WO2005009100A1

WO2005009100A1 - Process for producing electronic circuit and system for producing electronic circuit

Info

Publication number: WO2005009100A1
Application number: PCT/JP2004/010331
Authority: WO
Inventors: Seigo Kodama; Shinsuke Suhara; Kunio Ooe
Original assignee: Fuji Machine Mfg. Co., Ltd.
Priority date: 2003-07-22
Filing date: 2004-07-21
Publication date: 2005-01-27
Also published as: JP2010232693A; JP5271315B2; JP4745825B2; JPWO2005009100A1

Abstract

Degree of freedom is enhanced in the feeding of a circuit board when electronic circuit components are mounted on the front surface and rear surface of the circuit board. Each of a plurality of mounting units (10) comprises a front conveyor (40), a rear conveyor (42), wiring board holders provided for respective conveyors (40, 42), a mounting head, a mounting head group mover, a component feeder, front a surface mounting program, and a rear surface mounting program. The rear conveyor (42) carries a printed circuit board (14) while directing its surface upward. The surface mounting program is selected and an electronic circuit component is mounted on the surface. Subsequently, the printed circuit board (14) is turned over and carried in the opposite direction on the front conveyor (40) while directing the rear surface upward. Then the rear surface mounting program is selected and an electronic circuit component is mounted on the rear surface. The electronic circuit component can be mounted regardless of whether the front surface is directed upward or the rear surface is directed upward by selecting the programs. Furthermore, printed circuit boards directing the front surface upward and printed wiring boards directing the rear surface upward can be fed in an arbitrary order on one conveyor.

Description

Detail

Electronic circuit production method and electronic circuit production

Technical field

The present invention relates to an electronic circuit production method and an electronic circuit production system, and more particularly to a method and an improvement of a system for performing operations for producing an electronic circuit on both front and back surfaces of a circuit board.

^ Scenic technology

[0002] Electronic circuit components are mounted on a circuit board such as a printed wiring board to constitute an electronic circuit. A method for mounting electronic circuit components on both front and back surfaces of a circuit board to produce an electronic circuit is already known, for example, as described in Patent Document 1. According to this electronic circuit component mounting method, the circuit board with the front side facing upward and the circuit board with the rear side facing upward form a set, and the mounting of the electronic circuit components is performed as a single circuit board. Is The order of transport of the two circuit boards that make up the set by the board conveyor is set in advance, so that the circuit board with the front side up is transported first, and the mounting program is A component mounting location corresponding to the component mounting location on the front side is set on the downstream side in the transport direction, and the component mounting location on the back side is set on the upstream side. It is created in the same way as when electronic circuit components are mounted on the surface where the corresponding component mounting locations are set. The pair of circuit boards is supplied to the board conveyor again after the mounting of the electronic circuit components on one surface of each circuit board, so that the electronic circuit components are mounted on the other surface. However, also in this case, the circuit boards are set in pairs, and the circuit boards with the front side up are conveyed first. Therefore, even if electronic circuit components are mounted on both front and back surfaces of one circuit board, the mounting can be performed based on the same mounting program, and one electronic circuit component mounting system can be used. Electronic circuit components can be mounted on both front and back surfaces of the circuit board without any setup change, and work in process is reduced.

[0003] Also, two electronic circuit component mounting systems are provided, one of which is a surface mounting system for mounting electronic circuit components on the front surface of a circuit board, and the other is one on which electronic circuit components are mounted on the back surface. It is known to mount electronic circuit components on both the front and back surfaces of a circuit board.

[0004] Patent Document 1: JP-A-8-32225

Disclosure of the invention

[0005] However, according to the mounting method described in Patent Document 1, it is necessary to form a pair of circuit boards so that the circuit board with the surface facing upward is conveyed first. In this case, the supply order of the circuit board is restricted by the front and back sides of the surface, and the degree of freedom is low, which causes a decrease in productivity. Also, the mounting device must be a device that can mount electronic circuit components on a set of two circuit boards, which is large.

If two electronic circuit component mounting systems are provided, the equipment cost will increase and the entire system will become large.

[0006] In view of the above circumstances, the present invention improves the degree of freedom in supplying circuit boards and increases the size of mounting equipment when performing work for producing electronic circuits on both front and back surfaces of circuit boards. The present invention provides an electronic circuit production method and an electronic circuit production system of the following aspects according to the present invention. As in the case of the claims, each aspect is divided into sections, each section is numbered, and if necessary, the other section numbers are cited in a format. This is merely for the purpose of facilitating the understanding of the present invention, and the technical features described in this specification and their combinations should not be construed as being limited to those described in the following sections. Absent. In addition, when two or more items are described in one section, it is not always necessary to adopt these items together. It is also possible to select and adopt only some of the items.

[0007] The following items correspond to (1) and (20) correspond to claim 1 and claim 20 respectively.

[0008] (1) A screen printer for printing cream solder on a circuit board, an adhesive dispenser for applying an adhesive to the circuit board, and at least one electronic circuit component for mounting an electronic circuit component on the circuit board A method for producing an electronic circuit by an electronic circuit production system comprising at least one of an electronic circuit component mounting system including a mounting unit, a melting furnace for melting the time solder, and a curing furnace for curing the adhesive. So, The electronic circuit production system is supplied with a mixture of a circuit board having a front side facing up and a circuit board having a back side facing up, and the screen printing machine, An electronic circuit production method for causing at least one of the adhesive dispenser, the electronic circuit component mounting system, the melting furnace, and the curing furnace to perform an operation according to a surface of the circuit board that faces upward.

An electronic circuit production system is often configured to include at least one of a screen printing machine and an adhesive dispenser, at least one electronic circuit component mounting unit, and at least one of a melting furnace and a curing furnace. .

If the electronic circuit production system according to this section includes an electronic circuit component mounting unit, the electronic circuit component mounting unit may be, for example, an electronic circuit component according to any one of paragraphs (11) to (19). It is configured similarly to the circuit component mounting unit.

The type, number, position, etc. of mounted electronic circuit components are usually different between the front and back surfaces of a circuit board. In a screen printing machine, a screen mask corresponding to the printing of cream solder on the front surface is used. Printing work using a screen mask according to the printing of cream solder on the back side is performed.For the adhesive dispenser, application work based on the adhesive front-surface application program and back-side application are performed. Coating work is performed based on the program. In a melting furnace, heating is performed at a temperature suitable for melting the cream solder that temporarily fixes the electronic circuit components on the surface of the circuit board, or melting the cream solder that temporarily fixes the back surface. Heating is performed at a temperature suitable for. In a curing oven, irradiation or heating suitable for curing the adhesive temporarily fixing the electronic circuit components to the surface of the circuit board is performed, or the adhesive temporarily fixed to the back surface is cured. Irradiation or heating of a suitable light beam is performed. According to the electronic circuit component production method described in this section, when the work to be performed on the front surface and the back surface of the circuit board is different in a work machine such as a screen printing machine constituting the electronic circuit production system, the supply is performed. Regardless of whether the front side or the back side of the circuit board is placed on the circuit board, it is possible to carry out the work corresponding to that. Therefore, for example, when a circuit board is supplied by a substrate supply device, a circuit board having a front surface facing upward and a circuit board having a rear surface facing upward can be supplied in an arbitrary order. Can improve efficiency The In addition, it is possible to suppress an increase in equipment cost and an increase in size of the equipment as compared with a case where a work system for performing work on the front surface of the circuit board and a work system for performing work on the back surface are provided.

(2) the electronic circuit production method,

A component supply device for supplying electronic circuit components,

A board holding device for holding a circuit board,

At least one mounting head that receives an electronic circuit component from the component supply device and mounts the electronic circuit component on a circuit board held by the board holding device;

A relative motion imparting device for imparting relative motion necessary for mounting an electronic circuit component to the at least one mounting head and the substrate holding device;

A step of mounting electronic circuit components on both front and back surfaces of a circuit board by an electronic circuit component mounting system including at least one electronic circuit component mounting unit having

The electronic circuit component mounting unit is supplied with a mixture of a circuit board with the front side up and a circuit board with the back side up, and the circuit board supplied with the front side up. Includes the electronic circuit component mounting step of mounting electronic circuit components based on the back surface mounting program for circuit boards supplied with the back side up based on the front surface mounting program Electronic circuit production method.

The electronic circuit production method of this section includes at least an electronic circuit component mounting step. When only the electronic circuit component mounting step is included, the electronic circuit component mounting method is an aspect of the electronic circuit production method. According to this method, one of the front surface mounting program and the back surface mounting program is selected according to which side of the supplied circuit board is facing up, and the electronic circuit component is mounted. Regardless of whether the surface placed on the supplied circuit board is the front surface or the back surface, the electronic circuit components can be mounted in accordance with that, and the circuit board with the front surface facing up And the circuit board with the back side up can be supplied in any order. Alternatively, even when the supply order is set in advance, the supply of the circuit board to the electronic circuit component mounting unit, which has a high degree of freedom in setting the order, is facilitated, and the productivity can be improved. Also, only one electronic circuit component mounting system is required, which can suppress an increase in equipment cost and an increase in size of the equipment. In addition, The supply of the circuit board to the electronic circuit component mounting unit is often performed by a board conveyer that carries the circuit board into and out of the board holding device, but this is not essential. The circuit board can be supplied by a board attaching / detaching device that grips and attaches the circuit board to the board holding device or removes the circuit board from the board holding device.

(3) The electronic circuit production method according to the above mode (2), wherein the circuit board with the front side up and the circuit board with the back side up are supplied in an arbitrary order.

According to the electronic circuit production method described in this section, the supply of the circuit board becomes easier, and the productivity is further improved.

(4) The circuit board includes a front and back information acquisition step of acquiring information on whether the front surface is facing upward or the back surface is facing upward, and based on the information acquired in the front and back information acquisition process. The electronic circuit production method according to (3), wherein the front surface mounting program and the back surface mounting program are selected and executed.

According to the electronic circuit production method described in this section, even if the circuit board with the front side facing up and the circuit board with the back side facing up are supplied in an arbitrary order, the acquisition of the front and back information is possible. It is possible to determine whether the surface of the circuit board on which the electronic circuit components are to be mounted is the front surface or the back surface, and select a circuit board mounting program according to the upward facing surface, and mount the electronic circuit components. .

