Example】

(Embodiment 1) An electronic component mounting machine according to a first embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 5 is an insertion head, 6 is an anvil, 7 is a board A set position, 8 is a board B set position, 9 is a printed board transport unit, 10 is a loader rail, 11 is a board A set position on a loader rail, 12 is a board B set position on the loader rail, 13 is an unloader rail, 14 is a board A set position on the unloader rail, and 15 is a board B set position on the unloader rail.

The operation of the electronic component mounting machine configured as described above will be described below with reference to FIGS. 1 and 6. FIG. 6 is a flow chart showing the operation of the sequence control means of the electronic component mounting machine shown in FIG.

First, the operation of loading the printed circuit board will be described. At 51 in FIG. 6, it is confirmed whether or not the printed circuit board supply device at the preceding stage can carry out the printed circuit board to the electronic component mounter (hereinafter, referred to as ready state). When the ready state is reached, printing is performed at 52 in FIG. Start loading the board.

At 53 in FIG. 6, it is confirmed whether or not the substrate A is carried into the substrate A setting position 11 on the loader rail 10, and then at 54 in FIG. 6, the substrate B is similarly moved to the substrate setting position 12.
Check that the items have been delivered.

Next, at 55 in FIG. 6, the printed board carrying unit 9 carries the boards A and B from the loader rail onto the XY table. When it is confirmed at 56 in FIG. 6 that the board A and the board B are set at the board A set position 7 and the board B set position 8 in the XY table, respectively, the NC data set in advance and other Electronic components are mounted on the boards A and B based on the initial data. At this time, the NC data is 1 for the board A and the board B.
It must be set assuming that it is a single board.

After the electronic parts are mounted on the board under the above conditions, the board A and the board B are moved from the XY table at 58 in FIG.
Is carried out to the unloader rail 13 by the printed circuit board transport unit.

At 59 in FIG. 6, it is confirmed whether the board A is transferred to the board A setting position 14 on the unloader rail 13,
Further, at 60 in FIG. 6, it is confirmed whether the board B is transported to the board B setting position 15 on the unloader rail 13.
At this time, in 61 of FIG. 6, a signal that can be carried out from the electronic component mounter to the rear stage side (hereinafter referred to as ready state) is transmitted, and at 62, it is confirmed that the ready state signal is also transmitted from the rear stage side. If confirmation is complete, unloader rail 1 at 63
The substrate A and the substrate B on 3 are carried out to the rear stage side.

(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings. FIG. 2 is an overall perspective view of the suction type printed circuit board supply device. In FIG.
16 is an unloader rail, 17 is a printed circuit board suction part, 18 is a suction part slide rail, 19 is a board A, 20
Is the substrate B.

The operation of the printed circuit board supply device configured as described above will be described below. FIG. 7 is a flowchart showing the operation of the suction type printed circuit board supply device.

At 65 in FIG. 7, it is confirmed that the substrates A and B are not waiting on the unloader rail 16, and then the operation is started. Slide rail 1 at 66 in FIG.
The suction unit 17 horizontally moves and moves up and down on 8 to suck the substrate A. At 67 in FIG. 7, the substrate A is transferred onto the unloader rail 16. After confirming that the substrate A is present on the rail at 68 in FIG. 7, the substrate B is then adsorbed and conveyed.

At 69 in FIG. 7, the suction portion 17 horizontally moves and moves up and down to suck the substrate B. At 70 in FIG. 7, the substrate B is transferred onto the unloader rail 16. After confirming that the board B is present on the unloader rail at 71 in FIG. 7, a ready signal is transmitted to the electronic component mounting machine at the subsequent stage at 72. When the ready signal is received from the rear side at 73 in FIG. 7, the boards A and B on the unloader rail are carried out at 74.

(Third Embodiment) A third embodiment of the present invention will be described below with reference to the drawings. FIG. 3 is an overall perspective view of the push-up type printed circuit board stocking device. Figure 3
In FIG. 21, 21 is a board A stock position, 22 is a board B stock position, 23 is a board A carry-in position, 24 is a board B carry-in position, 25 is a loader rail, 26 is a board A retracted position on a loader rail, and 27 is a loader rail. This is the retracted position of the upper substrate B.

