JP2003243887A - Board supply device, board housing device, housing rack and board mounting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To supply a plurality of types of boards of a different size to a mounting line in arbitrary order to house a mounted board from the mounting line in a mounting system for mounting electronic parts on the board. <P>SOLUTION: A plurality of housing rack exchange parts 111 for storing a housing rack 8 for housing one type of board are provided in a supply device 11 for supplying the board to a mounting line, and a transfer part 112 for transferring the board from each housing rack exchange parts 111 to the mounting line is provided. On the other hand, a plurality of housing rack exchange parts 161 for storing the housing rack 8 for housing one type of board are provided in a housing device 16 for housing the board from the mounting line, and a transfer part 162 for transferring the board swept away from the mounting line to each housing rack exchange part 161. Thus, a plurality of types of boards of a different size are supplied to the mounting line in arbitrary order to house the mounted board from the mounting line. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to techniques for handling substrates of different sizes.

[0002]

2. Description of the Related Art Conventionally, various processes have been performed when mounting electronic components such as fine electronic elements and circuit chips on a plate-shaped printed wiring board (hereinafter referred to as "board") formed of resin. A mounting system is used in which a plurality of devices are arranged in an array.

Usually, in a mounting system, a supply device for supplying the accommodated substrate to the transport path of the mounting line, a coating device for applying solder paste to the substrate, a mounting device for mounting electronic components on the solder paste, and a solder paste. A reflow device that heats and melts and cools and solidifies, an inspection device that inspects the mounting state of electronic components, and
A storage device that stores the mounted boards is sequentially arranged.

[0004]

By the way, in recent years, due to shortening of life cycle of electric appliances and multi-functionalization,
Even in mounting systems, high-mix low-volume production has come to be required. Taking a television as an example of an electronic device in which various types of mounting boards are built-in, one TV has one main board, two signal boards, two terminal boards, one high-frequency circuit board, and others. There may be a case in which there are a total of 10 types of mounting boards of four different sizes.
Further, recently, due to market demands, the specifications may be different one by one, and in order to meet such demands, it is necessary for the mounting system to frequently perform the work of switching the substrate type.

Examples of the work for switching the type of substrate include, for example, the work of exchanging the storage rack for accommodating the substrate in the supply device and the storage device, the work of exchanging the metal mask used in the coating device, and the transportation of the substrate in various devices. There are operations such as changing the width of the conveyor by turning a handle, and these operations are performed by an operator. The switching operation is performed in a state in which the worker waits until the board under mounting does not exist on the mounting line and the mounting system is completely stopped. Therefore, the switching work requires a lot of time.

However, the market demand for high-mix low-volume production tends to increase further, and the conventional mounting system may not be able to exert sufficient production capacity.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique suitable for high-mix low-volume production.

[0008]

According to a first aspect of the present invention, there is provided a substrate supply device for supplying a substrate to a next step, which includes a substrate arrangement section in which a plurality of types of substrates having different sizes are arranged. And a transfer unit for transferring the substrate from the substrate arrangement unit to the next step.

According to a second aspect of the present invention, in the substrate supply apparatus according to the first aspect, a plurality of storage racks, each storing one type of substrate, are provided at a plurality of mounting positions in the substrate placement unit. And a transfer unit, the transfer unit moving between a plurality of receiving positions for receiving the substrates from the plurality of mounting positions.

A third aspect of the present invention is the substrate supply apparatus according to the second aspect, wherein the transfer section waits for the substrate to stand by between the plurality of mounting positions and the transfer section. Further has a part.

According to a fourth aspect of the present invention, there is provided the substrate supply apparatus according to the second or third aspect, wherein the plurality of mounting positions are arranged in a direction perpendicular to the substrate transfer direction after the next step. Arranged.

According to a fifth aspect of the present invention, in the substrate supply apparatus according to any of the second to fourth aspects, the substrate arranging portion is a storage rack mounted at the plurality of mounting positions. It has a storage rack exchange section for exchanging with another storage rack.

According to a sixth aspect of the present invention, in the substrate supply apparatus according to any of the second to fifth aspects, the transfer section includes two guide sections that guide two opposite sides of the substrate. And a gap changing mechanism for changing the gap between the two guide portions.

According to a seventh aspect of the present invention, in the substrate supply apparatus according to the first aspect, a plurality of storage racks, each storing one type of substrate, are provided at a plurality of mounting positions in the substrate placement unit. And the transfer unit moves one of the plurality of mounting positions to a supply position for supplying a substrate to the next step, depending on the type of the substrate supplied to the next step. .

According to an eighth aspect of the invention, there is provided the substrate supply device according to the first aspect, wherein a plurality of storage racks, each storing one type of substrate, are placed in the substrate arranging section. The board arranging section has a storage rack exchanging section for exchanging the storage rack from which the board is taken out with another arbitrary storage rack.

The invention according to claim 9 is the board supply apparatus according to any one of claims 2 to 8, further comprising an identification section for identifying a storage rack from which the board is taken out.

According to a tenth aspect of the present invention, in the substrate supply apparatus according to the ninth aspect, the identifying section identifies the type of the substrate taken out from the storage rack.

According to a tenth aspect of the present invention, there is provided a substrate storage device for storing a substrate from a previous step, wherein a substrate arranging section capable of arranging a plurality of types of substrates having different sizes and a substrate from the previous step. And a transfer unit that transfers the substrate to the substrate placement unit.

According to a twelfth aspect of the present invention, in the substrate storage device according to the eleventh aspect, a plurality of storage racks, each storing one type of substrate, are provided at a plurality of mounting positions in the substrate arranging section. And the transfer unit has a transfer unit that moves between the plurality of delivery positions for delivering the substrate to the plurality of placement positions.

According to a thirteenth aspect of the present invention, in the substrate storage apparatus according to the twelfth aspect, the transfer section waits for the substrate to stand by between the plurality of mounting positions and the transfer section. Further has a part.

According to a fourteenth aspect of the present invention, there is provided the substrate storage device according to the twelfth or thirteenth aspect, wherein the plurality of mounting positions are arranged in a direction perpendicular to the substrate transfer direction before the preceding step. Arranged.

According to a fifteenth aspect of the present invention, there is provided the substrate storage device according to any one of the twelfth to fourteenth aspects, wherein the substrate arranging portion is a storage rack mounted on the plurality of mounting positions. It has a storage rack exchange section for exchanging with another storage rack.

According to a sixteenth aspect of the present invention, in the substrate housing apparatus according to any one of the twelfth to fifteenth aspects, the transfer portion includes two guide portions that guide two opposite sides of the substrate, And a gap changing mechanism for changing the gap between the two guide portions.

According to a seventeenth aspect of the invention, there is provided the substrate storage device according to the eleventh aspect, wherein a plurality of storage racks, each storing one type of substrate, are provided at a plurality of mounting positions in the substrate placement section. And the transfer unit moves any one of the plurality of mounting positions to a receiving position for receiving the substrate from the previous step, depending on the type of the substrate received from the previous step.

The invention as set forth in claim 18 is the substrate storage device as set forth in claim 11, wherein a plurality of storage racks, each storing one type of substrate, are placed in the substrate placement section, and The board arranging section has a storage rack exchanging section for exchanging the storage rack in which the boards are stored with another arbitrary storage rack.

The invention described in claim 19 is the board storage device according to any one of claims 12 to 18, further comprising an identification section for identifying a storage rack in which the boards are stored.

According to a twentieth aspect of the present invention, in the substrate accommodating apparatus according to the nineteenth aspect, the identifying section receives the type of the substrate to be accommodated and identifies the accommodating rack to be accommodated.

According to a twenty-first aspect of the present invention, there is provided a storage rack for storing a plurality of substrates arranged in parallel with each other in a direction normal to a main surface, each of the storage racks supporting one side of the substrate. A first support part and a plurality of second support parts each supporting another side opposite to the one side, and each of the plurality of first support parts and a corresponding second support part. The interval between can be changed.

According to a twenty-second aspect of the present invention, in the storage rack according to the twenty-first aspect, the second support portion allows a support member that supports the other side and the support member to move. And a support body attached.

The invention according to claim 23 is the storage rack according to claim 21 or 22, wherein the plurality of first racks are provided.
The support portion is a plurality of grooves formed in a portion parallel to the arrangement direction of the plurality of substrates to be stored.

