JP4263310B2 - Printed wiring board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed wiring board having a V-cut confirmation circuit for confirming the presence or absence of a V-cut groove provided in order to increase the productivity of component mounting of a printed wiring board used in various electronic devices. .
[0002]
[Prior art]
In recent years, with the progress of cost reduction of various electronic devices, improvement in mass productivity has been demanded also in a mounting process in which electronic components are mounted on a printed wiring board and soldered.
[0003]
Therefore, a mounting method in which individual printed wiring boards are assembled into individual printed wiring boards after mounting and soldering electronic components using a multi-piece collective printed wiring board connected through V-cut grooves and perforations. Has become commonplace.
[0004]
A conventional printed wiring board having a V-cut groove is shown in FIG.
[0005]
In the process of manufacturing the collective printed wiring board 21, V cut grooves 25a, 25b, and 25c need to be provided between the adjacent individual printed wiring boards 22 and between the individual printed wiring boards 22 and the outer frame 24. The presence / absence of a groove has been determined by conducting an electrical continuity test of the V-cut confirmation circuits 28a, 28b, and 28c.
[0006]
That is, by conducting a continuity test between the terminals 29 of the V-cut confirmation circuit 28a as shown in FIG. 8, it is possible to determine that the V-cut processing has been performed if the disconnection state is as shown in the figure. A method of preventing forgetting to process the V-cut using such a printed wiring board has been taken.
[0007]
[Problems to be solved by the invention]
The use of the printed wiring board 21 having the V-cut confirmation circuits 28a to 28c for preventing forgetting the conventional V-cut processing has the following problems.
[0008]
Normally, the electronic component is mounted on the printed wiring board 21 by fixing the outer frame 24 on both sides of the printed wiring board 21 by the chucking portion of the transport mechanism in the board transport mechanism of the component mounting apparatus and the soldering apparatus. The printed wiring board 21 is conveyed to the soldering process and the cleaning process. At this time, in the soldering by the solder flow, the solder is applied to the entire area of the printed wiring board 21 excluding the outer frames 24 on both sides. Therefore, solder adheres to exposed copper foil portions such as lands and terminals.
[0009]
That is, the solder 30 adheres to the terminals 29a, 29b, 29c of the V-cut confirmation circuit formed other than the outer frame 24 covered with the chucking portion of the transport mechanism (FIG. 9).
[0010]
Thereafter, the printed wiring board is divided along the V-cut groove and the perforation 31, and is incorporated into an electronic device through a process such as electrical inspection.
[0011]
At this time, the divided outer frames 24, 24a, and 24b are not components that constitute the electrical equipment, and thus are treated as industrial waste. At this time, the solder 30 attached to the terminals 29a, 29b, and 29c in the soldering process is also processed in the same manner.
[0012]
However, as one of the protection measures for the global environment in recent years, regulation of lead contained in solder and the flow of reduction and recycling of industrial waste in the process of manufacturing electronic devices are occurring year by year. Since the outer frame portion to be discharged after mounting the board also contains solder, it has been a problem in disposal and recycling processing.
[0013]
The present invention solves the above-mentioned conventional problems, can easily confirm the presence or absence of V-cut processing in the manufacturing process of the printed wiring board, and industrial waste after the mounting of the printed wiring board and manufacturing of the electronic device also contains lead It is an object of the present invention to provide a printed wiring board that constitutes an outer frame part that is easy to dispose or recycle and is useful for protecting the global environment.
[0014]
[Means for Solving the Problems]
In order to solve this problem, the present invention is a printed wiring board having an outer frame and a V-cut groove, wherein at least two terminals are connected to each other via a V-cut processing region, and the V-cut groove is processed. An electronic device is manufactured by mounting an electronic component using a printed wiring board on which an insulating film is formed on the V-cut confirmation circuit in a printed wiring board on which a V-cut confirmation circuit that is electrically disconnected is formed. Thus, the discharge of industrial waste containing lead solder can be eliminated.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, a chucking outer frame, an unframed outer frame, a V-cut groove, at least two terminals for continuity inspection, and a V-cut machining region between the terminals are provided. And a V-cut confirmation circuit that is electrically disconnected during V-cut groove processing, and an insulating film formed in the V-cut processing region including the V-cut confirmation circuit. The continuity testing terminals are formed on the chucking outer frame, and the V-cut confirmation circuit connected by wiring between the continuity testing terminals is formed on the non-chucked outer frame. The cut confirmation circuit is a printed wiring board that is covered with the insulating film so that the solder does not adhere except for the continuity test terminal. Prevent the deposition of solder on the V-cut confirmation circuit by the presence, with the effect that does not generate industrial waste containing lead solder.
