JP2002361830A - Mounting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting system which has an excellent production efficiency and which realizes a reduction in a manufacturing cost. SOLUTION: The mounting system 1 mounts a conductor pin and a capacitor on a solder printed side face of a printed circuit board 2. The system 1 comprises a solder printer 12 for printing a solder for connecting the pin or the capacitor to the solder printed side face, a solder inspecting unit 13 for inspecting a non-defective or a defective solder printed by the printer 12, a capacitor mounting unit 14 for mounting the capacitor and the pin on the board 2 which is judged to be a good product by the unit 13, and a pin mounting unit 15. When the unit 13 detects the defective product, the board 2 is sorted from the non-defective product, the printer 12 is stopped or various type conditions are changed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting system for mounting two or more types of mounting components, such as conductor pins and capacitors, on the side of a printed wiring board on which solder is printed.

[0002]

2. Description of the Related Art Conventionally, there is a mounting system for mounting two or more types of mounting components on a solder printed side surface of a printed wiring board. For example, as a mounting system for mounting a conductor pin and a capacitor on a solder printed side surface of a printed wiring board, there is the following mounting system. That is, the mounting system includes a solder printing machine that prints solder at a desired position on a solder printing side surface of the printed wiring board, and a mounting machine that mounts the conductor pins and capacitors on the printed wiring board via the solder. Having. Then, a large number of printed wiring boards are sequentially put into the solder printing machine and the mounting machine and processed, so that the conductor pins and the capacitors are mounted on the printed wiring board.

Further, as a mounting system for mounting a solder ball and a capacitor on a solder printed side surface of a printed wiring board, there is the following mounting system. That is, the mounting system includes a solder printing machine that prints solder at a desired position on a solder printing side surface of the printed wiring board, and a mounting machine that mounts the capacitor on the printed wiring board via the solder. Then, a large number of printed wiring boards are sequentially put into the solder printing machine and the mounting machine and processed, whereby the solder balls and the capacitors are mounted on the printed wiring board.

[0004]

However, in the above-mentioned conventional mounting system, solder printing by a solder printing machine and mounting of conductor pins and capacitors are performed continuously. Therefore, even if the printed wiring board on which the solder is printed by the solder printing machine has a solder defect such as a blurred solder or a solder bridge (a phenomenon in which adjacent solders are short-circuited), the mounting machine can print the solder. The conductor pins and capacitors are directly mounted on the wiring board. If the solder printed on the printed wiring board has blurred solder, the mounted conductor pins and capacitors may cause problems such as defective mounting. Also, if a solder bridge is generated, it may cause a defect such as an electrical short circuit of the printed wiring board.

[0005] Therefore, when the mounting machine mounts the conductor pins or the capacitors regardless of the presence or absence of the solder defect as in the mounting system, a defective product is manufactured. As a result, the production efficiency is reduced, and the conductor pins and capacitors are wasted and the production cost is increased.

Further, in the above mounting system, even if the solder printed on the printed wiring board has a solder defect, the solder inspection is performed after the mounting step of the conductor pins and capacitors, so that the solder defect is detected. Detection is delayed. The solder defect is highly likely to have occurred due to a defect in the solder printing machine or inappropriate conditions.

[0007] Therefore, there is a possibility that a defective solder may occur on a large number of printed wiring boards processed by the solder printing machine before the defective product reaches the inspection process. That is, a large number of defective products may be generated, production efficiency may be reduced, and manufacturing costs may be increased. The above-mentioned problem becomes more conspicuous as the number of mounted components becomes two or more.

The present invention has been made in view of such a conventional problem, and has as its object to provide a mounting system which is excellent in production efficiency and realizes a reduction in manufacturing cost.

[0009]

According to a first aspect of the present invention, there is provided a mounting system for mounting two or more types of mounting components on a solder printed side surface of a printed wiring board. A solder printing machine for printing solder for connecting the mounted component at a desired position, a solder inspection machine for inspecting the quality of the solder printed on the side of the solder printing by the solder printing machine, and the solder inspection machine A mounting machine for mounting the mounted component on the printed wiring board determined to be non-defective through the solder, and separating the printed wiring board when the solder inspection machine detects a defective product; In addition, there is provided a mounting system in which the solder printing machine is stopped or various conditions of the solder printing machine are changed.

[0010] A mounting system according to the present invention includes the above-mentioned solder inspection machine. Then, when the solder inspection machine detects a solder defect, the printed wiring board on which the defective solder is printed is separated from non-defective products. Therefore, the mounting component can be prevented from being mounted on the printed wiring board on which the defective solder is printed by the mounting machine. Therefore, in the above-mentioned mounting machine, it is possible to improve production efficiency without processing defective products. In addition, there is no risk of wasting the mounted components, and the manufacturing cost can be reduced.