A twenty-fourth aspect of the present invention is a board mounting system, comprising a group of mounting apparatuses for mounting electronic components on a board, a board supply apparatus for supplying a plurality of types of boards to the mounting apparatus group, and the mounting. A board housing device for housing a board delivered from the device group, a first identification unit for identifying the type of the board supplied to the mounting device group, and a second identification for identifying the type of the board delivered from the mounting device group. And a section.

According to a twenty-fifth aspect of the present invention, in the substrate mounting system according to the twenty-fourth aspect, a plurality of storage racks corresponding to the types of substrates are mounted in the substrate storage device, and the substrate storage device is One storage rack is specified based on the identification result of the second identification unit, and the board identified by the second identification unit is stored in the one storage rack.

The invention described in Item 26 is the board mounting system according to Item 24 or 25, wherein the first
The storage unit further stores the identification result by the identification unit and the identification result by the second identification unit.

[0034]

BEST MODE FOR CARRYING OUT THE INVENTION <1. Structure of Mounting System> FIG. 1 is a plan view of a mounting system 1 suitable for mounting electronic components on various kinds of printed circuit boards (hereinafter referred to as “boards”), and FIG. It is a front view. In the mounting system 1, as a general rule, mounting is performed on a plate-shaped substrate made of resin, but mounting may be performed on another type of substrate (for example, a flexible circuit board). The mounted electronic parts include fine chips such as resistors and capacitors, IC packages, connectors,
It includes various components such as variable resistors. Although the mounting system 1 uses solder paste for mounting,
Mounting using other types of bonding materials may be performed.

In the mounting system 1, from the upstream, the board 11 is taken out from the storage rack 8 and supplied to the transport path of the next process, the coating apparatus 12 for applying the solder paste to the board, and the electronic parts are mounted on the solder paste. Mounting device 13, a reflow device 14 that heats and melts the solder paste and cools and solidifies it, an inspection device 15 that inspects the mounting state of electronic components, and a storage rack 8 that receives a substrate from the transport path of the previous process. Storage device 1
6 are arranged in order. In the following description, a device group related to mounting from the coating device 12 to the inspection device 15 is called a mounting line.

Note that, in FIG. 1, the head portions of the coating device 12, the mounting device 13, and the inspection device 15 are not shown in order to clearly show the transport path.

The supply device 11 receives a substrate from the plurality of storage rack exchange units 111 for exchanging the storage rack 8 from which the substrate is taken out with another storage rack 8, and transfers it to the coating device 12. It has the transfer part 112 to mount. As shown in FIG. 1, the plurality of storage rack exchanging units 111 are arranged in a direction perpendicular to the substrate transfer direction after the next process of the mounting line. As a result, in the mounting system 1, even when a large number of storage rack replacement units 111 are arranged, it is possible to prevent the supply device 11 from becoming long in the substrate transport direction.

Each storage rack exchange section 111 stores a plurality of storage racks 8 for storing one type of board, and the mounting system 1
Storage rack replacement unit 1 for each type of board mounted in
11 is provided. The storage rack 8 arranges a plurality of boards parallel to each other in the normal direction of the main surface (in the mounting system 1, since the boards are handled in a horizontal posture, the normal direction of the main surface is the vertical direction). It is a so-called magazine rack for storing in the same manner, and is the same as that used conventionally.

The transfer section 112 is an arbitrary storage rack replacement section 1
11 can access any of a plurality of types of substrates having different sizes, and can transfer the substrates to a mounting line starting from the coating device 12.

The coating device 12 has a transport mechanism 2 composed of three transport portions 21, and the head portion 1 for discharging solder paste from nozzles on the transport path of the transport mechanism 2.
21 (see FIG. 2) is arranged. The head portion 121 is movable in the horizontal direction and the vertical direction, and the solder paste is applied in a dot shape on a predetermined position on the substrate which is being transported.

A plurality of mounting devices 13 are provided, and each mounting device 13 has a transport mechanism 2 composed of two transport units 21. Two head units 1 are provided above the two transport units 21.
31 (see FIG. 2) is located, and the electronic component is mounted on the solder paste of the substrate held by each transfer unit 21. The electronic components are supplied from the cassette unit 132 shown in FIG. 1, and a reel wound with a tape on which the electronic components are arranged is attached to the cassette unit 132.

The reflow device 14 grips the substrate by a chuck (not shown) to move the mounting device 13 to the pallet 7.
It has a transfer section 141 for transferring the substrate to and a transfer section 142 for taking out the substrate from the pallet 7 by a chuck and sending it to the inspection device 15. Inside the reflow device 14, the substrate is conveyed while being placed on the pallet 7.
A plurality of heating units 143 (see FIG. 2) are provided inside the reflow device 14, and the substrate is heated (preheating and main heating) according to a predetermined temperature control profile while the substrate is being transported. The board in which the solder paste is melted by heating is air-cooled by a fan (not shown) and the solder is solidified to fix the electronic component to the board. Transfer unit 14
The pallet 7 from which the substrate has been taken out in 2 is conveyed to the transfer section 141 via the lower part of the reflow device 14.

The inspection apparatus 15 has a transport mechanism 2 composed of three transport units 21, and a head unit 151 (see FIG. 2) having a camera is arranged on the transport path of the transport mechanism 2. The head portion 151 is movable in the horizontal direction, and confirms whether the electronic component is properly mounted on the board. The inspection result is used for production control.

The storage device 16 receives a board from a plurality of storage rack exchange parts 161 for exchanging the storage rack 8 for another storage rack 8 as with the supply device 11 and the inspection device 15 to the storage rack exchange part 161. Transfer unit 1 to transfer
62. As shown in FIG. 1, the plurality of storage rack exchange units 161 are arranged in a direction perpendicular to the board transport direction before the previous process of the mounting line. As a result, in the mounting system 1, even when a large number of storage rack replacement parts 161 are arranged, it is possible to prevent the storage device 16 from becoming long in the substrate transport direction.

Each storage rack exchange section 161 is provided in the supply device 1
Similar to the storage rack exchanging unit 111 on the one side, a plurality of storage racks 8 for accommodating one type of substrate are stored, and the storage rack exchanging unit 161 is provided for each type of substrate. Transfer unit 162
Can hold any of a plurality of types of substrates to be transferred, and transfers the substrate received from the inspection device 15 to the storage rack replacement unit 161 corresponding to the type of the substrate.

As described above, in the mounting system 1, it is possible to supply a plurality of types of substrates from the supply device 11 to the mounting line in an arbitrary order, and the mounted substrates are also sorted by type. It is stored in the storage rack 8.

In the mounting line, it is possible to mount a plurality of types of substrates in any order. Although details will be described later, a plurality of types of substrates can be efficiently transported in an arbitrary order by providing the coating device 12, the mounting device 13, and the inspection device 15 with the plurality of transportation units 21. In the reflow device 14 as well, as described above, the pallet 7 can convey a plurality of types of substrates in an arbitrary order. As a result, the mounting system 1 mounts boards suitable for high-mix low-volume production.

For example, when three different types of substrates 901 to 903 are used for one electric appliance 900 as shown in FIG. 3, conventionally, it is assumed that several hundred to several thousand electric appliances 900 are manufactured. The mounting on 901, the mounting on board 902, and the mounting on board 903 are continuously performed in units of the number of manufactured units, and it is necessary to suppress the switching of the system setting due to the change of the board type to about twice. There is a problem that the switching time puts pressure on the manufacturing cost and manufacturing efficiency.

On the other hand, in the mounting system 1, the substrates 901 to 9 are used.
03 can be mounted in an arbitrary order, so that it is also possible to mount the boards 901, 902, and 903 one by one. As a result, even if a very small number of electrical appliances 900 are manufactured, mounting can be performed without lowering manufacturing cost and manufacturing efficiency.

Even when the electronic components are mounted on the substrate used for only one television, which is illustrated as the problem to be solved by the invention, ten kinds of substrates having different sizes are mixed and continuously transported. However, since the mounting can be performed, the production stop state for switching the board model is eliminated, and the mounting efficiency of the mounting system 2 is dramatically improved. Further, it is possible to reduce the inventory of electronic components and boards before and after mounting, and it is possible to implement mounting quickly and at low cost in response to market demands.

Hereinafter, some devices in the mounting system 1 will be described in detail.

<2. Supply Device and Storage Device> FIGS. 4 and 5 are a plan view and a front view of the supply device 11. As shown in FIG. 4, the supply device 11 has a plurality of storage rack replacement parts 111 in a direction perpendicular to the board transfer direction of the mounting line, and further, between the plurality of storage rack replacement parts 111 and the coating device 12. It has a transfer section 112.