[0016]
The printed wiring board according to claim 1, wherein at least two terminals are formed on the outer frame. By providing at least two inspection terminals on the outer frame, the mounting soldering apparatus in the mounting process is provided. Since the outer frame is not soldered at the chucking portion, the solder does not adhere to the V-cut confirmation circuit including the terminals, and the outer frame can be divided and separated, and can be easily treated as industrial waste that does not contain solder at the time of disposal. It is to become.
[0017]
The invention according to claim 2 of the present invention is the printed wiring board according to claim 1, wherein the insulating film is a solder resist, and the insulating film of the V-cut confirmation circuit is formed on the conductor circuit of the printed wiring board. By simultaneously forming as a solder resist, the productivity is improved.
[0018]
The invention according to claim 3 of the present invention is the printed wiring board according to claim 1, wherein the printed wiring board is a multi-piece collective printed wiring board having a plurality of individual printed wiring boards. In addition to improving mounting productivity, it has the effect of not generating industrial waste containing lead solder.
[0019]
Invention of Claim 4 of this invention is a printed wiring board of Claim 3 which has V cut groove | channel between adjacent separate printed wiring boards, Productivity of component mounting, and division | segmentation of a printed wiring board This has the effect of preventing the generation of industrial waste containing lead solder.
[0020]
Invention of Claim 5 of this invention is a printed wiring board of Claim 4 in which the V cut confirmation circuit is formed through the V cut process area | region between the adjacent individual printed wiring boards, The presence / absence of V-cut processing formed between the individual printed wiring boards and between the outer frames can be confirmed, and industrial waste containing lead solder is not generated.
[0021]
The invention according to claim 6 of the present invention is the printed wiring board according to claim 5 in which the land pattern in the individual printed wiring board is used as a terminal of the V-cut confirmation circuit. By using the terminal of the V-cut confirmation circuit between the inside and the land pattern for component mounting, the degree of freedom in wiring design is increased.
[0022]
(Embodiment)
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0023]
FIG. 1 is a schematic diagram showing a printed wiring board according to an embodiment of the present invention, FIG. 2 is a diagram showing details of a V-cut confirmation circuit portion of the printed wiring board according to the embodiment of the present invention, and FIG. It is a figure which shows the detail of the V cut confirmation circuit part after V cut processing of the printed wiring board in embodiment of invention. FIG. 4 is a diagram showing details of a V-cut confirmation circuit formed between adjacent individual printed wiring boards, and FIG. 5 is a diagram showing a state during conveyance in a component mounting process using the printed wiring board in one embodiment of the present invention. FIG. 6 is a partial detailed view showing a chucking state, and FIG. 6 is a schematic view showing a printed wiring board according to another embodiment of the present invention.
[0024]
1 to 6, 1 is a printed wiring board, 2 is an individual printed wiring board, 3 is a collective printed wiring board, 4 and 4 a are outer frames, 5 and 5 a are V-cut grooves, and 6, 6 a and 6 b are V-cut processing. The region, 7 is a conductor circuit, 8a to 8e are V-cut confirmation circuits, 9 is a terminal, 10 is a solder resist, 11 is a chucking portion for conveying the component mounting apparatus, and 12 is a perforation.
[0025]
First, the printed wiring board of the present invention will be described.
[0026]
As shown in FIG. 1, the configuration of the printed wiring board 1 in which a multi-piece collective printed wiring board 3 in which a plurality of individual printed wiring boards 2 are connected is connected to the outer frames 4 on both sides is the same as that of the outer frame 4. A V-cut processing region 6a is provided between the printed wiring boards 3, and a V-cut processing region 6b is provided between adjacent individual printed wiring boards.
[0027]
Further, V cut confirmation circuits 8a to 8d are formed in the vicinity of the V cut processing region.
[0028]
Next, details of the V-cut confirmation circuit portion will be described with reference to FIG. Two terminals 9 for continuity inspection of the V-cut confirmation circuit 8a are formed on the outer frame 4, and the two terminals are connected to each other via the V-cut processing region 6a and are electrically connected. Further, a solder resist 10 as an insulating film formed simultaneously with the solder resist for protecting the conductor circuit 7 of the printed wiring board 1 is formed on the V-cut confirmation circuit excluding the terminal 9.