Further, when the solder inspection machine detects a solder defect, the mounting system stops the solder printing machine or changes various conditions of the solder printing machine. Moreover,
The detection of the solder failure is performed before the mounting process of the two or more types of mounted components. Thus, when the above-mentioned solder failure occurs, it is possible to prevent the occurrence of the solder failure in a large number of printed wiring boards to be processed thereafter. Therefore, the production efficiency can be improved and the production cost can be reduced.

That is, it is highly probable that the above-mentioned solder failure is caused by some kind of trouble in the above-mentioned solder printing machine or inappropriate various conditions. Therefore, as described above, when a solder defect is detected, the solder printing machine is stopped or various conditions of the solder printing machine are changed, so that a large number of defective products can be reliably prevented.

As described above, according to the present invention, it is possible to provide a mounting system which is excellent in production efficiency and realizes a reduction in manufacturing cost.

Next, a second invention is a mounting system for mounting a solder ball and at least one other type of mounting component on a solder printed side surface of a printed wiring board. A solder printing machine that prints the solder for forming the solder ball and the solder for connecting the mounting component to a desired position on the solder printing side surface;
A solder inspection machine for inspecting the quality of the solder printed on the side of the solder printing by the solder printing machine, and mounting the mounted component on the printed wiring board determined to be good by the solder inspection machine via the solder. And a mounting machine that performs
When the solder inspection machine detects a defective product, the printed wiring board is separated and the solder printing machine is stopped,
Alternatively, there is provided a mounting system wherein various conditions of the solder printing machine are changed (claim 3).

In this case, it is possible to provide a solder ball mounting system which is excellent in production efficiency and reduces the production cost by the same operation and effect as the first invention.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the first invention (Claim 1), the mounting components include, for example, conductor pins and capacitors. In the mounting system, when the solder inspection machine detects a solder defect, the solder printing machine may be stopped or various conditions may be changed without stopping. If the above solder printing machine is stopped, then
For example, after changing and adjusting various conditions appropriately, or after solving various problems that have occurred in the solder printing machine,
Restart the solder printing machine. For example, the printer is restarted after cleaning the plate and replacing the squeegee in the printing press.

The various conditions of the solder printing machine include, for example, the amount of solder supplied to the printed wiring board, the temperature and viscosity of the solder to be printed, and the like. The same applies to the following. Also,
In the mounting machine, for example, a mounting machine for mounting the conductor pins and a mounting machine for mounting the capacitors may be separately provided, and the conductor pins and the capacitors are separated by one mounting machine. It may be implemented.

A product obtained by the mounting system of the conductor pins and the capacitors is, for example, a PGA (pin grid array) which is an IC package for mounting an IC and connecting to a motherboard via the conductor pins. Etc.

It is preferable that the solder defect detected by the solder inspection machine is at least one of a solder blur and a solder bridge. As a result, it is possible to prevent the conductive pins and the capacitors from being mounted on the printed wiring board on which the solder fading or the solder bridge has occurred, thereby improving the production efficiency and reducing the production cost. The above-mentioned solder blur refers to, for example, that the amount of printed solder is insufficient and the solder is blurred. The solder bridge is a phenomenon in which a plurality of adjacent solders to be printed independently are short-circuited. The same applies to the following.

Products obtained by the mounting system according to the second invention (claim 3) include, for example,
There is a BGA (Ball Grid Array) which is an IC package for mounting an IC and connecting to a motherboard via solder balls.

It is preferable that the solder defect detected by the solder inspection machine is at least one of a solder blur and a solder bridge. As a result, mounting components are prevented from being mounted on the printed wiring board on which the solder blur or the solder bridge has occurred, and it is possible to improve the production efficiency and reduce the manufacturing cost.

[0022]

(Embodiment 1) A mounting system for a conductor pin and a capacitor according to an embodiment of the present invention will be described with reference to FIGS. The conductor pin and capacitor mounting system 1 of this example is a mounting system for mounting the conductor pins 31 and the capacitors 32 on the solder printed side surfaces 21 of the printed wiring board 2 as shown in FIG.

The mounting system 1 is, as shown in FIG.
It has a solder printing machine 12, a solder inspection machine 13, a capacitor mounting machine 14, and a pin mounting machine 15. As shown in FIGS. 3 and 4 (A), the solder printing machine 12 has a solder 4 for connecting the conductor pin 31 or the capacitor 32 at a desired position on the solder printed side surface 21 of the printed wiring board 2. Print. The solder inspection machine 13 inspects the quality of the solder 4 printed on the solder printing side surface 21 by the solder printing machine 12.