The storage rack exchanging section 111 includes the storage rack 8
It has a storage part 31 for storing the storage space and an elevating part 32 for replacing the storage rack 8. As shown in FIG. 5, in the storage unit 31, the storage rack 8 for storing the substrates 9 is placed in the lower stage, and the storage rack 8 after the substrates 9 are taken out is placed in the upper stage. Conveyors 311 and 312 for moving the storage racks 8 are provided in the lower and upper stages of the storage unit 31, respectively.

The elevating part 32 has a conveyor 321 on which the storage rack 8 is placed, and the conveyor 321 is moved up and down by a driving part 322. In the storage rack exchanging section 111, as a general rule, the storage rack 8 is transferred from the lower conveyor 311 to the conveyor 321 in a lowered state, and after the elevating section 32 is moved up, it is transferred to the upper conveyor 312.

An extruding mechanism 313 is provided between the belts of the upper conveyor 312 as shown in FIGS. 4 and 5, and the extruding member 3131 of the extruding mechanism 313 is driven by the driving section 31.
It is movable by 32. Conveyor 3 of lifting unit 32
21 intermittently rises at every storage interval of the substrates 9 in the storage rack 8 and every time the conveyor 321 rises, the pushing mechanism 313.
Pushes the substrate 9 toward the transfer section 112 side. This allows
The substrates 9 are discharged one by one to the transfer section 112, and when the lowermost substrate 9 in the storage rack 8 is pushed out, the empty storage rack 8 is transferred to the upper conveyor 312.

As shown in FIG. 4, the transfer section 112 has a plurality of standby sections 33 and transfer sections 34 corresponding to the respective storage rack replacement sections 111. Each standby unit 33 has a conveyor 331 corresponding to the size of the substrate 9 in the storage rack 8 of the corresponding storage rack exchange unit 111, and only one substrate 9 pushed out from the storage rack exchange unit 111 is on the conveyor 331. Held in.

The transfer section 34 has a transfer table 342 provided with a conveyor 341 and a transfer mechanism 343 for moving the transfer table 342 in a direction perpendicular to the substrate transfer direction of the mounting line. One of the belts of the conveyor 341 is movable by two guide rails, a ball screw mechanism and a motor, and the width of the conveyor 341 in the direction perpendicular to the conveying direction can be changed according to the size of the substrate 9 to be held. It is said that

The moving mechanism 343 also moves the transfer table 342 by means of two guide rails, a ball screw mechanism and a motor. The transfer unit 34 can receive the substrates 9 of various sizes from the arbitrary standby unit 33 by the moving mechanism 343 and the width-changeable conveyor 341, and the received substrates 9 are transferred to the coating device 12. Since the various substrates 9 are on standby in the plurality of standby units 33, the transfer table 342 can quickly receive the substrate 9 of any type.

As shown in FIG. 4, a reading sensor 323 for reading a bar code on the storage rack 8 is provided on the elevating part 32 of each storage rack exchanging part 111. As a result, the storage rack 8 placed on the conveyor 321 to take out the substrate 9 is identified, and it is confirmed in advance whether the size or model of the substrate 9 stored in the storage rack 8 is incorrect. As a result, even if the wrong storage rack 8 is carried into the storage rack replacement unit 111, the wrong substrate 9
Are prevented from being pushed out to the standby portion 33.

6 and 7 are a plan view and a front view of the storage device 16. The storage device 16 has substantially the same configuration as the supply device 11, and has a plurality of storage rack replacement parts 161 in a direction perpendicular to the board transfer direction of the mounting line, as shown in FIG. Storage rack replacement unit 1
The transfer unit 162 is provided between the device 61 and the inspection device 15.

The storage rack exchange section 161 is similar to the storage rack exchange section 111 of the supply device 11 except that the storage rack exchange section 161 has the storage section 31 and the elevating section 32 and does not have the pushing mechanism 313. However, as shown in FIG. 7, in the storage rack exchange section 161, the conveyor 312 on the upper stage of the storage section 31 is used.
Empty transfer rack 8 is transferred to the elevating part 32, the storage rack 8 is lowered while the substrate 9 is being stored, and the storage rack 8 containing the substrate 9 is transferred from the conveyor 321 to the lower conveyor 311. .

The transfer section 162 is also the transfer section 11 of the supply device 11.
The structure is almost the same as that of No. 2 and has a plurality of standby units 33 and transfer units 34. However, the standby unit 33 is provided with the pushing mechanism 332, and the standby unit 33 is elongated by that amount.

The transfer section 34 has the same structure as the transfer section 34 of the supply device 11, and receives the substrates 9 of various sizes from the inspection device 15 by a transfer table 342 having a conveyor 341 whose width can be changed and a transfer mechanism 343. The substrate 9 received by the
1 is transferred to the standby unit 33.

Each standby unit 33 conveys the received substrate 9 to the storage rack exchange unit 161 side by the conveyor 331,
The substrate 9 is stored in the storage rack 8 on the elevating unit 32 by the pushing mechanism 332. When one substrate 9 is stored, the lifting unit 3
2 descends, and preparations are made for accommodating the next substrate 9 of the same size. When one storage rack 8 is filled with the substrate 9, the storage rack 8 is transferred to the lower conveyor 311 and the conveyor 321 of the elevating unit 32 rises to receive the empty storage rack 8 from the upper conveyor 312.

As shown in FIG. 6, the reading / reading sensor 323 for reading the bar code on the storage rack 8 is also provided in the lifting / lowering section 32 of each storage rack exchange section 161, and the storage rack 8 for storing the substrate 9 is provided. It is confirmed whether or not the size and model of the substrate 9 are met. This prevents the wrong substrate 9 from being stored.

As described above, since the supply device 11 and the storage device 16 are provided with the plurality of storage rack replacement parts 111 and 161, it is possible to supply and store a plurality of types of substrates 9, and further, to replace each storage rack. Parts 111, 16
By replacing the storage rack 8 in 1, it is possible to supply and store a large number of substrates 9.

<3. Multi Board Transfer Mechanism> As shown in FIGS. 1 and 2, in the mounting system 1, a large number of transfer parts 21 are provided.
Is provided, and the substrate 9 is transported. For example, in the coating device 12 and the inspection device 15, the three transport units 21 are arranged on the base of the device along the transport direction of the substrate 9 to configure the transport mechanism 2, and in the mounting device 13, the two transport units 21 are used. The transport mechanism 2 is configured. Each of the transport units 21 has the same configuration, holds only one substrate 9 at a time, and the width of the transport path is individually changed according to the size of the substrate 9 to be held. The structure of the transport unit 21 is the same as the structure on the transfer table 342 in the supply device 11 and the storage device 16. Hereinafter, after explaining the structure of the transport unit 21,
The cooperative operation of the plurality of transport units 21 will be described.

FIG. 8 is a plan view of the transport section 21, and FIGS. 9 and 10 are arrow AA and arrow B in FIG. 8, respectively.
It is sectional drawing in the position of -B. Note that details are omitted as appropriate.

The transfer section 21 transfers the substrate 9 by the conveyor 22, and the conveyor 22 forms a transfer path by guiding two opposite sides of the substrate 9 as shown in FIGS.
The belt 222 is attached to a plurality of pulleys so as to have one guide portion 221 and to be covered by the guide portion 221. The belt 222 is a motor 223 shown in FIGS. 8 and 9.
Driven by. As shown in FIG. 10, the upper end of the guide portion 221 is provided with a protruding portion that protrudes toward the substrate 9 to be conveyed, and the protruding portion and the belt 222 are provided with two protruding portions.
The substrate 9 placed on the two belts 222 is conveyed.

As shown in FIGS. 8 and 10, the transport unit 2
A motor 231 and a ball screw 232 are provided on one base (which may be the base of the apparatus), and two guide rails 233 are attached as shown in FIGS. 8 and 9. One of the two guide portions 221 is fixed to the base as shown in FIG. 10, and the other is attached to the nut 234 attached to the ball screw 232. Therefore, when the motor 231 rotates, only one guide portion 221 moves while being guided by the guide rail 233 by the ball screw mechanism. As a result, the distance between the two guide portions 221 (and the two belts 222) is changed, and stable conveyance can be performed while restraining the postures of the substrates 9 of various sizes.

As described above, the transfer table 342 of the supply device 11 and the storage device 16 has the same structure.
It has a mechanism for changing the distance between the two guide portions. Therefore, even when the substrate 9 is delivered to the transfer table 342, the posture of the substrate 9 is restricted, and the substrate 9 is delivered in a stable manner.