The front and back information is obtained, for example, by detecting the front and back by the front and back detection device, or by reading the front and back information by the information reading device. The front and back detection device is, for example, a device that is provided on a circuit board and reads information indicating whether it is a front surface or a back surface. For example, if an information recording unit is provided on a surface of a circuit board, and the information recording unit records information indicating whether the surface on which the information recording unit is provided is a front surface or a back surface, The front and back detection device is a device that reads recorded information. The information recording unit is composed of, for example, a barcode, a two-dimensional code, a wireless tag, a mark, or information represented by a combination of numbers, characters, symbols, etc., which is directly provided on a circuit board by printing or the like, or a sticker. The information recording unit is constituted by being indirectly provided by pasting or the like. The information reading device has a configuration corresponding to the information recording unit. Also, if the front and back surfaces of the circuit board can be distinguished by the unique characteristics of each surface, the front and back detection device will It is a device that acquires the characteristics of: For example, in the case where the front and back surfaces are differently distinguished in color or have portions with significantly different shapes, the front and back sides can be detected based on these.

When reading the front and back information by reading, for example, as will be described later, a board conveyor power is provided, and the circuit board is supplied with the front face up for each board conveyor, or If it is set in advance whether or not to be supplied in a state in which is placed above, reading the front and back setting information is acquisition of the front and back information. Even if the front and back sides of the upper surface are set, if the front and back information is acquired by detection by the front and back detection device, it is possible to confirm whether the circuit board is supplied in the set state. In this case, a front and back check step is provided, and the front and back of the circuit board are checked by the front and back check device.

(5) the electronic circuit production method,

A component supply device for supplying electronic circuit components,

A board holding device for holding a circuit board,

Two parallel board conveyors for loading and unloading circuit boards to and from the board holding device;

A circuit board with a front side facing up is supplied to one of the two board conveyers, and a circuit board with a back side facing up is supplied to the other, based on a mounting program corresponding to the front and back states of each circuit board. The electronic circuit production method according to item (1), including an electronic circuit component mounting step of mounting electronic circuit components.

At the beginning and the end of the mounting operation, the circuit board may be supplied only to the two board conveyors, to the gap, or to both. On the board conveyor side where the circuit board with the front surface facing upward is supplied, the electronic circuit components are mounted on the front surface of the circuit board, and the board conveyor where the circuit board with the back surface facing upward is supplied. On the side, electronic circuit components are mounted on the back surface of the circuit board. Since two board conveyors are provided, for example, while the electronic circuit components are being mounted on the circuit board carried into the board holding device by one of the board conveyors, the other board conveyor has the same Circuit boards can be loaded and unloaded, reducing the time required to change circuit boards on which electronic circuit components are mounted, and improving the production efficiency of circuit boards with electronic circuit components mounted on both front and back. Can be done.

The electronic circuit production method of this section includes at least an electronic circuit component mounting step. When only the electronic circuit component mounting step is included, the electronic circuit component mounting method is an aspect of the electronic circuit production method. The electronic circuit component mounting system in which this electronic circuit component mounting method is performed has two board conveyors, but has one component supply device and one relative motion imparting device, and at least one mounting head. There is not one electronic circuit component mounting system that has a component supply device, a substrate holding device, a board conveyor, at least one mounting head, and a relative motion imparting device. It is possible to efficiently produce a circuit board having electronic circuit components mounted on both front and back sides while suppressing the increase in the shape and equipment cost.

(6) In the initial stage of the mounting work on one type of circuit board, a plurality of circuit boards are supplied to both of the two board conveyors in one of a state in which the front side is upward and a state in which the back side is upward, and In the middle, the supply is performed in both the state where the front surface is facing upward and the state where the back surface is facing upward, and in the last stage, the plurality of circuit boards are aligned in the other of the state where the front surface is facing upward and the back surface is facing upward. The electronic circuit production method according to item (5), including a step of mounting electronic circuit components to be supplied.

In the electronic circuit component mounting process described in this section, for example, for each of the two board conveyors, it is set whether the surface placed on the supplied circuit board is the front surface or the back surface, and If the settings are not changed through a series of mounting operations and the circuit board is supplied to only one of the two board conveyors at the beginning and end of the mounting operation The number of board conveyors that do not operate can be reduced as compared to the case in which the production efficiency can be further increased.

During the mounting work, it is not determined whether the surface placed on the circuit board supplied to each of the two board converters is the front or back, even if it is determined for each board converter. , May be mixedly supplied to each of the two substrate conveyors. Also, in the initial stage and the final stage of the mounting operation, the upper surface of the circuit board supplied to the two board conveyors is not aligned with one of the front surface and the back surface, and one of the board conveyors has the front surface facing up. A circuit board may be supplied, and the other circuit board may be supplied with a circuit board having a back surface facing up, or may be mixed in each of the two board conveyors.

(7) The circuit board includes a front and back information acquisition step of acquiring information on whether the front surface is facing upward or the back surface is facing upward, based on the information acquired in the front and back information acquisition process. Select the surface mounting program for the circuit board with the front side facing up, and select the back side mounting program for the circuit board with the back side facing up (5) Or the electronic circuit production method according to the above (6).

The front and back information is acquired, for example, in the same manner as in the electronic circuit production method described in (4). Regardless of whether the circuit boards supplied to the two board conveyors are facing up or down, the wearing program is executed according to the front and back sides of the up-facing side based on the acquisition of the front and back information. The electronic circuit components can be selectively mounted.

If the front and back information is acquired, for example, in the electronic circuit component mounting system in which the electronic circuit production method described in the paragraph (6) is performed, for example, in the initial stage of the mounting operation, the circuit board is mounted on the two board conveyors, When the state of supply is aligned with one of the upward facing state and the reverse side facing upward, and the state of supplying both parts during the mounting work, one of the two circuit boards The front and back of the upward surface changes, but it is possible to reliably respond to the change, and to select the mounting program according to the front and back of the surface to mount the electronic circuit components. The same applies to the case where, at the end of the mounting operation, the circuit board is supplied to the two board conveyors with the front side facing up and the back side facing up. [0013] (8) The electronic circuit production method according to any one of (5) to (7), in which the two board conveyors are conveyed in the same direction.

The circuit board on which the electronic circuit components have been mounted on one of the front side and the back side is returned to the upstream end in the transport direction of the board conveyor, turned upside down, again supplied to the board conveyor, and supplied to the other side. Electronic circuit components are mounted. According to the electronic circuit production method described in this section, for example, a circuit board having electronic circuit components mounted on both sides can be discharged to a side opposite to a side to which an unmounted circuit board is supplied. it can.

(9) The electronic circuit production method according to any one of the above modes (5) to (7), in which the two board conveyors are transported in opposite directions.

After the circuit board is supplied to one of the board conveyors and the electronic circuit components are mounted on one of the front and back sides, the circuit board is not returned to the upstream end in the transport direction of the board conveyor and is sent to the other board conveyor. The circuit board is supplied from the upstream side in the transport direction, and the circuit board is transported in the opposite direction to the transport direction by one of the board conveyors. Electronic circuit components are mounted. According to the electronic circuit production method described in this section, for example, a circuit board having electronic circuit components mounted on both front and back surfaces is supplied, and a circuit board having no electronic circuit components mounted on both front and back surfaces is supplied. Can be drained and returned to the same side as the part.

(10) A screen printer for printing cream solder on a circuit board, an adhesive dispenser for applying an adhesive to the circuit board, and at least one electronic circuit component mounting unit for mounting an electronic circuit component on the circuit board. An electronic circuit component mounting system, a melting furnace for melting the cream solder, and an electronic circuit production system including at least one of a curing furnace for curing the adhesive,

A front and back information acquisition device for acquiring information on whether the circuit board has a front surface facing upward or a back surface facing upward;

At least one of the screen printing machine, the adhesive dispenser, the electronic circuit component mounting system, the melting furnace, and the curing furnace is provided with a circuit board facing upward based on the front and back information acquired by the front and back information acquisition device. Electronic circuit production with front and back working parts that perform work according to the state of the surface V According to the electronic circuit production system described in this section, for example, the functions and effects described in section (1) can be obtained.

(11) The electronic circuit component mounting system includes the electronic circuit component mounting system, and at least one electronic circuit component mounting unit of the electronic circuit component mounting system includes:

A component supply device for supplying electronic circuit components,

A board holding device for holding a circuit board,

A surface mounting program for mounting electronic circuit components on a circuit board held with the front side up on the substrate holding device, and electronic circuit components on a circuit board held with the back side up on the substrate holding device. A program storage unit for storing and storing both back mounting programs for mounting;

A program selector for selecting any one of the front-side mounting program and the back-side mounting program;

The electronic circuit production system according to the above mode (10).

One electronic circuit component mounting unit can be used to mount all or all of the electronic circuit components that are to be mounted. It may be one that performs all mounting. The plurality of electronic circuit component mounting units may have the same or different configurations of components (configuration for mounting electronic circuit components on a circuit board). The electronic circuit component mounting unit may be modularized. If the electronic circuit component mounting unit is modularized, for example, when a mounting system is configured with a plurality of electronic circuit component mounting units, a mounting system having a different configuration is set by changing or replacing the electronic circuit component mounting units that constitute the system. Can be easily obtained

The system according to this section is an embodiment of an electronic circuit production system when only an electronic circuit component mounting system is provided, provided that at least the electronic circuit component mounting system is provided. It becomes a child circuit component mounting system. According to this system, for example, the functions and effects described in the item (2) can be obtained.

(12) The electronic circuit production system according to the mode (11), further comprising a front / back discrimination device for discriminating between a front surface and a back surface of the circuit board.

The front / back discrimination device is configured by, for example, a front / back detection device. As described above, when the information recording unit is provided on the circuit board, it may be provided on both the front surface and the back surface of the circuit substrate, or may be provided on only one of them. In the latter case, since the information is not obtained for the surface on which the information recording unit is not provided, it is determined whether the surface is the front surface or the back surface. The same applies to the case where front and back sides are detected based on characteristics unique to the circuit board.The characteristics are set for only one of the front and back sides, and based on the fact that the characteristics cannot be obtained, which side is the front or back side Is determined.

According to the electronic circuit production system described in this section, regardless of whether the front or back surface is facing upward, a mounting program corresponding to that surface is correctly selected, and the mounting of the electronic circuit components is performed without error. Can be. Therefore, the circuit board with the front side up and the circuit board with the back side up can be supplied in an arbitrary order, and the productivity can be further improved.

