JP2003163499A - Mounting method for chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for mounting a chip wherein running efficiency of a production line is improved. <P>SOLUTION: Two mounter devices 12A and 12B are placed between a printing machine 10 and a reflow furnace 11. When chips 2 over the processing power of the single mounter device are mounted on a board 1, the board 1 after printing is serially carried from the mounter device 12A of the former step in the mounter device 12B of the later step. When the chips 2 within the processing power is mounted, the board 1 after printing is carried in parallel in both mounter devices 12A and 12B. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounting method for mounting a chip component on a land of a wiring pattern provided on a substrate by reflow soldering, and more particularly to a plurality of printers for one printing machine. The present invention relates to a mounting method of chip parts using a mounter device for a table.

[0002]

2. Description of the Related Art FIG. 5 is a plan view of an electronic circuit unit used as, for example, a high frequency device, and FIG. 6 is a sectional view of the electronic circuit unit. The electronic circuit unit is made of an insulating material such as glass epoxy resin. A substrate 1 and a large number of chip components 2 including chip capacitors, chip resistors and the like mounted on the substrate 1 are provided. A wiring pattern 3 made of copper foil or the like is provided on the substrate 1, and a large number of pairs of lands 3a are formed on the wiring pattern 3. Cream solder 4 is placed on these lands 3a.
After the electrode portions 2a provided on both ends of the chip component 2 are mounted on the paired lands 3a, the cream solder 4 is melted in a reflow furnace, so that each chip component 2 is placed on the substrate 1. It is designed to be mounted at a predetermined position.

FIG. 7 is a conventional example showing a manufacturing process of such an electronic circuit unit. As shown in the figure, first, after the substrate 1 is supplied to the printing machine 5, a mask (not shown) is placed on the substrate 1 in the printing machine 5 and the cream solder 4 is squeezed. Is printed on each land 3a through a mask. Next, the substrate 1 discharged from the printing machine 5 is carried into the mounter device 7 by the conveyor 6,
In this mounter device 7, the chip components 2 are vacuum-sucked and automatically mounted at predetermined positions on the substrate 1, so that both electrode portions 2a of each chip component 2 are mounted on the corresponding lands 3a via the cream solder 4. To do. Finally,
The substrate 1 discharged from the mounter device 7 is carried into the reflow furnace 9 by the conveyor 8, and each land 3 is transferred in the reflow furnace 9.
When the cream solder 4 on a is melted and solidified, as shown in FIGS. 5 and 6, an electronic circuit unit in which the corresponding chip component 2 is soldered on each land 3a of the substrate 1 is obtained.

In the manufacturing line of such an electronic circuit unit, various chip parts 2 such as chip resistors having different resistance values and chip capacitors having different capacities are mounted on the substrate 1 according to the circuit configuration, and the mounter device 7 is mounted. Is a chip component 2 from a plurality of parts feeders etc. sorted by type.
Is mounted on the substrate 1 by vacuum suction, but the processing capacity of the chip component 2 that can be mounted using one mounter device 7 is limited, but for example, one mounter device 7 There are cases where 120 chip components 2 must be mounted on the substrate 1 even though 70 chip components 2 can be mounted by using.

FIG. 8 shows a conventional example for realizing such a request. As shown in FIG. 8, two mounter devices 7A,
7B is arranged in series between the printing machine 5 and the reflow oven 9. In such a production line, after printing the cream solder 4 on each land 3a of the substrate 1 with the printing machine 5,
The substrate 1 discharged from the printing machine 5 is carried by the conveyor 6 into the mounter device 7A at the preceding stage. Then, after mounting, for example, 60 chip components 2 on the substrate 1 by the mounter device 7A in the preceding stage, the substrate 1 is carried into the mounter device 7B in the subsequent stage by the conveyor 8A, and the remaining 60 by the mounter device 7B in the subsequent stage.
The individual chip components 2 are mounted on the substrate 1. Finally, the substrate 1 discharged from the mounter device 7B in the subsequent stage is carried into the reflow oven 9 by the conveyor 8B, and the cream solder 4 on each land 3a is melted and solidified in the reflow oven 9 to obtain 120 An electronic circuit unit in which the individual chip components 2 are mounted can be obtained.