FIG. 11 is a diagram showing a typical example of the operation flow of the two transfer units 21 for transferring the substrate 9. Also,
12 to 15 are plan views showing the states of the two transport units 21, the second transport unit 21b is located downstream of the first transport unit 21a, and the first transport unit 21a to the second transport unit 21 are located.
The substrate 9 is conveyed to b. In the following description, the first
The substrate 9 newly received by the transport unit 21a is referred to as “first substrate 9”.
The substrate 9 delivered by the second transport unit 21b is referred to as "a" and the "second substrate 9b". Further, the motor 231 and the conveyor 22 of the first transfer unit 21a and the second transfer unit 21b are connected to the transfer control unit 20 as shown in FIG. 12, and the transfer control unit 20 performs the cooperative operation shown in FIG.

First, as shown in FIG. 12, the second transfer section 21
In a state in which b holds the second substrate 9b and the first transport unit 21a does not hold the substrate, the first transport unit 21a receives the first substrate 9a, so that the transport path is adjusted according to the size of the first substrate 9a. The width (that is, the distance between the two guide portions 221) is changed (step S11). Then, the first substrate 9a is received by the first transport unit 21a, and the state shown in FIG. 13 is obtained (step S12).

On the other hand, in the second transfer section 21b, the second substrate 9b
14 is discharged and the state shown in FIG. 14 is reached (step S13), the distance between the two guide portions 221 of the second transport portion 21b is changed according to the size of the first substrate 9a, The width of the transport path is changed (step S1)
4). Then, the first substrate 9a is transported from the first transport unit 21a to the second transport unit 21b, and returns to the state before step S11 (step S15).

Here, in the coating device 12 and the inspection device 15 having the three transport parts 21 shown in FIG. 2, the most upstream transport part 21 corresponds to the first transport part 21a, and the central transport part 21 is the first transport part 21a. If it is assumed that the head portions 121 and 151 of these devices are equivalent to the second transport portion 21b.
Since the substrate 9 held by b is accessed to perform the work (the processing by the head portion is referred to as “work” as appropriate), the head portion is moved to the first substrate 9a after step S15.
The operation to which the step of performing work (step S16) is added is executed by these devices. Then, the first transport unit 21
The a serves as a buffer for holding the standby substrate, and the reduction of the transfer efficiency due to the uneven transfer operation is suppressed.

On the other hand, in the coating device 12 and the inspection device 15, when it is considered that the central carrying part 21 corresponds to the first carrying part 21a and the most downstream carrying part 21 corresponds to the second carrying part 21b, step S12 is performed. Later, the head part is the first substrate 9a.
The operation to which the step of performing the work (step S17) is added is executed. In this case, the second transport unit 21b
Plays a role as a buffer for holding the substrate 9 to be delivered to the next apparatus, and suppresses the deterioration of the transfer efficiency due to the uneven transfer operation.

When it is grasped that the two transport portions 21 of the mounting device 13 correspond to the first transport portion 21a and the second transport portion 21b, one head portion 131 is held by the first transport portion 21a after step S12. A step of accessing the first substrate 9a to mount the electronic component (step S17) is added, and a step of accessing the first substrate 9a held by the second transport unit 21b and mounting the electronic component after the step S15 ( This is the operation in which step S16) is added.

Furthermore, the two transport units 21 performing the operation shown in FIG. 11 are the operations of the two transport units 21 adjacent to each other between the devices.
Alternatively, the transfer table 342 of the supply device 11 and the storage device 16
It may also be regarded as an operation of the transport unit 21 adjacent to these. In the mounting system 1, by providing a plurality of transfer parts 21 capable of changing the width of the transfer path in one device or by providing a transfer table 342 having the same structure as the transfer part 21, a plurality of types of substrates 9 can be arbitrarily selected. The smooth transportation is realized in the order of.

In the mounting of electronic parts, it is necessary to surely control the position of the substrate 9 to be conveyed and restrain the posture, and in the conventional mounting system, the same type of substrate 9 should be continuously and stably conveyed. Has been designed in. Ie 1
There is no concept that multiple conveyors are provided in one device and one conveyor conveys only one substrate 9 at a time. To change the type of the substrate 9 to be mounted, the operator changes the setting of each device. Was assumed. However, in the mounting system 1, one device is provided with a large number of transfer sections 21, and one conveyor holds only one substrate 9 at a time, so that any part of the transfer path in the device has an arbitrary width. In this way, the concept of switching the type of the substrate 9 is wiped out, and the switching work by the operator is unnecessary.

Further, steps S11, S12, S17
Is independent of steps S13, S14 and step S16 for the second substrate 9b (that is, step S16 executed before step S13). Therefore, steps S11, S12, S17 and steps S16, S13 are , S14 are executed in parallel with each other, whereby efficient transfer is realized. Note that “parallel” means a state in which at least a part of one operation and at least a part of the other operation are simultaneously executed (hereinafter the same), and the plurality of transfer units 21 transfer two or more substrates 9. By carrying out in parallel, efficient transportation is realized.

<4. Production Management> FIG. 16 is a diagram showing the main functions of the production management unit 5 that performs production management in the mounting system 1. A reading sensor 323 for reading the bar code of the storage rack 8 in the supply device 11 and the storage device 16 is connected to the production management unit 5. Further, as shown in FIG. 4 and FIG. 5, an upstream sensor 41 that reads the barcode written on the substrate 9 at the most upstream side of the transport path (that is, the most upstream transport section 21 of the coating device 12), and As shown in FIGS. 6 and 7, the most downstream side of the transport path (that is, the most downstream transport section 21 of the inspection device 15).
The downstream side sensor 42 for reading the bar code written on the board 9 is also connected to the production control unit 5.

17 and 18 are a plan view and a front view showing a state in which the upstream sensor 41 is attached.
The downstream sensor 42 is also attached in the same manner. The upstream side sensor 41 is attached to the inside of the two guide parts 221 via the flange 411 on the guide part 221 of the carrying part 21, and is a barcode marked on the substrate 9 carried by the belt 222 along the guide parts 221. To read.

The production control section 5 shown in FIG. 16 is constructed by a computer system, and the storage rack monitoring section 51 and the difference data generating section 52 are realized by the CPU performing arithmetic processing in accordance with a program. Production control department 5
Then, various data are stored in the fixed disk 53.

The outputs of the reading sensors 323 of the supply device 11 and the storage device 16 are input to the storage rack monitoring section 51 and collated with the storage rack management data 501 prepared in advance according to the production plan. Storage rack management data 5
01 indicates the type of the board 9 to be stored in each storage rack replacement section 111, 161 (the board product number, the product number of the product to be manufactured, a number for identifying the mounting conditions, etc.) and the storage rack 8.
Information indicating the type (number of stored sheets, storage pitch, etc.) is included. If they are different, the storage rack monitoring unit 51 notifies the operator.

The output from the upstream sensor 41 is the identification result of the substrate 9 supplied to the mounting line (that is, the mounting device group from the coating device 12 to the inspection device 15), and the supplied substrate data 502 is stored in the fixed disk 53. Is stored as The output from the downstream sensor 42 is the identification result of the board 9 paid out from the mounting line, and is stored in the fixed disk 53 as the storage board data 503. Then, the difference data generation unit 52 obtains a difference between the supply board data 502 and the storage board data 503 (a comparison result between the input board and the mounted board), and stores the difference data 504 in the fixed disk 53.

In the mounting system 1, the operator may remove the board 9 or insert the board 9 for a separate inspection. Further, the apparent defective substrate is also removed as appropriate.
The substrate 9 removed or inserted during the transportation for these reasons is managed as the difference data 504.

When mounting is performed only on the same type of substrates 9 as in the conventional case, the production management of the substrates is performed only by controlling the number of substrates supplied to the mounting line and the number of substrates paid out from the mounting line. be able to. However,
In the mounting system 1, since a plurality of types of substrates are transported in an arbitrary order, it is not possible to perform production control with only the number of substrates. Therefore, in the mounting system 1, the upstream sensor 4
By providing the 1 and the downstream side sensor 42, it is possible to appropriately perform production control of a plurality of types of substrates.

Further, the output from the downstream sensor 42 is also input to the storage device 16. As a result, the storage device 16 grasps the type of the substrate 9 received by the transfer unit 34 shown in FIG. 6, and the conveyor 3 of the transfer unit 34 is adjusted according to the size of the substrate 9.
The width of 41 is changed. Further, the storage rack 8 corresponding to the type of the substrate 9 is specified, and the transfer table 342 can be moved to the standby unit 33 that communicates with the storage rack exchange unit 161 having the specified storage rack 8.