It is not indispensable to provide a front / back discrimination device if it is set in advance whether the front side or the back side of the circuit board which is carried in / out of the board holding device by the board conveyor is in the upward state.

(13) One board conveyor for loading and unloading a circuit board, and a board supply device capable of supplying the board board with both the circuit board face up and the back face up The electronic circuit production system according to the above mode (11) or (12), including:

When the mounting of the electronic circuit components on one of the front and back surfaces is completed, the circuit board is turned over and returned to the substrate supply device, supplied to the substrate conveyor, and mounted on the other side. To be. Although there is only one board conveyor, electronic circuit components can be mounted on a circuit board with both front and back facing up by selecting two types of mounting programs. It is possible to supply the circuit board in a state of being mixed and the circuit board in a state where the back surface is turned up. This subordinates to subsection (12) In this embodiment, the circuit board with the front side up and the circuit board with the back side up can be mixed and supplied in an arbitrary order, and the productivity can be further improved. According to the electronic circuit production system, the mounting of the electronic circuit components on the front surface of the circuit board and the mounting of the electronic circuit components on the back surface can be performed without the necessity of a setup change, even though there is only one board conveyor. In addition, it is possible to obtain a small and inexpensive electronic circuit component mounting unit that requires less work in process and has high productivity. The mounting head and the relative motion imparting device can make the electronic circuit component mounting unit particularly small as long as the electronic circuit components can be mounted on the! Circuit boards.

(14) Two board conveyors arranged in parallel with each other to carry in and out a circuit board, and a circuit board is supplied to one of the two board conveyors with the surface thereof facing up, and to the other, The electronic circuit production system according to the above mode (11) or (12), comprising: a board supply device configured to supply a circuit board with a back surface up.

According to the electronic circuit production system described in this section, for example, the functions and effects described in section (5) can be obtained.

(15) The electronic circuit production system according to the mode (14), wherein the two board conveyors convey circuit boards in the same direction.

According to the electronic circuit production system described in this section, for example, the functions and effects described in section (8) can be obtained.

(16) The electronic circuit production system according to the mode (14), wherein the two board conveyors convey circuit boards in mutually opposite directions.

According to the electronic circuit production system described in this section, for example, the functions and effects described in section (9) can be obtained.

(17) The circuit board discharged from the downstream side in one transfer direction of the two board conveyors is sent to the other board conveyor from the upstream side in the circuit board transfer direction of the circuit board, and the circuit board is discharged. The electronic circuit production system according to the above mode (16), comprising a transport direction reversing device for reversing the transport direction of the electronic circuit.

According to the electronic circuit production system described in this section, the circuit board automatically changes the transport direction. Inverted.

(18) The electronic device according to any one of (13) to (15), further including a circuit board return device for returning the circuit board discharged from the board conveyor to an upstream end in the transport direction of the board conveyor. Circuit production system.

According to the electronic circuit component mounting unit described in this section, the circuit board is automatically returned and can be quickly returned.

(19) From the substrate conveyor, at least one of the upstream side and the downstream side in the substrate transport direction, the front and back of the circuit board on which the electronic circuit components have been mounted on one of the front surface and the back surface are completed. Electronic circuit production system according to any one of paragraphs (11) to (18), provided with a reversing device.

According to the electronic circuit production system of this section, the circuit board is automatically turned upside down and can be quickly turned over.

(20) The electronic circuit production system according to any one of (11) to (19), further including an electronic circuit component mounting system in which a plurality of the electronic circuit component mounting units are arranged in series. According to the electronic circuit production system of this section, the plurality of electronic circuit component mounting units each share the mounting of electronic circuit components on one circuit board, and each of the electronic circuit component mounting units has a different configuration. When different electronic circuit components are mounted on the circuit board and the mounting of the electronic circuit components by all the electronic circuit component mounting units is completed, the mounting of the electronic circuit components on the front surface or the back surface of one circuit board is completed. . The mounting of electronic circuit components on a plurality of circuit boards is performed in parallel, and a single electronic circuit component mounting unit mounts all of the electronic circuit components on one circuit board in a single unit. The number of sheets produced per unit time increases, and the production efficiency improves.

Brief Description of Drawings

FIG. 1 is a plan view schematically showing an electronic circuit component mounting system according to an embodiment of the present invention.

FIG. 2 is a perspective view showing two of the mounting units constituting the electronic circuit component system.

[FIG. 3] Electronic circuits on the front and back surfaces of the printed wiring board in the above electronic circuit component system. It is a figure explaining mounting of a road component.

Garden 4] is a diagram showing a printed wiring board on which electronic circuit components are mounted in the electronic circuit component mounting system, FIG. 4 (a) is a plan view, and FIG. 4 (b) is a side view.

FIG. 5 is a block diagram showing a configuration of a control device for controlling the mounting unit.

Garden 6] is a diagram illustrating mounting of electronic circuit components on the front and back surfaces of a printed wiring board in the electronic circuit component mounting system according to another embodiment of the present invention.

Garden 7] is a diagram illustrating mounting of electronic circuit components on the front and back surfaces of a printed wiring board in the electronic circuit component mounting system according to still another embodiment of the present invention.

Garden 8] is a diagram illustrating mounting of electronic circuit components on the front and back surfaces of a printed wiring board in the electronic circuit component mounting system according to still another embodiment of the present invention.

Garden 9] is a diagram for explaining the production status of each time zone in the electronic circuit component mounting system shown in FIG.

Explanation of symbols

[0023] 10: Electronic circuit component mounting unit 14: Printed wiring board 22: Component supply device 24: Wiring board holding device 34: Tape feeder 40: Wiring board conveyer (front conveyer)

42: Wiring Board Conveyor (Lya Conveyor) 52: Mounting Head Group Moving Device 52: Mounting Head 70: Wiring Board Supply Device 76: Front 78: Back 86: Bar Code Reader 90: Front / Back Reverse Device 92: Wiring Board Feeding Device 100: Mounting unit control device 130: System control device 150: Wiring board supply device 160: Wiring board return device 164: Front and back reversing device 200: Mounting unit 202: Wiring board conveyer 204: Wiring board conveyer (return conveyer) 210 : Wiring board conveyor 216: Bar code reader 220: Front / back inversion Best mode for carrying out the invention

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

As schematically shown in FIG. 1, the electronic circuit component mounting system of the present embodiment includes a plurality of electronic circuit component mounting units (hereinafter abbreviated as mounting units) 10, and is an embodiment of an electronic circuit production system. is there. These mounting units 10 are arranged in series on a system base 12 (see FIG. 2) as a system body, and each of the plurality of mounting units 10 The mounting of electronic circuit components on one printed wiring board 14 (see Fig. 4) as a substrate is shared. The direction in which the plurality of mounting units 10 are arranged is referred to as an X-axis direction.

As shown in FIG. 2, the plurality of mounting units 10 each include an apparatus main body 20, a component supply device 22, a wiring board holding device 24, a wiring board transport device 26, a mounting device 28, and the like. It is a modularized device that is deployed in each and modularized, and is similarly attached to the system base 12 to configure an electronic circuit component mounting system. Although the mounting unit 10 has not been disclosed yet, it is configured similarly to the mounting unit described in the specification of Japanese Patent Application No. 2003-115216 filed by the present applicant, and will be briefly described here. .

[0026] The component supply device 22 includes, for example, a tape feeder 34 as a component supply feeder, which is a type of component supply device that supplies electronic circuit components one by one. Have more than one. These tape feeders 34 are removably mounted on a pallet (not shown) as a feeder support member, and are attached to the apparatus body 20 together with the pallets to supply electronic circuit components.

In the present embodiment, the wiring board transport device 26 includes a plurality of, for example, two wiring board conveyors 40 and 42. The circuit board conveyors 40 and 42 are configured to independently carry the printed circuit board 14 in the X-axis direction, are provided in parallel with each other, and are adjacent to each other in the Y-axis direction. The Y-axis direction is a direction perpendicular to the X-axis direction in the horizontal plane. In the present embodiment, each of the wiring board conveyors 40 and 42 includes a servomotor, which is a type of electric motor, as a drive source, and includes a pair of guide rails as guide members and a pair of conveyor belts as endless winding members. By rotating the conveyor belt, the printed wiring board 14 can be transported in both forward and reverse directions.

[0028] The wiring board conveyors 40 and 42 can adjust the wiring board conveyance width independently of each other, and the interval between the pair of guide rails is the width of the printed wiring board 14 on which the electronic circuit components are mounted. Adjusted to suit. Hereinafter, of the wiring board conveyors 40 and 42, the wiring board conveyor 40 on the front side of the mounting unit 10, that is, the component supply device 22 side is referred to as a front conveyor 40, and the wiring board conveyor 42 on the rear side is referred to as a rear conveyor 42. . The wiring board holding device 24 is provided for each of the front and rear conveyors 40 and 42 and serves as a plurality of support members. A backup plate (not shown), a backup plate 44 as a support member attaching member, and a clamp plate (not shown) as a wiring board holding member support and hold the printed wiring board 14 from below. Between the adjacent mounting units 10, the front conveyors 40 and the rear conveyors 42 transfer the printed wiring boards 14, and carry the printed wiring boards 14 into and out of the wiring board holding device 24. . The electronic circuit component mounting system includes a transport line configured by connecting the front conveyors 40 of the plurality of mounting units 10 in series and a transport line configured by connecting the rear conveyors 42 in series. Two transfer lines can be provided.

The mounting device 28 includes a mounting head group 46 and a mounting head group moving device 48 as shown in FIG. In the present embodiment, the mounting head group 46 includes a head holder 50 and at least one mounting head 52 held by the head holder 50. Each of the mounting heads 52 is held by the head holder 50 so as to be able to move up and down and rotatable around its own axis, and is a kind of component holder, and has at least a suction nozzle that sucks and holds electronic circuit components by negative pressure. Keep one. There are a plurality of types of mounting head groups 46. For example, there are a plurality of types according to the number of mounting heads 52 to be held, and the mounting heads 52 are detachably held by the mounting head group moving device 48.