[0006]

According to the above-mentioned prior art, since the two mounter devices 7A and 7B are arranged in series between the printing machine 5 and the reflow furnace 9, one mounter device is installed. When the processing capacity (the number of mountable chip parts 2) is, for example, 70, a product (electronic circuit unit) in which a maximum of 140 chip parts 2 are mounted by using the two mounter devices 7A and 7B is provided. It can be manufactured. However, the chip component 2 mounted on the substrate 1
The quantity of must be changed according to the circuit configuration of the product,
In some cases, a single mounter device is used to manufacture a product in which a sufficient number of chip components 2, for example, 60 chip components 2, can be mounted. In such a case, after mounting all the chip components 2 on the substrate 1 using only the mounter device 7A in the previous stage, the substrate 1 may be carried into the reflow furnace 9 through the mounter device 7B in the subsequent stage. However, since the mounter device 7B in the subsequent stage is not substantially operated, there is a problem that the operation efficiency of the entire manufacturing line is significantly reduced.

The present invention has been made in view of the actual situation of the prior art as described above, and an object thereof is to provide a mounting method of a chip component capable of improving operating efficiency.

[0008]

In order to achieve the above object, in the method of mounting a chip component according to the present invention, a step of printing cream solder on a land of a board using one printing machine, and this printing Selectively loading the substrate discharged from the machine into either the first or second mounter device, and mounting the chip component on the land of the substrate using the first mounter device, A step of selectively loading the substrate discharged from the first mounter device into either the second mounter device or the reflow furnace;
A step of mounting a chip component on a land of a substrate using the second mounter device, a step of loading the substrate discharged from the second mounter device into the reflow oven, and a cream using the reflow oven. And a step of melting the solder.

According to this structure, when a chip component having a processing capacity higher than that of one mounter device is mounted on the substrate, the printed substrate is serially connected from the first mounter device to the second mounter device. After carrying in and mounting a part of the chip parts required on the substrate by the first mounter device, the remaining chip parts may be mounted by the second mounter device and then carried into the reflow furnace. On the other hand, when mounting a chip component within the processing capacity of one mounter device on the substrate, the printed substrate is loaded in parallel to the first mounter device and the second mounter device, and then the first mounter device is mounted. After mounting all the chip parts required for the board in the device and also mounting all the chip parts required for the board in the second mounter device, the chips are ejected from the first and second mounter devices. Each of the substrates may be loaded into the reflow furnace. Therefore, in any case, it is possible to effectively operate both the first and second mounter devices to mount the chip component, and in particular, it is possible to remarkably improve the operation efficiency in multi-type production. Further, when the printed board is carried in parallel to the first mounter device and the second mounter device, either one of the first mounter device and the second mounter device is stopped due to machine trouble or maintenance. Even so, the rest of the mounter device can be operated as it is,
From this point as well, the operation efficiency can be improved.

In the above structure, the first bypass conveyor for carrying the substrate discharged from the printing machine into the second mounter device and the second bypass conveyor for carrying the substrate discharged from the first mounter device into the reflow furnace. It is preferable to provide a bypass conveyor. In this case, the first bypass conveyors may be arranged side by side on the first mounter device, but if the two are vertically overlapped, it is preferable because the arrangement space for the first bypass conveyors can be reduced. Similarly, the second bypass conveyors may be arranged side by side on the second mounter device, but if the two are vertically overlapped, it is preferable because the space for disposing the second bypass conveyor can be reduced.

Further, in the above structure, when the substrate is provided with a marking capable of identifying that the chip component is mounted by either the first or the second mounter device, the printed substrate is the first mounter device. And the second mounter device in parallel, by visually observing the markings of the substrates discharged as the same lot from the reflow furnace, which mounter device was used to mount the chip component on this substrate? Can be confirmed. As a result, for example, if a mounting failure is found in the product, the mounter device that causes it can be identified, so by stopping and repairing the mounter device, it is possible to stop the rest of the mounter device. It can be operated.
Alternatively, when mounting different types of chip parts for each mounter device on the board discharged from the printing machine, after multiple kinds of products are discharged from the reflow oven as the same lot, the markings can be visually checked for each product. Can be easily classified.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a layout diagram showing a manufacturing line of an electronic circuit unit according to the embodiment, and FIG.
Is an explanatory view showing a first usage method of the manufacturing line, FIG. 3 is an explanatory view showing a second usage method of the manufacturing line, and FIG. 4 is a chip component mounting method according to the first and second usage methods. It is a flowchart shown.