In the mounting system 1, since the downstream side sensor 42 is provided at the most downstream side of the transport path, even if the board 9 is removed or inserted from the transport path in the middle, after checking each board 9 finally. Appropriate storage in the storage rack replacement unit 161 is realized.

The type of the substrate 9 supplied from the supply device 11 to the mounting line is sequentially transmitted to the transfer section 21 arranged in the mounting line, and the width of the transfer path of the transfer section 21 is changed. When the substrate 9 is removed or inserted during transportation, the signal transmitted between the transportation units 21 is appropriately modified. Then, after the final confirmation is made by the downstream side sensor 42, the substrate 9 is stored. Each transport unit 21 may be provided with a sensor for detecting the type of the substrate 9, and in this case, removal and insertion of the substrate 9 are automatically recognized.

<5. Other Transport Mechanism> FIG. 19 is a plan view showing another form of the mounting device. The mounting device 13a shown in FIG. 19 differs from the mounting device 13 shown in FIG. 1 in that the mounting device 13a shown in FIG. In addition, an auxiliary transport unit 210 is arranged on the upstream side of each mounting device 13a. The transport unit 21 and the upstream-side auxiliary transport unit 210 of each mounting device 13a are controlled by the transport control unit 20a, and communication for synchronizing the control is performed between the transport control units 20a.

Above each of the two transporting parts 21 on the upstream side and the downstream side of the three transporting parts 21 of the mounting device 13a, the electronic component is taken out from the cassette part 132 and the board 9 held by the transporting part 21 is held. The head part 131 to be mounted is located. The auxiliary transport unit 210 has substantially the same configuration as the transport unit 21, but is a separate body from the mounting device 13a. In the auxiliary transport unit 210, an operator can take out or insert the substrate 9 between the devices as needed, and the guide unit 2 shown in FIG.
Unlike 21, the upper portion of the guide portion 221 is shaped so as not to project above the substrate 9.

That is, in the mounting device 13a, the auxiliary carrying section 210 serves as a buffer for the upstream head section 131, and the central carrying section 21 serves as a buffer for the downstream head section 131. . As a result, even if there is unevenness in the mounting time of the electronic components by the heads 131 of the plurality of mounting devices 13a, the stable transfer of the substrate 9 is realized.

FIG. 20 is a diagram showing the flow of the operation of one mounting device 13a and the auxiliary transport section 210 on the upstream side, and FIGS. 21 to 24 are the mounting apparatus 13a and the auxiliary transport section 2 respectively.
FIG. 10 is a diagram for explaining a state of the operation of 10. In the following description, the three transport units 21 are arranged from the upstream side to the first transport unit 21a, the second transport unit 21b, and the third transport unit 21c.
In the state shown in FIG. 21, the substrate 9 held by the auxiliary transport unit 210 is the first substrate 9a, the substrate 9 held by the second transport unit 21b is the second substrate 9b, and the auxiliary transport unit 210 is the first substrate 9a. The substrate 9 that is received after being called is called a third substrate 9c. Further, in FIG. 20, the operation of only the auxiliary transport unit 210 is shown by a block of a wavy line.

As shown in FIG. 21, the auxiliary transfer section 210 holds the first substrate 9a, and the second transfer section 21b holds the second substrate 9b.
In the state of holding, the first transfer unit 21a changes the width of the transfer path according to the size of the first substrate 9a (that is, changes the interval between the two guide units 221 shown in FIG. 8) (step). S21), the third transfer unit 21c changes the width of the transfer path according to the size of the second substrate 9b (Step S22). Then, the first transfer unit 21a receives the first substrate 9a from the auxiliary transfer unit 210 (step S2
3), second from the second transport unit 21b to the third transport unit 21c
The substrate 9b is transported (step S24). As a result, the mounting device 13a enters the state shown in FIG.

In the first transfer section 21a, the head section 131 accesses the first substrate 9a to mount electronic components (step S25), and in the third transfer section 21c, the other head section 131 is attached to the second board 9b. Accesses and electronic components are mounted (step S26). In addition, the auxiliary transport unit 2
Since the 10 and the second transfer unit 21b do not hold the substrate 9, the width of the transfer path is changed according to the third substrate 9c newly received by the auxiliary transfer unit 210 as shown in FIG. 23 (step S31). The width of the transport path is changed according to the first substrate 9a which is to be received by the second transport unit 21b (step S27).

After that, the auxiliary carrying section 210 moves the third substrate 9c.
(Step S32), the first substrate 9a is transported from the first transport unit 21a to the second transport unit 21b (Step S28), and the second substrate 9b is paid out from the third transport unit 21c (Step S29).

With the above operation, as shown in FIG. 24, the first state in which the auxiliary transfer section 210 and the second transfer section 21b hold the substrate 9 (the state before steps S21 and S22).
Then, the transporting and mounting operations are repeated.

Here, the operation of transferring the substrate 9 from the auxiliary transfer section 210 to the first transfer section 21a (step S23).
And the substrate 9 from the second transfer section 21b to the third transfer section 21c.
Can be performed independently of the operation of transporting (step S24). Therefore, steps S21 and S
23, S31, S25 flow and steps S22, S2
4, S27, S26 and S29 can be executed in parallel with each other. Further, since the operation of mounting the electronic component on the board 9 and the operation of changing the width of the transfer path by the downstream transfer unit 21 in accordance with the size of the board 9 being mounted are also independent from each other, each step S31, S25, S27,
S26 can also be executed in parallel with each other.

Similarly, the operation of the auxiliary transfer section 210 receiving the substrate 9 (step S32), the operation of transferring the substrate 9 from the first transfer section 21a to the second transfer section 21b (step S28), and the third operation Since the transfer unit 21c can also perform the operation of paying out the substrate 9 (step S29) independently of each other, the flow of steps S31, S32, the flow of steps S25, S27, S28, S21, and the steps S26, S29, It can be executed in parallel with the flow of S22.

By performing the operations of the auxiliary transport section 210 and the mounting device 13 while satisfying the relationship of these operations, the transport and mounting operations can be performed quickly, and even if there is some unevenness in the transport operation, it is stable. The performed operation is realized.

The structure shown in FIG. 19 can be used for an apparatus that performs processing other than the mounting of electronic components, and can also be used for the coating apparatus 12, the reflow apparatus 14 and the inspection apparatus 15.

Here, in the case where the apparatus is provided with a plurality of head portions, the substrate 9 is provided in order to suppress the influence of the unevenness of the work timing of the head portion on the substrate 9 on the operation of each transporting portion 21.
21 that serves as a buffer for waiting
It is preferable that at least one (hereinafter, referred to as “buffer carrying unit”) is provided. That is, the number of head parts (the transport part 21 (hereinafter,
It is called a "work transfer section". It is preferable that more transport units 21 than the number of) are provided.

In the case where the buffer auxiliary carrying section 210 is provided on the upstream side of the apparatus, it is preferable that at least one buffer carrying section is arranged between the plurality of work carrying sections.

Further, the substrate 9 is provided upstream of each work transfer section.
Since a more stable operation can be realized by waiting for, the buffer transport unit is provided on the upstream side of each work transport unit other than the most upstream work transport unit, and transport is performed for n heads. More preferably, the number of parts 21 is (2n-1). That is, it is preferable that the buffer transport unit is arranged between any two adjacent work transport units of the plurality of work transport units. Of course, the number of buffer transport units for one head unit may be two or more,
It can be said that one device is preferably provided with (2n-1) or more transport units 21.

Further, in FIG. 19, the substrate 9 is made to stand by by the auxiliary transport unit 210 with respect to the head portion on the most upstream side, but the auxiliary transport unit 210 may be provided integrally with the apparatus. In this case, at least one buffer transport unit and work transport unit are arranged alternately,
One apparatus is provided with 2n or more of the transport units 21 with respect to the number n of heads.

The transport unit 21 may be attached so as to protrude from the base of the apparatus, and it is not necessary that all the transport units 21 be arranged on the base of the apparatus.

<6. Other Supply Device and Storage Device> FIG. 25 is a plan view showing the supply device 11a having only one storage rack exchange unit 111, and FIG. 26 is a plan view showing the storage device 16a having only one storage rack exchange unit 161. It is a figure.