The operation will be described below with reference to FIGS. 3 and 8. FIG. 8 is a flowchart showing the operation of the push-up type printed circuit board stocking device. At 75 in FIG. 8, it is confirmed whether or not the ready signal is transmitted from the electronic component mounting machine at the preceding stage. When the ready signal is confirmed, the board A and the board A are placed on the loader rail 25 at 76 in FIG.
The substrate B is loaded. Next, at 77, it is confirmed that the board A is at the board A retracted position 26 and the board B is at the board B retracted position 27 on the loader rail.

When the confirmation is completed at 77 in FIG. 8, first, at 78 in FIG. 8, the substrate A is transported from the substrate A standby position 26 to the substrate A loading position 23. The substrate A conveyed at 79 in FIG.
Is stored in.

Next, at 80 in FIG. 8, the substrate B is conveyed from the substrate B retreat position 27 to the substrate B carry-in position 34. 8 of FIG.
The substrate B transported in 1 is pushed up and stored in the substrate B stock position 22 as it is. After storing the board B,
At 82 in FIG. 8, a ready signal is transmitted to the front side to complete the printed circuit board stock operation.

(Embodiment 4) A fourth embodiment of the present invention will be described below with reference to the drawings. FIG. 4 is an overall perspective view of a rack type printed circuit board supply device showing a fourth embodiment of the present invention. In FIG. 4, 31 is a board A rack,
32 is a board B rack, 33 is a slide rail, 34 is a board A set position on the slide rail, 35 is a board B set position on the slide rail, 36 is a sliding direction, 37
Is an unloader rail, 38 is a substrate A set position on the unloader rail, and 39 is a substrate B set position on the unloader rail.

The operation of the rack type substrate supply apparatus having the above-mentioned structure will be described below. FIG. 7 is a flowchart showing the operation of the rack-type printed circuit board supply device.

The unloader rail 3 at 65 in FIG.
The operation is performed after confirming that there are no substrates A and B on No. 7. At 66 in FIG. 7, the slide rail 33 moves to the front of the board A rack 31, and the board A is taken out from the board A rack 31 to the board A set position 34 on the slide rail.
At 67 in FIG. 7, the slide rail 33 moves to the front of the unloader rail 37 to carry the substrate A onto the unloader rail. At 68 in FIG. 7, it is confirmed that the board A is set at the board A setting position 38 on the unloader rail. When the confirmation is completed, the next operation starts.

At 69 in FIG. 7, the slide rail 33 moves to the front of the board B rack 32 to move from the board B rack 32 to the board B.
Is taken out to the board B set position 35 on the slide rail. At 70 in FIG. 7, the slide rail 33 moves to the front of the unloader rail 37 to carry the substrate B onto the unloader rail. At 71 in FIG. 7, it is confirmed that the board B is set at the board B setting position 39 on the unloader rail. When the confirmation is completed, a ready signal is transmitted to the subsequent stage at 72 in FIG. When the ready signal from the rear side is confirmed at 73 in FIG. 7, the substrates A and B are carried out to the rear side at 74.

(Embodiment 5) A fifth embodiment of the present invention will be described below with reference to the drawings. FIG. 5 is an overall perspective view of a rack type printed circuit board stocking device.

In FIG. 5, 41 is a board A storage rack, 4
2 is a board B storage rack, 43 is a slide rail, 44 is a board A set position on the slide rail, 45 is a board B set position on the slide rail, 46 is a sliding direction, 4
7 is a loader rail, 48 is a substrate A standby position on the loader rail, and 49 is a substrate B standby position on the loader rail.

The operation of the rack type printed circuit board stocking device constructed as described above will be described below. FIG. 8 is a flowchart showing the operation of the rack type printed circuit board stocking device.

At 75 in FIG. 8, it is confirmed whether or not the ready signal is transmitted from the preceding stage side. When the confirmation is completed,
At 76, the substrates A and B are loaded onto the loader rail 47.

Substrate A on the loader rail at 77 in FIG.
Substrate A and substrate B are placed at standby position 48 and substrate B standby position 49, respectively.
Make sure that there is substrate B. When the confirmation is completed, first, the operation of storing the substrate A is started. At 79 in FIG. 8, the slide rail 43 is moved so that the board A set position 44 is in front of the loader rail 47, and the board A is carried from the board A standby position 48 to the board A set position 44 on the slide rail. , The board A storage rack 41. Next, the operation of storing the substrate B is started.