[0030] The mounting head group 46 is moved to an arbitrary position in the horizontal plane by the mounting head group moving device 48, which is an XY robot type moving device provided in the apparatus main body 20, and the mounting head 52 is moved to the component supply device. The printed wiring board is moved between the front conveyor 22 and the front conveyor 40 or the rear conveyor 42, receives the electronic circuit component from one of the plurality of tape feeders 34 by suction suction, and is held by the printed circuit board holding device 24. Attach it to plate 14. The mounting head 52 is also moved up and down by a mounting head elevating device (not shown) to receive and mount electronic circuit components by suction nozzles. The mounting head 52 is further rotated about its own axis by a mounting head rotating device (not shown). In the present embodiment, the mounting head group moving device 48 and the mounting head elevating device move the mounting head 52 and the wiring board holding device 24 to provide a relative movement imparting relative motion required for mounting the electronic circuit components. Is composed.

[0031] As shown in FIG. 2, the device main body 20 includes a holder accommodating device. Is provided. A plurality of at least one type of suction nozzle is accommodated in the nozzle stocker 56, and the mounting head 52, for example, picks up a suction nozzle (not shown) corresponding to the type of electronic circuit component mounted on the printed wiring board 14 from the nozzle stocker 56. Replace the suction nozzle with the receiving or nozzle stop force 56.

The mounting head group moving device 48 is provided with a wiring board image capturing device 60 (see FIG. 5) having a CCD camera as an imaging device. To print the printed wiring board 14.

Further, in each of the plurality of mounting units 10, a component imaging device 62 having a CCD camera as an imaging device is provided between the component supply device 22 and the wiring board transport device 26 in the device main body 20. The component imaging device 62 images the posture and the like of the electronic circuit component held by the mounting head 52.

The printed wiring board 14 is supplied to the front and rear conveyors 40 and 42 by a wiring board supply device 70. As shown in FIGS. 1 and 3, the wiring board supply device 70 includes electronic circuit components in the wiring board transport direction, and in the present embodiment, both of the front and back surfaces of the plurality of mounting units 10 arranged in series. Provided adjacent to the upstream of the mounting unit 10 located at the most upstream side in the direction in which the unmounted printed wiring board 14 is transported for component mounting (in FIG. 1, leftward and rightward). The printed wiring board 14 is provided to the rear conveyor 42 of the mounting unit 10.

In the present embodiment, as shown in FIG. 3, the wiring board supply device 70

72, and a supply conveyor 74 as a feeding device or a distribution device for feeding the printed wiring board 14 housed in the wiring board housing section 72 to the rear conveyor 42. The printed circuit board 14 in which cream solder is applied to both the front surface 76 and the rear surface 78 is housed in the wiring board housing section 72.

[0036] Bar codes 82 and 84 (see FIG. 4) as information recording units are provided on the front surface 76 and the back surface 78 of the printed wiring board 14, respectively. The barcode 82 records, for example, wiring board ID data for individually identifying the plurality of printed wiring boards 14 and data indicating that the surface on which the barcode 82 is provided is the surface 76 of the printed wiring board 14. Being done. The barcode 84 also has the printed circuit board ID data and the surface on which the barcode 84 is provided. Data indicating that the back side of 4 is 78 is recorded. The barcodes 82 and 84 are turned upside down around an axis parallel to the Y-axis direction through the center of the printed wiring board 14 when the printed wiring board 14 is conveyed by the front conveyor 40 or the rear conveyor 42. It is provided so as to be located at the same position in the horizontal plane when it is taken off.

As shown in FIG. 3, a bar code reader 86 as an information reading device, which is a type of information detecting device, is provided above the supply conveyor 74. The barcode reader 86 is provided so as to be position-adjustable, and is provided on an upward surface in a state where the printed wiring board 14 held by the supply conveyor 74 is in a standby state in preparation for feeding to the rear conveyor 42. The bar code is located at a position where the bar code can be read. The bar code reader 86 may be provided so as to be movable, and the information may be read by being moved with respect to the bar codes 82 and 84 by the bar code reader moving device. The information may be read using the relative movement between the barcode reader 86 and the barcodes 82 and 84 when the printed wiring board 14 is transported by the supply conveyor 74.

[0038] For the plurality of mounting units 10, a front / back reversing device 90 and a wiring board feeding device 92 are provided adjacent to a downstream side of the mounting unit 10 located at the most downstream in the wiring board conveyance direction by the rear conveyor 42. ing. The reversing device 90 receives the printed wiring board 14 from the lowermost mounting unit 10 and reverses the printed circuit board 14 in the transport posture. In the present embodiment, the front / back reversing device 90 is a device that rotates the printed wiring board 14 by rotating it 180 degrees around an axis parallel to the Y-axis direction, passing through the center thereof, and reversing it.

In the present embodiment, the wiring board feeding device 92 rotates the printed wiring board 14 inverted by the front / back inverting device 90 in the same posture, that is, around the axis perpendicular to the front surface 76 and the rear surface 78. In the wiring board conveyance direction by the rear conveyor 42, the feeding unit 10 is configured to feed the front conveyor 40 of the mounting unit 10 located at the most downstream side. The wiring board feeding device may be a device that turns the printed wiring board 14 around a vertical turning axis and feeds the printed wiring board 14 to the front conveyor 40. The front conveyor 40 conveys the printed wiring board 14 in a direction opposite to the direction of conveyance by the rear conveyor 42, and conveys the printed wiring board 14 toward the supply side of the printed wiring board 14 to the rear conveyor 42. The wiring board feeding device 92 is a conveyance direction reversing device for reversing the conveyance direction of the printed wiring board 14 by 180 degrees. Device.

As shown in FIG. 5, each of the plurality of mounting units 10 includes a mounting unit control device 100 for controlling various devices provided therein including the component supply device 22. The mounting unit control device 100 mainly includes a computer 112 having a CPU 102, a ROM 104, a RAM 106, an input / output interface 108, and a bus 110 for connecting them. The component supply device 22, the wiring board holding device 24, the mounting device 28, the wiring board conveyers 40 and 42, etc. are connected to the input / output interface 108 via respective drive circuits 114 in the control device 100. .

The wiring board imaging device 60 is connected to the input / output interface 108 via a component image processing unit 120, and the component imaging device 62 is connected to the input / output interface 108 via a board image processing unit 122. Thus, based on the imaging data, information on the holding posture of the electronic circuit component, information on the position error of the component mounting point on the printed wiring board 14, and the like are obtained. The ROM 104 stores a basic operation program of the mounting unit 10 and the like. The RAM 106 further stores a component mounting program for mounting electronic circuit components on the printed wiring board 14, a printed wiring board. Information and the like regarding the electronic circuit components to be mounted on 14 are stored. The component mounting program includes mounting sequence data, mounting position data, mounted component data, and the like set according to the type of the printed wiring board 14 on which the component mounting work is performed. Both a front surface mounting program for mounting components and a rear surface mounting program for mounting electronic circuit components on the back surface 78 are stored. The RAM 106 also stores various types of component supply device-related data such as component-specific data relating to electronic circuit components to be mounted and tape feeder arrangement data (which electronic circuit components are supplied from which tape feeder 34) in the component supply device 22. Data etc. are stored.

[0042] The electronic circuit component mounting system includes a system control device 130 that integrally controls the entire system including a plurality of mounting units 10, a wiring board supply device 70, a front / back reversing device 90, and a wiring board feeding device 92. I have. The system control device 130 is mainly composed of a computer. The other mounting unit 10 and the system controller 130 are connected to the input / output interface 108 of the mounting unit controller 100 via a communication cable 132. The mounting unit controller 100 communicates with the system controller 130 and the mounting unit controller 100 of another mounting unit 10 to exchange information, send and receive commands, and the like. The barcode reader 86 is connected to the system control device 130 in the present embodiment. The wiring board supply device 70, the barcode reader 86, the front / back inversion device 90, and the wiring board feeding device 92 are shared by the plurality of mounting units 10, and constitute the mounting unit 10. The part of the system control device 130 that controls the mounting unit 10 also constitutes the mounting unit 10.

The mounting of electronic circuit components on the front surface 76 and the back surface 78 of the printed wiring board 14 will be described.

The electronic circuit component mounting system has a plurality of mounting units 10 and focuses on one printed wiring board 14 in which the mounting of electronic circuit components to the printed wiring board 14 is performed in parallel in each mounting unit 10. Then, the printed wiring board 14 is supplied by the wiring board supply device 70 to the rearmost conveyor 42 at the uppermost stream with the surface 76 facing upward, carried into the wiring board holding device 24, and mounted by the mounting head 52. The electronic circuit components are mounted on.

[0044] The printed wiring board 14 having the front surface 76 and the back surface 78 each coated with a time solder is housed in the wiring board housing section 72 of the wiring board supply device 70 with the front surface 76 facing up. And is supplied to the rear conveyor 42 by the supply conveyor 74. While the printed wiring board 14 is held by the supply conveyor 74 and kept in standby for feeding to the rear conveyor 42, the information recorded in the barcode 82 provided on the front surface 76 is read by the barcode reader. 86, it is detected whether the upward surface of the printed wiring board 14 is the front surface 76 or the rear surface 78. The system controller 130 checks whether the upward surface is the surface 76 based on the information read by the barcode reader 82. If the upward surface of the printed wiring board 14 is not the surface 76, for example, the information A warning or information is issued by the device or the warning device, and an appropriate process is performed based on the warning or notification, such as the operator turning the front and back of the printed wiring board 14 to the desired direction. In the present embodiment, the printed wiring board 14 supplied from the wiring board supply device 70 to the rear conveyor 42 has the front surface 76 facing upward, and based on the detection of the front and back sides, the printed wiring board 14 is printed. It is checked whether the upwardly facing surface of plate 14 is surface 76. In the present embodiment, the wiring board ID is recorded on the barcodes 82 and 84, and the wiring board ID is also read. Wiring board ID data can be It can be used, for example, to check the type of the printed wiring board 14 based on the wiring board ID, or to mount electronic circuit components on the front 76 and back 78 of the printed wiring board 14. The arrival history can be recorded in association with the wiring board ID.