As shown in FIG. 1, in the electronic circuit unit manufacturing line according to this embodiment, two mounter devices 12 are provided between one printing machine 10 and one reflow furnace 11.
A and 12B are arranged, and an electronic circuit unit as shown in FIGS. 5 and 6 is manufactured by using the printing machine 10, the mounter devices 12A and 12B, and the reflow furnace 11. Two mounter devices 12A and 12B
Among them, the first mounter device 12A in the front stage is connected to the printing press 10 via the first switching stage 13, and the second mounter device 12B in the rear stage is connected to the mounter device 12A via the second switching stage 14. It is connected. The first switching stage 13 is connected to the second switching stage 14 via the carry-in conveyor 15A, the first mounter device 12A, and the carry-out conveyor 16A, and is arranged in the space below the first mounter device 12A. It is also connected to the second switching stage 14 via the first bypass conveyor 17. Further, the second switching stage 14 is connected to the discharge stage 19 via the carry-in conveyor 15B, the second mounter device 12B and the carry-out conveyor 16B, and
A discharge stage 19 is provided via a second bypass conveyor 18 arranged in a space below the second mounter device 12B.
The discharge stage 19 is also connected to the reflow furnace 11.

The printer 10 prints the cream solder 4 on each land 3a of the wiring pattern 3 provided on the substrate 1. The printer 10 prints the cream solder 4 on one substrate 1.
The processing time required for printing is, for example, 20 to 30 seconds. The substrate 1 after printing is discharged from the printing machine 10 onto the first switching stage 13, and after temporarily waiting on the first switching stage 13, in the case of a second usage described later, a carry-in conveyor. The first mounter device 12 through 15A
It is carried in to A one by one. On the other hand, in the case of the first usage described later, the substrate 1 on the first switching stage 13 is selectively discharged to the carry-in conveyor 15A and the first bypass conveyor 17, and the substrate 1 discharged to the carry-in conveyor 15A. The substrate 1 that has been directly loaded into the first mounter device 12A and discharged to the first bypass conveyor 17 passes through the lower space of the first mounter device 12A and temporarily stands by on the second switching stage 14. Then, it is carried into the second mounter device 12B from the second switching stage 14 via the carry-in conveyor 15B. In this case, the first and second mounter devices 12A and 12B output the request signals SA and SB respectively when they enter the standby state, and the first switching stage 13 receives the substrate 1 when the request signal SA is received. And when the request signal SB is received, the substrate 1 is discharged to the first bypass conveyor 17.

First and second mounter devices 12A, 1
2B is for automatically mounting by mounting a large number of chip components 2 on each land 3a of the loaded substrate 1 by one mounter device 12A, 12B.
The processing time required to mount the chip component 2 on the chip is, for example, 2 to 3 minutes, and one mounter device 12 is used.
The maximum number of chip components 2 in which A and 12B can be mounted on one substrate 1 is, for example, 70.

The substrate 1 on which the chip component 2 is mounted by using the first mounter device 12A is the unloading conveyor 16A.
After being discharged, it is discharged to the second switching stage 14 and temporarily stands by on the second switching stage 14. Then, in the case of the second usage described later, the second switching stage 14
The upper substrate 1 is sequentially carried into the second mounter device 12B via the carry-in conveyor 15B.
After the chip component 2 is mounted by 2B, it is carried into the reflow furnace 11 from the carry-out conveyor 16B through the discharge stage 19. On the other hand, in the case of the first usage described later, the second
The substrate 1 on the switching stage 14 is selectively discharged to the carry-in conveyor 15B and the second bypass conveyor 18, and the substrate 1 discharged to the carry-in conveyor 15B is directly carried to the second mounter device 12B. After the chip component 2 is mounted by the mounter device 12B of No. 2, the reflow furnace 11 is passed from the carry-out conveyor 16B through the discharge stage 19.
Be delivered to. On the other hand, the substrate 1 discharged from the second switching stage 14 to the second bypass conveyor 18 is
It is carried into the discharge stage 19 through the lower space of the second mounter device 12B, and is carried into the reflow furnace 11 through the discharge stage 19.