Next, at 81 in FIG. 8, the slide rail 43
Moves so that the board B set position 45 is in front of the loader rail 47, carries the board B from the board B standby position 49 to the board B set position 45 on the slide rail, and stores it in the board B storage rack 42. . After that, at 82 in FIG. 8, a ready signal is transmitted to the front side, and the process ends.

[0035]

As described above, according to the present invention, NC data and an operation program capable of simultaneously transporting two substrates are set so that electronic components can be mounted on two types of substrates at the same time. Types A substrate A supplied from different places, a substrate supply device that merges the substrates B and carries them into the electronic component mounting machine, and the already mounted substrates A,
If there are a board stock device for rearranging and storing the board B again, for example, if there is a board A into which a radial part is inserted after inserting an axial part and a board B into which a chip part is inserted after inserting an axial part, the axial inserting step is performed. When the board A and the board B can be mounted at the same time, the radial insertion can be immediately performed on the board A and the chip parts can be mounted on the board B, so that the time required for each equipment can be reduced and the efficiency is improved. Board mounting can be realized.

[Brief description of drawings]

FIG. 1 is an overall perspective view of an electronic component mounting machine according to a first embodiment of the present invention.

FIG. 2 is an overall perspective view of a suction type printed circuit board supply device according to a second embodiment of the present invention.

FIG. 3 is an overall perspective view of a push-up type printed circuit board stock device according to a third embodiment of the present invention.

FIG. 4 is an overall perspective view of a rack type printed circuit board supply device according to a fourth embodiment of the present invention.

FIG. 5 is an overall perspective view of a rack type printed circuit board stocking device according to a fifth embodiment of the present invention.

FIG. 6 is a flowchart of the operation of the electronic component mounter according to the first embodiment of the present invention.

FIG. 7 is a flowchart of the operation of the printed circuit board supply device according to the second and fourth embodiments of the present invention.

FIG. 8 is a flowchart of the operation of the printed circuit board stocking device in the third and fifth embodiments of the present invention.

FIG. 9 is a block diagram of a conventional electronic component mounter.

[Explanation of symbols]

 7 Board A set position in XY table 8 Board B set position in XY table 9 Printed circuit board transport unit 10 Loader rail 11 Board A set position on loader rail 12 Board B set position on loader rail 13 Unloader rail 14 Anne Board A set position on loader rail 15 Board B set position on unloader rail 16 Unloader rail 17 Board adsorption part 18 Slide rail 19 Board A 20 Board B 21 Board A stock position 22 Board B stock position 23 Board A carry-in position 24 board B loading position 25 loader rail 26 board A standby position on loader rail 27 board B standby position on loader rail 31 board A rack 32 board B rack 33 slide rail 34 board A set position on slide rail 35 Board B set position on id rail 36 Sliding direction 37 Unloader rail 38 Board A set position on unloader rail 39 Board B set position on unloader rail 41 Board A storage rack 42 Board B storage rack 43 Slide rail 44 Slide rail Upper board A set position 45 Board B set position on slide rail 46 Sliding direction 47 Loader rail 48 Board A standby position on loader rail 49 Board B standby position on loader rail

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location B65G 47/91 A 7716-3F

Claims (3)

[Claims] 1. A mechanism for mounting two printed circuit boards in an XY table, each printed circuit board having an A,
An electronic component mounting machine provided with a sequence control means for setting the two printed circuit boards in the XY table in the order of A and B when B is set. 2. A mechanism capable of installing two printed circuit boards in an XY table, each printed circuit board having an A,
In the case of B, the two printed circuit boards A are provided in the preceding stage of the electronic component mounting machine equipped with the sequence control means for setting the two printed circuit boards in the XY table without fail, and the printed circuit boards A having different mounting patterns are provided. About B, A, B,
A printed circuit board supply device including means for supplying a printed circuit board to an electronic component mounting machine in the order of A and B. 3. An XY table has a mechanism capable of installing two printed circuit boards, each printed circuit board having an A
In the case of B, the two printed circuit boards A are provided in the subsequent stage of the electronic component mounting machine equipped with the sequence control means for setting the two printed circuit boards in the order of A and B in the XY table, and have different mounting patterns. About B, A, B,
A printed circuit board stocking device equipped with means for correctly distributing and loading the substrates supplied from the electronic component mounting machine in the order of A and B into two types, A and B.