Then, the printed wiring board 14 with the surface 76 facing upward is sent to the rear conveyor 42 of the most upstream mounting unit 10, and the mounting head 52 is moved by the mounting head group moving device 48, Electronic circuit components are received from feeder 34 and mounted on surface 76. In the electronic circuit component mounting system of the present embodiment, the printed wiring board 14 is conveyed with the front surface 76 facing upward by the rear conveyor 42, and the electronic circuit components are mounted on the front surface 76, and the rear surface is mounted by the front conveyor 40. It is supposed that the electronic circuit component is mounted on the rear surface 78 while being transported with the 78 facing upward. Therefore, when electronic circuit components are mounted on the printed wiring board 14, the preset front and back information is read out, and the mounting head 52 is mounted on the printed wiring board 14 by the front conveyor. One of the front-side mounting program and the back-side mounting program is selected based on whether the printed wiring board 14 is conveyed by the rear conveyor 42 or the rear conveyor 42, and the electronic circuit component is selected based on the program. Mounting is performed.

The rear conveyor 42 transfers the printed wiring board 14 to and from the rear conveyor 42 of the adjacent mounting unit 10, and the printed wiring board 14 first transmits to each of the plurality of mounting units 10. The electronic circuit components are mounted on the surface 76 while being conveyed by the rear conveyor 42 with the surface 76 facing upward, and held by the wiring board holding device 24.

The printed wiring board 14 having the electronic circuit components mounted on the front surface 76 in all the mounting units 10 is discharged from the mounting unit 10 at the most downstream position to the front / back reversing device 90, and is turned upside down so that the rear surface 78 faces upward. At the same time, it is fed to the front conveyor 40 of the lowermost mounting unit 10 by the wiring board feeding device 92. The mounting unit 10 is the most upstream mounting unit 10 in the transport direction of the printed wiring board 14 by the front conveyor 40, and the printed wiring board 14 is separated from the rear conveyor 42 by the front conveyor 40. The printed circuit board is conveyed in the opposite direction, and is held by the wiring board holding device 24 with the back surface 78 facing up in each of the plurality of mounting units 10, and the electronic head is mounted on the back surface 78 by the mounting head 52. [0048]: When the electronic circuit components are mounted on the back surface 78 of the printed wiring board 14 to be transported further, a mounting program is selected in the same manner as when mounting the electronic circuit components on the front surface 76, and mounting is performed based on the program. The head 52 is moved by the mounting head group moving device 48, and receives the electronic circuit component from the tape feeder 34 and mounts it on the back surface 78. In the present embodiment, a transport line composed of a plurality of rear conveyors 42 constitutes a front production track, and a transport line composed of a plurality of front conveyors 40 constitutes a back production track. Therefore, the printed circuit board 14 held by the printed circuit board holding device 24 provided for the rear conveyor 42 is held on the back surface 78, which is a held surface or a supported surface, on which no electronic circuit components are mounted yet. The plurality of backup pins are arranged at positions suitable for supporting the printed wiring board 14 from the rear surface 78 when the electronic circuit component is mounted on the front surface 76. In addition, the wiring board holding device 24 provided for the front conveyor 40 has a plurality of electronic circuit components mounted on the surface 76 that is the held surface or the supported surface of the printed wiring board 14 to be held. The backup pins are arranged to support the printed wiring board 14 from the front surface 76 side, avoiding the mounted electronic circuit components.

As described above, in one mounting unit 10, the mounting programs corresponding to the front and back of the component mounting surface are read out, and the mounting of the electronic circuit components on the surface 76 of the printed wiring board 14 and the mounting of the printed wiring board 14 are performed. Both the mounting of the electronic circuit components on the back surface 78 are selectively performed. Therefore, the component supply device 22 holds the number and types of tape feeders 34 required for mounting the electronic circuit components on both the front surface 76 and the back surface 78. The nozzle stocker 56 accommodates the number and types of suction nozzles required for mounting electronic circuit components on both the front surface 76 and the back surface 78. The tape feeder 34 and the suction nozzle are set at the time of setup change, and at that time, a front surface mounting program and a rear surface mounting program corresponding to the type of the printed wiring board 14 are also set. At the time of the setup change, the arrangement of the backup pins of the wiring board holding device 24 and the adjustment of the wiring board conveyance width of the conveyors 40 and 42 are also performed.

[0050] In the mounting unit 10 that is the most upstream in the wiring board transport direction by the rear conveyor 42, the mounting of the electronic circuit components on the surface 76 of the printed wiring board 14 in the mounting unit 10 is performed. When the process is completed and passed to the mounting unit 10 adjacent on the downstream side, a new printed wiring board 14 is supplied from the wiring board supply device 70.

Therefore, in the initial stage of the mounting operation, the printed wiring board 14 is carried into and out of the wiring board holding device 24 by only the rear conveyor 42 in each of the plurality of mounting units 10, and the printed wiring board held by the mounting unit 10 Reference numeral 14 denotes one sheet, and electronic circuit components are mounted on the printed wiring board 14, but the printed wiring board 14 is finally carried into and out of the wiring board holding device 24 by the front conveyor 40. In this state, two printed wiring boards 14 are held in one mounting unit 10. In this state, for example, in one mounting unit 10, the mounting of the electronic circuit components on the front surface 76 of the printed wiring board 14 and the mounting of the electronic circuit components on the back surface 78 are, for example, alternately performed according to a predetermined rule. It is performed in. At the time of mounting, the front-side mounting program and the back-side mounting program are selected depending on which conveyor is the printed wiring board 14 on which the electronic circuit components are mounted.

When the mounting of the electronic circuit components on the back surface 78 of the printed wiring board 14 in the downstreammost mounting unit 10 in the feed direction of the printed wiring board 14 by the front conveyor 40 is completed, the printed wiring The plate 14 is discharged and sent to the next process.

At the end of the mounting operation, the loading and unloading of the printed wiring board 14 to and from the wiring board holding device 24 by only the front conveyor 40 in each of the plurality of mounting units 10 is performed, and the mounting of the electronic circuit components on the rear surface 78 is performed. Only is performed.

As is clear from the above description, in the present embodiment, the RAM 106 of the computer 112 constitutes a program storage unit, and the printed circuit board 14 of the mounting unit controller 100 on which electronic circuit components are mounted. The part for selecting the front mounting program and the rear mounting program according to the conveyor that transports the paper constitutes a program selection unit. The barcode reader 86 constitutes a front / back information obtaining device or a front / back detection device as a front / back discriminating device, and the barcode reader 86 of the system controller 130 obtains information by reading the information recorded in the barcodes 82 and 84. Based on the information on the front and back, the part for confirming that the printed wiring board 14 supplied by the wiring board supply device 70 is in a state in which the front surface 76 faces upward constitutes a front and back confirmation device, and a bar code 82, Use the wiring board ID data recorded in Parts constitute the wiring board information utilization unit. Furthermore, a part for mounting electronic circuit components to the printed wiring board 14 based on the program selection part of the mounting unit control device 100 and the selected mounting program constitutes a front-back working part.

[0055] The printed circuit board 14 on which the electronic circuit components have been mounted on the front surface 76 may be turned upside down in a state where the printed circuit board 14 can be sent to the front conveyor 42 by the wiring board feeding device 92. At times, it may be reversed.

In the above-described embodiment, the front conveyor 40 and the rear conveyor 42 are configured to convey the printed wiring board 14 in opposite directions to each other. The printed wiring board 14 may be transported in the direction. The embodiment will be described with reference to FIG.

In the present electronic circuit component mounting system also, for each of the front conveyor 40 and the rear conveyor 42, the force for transporting the printed wiring board 14 with the front surface 76 up, and the rear surface 7 8 up. It is set whether to convey in the state where For example, the front conveyor 40 transports the printed wiring board 14 with the back surface 78 facing up, and the rear conveyor 42 transports the printed wiring board 14 with the front surface 76 facing up. The wiring board transport direction of each of the front and rear conveyors 40 and 42 is the same, and the wiring board supply device 150 provided adjacently upstream of the mounting unit 10 at the most upstream position in the transport direction is provided. The printed wiring board 14 can be divided into the front conveyor 40 and the rear conveyor 42 according to whether the surface placed on the printed wiring board 14 is the front surface 76 or the rear surface 78. ing.

The wiring board supply device 150 includes a wiring board housing section 152, a supply section, a supply conveyor 154 serving as a wiring board sorting apparatus, and a feeding apparatus. In this embodiment, the supply conveyor 154 is provided so as to be movable in a horizontal plane, and in a direction perpendicular to the wiring board transport direction. (Omitted), and at least to a position for supplying the printed wiring board 14 to the front conveyor 40 and a position for supplying the printed wiring board 14 to the rear conveyor 42.

[0059] A bar code reader 156 is provided above the supply conveyor 154 in a state where the printed wiring board 14 is supplied to the front conveyor 40 so as to be position-adjustable. Read the information recorded in the barcodes 82 and 84 provided in 14. The directions of transport of the wiring boards of the front conveyor 40 and the rear conveyor 42 are the same, and the printed wiring board 14 that has been transported by the rear conveyor 42 and the mounting of the electronic circuit components on the front surface 76 has been completed, It is returned to the wiring board supply device 150 and supplied to the front conveyor 40. Therefore, a wiring board return device 160 is provided. In the present embodiment, the wiring board return device 160 includes a return conveyor 162 provided for each of the plurality of mounting units 10.

In addition to the front conveyor 40 and the rear conveyor 42, the return conveyor 162 of each mounting unit 10 is connected to each other to form a return-only track, and the printed wiring board 14 Perform delivery. The wiring board conveyance direction of the return conveyor 162 is opposite to the front conveyor 40 and the rear conveyor 42. Further, between the wiring board return device 160 and the wiring supply device 150, a front and back reversing device 164 is provided, and the printed wiring board 14 is turned upside down and the back surface 78 is turned up to supply the wiring board. It is passed to the supply conveyor 154 of the device 150. In the present embodiment, the printed wiring board 14 is returned by the wiring board return device 160 that does not change the posture (orientation) in the transport direction, and is passed around the axis parallel to the Y-axis direction by the front-back reversing device 164 through the center thereof. When it is turned over and supplied to the supply conveyor 154, the information of the bar code 84 provided on the back surface 78 is read by the bar code reader 86.