The supply device 11a is a storage rack exchange section 111.
And a transfer section 112a. Storage rack replacement unit 11
1 has the same structure as the storage rack exchange section 111 shown in FIGS. 4 and 5, and exchanges the storage rack 8 from which the substrate 9 is taken out. The transfer section 112a is the auxiliary transport section 2 shown in FIG.
The same as 10. In the following description, the reference numerals attached to FIG. 5 are appropriately referred to.

In the storage rack exchange section 111, the storage rack 8 is not only conveyed from the lower conveyor 311 to the upper conveyor 312 by the lower conveyor 311, the upper conveyor 312 and the elevating section 32, but also from the upper conveyor 312. It is also possible to convey the storage rack 8 to the lower conveyor 311. That is, the storage rack 8 from which the substrate 9 is taken out can be exchanged with another storage rack 8 that is arbitrary. Further, the plurality of storage racks 8 that are stored each store substrates 9 of different types.

Therefore, while the storage rack exchange section 111 confirms the output of the reading sensor 323, the storage rack 8 placed on the elevating section 32 is exchanged and the transfer section 112a is moved.
By changing the width of the conveyor of
Can be retrieved in any order. The taken-out substrate 9 is supplied to the coating device 12 from the transfer section 112a.

The storage device 16a is a storage rack exchange section 161.
And a transfer section 162a. Storage rack replacement unit 16
1 has the same structure as the storage rack exchange section 161 shown in FIGS. 6 and 7, and exchanges the storage rack 8 for storing the substrate 9. The transfer section 162a has a conveyor 162 whose width can be changed.
1 and an extrusion mechanism 1622. In the following description, the reference numerals attached to FIG. 7 will be appropriately referred to.

Also in the storage rack exchanging section 161, the lower conveyor 311, the upper conveyor 312 and the elevating section 3 are provided.
2 from the lower conveyor 311 to the upper conveyor 31
Not only is the storage rack 8 conveyed to the second stage, but also the storage rack 8 can be conveyed from the upper conveyor 312 to the lower conveyor 311. That is, the storage rack 8 in which the board 9 is stored can be replaced with another storage rack. Further, the plurality of storage racks 8 that are stored each store substrates 9 of different types.

The type of the substrate 9 delivered from the inspection device 15 is identified by the downstream side sensor 42, and the width of the conveyor 1621 of the transfer section 162a is changed according to the identification result. When the transfer section 162a receives the substrate 9 from the inspection device 15 and conveys it to the vicinity of the storage rack exchange section 161, the storage rack exchange section 161 confirms the output of the reading sensor 323 and the storage rack placed on the elevating section 32. 8 is replaced, and the substrate 9 is stored in an appropriate storage rack 8 by the pushing mechanism 1622.

As described above, each of the supply device 11a and the storage device 16a has one storage rack exchange section 11a.
Although only 1, 161 are provided, a plurality of types of boards 9 in an arbitrary order can be supplied to the mounting line and the boards 9 from the mounting line can be stored by arbitrarily replacing the storage rack 8. You can

Next, still another example of the supply device will be described. In the supply device 11 and the storage device 16 shown in FIGS. 4 to 7, the transfer units 112 and 162 have the standby unit 33 and the transfer unit 34, but the standby unit 33 is omitted and the storage rack replacement units 111 and 161 and the transfer unit are omitted. The substrate 9 may be directly transferred to and from 34.

FIG. 27 is a plan view showing the supply device 11b with the standby portion 33 omitted, and FIG. 28 is a plan view showing the storage device 16b with the standby portion 33 omitted. Supply device 1
1b has the same structure as the supply device 11 shown in FIG. 4 except that the standby portion 33 is omitted.
The standby unit 33 is omitted from the storage device 16 shown in FIG. 6, and the substrate 9 is stored in the transfer rack 342 on the transfer rack 342.
The structure is such that an extruding mechanism 35 for extruding to 1 is provided. That is, in the supply device 11, the transfer unit 34 moves between a plurality of receiving positions for receiving the substrates, and in the storage device 16, the transfer unit 34 moves between a plurality of payout positions for delivering the substrates, so that a plurality of types of substrates can be obtained. Substrate supply and storage is realized.

FIG. 29 is a plan view showing the structure of the pushing mechanism 35. The push-out mechanism 35 includes a drive unit 351 attached to a fixed guide unit, a moving member 352 that moves in the substrate 9 transport direction by the drive unit 351, and a moving member 35.
2 has a pin 353 attached to the moving member 352.
Can be moved up and down by a mechanism (not shown) together with the pin 353. Substrate 9 is conveyor 3 with transfer table 342
When it is held by 41, the moving member 352 and the pin 353 move up and move to the storage rack exchanging part 161 side, the tip of the pin 353 comes into contact with the edge of the substrate 9 and pushes the substrate 9 into the storage rack 8. When the substrate 9 is completely stored, the moving member 352 and the pin 353 descend to move the inspection device 1
Return to side 5.

Further, the feeding device 11 shown in FIGS.
Further, in the storage device 16, the standby unit 33 may be omitted, and a plurality of storage racks 8 may be arranged and arranged so as to be movable in a direction perpendicular to the transfer direction of the substrates 9. Figure 3
0 and FIG. 31 are a plan view and a front view of such a supply device 11c.

The supply device 11c has a storage rack switching section 36 and a push-out section 37. On the storage rack switching section 36, the storage racks 8 for storing different types of boards 9 are arranged in the horizontal direction and Three arrays are arranged in a direction perpendicular to the transport direction. The mounting portion 361 on which the storage rack 8 is mounted can be moved up and down by an elevating mechanism 362 composed of a ball screw and a guide rod. Further, the mounting portion 361 and the elevating mechanism 362 are arranged on a horizontal movement mechanism 363 composed of a ball screw, a guide rail, etc., and are movable in the direction in which the storage racks 8 are arranged.

When the substrate 9 is taken out from the supply device 11c, the horizontal movement mechanism 363 is used to move the desired storage rack 8
Moves to a position facing the transfer mechanism of the adjacent coating device 12, and the substrate 9 taken out by the elevating mechanism 362 moves to a transfer position with the transfer mechanism. After that, the pushing member 371 of the pushing unit 37 pushes the substrate 9 toward the coating device 12 side.

32 and 33 show another feeding device 11d.
FIG. 3 is a plan view and a front view showing FIG. The supply device 11d has a storage rack switching section 36a and a push-out section 37, and the storage rack switching section 36a has a storage rack 8 for accommodating different types of substrates 9 in the vertical direction and in the substrate 9 transport direction. Two are arranged in the vertical direction. The mounting portion 364 on which the storage rack 8 is mounted can be largely moved up and down by an elevating mechanism 365 including a ball screw and a guide rod.

When the substrate 9 is taken out from the supply device 11d, the substrate 9 taken out from the desired storage rack 8 is moved by the elevating mechanism 365 to the transfer position with the transfer mechanism of the coating device 12. After that, the pushing member 371 of the pushing unit 37 pushes the substrate 9 toward the coating device 12 side.

The configurations of the supply device 11c and the supply device 11d can be used as a storage device. For example, instead of the extrusion part 37, the extrusion mechanism 35 illustrated in FIG.
Is provided in the transport mechanism of the inspection device 15, so that the substrate 9
Can be stored.

As described above, the plurality of storage racks 8 are mounted on the mounting portions 361 and 364, and the storage racks 8 are mounted by the moving mechanism such as the elevating mechanism 362, the horizontal moving mechanism 363, and the elevating mechanism 365. By moving any one of the plurality of mounting positions to the supply position or the storage position according to the type of the substrate 9, the supply or storage of the various types of substrates 9 is realized.

<7. Mounting Multiple Types of Boards by Storage Rack> The storage rack 8 in the above description stores only one type of board 9, but a storage rack 8 that can store multiple types of boards 9 is used. May be done. 34 is a plan view of a storage rack 8a that can store a plurality of types of substrates 9, FIG. 35 is a vertical cross-sectional view taken along the arrow CC in FIG. 34, and FIG.
5 is a vertical sectional view taken along the arrow DD in FIG. In addition, also in the storage rack 8a, a plurality of types of substrates 9 parallel to each other are provided.
Are arranged and housed in the direction normal to the main surface, and the board 9 is housed and taken out by moving the board 9 in the vertical direction in FIG.