Further, only in the case of the first usage described later, the substrate 1 discharged from the first mounter device 12A is provided with an identifiable marking, and the marking is applied to the substrate 1, for example, a red felt pen. The marking is made using a coloring tool such as. In this case, the substrate 1 discharged from the second mounter device 12B is not marked, but the substrate 1 having no mark and the marked substrate 1 allow the chips on the substrate 1 to be removed. The component 2 is the first and second mounter devices 12A, 1
It can be identified which of 2B was used to mount. In addition, in the present embodiment, such marking is applied to the substrate 1 immediately after being discharged from the first mounter device 12A, but to the substrate 1 immediately before being loaded into the first mounter device 12A. Alternatively, the mounted substrate 1 may be marked using the second mounter device 12B instead of the first mounter device 12A, or the first and second mounters 12A and 12B may be used. It is also possible to mark the both substrates 1 mounted by using the mounter devices 12A and 12B with different colors.

The reflow furnace 11 melts the cream solder 4 carried on the substrate 1 and solders both electrode portions 2a of the chip component 2 onto the corresponding lands 3a. One reflow furnace 11 is provided. The processing time required to melt the cream solder 4 on the substrate 1 is, for example, 20 to 30 seconds.

Next, a method of mounting the chip component 2 on the above manufacturing line will be described with reference to FIGS.

In this embodiment, as a preparatory step before operating the manufacturing line, as shown in step S-1 of FIG. 4, a first use method and a first use method are performed by a changeover switch (not shown). Choose one of the methods.
Here, the first use method is a method of mounting the chip component 2 within the processing capacity of one mounter device 12A or 12B on the substrate 1, and in this case, the transfer direction of the substrate 1 is as shown in FIG. It is shown by solid and dashed arrows. On the other hand, the second usage method is a method of mounting the chip parts 2 on the substrate 1 in an amount exceeding the processing capacity of one mounter device 12A or 12B. In this case, the substrate 1 is conveyed in the direction shown in FIG. Is indicated by a solid arrow.

First, the first method of use will be described with reference to FIGS. 2 and 4. When the first method of use is selected in step S-1 of FIG. 4, a loader or the like (not shown) is used. After supplying the substrate 1 to the printing machine 10, as shown in step S-2, a mask (not shown) is placed on the substrate 1 and the cream solder 4 is squeezed by the printing machine 10 by
The cream solder 4 is printed on each land 3a through a mask. Next, after the substrate 1 discharged from the printing machine 10 is temporarily made to stand by on the first switching stage 13, as shown in step S-3, the first and the first switching stages 13 are operated. It waits for request signals SA and SB from the second mounter devices 12A and 12B.

When the request signal SA is received in step S-3, the substrate 1 on the first switching stage 13 is conveyed to the reflow furnace 11 along the arrow shown by the solid line in FIG. That is, when the request signal SA is output from the first mounter device 12A, the substrate 1 on the first switching stage 13 is transferred from the carry-in conveyor 15A to the first mounter device 12A.
As shown in step S-4, the first mounter device 12A sequentially vacuum-sucks and automatically mounts all the chip components 2 required for the substrate 1 to mount each chip component 2 as shown in step S-4. Both electrode portions 2a are mounted on the corresponding lands 3a via the cream solder 4. When all the chip components 2 are mounted on the substrate 1 by the first mounter device 12A, as shown in step S-5, the substrate 1 discharged from the first mounter device 12A to the carry-out conveyor 16B is removed. Marking is performed, and after this marking, the substrate 1 is conveyed onto the discharge stage 19 via the second bypass conveyor 18. After that, the substrate 1 is carried into the reflow furnace 11 from the discharge stage 19, and as shown in step S-6, the cream solder 4 on each land 3a is melted and solidified while the substrate 1 passes through the reflow furnace 11. By doing so, each chip component 2 is reflow-soldered on the land 3a of the substrate 1.