[0061] In the present electronic circuit component mounting system, the printed wiring board 14 housed in the wiring board housing section 152, the cream solder is applied to both front and back surfaces, and the printed wiring board 14 with the surface 76 facing up is provided by the supply con- troller. It is supplied to the rear conveyor 42 by 154. In a state where the printed wiring board 14 is held by the supply conveyor 154, the information recorded in the barcode 82 is read by the barcode reader 86, and the printed wiring board 14 is in a state where the surface 76 is facing up. What is confirmed is the same as in the above embodiment. In the mounting unit 10, as in the above-described embodiment, the surface mounting program is selected, and the mounting head 52 is moved to mount the electronic circuit component on the surface 76. In the initial stage of the mounting work on one type of printed wiring board 14, the printed wiring board 14 is supplied only to the rear conveyor 42, and the mounting of the electronic circuit components on the surface 76 in each of the plurality of mounting units 10 is performed. Done. When the mounting of the electronic circuit components on the surface 76 is completed in the mounting unit 10 at the most downstream in the wiring board transport direction, the printed wiring board 14 is moved from the rear conveyor 42 of the mounting unit 10 to the return conveyor 162. It is transferred, transported in the direction opposite to the component mounting direction, returned to wiring board supply device 150, and returned to the upstream end in the transport direction. At this time, the printed wiring board 14 is turned upside down by the upside down device 164 and is passed to the supply conveyor 154 of the wiring board supply device 150 with the back surface 78 turned up.

As described above, when the mounting work of the electronic circuit components on the printed wiring board 14 proceeds and the printed wiring board 14 in which the mounting of the electronic circuit components on the surface 76 is completed is generated, the wiring board supply device 150 The printed wiring board 14 housed in the wiring board housing 152 and having the front surface 76 facing upward is supplied to the rear conveyor 42, and the electronic circuit components are mounted on the front surface 76, and the rear surface 78 is facing upward. A certain printed wiring board 14 is supplied to a front conveyor 40. The supply conveyor 154 includes, for example, the timing of the return of the printed wiring board 14 by the wiring board return device 160, the mounting progress of the electronic circuit components in the plurality of mounting units 10, and the printed wiring board holding state, the front surface 76 and the back surface 78. Electronic circuit components are mounted based on the number of components mounted on the printed circuit board, the number of remaining printed wiring boards 14 supplied from the wiring board housing section 152, etc.

The printed wiring board 14 may be supplied alternately to the conveyor 42, or may be supplied continuously. The supply order and the continuous number may be set in advance. The printed circuit board 14 held by the supply conveyor 154 reads the information recorded in the barcode 82 or 84 by the barcode reader 156, and based on the front and back information obtained thereby, supplies the printed circuit board 142 to the printed circuit board. 14 is distributed to the front conveyor 40 and the rear conveyor 42, and the printed wiring board 14 is supplied to the front conveyor 40 with the back surface 78 facing up, and to the rear conveyor 42 with the front surface 76 facing up.

Further, according to the acquired front / back information and the information as to whether the printed wiring board 14 held by the supply conveyor 154 is supplied from the wiring board accommodating section 152 or passed from the front / back reversing device 164, the printing is performed. It is confirmed whether or not the desired surface of the wiring board 14 is facing upward. The printed wiring board 14 supplied from the wiring board accommodating section 152 is placed with the surface 76 facing up. Yes, the printed wiring board 14 passed from the front / back reversing device 164 should be in a state where the back surface 78 is up, and if the desired surface is not up, a warning is issued.

[0065] In each of the plurality of mounting units 10, two printed wiring boards 14 are held. However, similarly to the above-described embodiment, the printed wiring board 14 is connected to the front and rear conveyors 40 and 42. The mounting program is selected depending on which of the two is transported, and the electronic circuit components are mounted.

At the end of the mounting operation, when all the printed wiring boards 14 on which the electronic circuit components are to be mounted are supplied to the rear conveyor 42 and the electronic circuit components are mounted on the front surface 76, the front control The printed wiring board 14 is supplied only to the bay 40, and only the mounting of the electronic circuit component on the back surface 78 is performed in each of the plurality of mounting units 10.

In the present electronic circuit component mounting system, the supply conveyor 154 of the system controller 130 is controlled, and the printed wiring board 14 is distributed to the front conveyor 40 and the rear conveyor 42 based on the front and back information and supplied. The part is a wiring board distribution part, and it constitutes a wiring board supply control part. It may be considered that the wiring board distributing section and the wiring board supply control section constitute the wiring board supply device 150 together with the wiring board housing section 152 and the supply conveyor 154. The printed circuit board 14 on which the electronic circuit components have been mounted on the front surface 76 (the surface of the front surface 76 and the rear surface 78 on which the electronic circuit components are mounted first) is returned by the return conveyor 164, and turned upside down. A stand-by area, a stand-by area, a stand-by unit, and a stand-by unit may be provided for stand-by by the device 164 for inversion or delivery to the supply conveyor 154.

[0067] When the wiring board transport directions of the two board conveyors are the same as each other, in the initial stage of the mounting work on one type of printed wiring board 14, a plurality of circuit boards are attached to both of the two board conveyors with their surfaces facing upward. In the middle of the process, the supply is performed in both the state where the front surface is facing upward and the surface where the back surface is facing upward. The supply may be made in alignment with the other of the upward state and the reverse side. The embodiment will be described with reference to FIG.

The electronic circuit component mounting system according to the present embodiment is configured almost in the same manner as the electronic circuit component mounting system, except that the electronic circuit component mounting system is arranged on the back side production track constituted by the front conveyor 40. The printed wiring board 14 on which the components have been mounted is also Therefore, it can be returned to the wiring board supply device 150.

Also in the present electronic circuit component mounting system, in principle, the printed wiring board 14 carried by the front conveyor 40 is in a state in which the back surface 78 is faced up, and the printed wiring board carried by the rear conveyor 42 is The board 14 is placed with the surface 76 facing upward, but in the initial stage of the mounting work, as shown in FIG. 7 (a), the wiring board supply device 150 connects both the front conveyor 40 and the rear conveyor 42. The printed wiring board 14 is supplied with the surface 76 facing up. From the initial stage of the mounting operation, each of the plurality of mounting units 10 holds two printed wiring boards 14. At this time, by reading the information recorded in the bar code 82, it is detected that the upward surface of the printed wiring board 14 supplied to the front conveyor 40 and the rear conveyor 42 is the front surface 76. This front and back information is supplied from the system controller 130 to each of the mounting unit controllers 100 of the plurality of mounting units 10, and in each of the mounting units 10, even if the printed wiring board 14 is carried in by the front conveyor 40, Even if it is carried in by the rear conveyor 42, the surface mounting program is selected, and the electronic circuit components are mounted on the surface 76. The two production trucks are both surface production trucks, and the printed wiring board 14 having the electronic circuit components mounted on the front surface 76 is returned to the wiring board supply device 150 by the wiring board return device 160. However, in this case, the mounting of the electronic circuit components on the front surface 76 was completed as compared with the case where the mounting of the electronic circuit components on the front surface 76 was performed only by the front surface production truck constituted by the rear conveyor 42. The number of printed wiring boards 14 increases. Therefore, if necessary, the printed circuit board 14 ejected from the conveyors 40 and 42 after the electronic circuit components have been mounted on the front surface 76 is housed, and returned by the circuit board return device 160 or reversed by the front / back reverse device 164. Alternatively, a standby area or a storage area for waiting for the delivery to the supply conveyor 154 is provided, and a standby device or a storage apparatus is provided.

[0070] Then, if the wiring board supply state switching condition set in advance and the halfway of the wiring board supply state switching condition is satisfied, for example, the printed wiring board 14 supplied from the wiring board accommodating section 152 is supplied. When the number reaches the predetermined number, the front surface 76 is turned upward as shown in FIG. 7 (b), and the printed wiring board 14 on which the electronic circuit components are mounted is mounted on the rear conveyor 42 as shown in FIG. Is supplied, the back surface 78 is turned upward, and electronic circuit components are mounted on the back surface 78. The printed wiring board 14 to be supplied is switched to a state of being supplied to the front conveyor 40. During the mounting operation, the printed wiring board 14 is supplied while the front surface 76 is facing upward and the back surface 78 is facing upward. When the printed circuit board 14 on which the electronic circuit components have been mounted on the front surface 76 by all the mounting units 10 is returned, the mounting state may be switched based on that.

At this time, in the same manner as in the above-described embodiment, the circuit board supply device 150 has the electronic circuit components mounted on the front surface 76, is returned by the wiring board return device 160, and is turned upside down. The printed wiring board 14 in the upward state and the printed wiring board 14 supplied from the wiring board housing part 152 and having the surface 76 facing upward are distributed to the front conveyor 40 and the rear conveyor 42, respectively. Supply. In a state where the printed wiring board 14 is held by the supply conveyor 154, front and back information obtained by reading information recorded on the barcodes 82 and 84 causes a front controller in each of the plurality of mounting units 10. It can be seen that the printed circuit board 14 with the back surface 78 facing up was supplied to the conveyor 40, and when the electronic circuit components were mounted on the printed circuit board 14 carried in by the front conveyor 40, the back surface mounting program was executed. The electronic circuit component is mounted on the back surface 78 when selected. The front and back information is supplied to each of the plurality of mounting units 10, which is equivalent to detecting the front and back of the printed wiring board 14 in each of the mounting units 10.

If the wiring board supply state switching condition set in advance and the end-of-work wiring board supply state switching condition is satisfied, for example, all the printed wiring boards on which the electronic circuit components are to be mounted are scheduled. When the supply from the fourteen wiring board accommodating parts 152 is completed, the printed wiring board 14 is supplied to both of the two conveyors 40 and 42 with the rear surface 78 facing upward. At this point, no new printed circuit board 14 having electronic circuit components mounted on either side is newly supplied, and the printed circuit board 14 supplied by the circuit board supply device 150 is not provided on either side. Is in the upward state, and the wiring board supply device 150 supplies the printed wiring board 14 to both of the compilers 40 and 42. The printed wiring board 14 with the rear surface 78 facing upward is supplied to the rear conveyor 42, and as shown in FIG. 7 (c), the printed wiring board 14 is carried in and out by any of the conveyors 40 and 42. The printed circuit board 14 is also mounted with electronic circuit components on the back surface 78, and is used as a back surface production track. For example, recorded on barcode 84 The printed circuit board with the rear surface 78 facing upwards on the rear conveyor 42, based on the information on the front and back obtained by reading the information and the supply condition change condition at the end of the wiring board supply condition change. 14 is supplied, and the rear mounting program is selected, and the electronic circuit components are mounted. Also in the present embodiment, as in the embodiment shown in FIG. 6, the front and back sides of the printed wiring board 14 are checked.