As shown in FIG. 35, a plurality of support main bodies 81 extending horizontally from one side surface 801 (that is, a portion parallel to the arrangement direction of a plurality of substrates 9) are formed inside the storage rack 8a. As shown in FIGS. 35 and 36, a plurality of holes 811 are formed in the support body 81. As shown in FIGS. 34 and 35, a support member 82 that supports one side of the substrate 9 is attached to each of the plurality of support bodies 81.

FIG. 37 is a front view of the support member 82, and FIG. 38 is a sectional view taken along the arrow EE in FIG. The support member 82 is a rod-shaped member having an L-shaped cross section, and a pin 821 inserted into the hole 811 is attached to the lower surface thereof.
As shown in FIGS. 34 and 35, many holes 811 are formed, and the support member 82 can be movably attached to a plurality of positions.

Side surface 8 facing side surface 801 shown in FIG.
02 (that is, a portion parallel to the arrangement direction of the plurality of substrates 9) has a plurality of grooves 83, and one side of the substrate 9 is supported by a lower portion of the support member 82 as shown in FIGS. 34 and 35. The opposite side is supported by the groove 83. Therefore, most of the lower surface of the substrate 9 is separated from the support body 81 by a predetermined distance, and even if the substrate 9 is for double-sided mounting, the lower surface of the substrate 9 (or an electronic component already mounted on the lower surface) is damaged. The substrate 9 can be taken in and out without the need.

In the storage rack 8a, as shown in FIGS.
By moving the position of the supporting member 82 according to the size of the substrate 9 to be stored, the plurality of supporting members 8
The distance between each of the two and the corresponding groove 83 can be changed, and a plurality of types of substrates 9 can be stored. Further, since the mounting position of the supporting member 82 can be easily changed, the substrate 9 to be housed can be easily changed.

When the storage rack 8a is used as the supply device 11 or the storage device 16, a plurality of types of substrates 9 can be supplied to the mounting line by sequentially taking out the substrates 9 from the storage rack 8a. Therefore, in the supply device 11 and the storage device 16, it is not necessary to arrange a plurality of storage rack replacement parts 111 and 161 as shown in FIG. 1, and the storage rack replacement parts 111 and 161 move the storage rack 8a in one direction. It is only necessary to perform the exchange operation in order. As a result, it is possible to simplify the configurations and operations of the supply device 11 and the storage device 16.

Of course, the boards 9 may be taken out from the storage rack 8a in any order. In this case, the bar code previously marked on the storage rack 8a in the production management section 5 and the type and order of the boards 9 to be stored. The relationship with is entered.

The structure of the storage rack 8a may be changed as appropriate. For example, in FIG. 35, the support body 81 projects from only one side surface 801, but both side surfaces 801, 80
The support body 81 projects from 2 (both support bodies 81 may be integrated), and one substrate 9 has two support members 82.
May be supported by. However, as shown in FIG. 35, the structure of the storage rack 8a can be simplified by supporting one side of the substrate 9 with the groove 83.

FIG. 39 is a perspective view showing another supporting member 82a. The upper part of the support member 82a is a two-stage pin, and the pin 821 inserted into the hole 811 is attached to the lower part. In FIG. 40, the support member 82a is the hole 8 of the support body 81.
11 is a plan view showing how the substrate 9 is attached to the substrate 11 and is supported by the support member 82a. FIG.

The support body 81 is not limited to the plate shape, and may be a rod-shaped portion extending horizontally from the side surface 801.

Further, a member in which the support main body 81 and the supporting member 82 are integrated is prepared according to the type of the substrate 9, and the side surface 8 is formed in accordance with the type and the number of the substrate 9 accommodated in this member.
01 may be detachably attached.

As described above, various structures can be used as the structure of the storage rack 8a for storing a plurality of types of substrates 9.

<8. Modifications> Although the embodiments related to the present invention have been described above, various modifications may be made to the above embodiments.

In the transfer unit 21 and the transfer table 342 in the above embodiment, the substrate 9 is transferred by a conveyor having a belt, but the mechanism for holding and transferring the substrate 9 may be another mechanism. For example, the substrate 9 may be conveyed by being pressed by a predetermined member while being held by the guide portion 221, or by being brought into contact with a rotating roller. Further, instead of the guide portion 221, the two sides of the substrate 9 may be grasped by the grasping mechanism, and the substrate 9 may be conveyed by moving the grasping mechanism. In this case, the distance between the gripping mechanisms facing the two sides of the substrate 9 corresponds to the width of the transport path.

Further, the storage rack 8 into and out of which the substrate 9 is taken in and out, and the substrate 9 in the mounting line may be identified by a method other than the barcode. For example, the numbers or symbols written on the storage rack 8 or the substrate 9 may be recognized by the camera.

Supplying devices 11, 1 in the above embodiment
Although the storage rack 8 is exchanged in the 1a and the storage devices 16 and 16a, the storage rack replacement units 111 and 161 may be omitted and the storage rack 8 may be placed at a predetermined placement position. Furthermore, the substrate 9 may not be stored in the storage rack 8 in any of the supply device and the storage device. For example, the substrates 9 may be stacked as they are at a predetermined mounting position and taken out one by one. That is, in the supply device 11 and the storage device 16, a plurality of types of substrates 9 having different sizes may be arranged in any manner.

In the above embodiment, the widths of the transport paths of the plurality of transport units 21 provided in one apparatus are controlled independently of each other, but it is not always necessary that all the transport units 21 be controlled independently. For example, the widths of the transport paths of the two transport units 21 among the three transport units 21 may be similarly changed.
Even with such control, the widths of different transport paths can be set at the same time in one device, and a plurality of types of substrates 9 having different sizes can be transferred in parallel in one device for smooth transport. It can be performed. That is, the width of the transport path is individually changed for at least two of the plurality of transport units 21 in one device, so that transport suitable for mounting a plurality of types of substrates is realized.

In other words, the plurality of transport sections 21 that are not independently controlled are regarded as one transport section, and a plurality of transport sections that are independently controlled are provided in the apparatus, so that a smooth transport of a plurality of types of substrates 9 is realized. . Since the number of independently controlled transport units is greater than the number of head units, it is possible to allow the substrate 9 to stand by at some transport units, and to serve as a buffer among the independently controlled transport units. The substrate 9 can be made to stand by at the upstream of each head unit other than the most upstream head unit by providing the carrying unit to be achieved between the carrying units where the head unit works.

When focusing on one device and minimizing the number of the transfer sections 21 (when the transfer between the transfer sections 21 can be performed relatively stably), the substrate 9 is sequentially moved from the downstream side. In consideration of the necessity of performing the above, it is preferable that one apparatus is provided with a transport section corresponding to each head section and only one buffer transport section is provided on the most downstream side. That is, it is preferable that the number of transport units is one more than the number of head units.

Further, in the transfer mechanism 2 according to the above-described embodiment, the substrate 9 is directly transferred, but even if one or a plurality of the substrates 9 are held on a pallet which is a member for holding the substrate 9, the substrate 9 is transferred. Good. Even in this case, the transport mechanism 2
By using, it becomes possible to use various pallets according to the type and number of the substrates 9 placed on the pallets, and efficient transport is realized.

Although the substrate 9 is transported by the pallet 7 in the reflow device 14 in the above-described embodiment, the reflow device 14 may also be provided with a plurality of transport parts capable of changing the width of the transport path. .

[0147]

According to the board supply apparatus of the present invention, a plurality of kinds of boards having different sizes can be supplied to the mounting line in an arbitrary order. It is possible to accommodate a plurality of types of substrates of different sizes that are dispensed from the line. Further, according to the storage rack according to the present invention, a plurality of types of substrates can be stored in one storage rack. According to these inventions, supply or storage of substrates suitable for high-mix low-volume production is realized.

Further, according to the board mounting system of the present invention, it is possible to identify the kinds of boards supplied to the mounting line and the boards paid out from the mounting line, and mounting is performed on a plurality of kinds of boards. In this case, production control can be appropriately performed.

[Brief description of drawings]

FIG. 1 is a plan view of a mounting system.

FIG. 2 is a front view of a mounting system.

FIG. 3 is a diagram illustrating a substrate used for an electric appliance.

FIG. 4 is a plan view of the supply device.

FIG. 5 is a front view of the supply device.

FIG. 6 is a plan view of the storage device.

FIG. 7 is a front view of the storage device.

FIG. 8 is a plan view of the transport unit.

FIG. 9 is a cross-sectional view of a transport unit.

FIG. 10 is a cross-sectional view of a transport unit.

FIG. 11 is a diagram showing a flow of operations of two transport units.

FIG. 12 is a plan view showing a state of two transport units.