The capacitor mounting machine 14 is shown in FIG.
As shown in (1), the capacitor 32 is mounted via the solder 4 on the printed wiring board 2 which has been judged by the solder inspection machine 13 to have no solder failure. The pin mounting machine 15 is, as shown in FIG.
Printed wiring board 2 determined to have no solder failure
Then, the conductor pins 31 are mounted via the solder 4. When the solder inspection machine 13 detects a solder defect, the printed wiring board 2 on which the defective solder is printed is separated from non-defective products, and the solder printing machine 12 is stopped.

After that, various conditions of the solder printing machine 12 are appropriately changed and adjusted, or various problems such as clogging of the plate and insufficient amount of solder which have occurred in the solder printing machine 12 are solved. Then, the solder printing machine 12 is restarted. That is, after the plate cleaning, the replenishment of the solder, or the replacement of the squeegee, etc. in the solder printing machine 12, the restart is performed. Various conditions for the solder printing machine 12 include, for example, the amount of solder supplied to the printed wiring board 2, the temperature and viscosity of the solder 4 to be printed, and the like.

In this embodiment, the capacitor mounter 14 and the pin mounter 15 are provided separately. However, a device in which the conductor pins 31 and the capacitors 32 are mounted by one mounter may be used. . The product obtained by the above-described conductor pin and capacitor mounting system 1 of the present embodiment is a PGA (Pin / Pin) which is an IC package for mounting an IC and connecting to a motherboard via the conductor pin 31.
Grid array).

The solder failures detected by the solder inspection machine 13 include the solder blur 48 (FIG. 5A) and the solder bridge 4.
9 (FIG. 5B). The above-mentioned solder blur 48 means that, for example, the amount of the printed solder 4 is insufficient and the solder 4 is in a blurred state. Further, the solder bridge 49 refers to a phenomenon in which a plurality of adjacent solders 4 to be printed independently are short-circuited. The broken line in FIG. 5 indicates the outer shape of the solder which should be printed.

The mounting system 1 for mounting conductor pins and capacitors according to the present embodiment will be described below in detail with reference to FIGS.
As shown in FIG. 1, the mounting system 1 includes, in addition to a solder printing machine 12, a solder inspection machine 13, a capacitor mounting machine 14, and a pin mounting machine 15, a loading machine 11 for loading a printed wiring board 2 before solder printing. And a receiver 16 for receiving the printed wiring board 2 on which the conductor pins 31 and the capacitors 32 are mounted.

Further, the mounting system 1 moves the printed wiring board 2 input from the inputting machine 11 by an arrow A in FIG.
As shown in (1), there is a transport conveyor 171 for transporting to the receiver 16 in the order of the solder printing machine 12, the solder inspection machine 13, the capacitor mounting machine 14, and the pin mounting machine 15. Furthermore,
The mounting system 1 includes a discharge conveyor 172 that separates and discharges the printed wiring board 2 in which the solder failure has been detected by the solder inspection machine 13 from non-defective products.

The printed wiring board 2 loaded from the loading machine 11 is transported to the solder printing machine 12 by the transport conveyor 171. The solder printer 12 is shown in FIG.
As shown in FIG. 4A, the solder 4 for connecting the conductor pins 31 and the capacitors 32 is
(See step S in FIG. 2)
1).

The printed wiring board 2 on which the solder 4 is printed
Is transferred to the solder inspection machine 13 by the transfer conveyor 171. The solder inspection machine 13 inspects the printed wiring board 2 for a solder defect such as a solder scrap 48 or a solder bridge 49 (Step S in FIG. 2).
2). This solder inspection is performed, for example, on the printed wiring board 2 described above.
The image can be obtained by taking an image of the solder printed side surface 21 and recognizing the image of the solder 4.

Then, the printed wiring board 2 judged by the solder inspection machine 13 to have no solder failure is conveyed to the capacitor mounting machine 14 by the conveyance conveyor 171. The capacitor mounter 14 mounts the capacitor 32 on the printed wiring board 2 via the solder 4 as shown in FIG. 4B (step S3). Next, the printed wiring board 2 is transported to the pin mounting machine 15,
The pin mounting machine 15 mounts the conductor pins 16 on the printed wiring board 2 via the solder 4 (step S4).