On the other hand, in step S-3, the request signal S
Upon receiving B, the substrate 1 on the first switching stage 13 is transported to the reflow furnace 11 along the arrow indicated by the broken line in FIG. That is, when the request signal SB is output from the second mounter device 12B, the substrate 1 on the first switching stage 13 is conveyed to the second switching stage 14 via the first bypass conveyor 17, and then this It is carried into the second mounter device 12B from the second switching stage 14 via the carry-in conveyor 15B. Then, as shown in step S-7, all the chip components 2 required for the substrate 1 are sequentially vacuum sucked and automatically mounted by the second mounter device 12B, and both electrode parts of each chip component 2 are mounted. 2a is mounted on the corresponding land 3a via the cream solder 4. When all the chip components 2 are mounted on the substrate 1 by the second mounter device 12B, the substrate 1 is conveyed from the second mounter device 12B to the discharge stage 19 via the carry-out conveyor 16B. After that, the substrate 1 is carried into the reflow furnace 11 from the discharge stage 19, and step S-6 is performed.
As shown in FIG. 3, each chip component 2 is reflow-soldered on the land 3 a of the board 1 by melting and solidifying the cream solder 4 on each land 3 a while the board 1 passes through the reflow furnace 11.

After the reflow soldering in step S-6, the substrate 1 is discharged from the reflow furnace 11 by using an unloader (not shown) or the like to obtain an electronic circuit unit as shown in FIGS. At that time, the substrate 1 on which the chip component 2 is mounted by using the first mounter device 12A
Since the products (electronic circuit units) are sequentially discharged from the reflow furnace 11 as the same lot, the chip parts 2 of each product can be attached to any of the mounter devices 12A, 12B, You can check if it is mounted using. As a result, for example, if a mounting failure is found in the product, the mounter device that causes it can be identified, so by stopping and repairing the mounter device, it is possible to stop the rest of the mounter device. It can be operated. Alternatively, for the substrate 1 ejected from the printing machine 10, the first
Also, when dissimilar chip parts 2 are mounted on each of the second mounter devices 12A and 12B, after the two kinds of products are discharged from the reflow furnace 11 as the same lot, the markings can be visually checked to classify the products. It can be done easily.

The processing time required for the printing machine 10 to print the cream solder 4 on each land 3a of one substrate 1 is 20 to 30 seconds, and each mounter device 12A, 12B has one substrate 1 Since the processing time required to mount the chip components 2 on the substrate is 2 to 3 minutes, for example, while the first mounter device 12A mounts all the chip components 2 on the substrate 1, The cream solder 4 can be printed on at least three or more substrates 1. As a result, one or more substrates 1 are placed on the first switching stage 13.
The substrate 1 can be immediately loaded into the first and second mounter devices 12A and 12B that output the request signals SA and SB. Similarly, reflow furnace 1
It takes 20 to 30 seconds to perform reflow soldering for one substrate 1 on one substrate 1, and each mounter device 12A, 1
Since the processing time required for 2B to mount the chip component 2 on one substrate 1 is 2 to 3 minutes, the first and the second
The substrates 1 sequentially discharged from the mounter devices 12A and 12B can be supplied to the reflow furnace 11 without waiting time.

Next, the second method of use will be described with reference to FIGS. 3 and 4. When the second method of use is selected in step S-1 of FIG. 4, a loader or the like (not shown) is used. After supplying the substrate 1 to the printing machine 10 by using the printing machine 10, a mask (not shown) is placed on the substrate 1 and the cream solder 4 is squeezed by the printing machine 10 as shown in step S-8.
The cream solder 4 is printed on each land 3a through a mask. Next, the substrate 1 ejected from the printing machine 10 is temporarily placed on the first switching stage 13 and then waits for the request signal SA from the first mounter device 12A, and then the first mounter device 12A. When the request signal SA is received, the substrate on the first switching stage 13 is transported to the reflow furnace 11 along the arrow shown by the solid line in FIG.