FIG. 13 is a plan view showing a state of two transport units.

FIG. 14 is a plan view showing a state of two transport units.

FIG. 15 is a plan view showing a state of two transport units.

FIG. 16 is a diagram showing main functions of a production control unit.

FIG. 17 is a plan view showing a state in which an upstream sensor is attached.

FIG. 18 is a front view showing a state in which an upstream sensor is attached.

FIG. 19 is a plan view showing another form of the mounting device.

FIG. 20 is a diagram showing a flow of operations of the mounting device and the auxiliary transport unit on the upstream side.

FIG. 21 is a view for explaining the operation states of the mounting device and the auxiliary transport unit.

FIG. 22 is a diagram for explaining the operation states of the mounting device and the auxiliary transport unit.

FIG. 23 is a diagram for explaining the manner of operation of the mounting device and the auxiliary transport unit.

FIG. 24 is a diagram for explaining the operation of the mounting device and the auxiliary transport unit.

FIG. 25 is a plan view showing another supply device.

FIG. 26 is a plan view showing another storage device.

FIG. 27 is a plan view showing another supply device.

FIG. 28 is a plan view showing another storage device.

29 is a plan view showing the transfer table in FIG. 28. FIG.

FIG. 30 is a plan view showing another supply device.

FIG. 31 is a front view showing another supply device.

FIG. 32 is a plan view showing another supply device.

FIG. 33 is a front view showing another supply device.

FIG. 34 is a plan view of a storage rack that can store a plurality of types of substrates.

FIG. 35 is a sectional view of the storage rack.

FIG. 36 is a sectional view of the storage rack.

FIG. 37 is a front view of a supporting member.

FIG. 38 is a sectional view of a supporting member.

FIG. 39 is a perspective view of another support member.

FIG. 40 is a diagram showing how a substrate is supported by another supporting member.

[Explanation of symbols]

1 Mounting system 8,8a storage rack 9 substrates 11, 11a, 11b, 11c supply device 12 Coating device 13 Mounting device 14 Reflow equipment 15 Inspection device 16, 16a, 16b storage device 32 Lifting part 33 Standby 34 Transfer Department 36, 36a Storage rack switching unit 37 Extruder 41 Upstream sensor 42 Downstream sensor 53 Fixed disk 81 Support body 82, 82a support member 83 groove 111, 161 Storage rack replacement section 112,162 Transfer section 221 Guide part 231 motor 232 ball screw 323 reading sensor 361 Placement part 362 lifting mechanism 363 Horizontal movement mechanism 342 transfer table 502 Supply board data 503 Storage board data

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 5E313 AA02 AA11 AA15 AA22 CC04                       DD02 DD03 DD05 DD08 DD12                       DD14 EE02 EE05 EE22 FG01                       FG02 FG05 FG06 FG08

Claims (26)

[Claims] 1. A substrate supply device for supplying a substrate to a next step, wherein a substrate arranging section on which a plurality of types of substrates having different sizes are arranged, and the substrate is transferred from the substrate arranging section to the next step. A substrate supply device comprising: a transfer unit. 2. The substrate supply device according to claim 1, wherein a plurality of storage racks, each storing one type of substrate, are placed at a plurality of placement positions in the substrate placement unit, The substrate supply apparatus, wherein the mounting unit has a transfer unit that moves between a plurality of receiving positions for receiving the substrates from the plurality of mounting positions. 3. The substrate supply device according to claim 2, wherein the transfer unit further includes a standby unit for waiting the substrate between the plurality of mounting positions and the transfer unit. Substrate supply device. 4. The substrate supply apparatus according to claim 2 or 3, wherein the plurality of mounting positions are arranged in a direction perpendicular to a substrate transfer direction after the next step. Substrate supply device. 5. The substrate supply device according to claim 2, wherein the substrate placement unit replaces a storage rack placed at the plurality of placement positions with another storage rack. A substrate supply apparatus having a storage rack exchange section. 6. The substrate supply apparatus according to claim 2, wherein the transfer unit guides two opposing sides of the substrate, and a gap between the two guide units. Interval change mechanism to change
A substrate supply device comprising: 7. The substrate supply device according to claim 1, wherein, in the substrate placement unit, a plurality of storage racks, each of which stores one type of substrate, are placed at a plurality of placement positions, Substrate supply, characterized in that the mounting unit moves one of the plurality of mounting positions to a supply position for supplying the substrate to the next step, depending on the type of the substrate supplied to the next step. apparatus. 8. The substrate supply device according to claim 1, wherein a plurality of storage racks, each storing one type of substrate, are placed in the substrate placement unit, and the substrate placement unit sets the substrate A substrate supply device having a storage rack exchange section for exchanging a storage rack to be taken out with another storage rack. 9. The board supply device according to claim 2, further comprising an identification unit for identifying a storage rack from which the board is taken out. 10. The substrate supply device according to claim 9, wherein the identification unit identifies the type of the substrate taken out from the storage rack. 11. A substrate accommodation device for accommodating a substrate from a previous step, comprising: a substrate arranging section capable of arranging a plurality of types of substrates having different sizes; and a substrate from the previous step to the substrate arranging section. A substrate accommodating device comprising: a transfer unit for mounting. 12. The substrate storage device according to claim 11, wherein a plurality of storage racks, each storing one type of substrate, are placed at a plurality of placement positions in the substrate placement unit, The substrate accommodating apparatus, wherein the mounting unit has a transfer unit that moves between a plurality of dispensing positions that dispenses the substrate to the plurality of mounting positions. 13. The substrate storage device according to claim 12, wherein the transfer unit further includes a standby unit for waiting a substrate between the plurality of mounting positions and the transfer unit. Substrate storage device. 14. The substrate storage device according to claim 12, wherein the plurality of mounting positions are arranged in a direction perpendicular to a substrate transfer direction before the preceding step. Substrate storage device. 15. The substrate storage device according to claim 12, wherein the substrate placement unit replaces a storage rack placed at the plurality of placement positions with another storage rack. A substrate storage device having a storage rack exchange section. 16. The substrate storage device according to claim 12, wherein the transfer unit guides two opposite sides of the substrate, and a gap between the two guide units. Interval change mechanism to change
A substrate storage device comprising: 17. The substrate storage device according to claim 11, wherein a plurality of storage racks, each of which stores one type of substrate, are placed at a plurality of placement positions in the substrate placement unit. The substrate storage device, wherein the mounting unit moves any one of the plurality of mounting positions to a receiving position for receiving the substrate from the previous process according to the type of substrate received from the previous process. 18. The substrate storage device according to claim 11, wherein a plurality of storage racks, each storing one type of substrate, are placed in the substrate placement unit, and the substrate placement unit sets the substrate A substrate storage device having a storage rack exchange section for exchanging a storage rack to be stored with another storage rack. 19. The substrate storage device according to claim 12, further comprising an identification unit that identifies a storage rack in which the substrates are stored. 20. The substrate storage device according to claim 19, wherein the identifying unit receives the type of the substrate to be stored and identifies a storage rack to be stored. 21. A storage rack for storing a plurality of substrates arranged in parallel with each other in a direction normal to a main surface, each of the plurality of first support portions supporting one side of the substrate, Includes a plurality of second support portions that support another side opposite to the one side, and a distance between each of the plurality of first support portions and a corresponding second support portion can be changed. Storage rack characterized by being said. 22. The storage rack according to claim 21, wherein the second support portion supports the other side, and a support body to which the support member is movably mounted.
Storage rack characterized by having. 23. The storage rack according to claim 21, wherein the plurality of first support portions are a plurality of grooves formed in a portion parallel to the arrangement direction of the plurality of substrates to be stored. Storage rack characterized by that. 24. A substrate mounting system, comprising: a mounting device group for mounting electronic components on a substrate; a substrate supply device for supplying a plurality of types of substrates to the mounting device group; and a substrate dispensed from the mounting device group. A board housing device for housing and a type of board supplied to the mounting device group;
A board mounting system, comprising: an identification section; and a second identification section for identifying the type of the board paid out from the mounting apparatus group. 25. The board mounting system according to claim 24, wherein a plurality of storage racks corresponding to the types of boards are placed in the board housing device, and the board housing device identifies the second identifying unit. A board mounting system characterized in that one storage rack is specified based on the result, and the board identified by the second identification unit is stored in the one storage rack. 26. The board mounting system according to claim 24, further comprising a storage unit that stores an identification result by the first identification unit and an identification result by the second identification unit. Board mounting system.