In the electronic circuit component mounting machine of this embodiment, the backup pins of the wiring board holding device 24 provided for each of the front and rear conveyors 40 and 42 connect the print wiring board 14 to the print wiring board 14 in plan view. In this embodiment, the front surface 76 is provided so as to be supported at a common portion where the electronic circuit component is not mounted and the rear surface 78 is a portion where the electronic circuit component is not mounted. Therefore, the front conveyor 40 and the rear conveyor 42 are supplied with a difference between the printed wiring board 14 having the front surface 76 facing upward and the printed wiring board 14 having the rear surface 78 facing upward. Also, the backup pin can support the printed wiring board 14.

In the present embodiment, the supply of the printed wiring board 14 to the conveyors 40 and 42 at the beginning, middle, and end of the mounting operation is controlled by controlling the supply conveyor 154 and the like of the system controller 130. The section for switching the supply state constitutes a substrate supply control section or a substrate supply switching section.

In each of the above embodiments, the electronic circuit component mounting unit includes two wiring board conveyers provided in parallel, and mounts components on the printed wiring board 14 in two production lines. With a single production circuit board conveyer, the mounting of components on the front side of the printed wiring board and the mounting of components on the back side can be performed on a single production line. The embodiment will be described with reference to FIGS.

The electronic circuit component mounting system according to the present embodiment is configured in the same manner as the electronic circuit component mounting system according to each of the above embodiments, and the plurality of mounting units 200 arranged in series each include two wiring board conveyers 202. , Equipped with 204. On one of these conveyors 202 and 204, for example, an electronic circuit component is mounted on the printed wiring board 14 conveyed by the wiring board conveyor 202, and the wiring board conveyor 204 is used as a return conveyor, and Is composed. Therefore, the most upstream mounting unit in the wiring board transport direction A wiring board supply device 210 is provided adjacent to the slot 200 on the upstream side of the wiring board conveyor 202. The wiring board supply device 210 is configured in the same manner as the wiring board supply device 70, has a wiring board accommodation portion 212 and a supply conveyor 214, and a bar code reader 216 is provided above the supply conveyor 214.

[0077] Regarding the printed wiring board 14 transported by the wiring board conveyor 202 of the mounting unit 200 at the most downstream side in the wiring board transport direction, the printed wiring board 14 is placed on one of the front and back surfaces (the front surface 76 in the present embodiment). The printed wiring board 14 on which the electronic circuit components have been mounted is returned to the wiring board supply device 210 by the wiring board conveyor 204, and is turned upside down by the upside down device 220.

In the present electronic circuit component mounting system, the printed wiring board 14 is supplied only from the wiring board housing section 212 at the beginning of the mounting operation. The printed circuit board 14 has no electronic circuit components mounted on either side, and is supplied with the front surface 76 facing up.In the mounting unit 200, the work of mounting the electronic circuit components on the front surface 76 is performed. As a result, as shown in FIG. 9 (a), a production time slot occurs in which only the electronic circuit components are mounted on the surface 76. The printed circuit board 14 reads the information recorded in the bar code 82 or 84 by the bar code reader 216 while being held by the supply conveyor 214, and thereby, the printed circuit board 14 supplied to the circuit board conveyor 202. However, whether the front surface 76 is in the upward state or the rear surface 78 is in the upward state is detected and determined. The front and back information is supplied from the system controller 130 to the mounting unit controller 100, and in each of the plurality of mounting units 200, a mounting program is selected based on the front and back information, and the print wiring board 14 Circuit components are mounted.

The printed wiring board 14 on which the electronic circuit components are mounted on the front surface 76 by all the mounting units 200 is returned to the wiring board supply device 210 by the wiring board conveyor 204, and is turned upside down by the front and back turning device 220. The information is passed to the supply conveyor 214 with the back surface 78 facing up, the information recorded in the barcode 84 is read by the barcode reader 216, and the information is supplied from the supply conveyor 214 to the wiring board conveyor 202.

[0080] Even after the printed wiring board 14 with the back surface 78 facing upward is supplied to the wiring board conveyor 202, the supply conveyor 214 keeps the printed wiring board 14 of the wiring board accommodating portion 202 in the wiring board. Supply to Comparator 202. The supply conveyor 214 connects the printed wiring board 14 with the front surface 76 up and the printed wiring board 14 with the back surface 78 up, for example, the mounting progress of the electronic circuit components in the mounting unit 200, Depending on the number of components mounted on the front surface 76 and the rear surface 78, the state of the printed circuit board 14 being returned by the circuit board conveyor 204, the number of remaining printed circuit boards 14 in the circuit board housing 212, etc. The mounted printed wiring boards 14 are supplied to the wiring board conveyer 202 while being appropriately mixed so that the production is efficiently performed. Therefore, a plurality of printed wiring boards 14 having the same front and back sides are supplied to the wiring board conveyor 202 successively, and a plurality of the printed wiring boards 14 are supplied alternately. The wiring board 14 and the printed wiring board 14 with the back surface facing upward may be supplied to the wiring board conveyor 202 alternately:! The number of continuous printed wiring boards 14 with the same front side and back side is not fixed but can vary, and changes depending on the situation, with the printed wiring board 14 with the front side 76 up and the back side 78 up. The printed wiring board 14 in the state as described above is supplied in an arbitrary order. A board mixed supply control unit serving as a board supply control unit controls the supply conveyor 214 and the like of the system control unit 130 and supplies the two states of the printed wiring boards 14 in a mixed order to the transfer board conveyor 202 in an arbitrary order. Alternatively, it is a board arbitrary order supply control unit, and constitutes a variable number of front and back substrate supply control unit. It may be considered that these supply control units constitute the wiring board supply device 210 together with the wiring board accommodation unit 212 and the supply conveyor 214. The supply order may be set in advance. The supply order is an order in which at least one printed wiring board 14 having the same upward-facing surface is continuous even in the order in which the front and back sides are alternately supplied as described above, and the number of continuous sheets is set in advance. The order may be. In the former case, a front and back substrate alternate supply control unit is provided as a substrate setting order supply control unit which is a substrate supply control unit, and in the latter case, a front and back substrate continuous supply control unit is provided.

The bar code 84 is also read by the bar code reader 216 from the printed circuit board 14 passed from the front / back reversing device 220 to the supply conveyor 214, the front / back is detected for the upward surface, and the front / back information is stored in each of the plurality of mounting units 20. Supplied to Therefore, to each of the plurality of mounting units 200, the printed wiring board 14 with the front surface 76 facing up and the printed wiring board 14 with the back surface 78 facing up are supplied in an arbitrary order. Board competition The printed circuit board 14 carried into and out of the circuit board holding device 24 by the locker 202 can be identified as a force with the front surface 76 facing up, and whether or not the back surface 78 is facing up, and mounted based on the front / back information. The program is selected, and the electronic circuit components are mounted on the printed wiring board 14. Each wiring board conveyor 202 of the plurality of mounting units 200 constitutes a front and back production truck, and as shown in FIG. 9B, in some of the plurality of mounting units 200, mounting of electronic circuit components on the front surface 76 is performed. However, in another part, a time zone occurs in which the electronic circuit components are mounted on the back surface 78. Therefore, as in the embodiment shown in FIG. 7, the backup pins of the wiring board holding device 24 are arranged so as to support the printed wiring board 14 from the back surface 78 side and the front surface 76 side.

If the number of printed wiring boards 14 to be mounted is supplied from the wiring board accommodating section 212 to the wiring board conveyor 202 and the printed wiring board 14 on which the electronic circuit components are not mounted on any of the front and rear surfaces is no longer supplied, As shown in FIG. 9 (c), the printed wiring board 14 supplied to the wiring board conveyor 202 is only the printed wiring board 14 with the back surface 78 facing up, and eventually all of the mounting units 200 are connected to the back surface 78. There are times when only electronic circuit components are mounted. The reading of the information recorded in the barcode 82 or 84 by the barcode reader 216 is performed every time the supply conveyor 214 holds the printed wiring board 14, and based on the information on the front and back, the information is read in all the mounting units 200. The back surface mounting program is selected, and the electronic circuit components are mounted on the back surface 78. Also in the present embodiment, the front and back of the printed wiring board 14 are checked in the same manner as in the embodiment shown in FIGS.

[0083] Regardless of whether one or two production lines are provided, the wiring board return device may be provided separately from the board conveyor of the mounting unit. Further, the electronic circuit component mounting unit may be provided with one board conveyor, and the front and back production lines may be constituted by the board conveyor, and a wiring board returning device may be provided separately from the board conveyor. Further, in the case where the wiring board return device is configured by a conveyor, the return device is not limited to a configuration in which a plurality of conveyors are connected to each other, but may be a single continuous conveyor. Further, the wiring board returning device is not limited to the conveyer, and may be any device that can return the printed wiring board 14, and for example, may be provided with a board holding member and a board holding member moving device. Furthermore, to surface 76 After the printed circuit board 14 on which the electronic circuit components have been mounted is turned upside down, it may be returned by a return device.

In each of the embodiments shown in FIG. 6 to FIG. 9, the supply conveyors 154 and 214 forming the supply units of the wiring board supply devices 70, 150 and 210 are connected to the printed wiring board 14 by the wiring board accommodation unit 152. , 212 Power received from the front and back flipping device 164, 220 Power received by the printed wiring board 14 with the front surface 76 facing up \ Force with the back surface 78 facing up It is possible to obtain information. In this case, the system controller 130 controls the receiving of the printed wiring board 14 from the wiring board accommodating portions 152, 212 of the supply conveyors 154, 214, and the front and back reversing devices 164, 220 and the supply conveyors 154, 214. The part that controls the delivery of the printed wiring board 14 during the period constitutes a front and back information acquisition device, and the information recording unit and the information reading unit of the printed wiring board can be used for checking the front and back sides. .

In the embodiment shown in FIGS. 1 to 5, a bar code reader is provided near the wiring board feeding device 92, and before the printed wiring board 14 is fed to the front conveyor 40 by the wiring board feeding device 92, The information recorded in the barcode 84 provided on the back surface 78 may be read to check the front and back sides.