That is, the substrate 1 on the first switching stage 13 is transferred from the carry-in conveyor 15A to the first mounter device 12
Are sequentially loaded into A, and as shown in step S-9, the first
With the mounter device 12A, approximately half of the chip components 2 required for the substrate 1, for example, 60 chip components 2 are sequentially vacuum-adsorbed and automatically mounted, and both electrode portions 2a of these chip components 2 are soldered with cream. It mounts on the corresponding land 3a through 4. When about half of the chip components 2 are mounted on the board 1 in step S-9, the board 1 is removed from the first mounter device 12A.
6A, second switching stage 14 and carry-in conveyor 15
After passing through B, it is carried into the second mounter device 12B. Then, as shown in step S-10, the second mounter device 12B sequentially vacuum-adsorbs the remaining chip components 2, for example, 60 chip components 2, onto the substrate 1, and automatically mounts them. Both electrode portions 2a are mounted on the corresponding lands 3a via the cream solder 4. When all the required chip components 2 are mounted on the substrate 1 in this manner, the substrate 1 is discharged from the second mounter device 12B through the carry-out conveyor 16B.
9 is conveyed. After that, the substrate 1 is discharged to the stage 1
9 to the reflow furnace 11, and as shown in step S-6, the cream solder 4 on each land 3a is melted and solidified while the substrate 1 passes through the reflow furnace 11, so that each chip component 2 Is reflow-soldered on the land 3a of the substrate 1.

According to the above embodiment, when the chip component 2 within the processing capability of the first mounter device 12A or the second mounter device 12B is mounted on the substrate 1,
The substrate 1 after printing by selecting the first usage method is loaded in parallel to the first mounter device 12A and the second mounter device 12B, and all the substrates 1 required by the first mounter device 12A are loaded. After mounting all the chip components 2 required for the substrate 1 in the second mounter device 12B as well as mounting the chip components 2 of the above, the substrates discharged from the first and second mounter devices 12A and 12B. Each of these may be carried into the reflow furnace 11. On the other hand, one first mounter device 12A or one second mounter device 12
When the chip component 2 having a processing capacity of B or higher is mounted on the substrate 1, the second usage method is selected to print the printed substrate 1 from the first mounter device 12A to the second mounter device 12B.
Are serially loaded into the first mounter device 12A and the substrate 1
After mounting a part of the chip component 2 required for
The remaining chip component 2 may be mounted by the second mounter device 12B and then loaded into the reflow furnace 11. Therefore, regardless of which of the first and second usage methods is performed, the two mounter devices 12A and 12B can be effectively operated without stopping and the chip component 2 can be mounted. It is possible to significantly improve the operation efficiency in the type production. Further, when the first usage method is executed, even if either one of the first and second mounter devices 12A and 12B is stopped due to a machine trouble, maintenance, or the like, the remaining mounter devices are operated as they are. Therefore, the operating efficiency can be improved also from this point.

Further, the first bypass conveyor 17 used when the first usage method is executed is arranged in the space below the first mounter device 12A, and the second bypass conveyor 18 is also the second mounter device 12B. Since it is arranged in the lower space of the above, the arrangement space of these first and second bypass conveyors 17 and 18 can be reduced. In this case, the first bypass conveyor 17 is arranged in the upper space of the first mounter device 12A,
The second bypass conveyor 18 is connected to the second mounter device 12
The same effect can be obtained by disposing it in the upper space of B.

Furthermore, the chip component 2 is a double mounter device 1.
Since the substrate 1 is provided with a marking that can be identified as being mounted by either 2A or 12B, when the first usage method is performed, that is, the printed substrate 1 is used as the first mounter device and the second mounter device. When the substrates 1 are loaded into the mounter device in parallel, the markings of the substrates 1 discharged from the reflow furnace 11 in the same lot can be visually observed.
Any of the mounter devices 12A and 12
You can use B to check if it is mounted. as a result,
For example, if a mounting defect is found in a product (electronic circuit unit), the mounter device that causes the mount defect can be identified. Therefore, by stopping and mounting the mounter device, the rest of the mounter devices are stopped. Can be operated without Alternatively, each mounter device 12A, 12B may be attached to the substrate 1 ejected from the printing machine 10.
When different kinds of chip parts 2 are mounted for each, after the plural kinds of products are discharged from the reflow furnace 11 as the same lot, the markings can be visually checked to easily classify the products.

In the above embodiment, the case where two mounter devices 12A and 12B are arranged between one printing machine 10 and one reflow oven 11 has been described.
If the printing machine 10 and the reflow oven 11 have sufficient processing capacity, it is possible to arrange one or more mounter apparatuses similar to the above between the second mounter apparatus 12B and the reflow oven 11.

