JP2001326431A - Multiple pattern printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multiple pattern PCB that can easily identify where a small PCB after division has been arranged before the division, and can reduce labor required for the pickup of articles that has been soldered improperly. SOLUTION: In this multiple pattern printed circuit board, small printed circuit boards 1 to 6 having the same wiring pattern on a printed circuit board are formed via a division line, and electronic components are mounted onto each small printed circuit board and are separated by the division line for manufacturing each small printed circuit board. The division line is composed of a long hole 13 and connection parts 10 to 12, and an identification means for identifying the small printed circuit boards 1 to 6 is provided at the connection parts 10 to 12 remaining on the small printed circuit boards 1 to 6 after the separation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called multi-panel printed circuit board in which a plurality of small printed boards are formed on a printed circuit board, and each of the small printed boards is cut off after mounting electronic components.

[0002]

2. Description of the Related Art Usually, a printed circuit board (hereinafter, referred to as "PCB") is used.
) Is often designed in consideration of the mounting space and work size of the device to be mounted and the component mounting process.

In other words, in order to reduce the cost, a multi-panel method is adopted in which the areas of several types of work sizes are compared with the areas of the substrates, and the number of substrates having the same wiring pattern is efficiently taken into consideration. The multiple patterning method is to form a plurality of small PCBs having the same wiring pattern on one large printed circuit board through dividing lines, mount electronic components, and then remove the small PCB on which the wiring pattern is formed. This is a method of manufacturing each small printed circuit board by separating at a dividing line.

FIG. 3 shows an example of a conventional multi-panel printed circuit board.

[0005] In FIG. 3, a small P requiring 21 to 26 is required.
CB, all of which are printed with the same wiring pattern on which surface mount components are mounted. 27 and 28 are discarded portions, 29 is a connecting portion (so-called perforation) holding each small PCB, 30 is a long hole, and a dividing line is formed by the connecting portion and the long hole. After mounting electronic components,
Separate along the dividing line, separate and make each small PC
B21 to B26 are manufactured, and each small PCB is mounted on each device.

[0006] Since the mounting of the electronic component is a surface mounting component, the surface mounting component is soldered in a reflow soldering process. Soldering by reflow is performed according to the following steps. First, a metal plate with a hole at the soldering position called a metal mask is placed on the PCB,
The cream solder is placed at a predetermined position with a hole. Next, after temporarily placing the electronic component on the PCB on which the cream solder is disposed, the electronic component is heated in a reflow furnace to melt the cream solder, and the electronic component is soldered and mounted on the PCB.

[0007]

However, in the above-mentioned conventional example, when a part of the metal mask is damaged, poor soldering occurs, and for example, there is an inconvenience that it is not soldered to a part of the small PCB 22 in FIG. Good products may be produced.

There is no problem if a defective soldering portion can be found before dividing the small PCB. However, if it is found that the metal mask is damaged at a position corresponding to the position of the small PCB 22 after the division, the separation is performed. Multiple small PCs
It is difficult to identify the corresponding small PCB from B.

That is, as shown in FIG.
2 are connected to the other small PCBs 21 and 2
3, the small PCBs 22, 23, and 24 all have the same shape. Therefore, it is difficult to distinguish from the appearance of the small PCB where it was located before the division. Therefore, a great deal of labor is required for picking up defective products at the production site. As a countermeasure, there is a means for printing and discriminating the numbers 21 to 26 on each small PCB with silk, but it is still necessary to check the numbers, which is labor intensive.

[0010] The problem to be solved by the present invention is that it is possible to easily identify where the small PCB after the division was placed before the division, and to reduce the labor required for picking up defective soldering products. To provide a PCB.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and a plurality of small printed boards provided with the same wiring pattern on a printed board of the present invention are formed through dividing lines. After mounting the electronic components on each small printed circuit board, separate them by dividing lines to form each of the small printed circuit boards. The connection portion remaining on the small printed circuit board is provided with identification means for identifying each small printed circuit board, and the identification means is means for changing the position of the connection portion. It is assumed that.

[0012] For example, by changing the position of the connection portion depending on the location of the small PCB, it is possible to provide a multi-panel printed board that can be easily visually identified even after the multi-panel board including the defective board is cracked.

[0013]

1 and 2 show an embodiment of a multi-panel printed circuit board according to the present invention.

In FIG. 1, 1 to 6 are small PCBs,
Is the discarded part. Reference numerals 9 to 12 denote perforations as connection parts, which together with the long holes 13 constitute a dividing line. As can be seen from FIG. 1, the positions of perforations 9 to 12 are different from those of the conventional example. In FIG. 1, it is assumed that a soldering defect exists on the substrate 2. After that, cutting is performed along the perforations, and each small PCB is divided as shown in FIG.

In FIG. 2, 10a and 10b are perforations 1.
Reference numerals 0, 11a, and 11b denote remaining portions of the perforations 11.
In the defective board 2, the remaining cutting parts 11b, 1
1a, and the substrate 1 has a cutting residue 11 in the center of the right side.
a, there is a remaining cutting portion 12 at the upper left side, and the substrate 3 has a remaining cutting portion 10a at the center of the left side and a remaining cutting portion 9 at the upper left side.

As can be seen from FIG. 2, the small PCB can be visually identified based on the position of the remaining cut portion of each small PCB, thereby facilitating extraction of a defective board.

In the above embodiment, each small PCB is identified by means for changing the position of the connection part (perforation). However, the identification means is not limited to this. The number of perforations may be changed depending on the position. That is, for example, the identification may be performed such that the perforation is 1 at a certain connection point and the perforation is 2 at another connection point.

[0018]

As described above, by providing a means for identifying each small PCB at the perforation of the multi-panel board, the positional relationship between the small PCBs can be specified, and when a soldering failure occurs during mounting. It facilitates the extraction of defective substrates.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an embodiment of the present invention, and is a plan view of a multi-surface printed circuit board.

FIG. 2 is a diagram illustrating an embodiment of the present invention, and is a plan view of a small printed circuit board after division.

FIG. 3 is a plan view of a conventional multiple printed circuit board.

FIG. 4 is a plan view of a small printed circuit board obtained by dividing a conventional multiple printed circuit board.

[Explanation of symbols]

 Reference Signs List 1 small printed board 2 small printed board 3 small printed board 4 small printed board 5 small printed board 6 small printed board 7 discarded material 8 discarded material 9 perforation 10 perforation 11 perforation 12 perforation 13 long hole

Claims (2)

[Claims] 1. A plurality of small printed circuit boards provided with the same wiring pattern on a printed circuit board are formed through dividing lines,
After mounting the electronic components on each small printed circuit board, separate them with dividing lines to manufacture each small printed circuit board. A multiple printed circuit board, wherein an identification means for identifying each small printed circuit board is provided at a connection portion remaining on the board. 2. The printed circuit board according to claim 1, wherein said identification means is means for changing a position of a connection part.