On the other hand, when a solder defect is detected in the solder inspection by the solder inspection machine 13 (step S2),
The printed wiring board 2 on which the defective solder is printed is transferred to the discharge conveyor 172 and discharged as shown by an arrow B in FIG. 1 (step S5). At the same time, the stop signal 5 is sent from the solder inspection machine 13 to the solder printing machine 12. The solder printing machine 12 that has received the stop signal 5 stops (step S6).

After that, various conditions of the solder printing machine 12 are appropriately changed and adjusted, or various problems occurring in the solder printing machine 12 are eliminated, and then the solder printing machine 12 is restarted. (Steps S7 and S8). For example, when the solder inspection machine 13 detects the solder blur 48, the solder blur is applied to the printed wiring board 2 to be processed thereafter by increasing the amount of solder supplied to the printed wiring board 2 or cleaning the plate. 48 should not occur.

When the solder inspection machine 13 detects the solder bridge 49, the amount of solder supplied to the printed wiring board 2 is reduced, and it is checked whether foreign matter is attached to the plate. For the printed wiring board 2 to be processed,
The solder bridge 49 should not be formed. In this way, the conductor pins 31 and the capacitors 32 are mounted on a large number of the printed wiring boards 2 sequentially supplied.

The transport conveyor 171 shown in this embodiment
Instead of (FIG. 1), for example, a rotary table on which the printed wiring board 2 is mounted and which rotates in a substantially horizontal plane can be used. In this case, the solder printing machine 12, the solder inspection machine 13, the capacitor mounting machine 14, and the pin mounting machine 15 are arranged in a ring.

Next, the operation and effect of this embodiment will be described. The mounting system 1 includes the solder inspection machine 13. When the solder inspection machine 13 detects a defective solder, the printed wiring board 2 on which the defective solder is printed is separated from non-defective products. Therefore, the capacitor mounting machine 14 and the pin mounting machine 15 are mounted on the printed wiring board 2 on which the defective solder is printed.
This prevents the capacitor 32 and the conductor pin 31 from being mounted. Therefore, in the capacitor mounting machine 14 and the pin mounting machine 15, defective products are not processed, and the production efficiency can be improved. Also,
There is no risk of wasting the conductor pins 31 and the capacitors 32, and the manufacturing cost can be reduced.

Further, when the solder inspecting machine 13 detects a solder defect, the mounting system 1 detects that the solder printing machine 1
2 was stopped, and various conditions of the solder printing machine 12 were changed.
Alternatively, various problems that have occurred in the solder printing machine 12 are eliminated. Moreover, detection of solder failure (step S2)
Is performed before the mounting process of the conductor pins 31 and the capacitors 32 (Steps S3 and S4). This gives
When the above-mentioned solder failure occurs, it is possible to prevent the occurrence of the solder failure in a large number of printed wiring boards 2 to be subsequently processed. Therefore, while improving production efficiency,
Manufacturing costs can be reduced.

That is, the solder failure is caused by the solder printing machine 1
It is highly probable that some trouble has occurred in 2 or various conditions have become inappropriate. Therefore, as described above, by stopping the solder printing machine 12, it is possible to reliably prevent the generation of a large number of defective products. Then, by solving the problem of the solder printing machine 12 or changing various conditions and adjusting them to appropriate conditions, it is possible to print the good solder 4 on the printed wiring board 2 to be inserted thereafter. , Conductor pins 31 and capacitors 32 can be appropriately mounted.

As described above, according to the present embodiment, it is possible to provide a conductor pin and capacitor mounting system which is excellent in production efficiency and reduces the production cost.

(Embodiment 2) This embodiment is an example in which various conditions are changed without stopping the solder printing machine 12 when a solder defect is detected. For example, when the solder inspection machine 13 detects the solder blur 48,
Increasing the solder supply and cleaning the plate. When the solder inspection machine 13 detects the solder bridge 49, the solder supply amount is reduced or the plate is cleaned according to the degree of the solder bridge 49. Then, the solder printing machine 12 is operated continuously. Others are the same as the first embodiment.

In this case, since the solder printing machine 12 can be continuously operated without stopping, it is possible to obtain a conductor pin and capacitor mounting system which is more excellent in production efficiency. In addition, the third embodiment has the same functions and effects as those of the first embodiment.

(Embodiment 3) In this embodiment, as shown in FIG.
Solder balls 33 are provided on the solder printed side surface 21 of the printed wiring board 2.
And an example of a mounting system for mounting the capacitor 32. The mounting system has a solder printing machine, a solder inspection machine, and a capacitor mounting machine.