Further, in each of the embodiments shown in FIGS. 1 to 6, the front and back of the surface placed on the printed wiring board 14 respectively conveyed by the two wiring board conveyors 40 and 42 are determined. Even without reading the information recorded in the codes 82 and 48, since the front and back of the printed wiring board 14 on which the electronic circuit components are mounted can be known, the information recording unit, the information acquisition device, and the front / back information acquisition process can be omitted. Yeah.

[0087] Cream solder is applied to one of the front and back surfaces of the circuit board, and after the mounting of the electronic circuit components on one of the surfaces, the printed wiring board is heated in a reflow furnace, and the cream solder is applied. The electronic circuit components may be mounted on the other surface after the electrical connection is obtained by melting the components. In this case, after melting, the printed wiring board is sent to a cream solder applicator, the other side is coated with cream solder, and then supplied to the mounting unit again in that state. In this case, a circuit board having cream solder or an adhesive applied to one of the front and back surfaces and a power supply to one of the front and back surfaces are provided in the board housing portion of the circuit board supply device. The circuit board on which the sub-circuit components are mounted and the other side coated with cream solder or adhesive is stored and supplied to the mounting unit. The same applies to a case where an adhesive is applied to the front and back surfaces of the circuit board to mount electronic circuit components. Both the cream solder and the adhesive may be applied to at least one of the front and back surfaces of the circuit board, and the electronic circuit component may be mounted.

Further, in each of the above embodiments, the electronic circuit component is mounted first on the front surface of the circuit board, but the electronic circuit component may be mounted first on the back surface. In addition, when a circuit board is transported by two board conveyors and electronic circuit components are mounted on the circuit board, the difference and deviation may be set as a surface mounting conveyor or as a back mounting conveyor.

Further, when the information recording section is provided on the circuit board, the information recording section is constituted by a wireless tag capable of recording a large amount of information. In addition to information indicating whether the surface provided with the circuit board is the back surface or the front surface of the circuit board and the board ID, as well as information on mounting more circuit boards and components, etc. And so on.

Further, in each of the above embodiments, the front / back discrimination device, the front / back detection device, and the information acquisition device are provided in each of the mounting units shared by the plurality of mounting units 10 to obtain front / back information, If circuit board information is recorded in the information recording unit, the circuit board information may be obtained by reading the information.

[0091] Further, in the circuit board holding device, it is indispensable to support the circuit board from below at a portion corresponding to the component mounting area of the raised surface on which the electronic circuit component is mounted by the support member. The mounting area may be supported from below at the part where the force is off. For example, in the case of a multi-cavity circuit board in which a plurality of printed circuit boards are manufactured after being divided into a plurality of circuit boards after an electronic circuit is formed, since electronic circuit components are not mounted on a boundary portion between the plurality of printed circuit boards, such a portion is required. Is to be supported from below. According to this circuit board holding device, the printed wiring board with either the front or back face up is held by the force S.

[0092] Further, the circuit board holding device is provided with a support member, and cannot support the circuit board from the surface opposite to the surface on which the electronic circuit components are mounted, and from the surface facing downward. Not missing. For example, if the circuit board has a small size in plan view or a large thickness and there is no risk of bending when mounting electronic circuit components, support is not essential. In this case, the circuit board holding device should be a device that has a function to hold the circuit board so that the circuit board does not move when the electronic circuit components are mounted. The wiring board can also be held.

[0093] Further, the mounting unit includes at least one rotating body rotatably held on the mounting machine main body around the rotation axis, and a plurality of head holding units provided on at least one rotating body. A plurality of mounting heads, each holding a component holder, and a plurality of mounting heads are turned around a turning axis by rotating a rotating body, and components are supplied by the suction nozzles. It may include a rotating body rotating device for moving a component receiving position for receiving an electronic circuit component from the device and a component mounting position for mounting the received electronic circuit component on a circuit board. In this case, the substrate holding device moving device that moves the plate holding device in the XY direction, the rotating body rotating device, and the mounting head elevating device constitute a relative motion imparting device. In addition, the component supply device includes a holding member that holds at least one component supply device, and a holding member moving device that moves the holding member, and the component holding device of the mounting head that has been moved to the component receiving position. The component supply tool is a device that supplies components.

As described above, the forces that have described in detail some embodiments of the present invention are merely examples, and the present invention is described in the above section [Problems to be Solved by the Invention, Problem Solving Means and Effects]. The present invention can be implemented in various modified and improved forms based on the knowledge of those skilled in the art, including the above-described embodiments.

Claims

The scope of the claims

[1] An electronic device including a screen printer for printing cream solder on a circuit board, an adhesive dispenser for applying an adhesive to the circuit board, and at least one electronic circuit component mounting unit for mounting an electronic circuit component on the circuit board. A method for producing an electronic circuit by an electronic circuit production system comprising at least one of a circuit component mounting system, a melting furnace for melting the cream solder, and a curing furnace for curing the adhesive,

The electronic circuit production system is supplied with a mixture of a circuit board having a front side facing up and a circuit board having a back side facing up, and the screen printing machine, An electronic circuit production method, comprising: causing at least one of the adhesive dispenser, the electronic circuit component mounting system, the melting furnace, and the curing furnace to perform an operation according to a surface of the circuit board facing upward.

[2] The method of producing an electronic circuit,

A component supply device for supplying electronic circuit components,

A board holding device for holding a circuit board,

The electronic circuit component mounting unit is supplied with a mixture of a circuit board with the front side up and a circuit board with the back side up, and the circuit board supplied with the front side up. An electronic circuit component mounting step of mounting electronic circuit components based on the back surface mounting program for a circuit board supplied with the back side up based on the front surface mounting program. 3. The electronic circuit production method according to claim 1.

3. The electronic circuit production method according to claim 2, wherein the circuit board with the front side up and the circuit board with the back side up are supplied in an arbitrary order.

[4] Information on whether the circuit board has a front side facing up or a back side facing up. 4. The method according to claim 3, further comprising a front and back information acquisition step of acquiring information, wherein the front and back mounting program is selected and executed based on the information acquired in the front and back information acquisition step. Electronic circuit production method.

[5] The method for producing an electronic circuit,

A component supply device for supplying electronic circuit components,

A board holding device for holding a circuit board,

A circuit board with a front side facing up is supplied to one of the two board conveyers, and a circuit board with a back side facing up is supplied to the other, based on a mounting program corresponding to the front and back states of each circuit board. 2. The electronic circuit production method according to claim 1, further comprising an electronic circuit component mounting step of mounting the electronic circuit component.

[6] In the initial stage of the mounting work on one type of circuit board, a plurality of circuit boards are supplied to both of the two board conveyors in one of a state where the front surface is facing upward and a state where the back surface is facing upward. In the above, the circuit board is supplied in both a state in which the front surface is facing upward and the back surface is facing upward, and in the last stage, the plurality of circuit boards are supplied while being aligned in the other of the state in which the front surface is facing upward and the back surface is facing upward The electronic circuit production method according to claim 5, further comprising an electronic circuit component mounting step.

[7] The circuit board includes a front and back information acquisition step of acquiring information on whether the front surface is facing upward or the back surface is facing upward, and based on the information acquired in the front and back information acquisition process. Select the front mounting program for a circuit board with its front side facing up, and select the back mounting program for a circuit board with its back side facing up. 7. The method for producing an electronic circuit according to claim 5, wherein the method is performed by selecting a program.

[8] The method according to any one of claims 5 to 5, wherein the transport directions of the two substrate conveyors are the same.

Electronic circuit production method according to item 7 or item 7.

9. The electronic circuit production method according to claim 5, wherein the transport directions of the two substrate conveyors are reversed.

[10] An electronic circuit including a screen printing machine for printing cream solder on a circuit board, an adhesive dispenser for applying an adhesive to the circuit board, and at least one electronic circuit component mounting unit for mounting an electronic circuit component on the circuit board. An electronic circuit production system comprising at least one of a component mounting system, a melting furnace for melting the cream solder, and a curing furnace for curing the adhesive,

The screen printing machine, the adhesive dispenser, the electronic circuit component mounting system, at least one of the melting furnace and the curing furnace, the upward and downward direction of the circuit board based on the front and back information acquired by the front and back information acquisition device. An electronic circuit production system with front and back working parts that perform work according to the surface in the state.

[11] The electronic circuit component mounting system includes the electronic circuit component mounting system, and at least one electronic circuit component mounting unit of the electronic circuit component mounting system includes:

A component supply device for supplying electronic circuit components,

A board holding device for holding a circuit board,

A surface mounting program for mounting electronic circuit components on a circuit board held with the front side up on the substrate holding device, and electronic circuit components on a circuit board held with the back side up on the substrate holding device. Both the back mounting program for mounting A program storage unit for storing and storing

11. The electronic circuit production system according to claim 10, comprising:

12. The electronic circuit production system according to claim 11, further comprising a front / back discrimination device for discriminating between a front surface and a back surface of the circuit board.

[13] A claim that includes one board conveyor for loading and unloading a circuit board, and a board supply device capable of supplying the circuit board to the board con- troller in both a state where the front side is facing up and a state where the back side is facing up. 13. The electronic circuit production system according to paragraph 11 or 12.

[14] Two board conveyors arranged in parallel with each other to carry in and out circuit boards

A substrate supply device for supplying a circuit board to one of the two substrate conveyors with the front side up, and supplying the circuit board to the other with the back side up. Electronic circuit production system as described.

15. The electronic circuit production system according to claim 14, wherein the two board conveyors convey circuit boards in the same direction.

16. The electronic circuit production system according to claim 14, wherein the two board conveyors convey circuit boards in directions opposite to each other.

[17] The circuit board discharged from the downstream side in one transport direction of the two board conveyors is sent to the other board conveyor from the upstream side in the circuit board transport direction of the circuit board, and the circuit board is discharged. 17. The electronic circuit production system according to claim 16, further comprising a transport direction reversing device for reversing the transport direction.

18. The electronic circuit production according to claim 13, further comprising a circuit board return device for returning a circuit board discharged from the board conveyor to an upstream end of the board conveyor in a transport direction. system.

[19] A front / back inverting device for inverting a circuit board on which an electronic circuit component has been mounted on one of the front surface and the back surface on at least one of an upstream side and a downstream side in the board conveying direction from the board conveyor. Electronic circuit production according to any one of claims 11 and 18, wherein 20. The electronic circuit production system according to claim 11, further comprising an electronic circuit component mounting system in which a plurality of said electronic circuit component mounting units are arranged in series. Stem.