[0032]

The present invention is carried out in the form as described above, and has the following effects.

In a production line in which a plurality of mounter devices are arranged between one printing machine and one reflow oven,
When mounting a chip component with a processing capacity of one mounter device or more on a substrate, the printed substrate is transferred from the first mounter device to the second mounter device in series, and the first mounter device is used. After mounting a part of the chip components required on the substrate, the remaining mount of the chip components may be mounted by the second mounter device and then carried into the reflow furnace. On the other hand, when mounting a chip component within the processing capacity of one mounter device on the substrate, the printed substrate is loaded in parallel to the first mounter device and the second mounter device, and then the first mounter device is mounted. After mounting all the chip parts required for the board in the device and also mounting all the chip parts required for the board in the second mounter device, the chips are ejected from the first and second mounter devices. Each of the substrates may be loaded into the reflow furnace. Therefore, in any case, it is possible to effectively operate both the first and second mounter devices to mount the chip component, and in particular, it is possible to remarkably improve the operation efficiency in multi-type production. Further, when the printed board is carried in parallel to the first mounter device and the second mounter device, either one of the first mounter device and the second mounter device is stopped due to machine trouble or maintenance. Even so, since the remaining mounter device can be operated as it is, the operating efficiency can be improved also from this point.

[Brief description of drawings]

FIG. 1 is a layout diagram illustrating a manufacturing line of an electronic circuit unit according to an exemplary embodiment.

FIG. 2 is an explanatory diagram showing a first method of using the manufacturing line.

FIG. 3 is an explanatory diagram showing a second method of using the manufacturing line.

FIG. 4 is a flowchart showing a chip component mounting method according to first and second usage methods.

FIG. 5 is a plan view of an electronic circuit unit.

FIG. 6 is a cross-sectional view of the electronic circuit unit.

FIG. 7 is a layout diagram showing a manufacturing line of an electronic circuit unit according to a conventional example.

FIG. 8 is a layout diagram showing a manufacturing line of an electronic circuit unit according to a conventional example using two mounter devices.

[Explanation of symbols]

1 substrate 2 chip parts 2a Electrode part 3 wiring patterns 3a land 4 cream solder 10 printing machines 11 reflow furnace 12A First mounter device 12B Second mounter device 13 First switching stage 14 Second switching stage 15A, 15B carry-in conveyor 16A, 16B carry-out conveyor 17 First bypass conveyor 18 Second bypass conveyor 19 Discharge stage

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yasuhiro Ujiie             69 Takarada Ishigami, Soma City, Fukushima Prefecture Ali Co., Ltd.             Inside F term (reference) 5E313 AA02 AA11 DD02 DD03 DD12                       DD14 DD50 EE50 FG01 FG02                       FG05 FG06                 5E319 AA03 AB05 AC01 BB05 CC33                       CD29 CD35 GG15

Claims (5)

[Claims] 1. A step of printing cream solder on a land of a board using one printing machine, and a board discharged from this printing machine is selectively used for either the first or second mounter device. The step of loading the chip component onto the land of the substrate by using the first mounter device, and the substrate discharged from the first mounter device in the second mounter device or the reflow furnace. A step of selectively loading into either one, a step of mounting a chip component on a land of a substrate by using the second mounter device, and a substrate discharged from the second mounter device into the reflow furnace. A mounting method for a chip component, comprising: a step of carrying in and a step of melting the cream solder using the reflow furnace. 2. The first bypass conveyor for carrying a substrate discharged from the printing machine into the second mounter device, and the substrate discharged from the first mounter device according to claim 1. A chip component mounting method, comprising: a second bypass conveyor that is carried into a reflow furnace. 3. The chip component mounting method according to claim 2, wherein the first bypass conveyor and the first mounter device are vertically overlapped with each other. 4. The chip component mounting method according to claim 2, wherein the second bypass conveyor and the second mounter device are vertically overlapped with each other. 5. The method according to claim 1, further comprising the step of providing a marking on the substrate that can identify that the chip component is mounted by either the first or second mounter device. Chip component mounting method.