As shown in FIG. 6 (A), the solder printing machine is used for solder 4 and solder balls 33 for connecting the capacitor 32 to a desired position on the solder printing side surface 21 of the printed wiring board 2. Of solder 4 is printed. The solder inspection machine inspects the quality of the solder 4 printed on the solder printing side surface 21 by the solder printing machine.

As shown in FIG. 6B, the capacitor mounting machine mounts the capacitor 32 on the printed wiring board 2 which has been judged by the solder inspection machine to have no solder failure.
It is mounted via the solder 4. The solder balls 3
The solder 4 for the solder balls 3
It becomes 3.

On the other hand, when the solder inspection machine detects a solder defect, the printed wiring board 2 on which the defective solder is printed is separated from non-defective products, and the solder printing machine is stopped. After that, various problems occurring in the solder printing machine are eliminated, or various conditions are appropriately changed and adjusted, and the solder printing machine is restarted.

The product obtained by the solder ball and capacitor mounting system of this embodiment is a BGA (ball grid array) which is an IC package for mounting an IC and connecting to a motherboard via the solder ball 33. . Others are the same as the first embodiment.

In this case, it is possible to provide a solder ball and capacitor mounting system which achieves excellent production efficiency and reduces manufacturing cost by the same operation and effect as the first embodiment. In addition, the third embodiment has the same functions and effects as those of the first embodiment. In the third embodiment as well, various conditions can be changed without stopping the solder printing machine. Also in this case, the production efficiency can be further improved.

[0049]

As described above, according to the present invention, it is possible to provide a mounting system which is excellent in production efficiency and realizes a reduction in manufacturing cost.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a mounting system for a conductor pin and a capacitor according to a first embodiment.

FIG. 2 is a flowchart of a mounting system for a conductor pin and a capacitor in the first embodiment.

FIG. 3 is a plan view of the printed wiring board according to the first embodiment.

4A is a cross-sectional view of the printed wiring board after solder printing, and FIG. 4B is a cross-sectional view of the printed wiring board after mounting the conductor pins and the capacitors in the first embodiment.

FIGS. 5A and 5B are plan explanatory views of (A) a solder blur and (B) a plan view of a solder bridge in the first embodiment.

6A is a cross-sectional view of a printed wiring board after solder printing, and FIG. 6B is a cross-sectional view of a printed wiring board after solder balls and capacitors are mounted in a third embodiment.

[Explanation of symbols]

 1. . . 11. Mounting system, . . 12. solder printing machine, . . 13. solder inspection machine, . . 14. Capacitor mounting machine, . . 1. Pin mounting machine, . . Printed wiring board, 21. . . 30. Solder printing side surface . . Conductor pin, 32. . . Capacitor, 33. . . 3. solder balls; . . solder,

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) B41F 15/14 B41F 15/14 C H05K 3/34 505 H05K 3/34 505A 505D 512 512B // B23K 101: 42 B23K 101: 42 (72) Inventor Toshiyuki Kasuga 3-200, Kawamacho, Ogaki-shi, Gifu F-term in the Kawama Plant of IBIDEN Co., Ltd. CD53 GG03 GG05 GG15

Claims (4)

[Claims] 1. A mounting system for mounting two or more types of mounting components on a solder printed side surface of a printed wiring board, wherein the mounting system is configured to mount the mounting component at a desired position on the solder printed side surface of the printed wiring board. A solder printer for printing solder for connecting components, a solder inspection machine for inspecting the quality of solder printed on the solder printing side surface by the solder printer, and a print judged to be good by the solder inspection machine A mounting machine for mounting the mounted component on the wiring board via the solder, and when the solder inspection machine detects a defective product, the printed wiring board is separated and the solder printing machine is separated. Or changing various conditions of the solder printing machine. 2. The mounting system according to claim 1, wherein the solder defect detected by the solder inspection machine is at least one of a solder blur and a solder bridge. 3. A mounting system for mounting a solder ball and at least one other type of mounting component on a solder printed side surface of a printed wiring board, the mounting system comprising: A solder printing machine for printing solder for forming the solder balls and solder for connecting the mounted components at positions, and a solder inspection for inspecting the quality of the solder printed on the side of the solder printing by the solder printing machine. And a mounting machine that mounts the mounted component on the printed wiring board determined to be good by the solder inspection machine via the solder, and the solder inspection machine detects a defective product. A mounting system for separating the printed wiring board and stopping the solder printing machine or changing various conditions of the solder printing machine. 4. The mounting system according to claim 3, wherein the solder defect detected by the solder inspection machine is at least one of a solder blur and a solder bridge.