[0029]
Further, the second V cut confirmation circuits 8c and 8d between the adjacent individual printed wiring boards 2 electrically connect the conductor circuits 7 in the vicinity of the V cut processing region 6 of the individual printed wiring board 2 as shown in FIG. The V-cut confirmation circuit 8c connected to each other may be formed, and the solder resist 10 may be formed thereon, or independent from any conductor circuit of the individual printed wiring board 2 as shown in FIG. A V-cut confirmation circuit 8d and a terminal 9 may be formed.
[0030]
FIG. 3 shows a state where the printed wiring board is subjected to V-cut processing.
[0031]
When the V-cut groove 5 is formed in the V-cut processing region 6, the V-cut confirmation circuit 8a is also cut at the same time and is in a disconnected state. As a result, the presence or absence of V-cut processing can be inspected by conducting a continuity test between both terminals 9 of the V-cut confirmation circuits 8c and 8d at the time of electrical inspection when the printed wiring board 1 is completed. For this reason, it is possible to confirm in advance that the V-cut processing has been forgotten, and the printed wiring board can be easily divided after the components are mounted.
[0032]
Next, mounting and soldering of electronic components on the printed wiring board 1 subjected to the V-cut processing will be described.
[0033]
As shown in FIG. 5, the printed wiring board 1 is chucked and fixed to the transport chucking portion 11 of the component mounting apparatus in the mounting process, and is transported to the electronic component mounting process, the soldering process, the cleaning process, and the like. To go. At this time, the soldering area of the printed wiring board 1 is an area of the collective printed wiring board 3 in which a large number of individual printed wiring boards 2 are formed, and the outer frame 4 for chucking the printed wiring board 1 is While being fixed to the conveyance chucking part 11, the whole is covered, and the solder which spouts does not adhere at the time of soldering in a solder flow system. Therefore, the solder is not attached to the terminals 9 formed on the outer frame 4 for chucking.
[0034]
Furthermore, since the V-cut confirmation circuit 8a of the outer frame 4a that is not chucked is covered with the solder resist 10, the jet solder does not adhere.
[0035]
After mounting the components of the printed wiring board described above, it is divided into individual printed wiring boards 2 through steps such as electrical inspection, and incorporated into electronic equipment. At this time, the outer frame 4 and the outer frame 4a are also divided and separated at the locations of the V-cut groove 5 and the perforation 12, and are treated as industrial waste. Can be processed.
[0036]
In addition, the V-cut confirmation circuit formed between the adjacent individual printed wiring boards is incorporated into the electronic device as it is as a printed wiring board constituting the electronic circuit, and does not become industrial waste at that time.
[0037]
In the description of the embodiment of the present invention, the outer frame 4a and the aggregate printed wiring board 3 that are not chucked are divided through the perforation 12, but a V-cut groove 5a is used instead of the perforation 12. In this case, the V-cut confirmation circuit 8e and at least two terminals for continuity inspection may be formed on the outer frame 4 in common with the terminal 9 of the V-cut confirmation circuit 8a as shown in FIG. Needless to say, it is possible to prevent the solder from adhering during component mounting even in this configuration.
[0038]
【The invention's effect】
As described above, the present invention provides a printed wiring board having a V-cut confirmation circuit that does not attach solder from an industrial waste such as an outer frame in a state where solder generated when using a conventional V-cut confirmation circuit is attached. By using it, the presence or absence of V-cut processing in the manufacturing process of the printed wiring board can be easily confirmed, and the efficiency of the mounting process of the printed wiring board is increased, and industrial waste in the manufacture of electronic equipment does not contain lead, It is possible to provide a printed wiring board that is easy to dispose and recycle and is useful for protecting the global environment.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing a printed wiring board according to an embodiment of the present invention. FIG. 2 is a diagram showing details of a V-cut confirmation circuit portion of the printed wiring board according to the embodiment of the present invention. The figure which shows the detail of the V cut confirmation circuit part after V cut processing of the printed wiring board in embodiment. FIG. 4 is the figure which shows the detail of the V cut confirmation circuit formed between adjacent individual printed wiring boards. FIG. 6 is a partial detailed view showing a chucking state during conveyance in a component mounting process using a printed wiring board in an embodiment of the present invention. FIG. 6 is a V-cut confirmation circuit for a printed wiring board in another embodiment of the present invention. FIG. 7 is a schematic diagram showing a conventional printed wiring board. FIG. 8 is a diagram showing details of a V-cut confirmation circuit part of a conventional printed wiring board. FIG. Diagram showing details of the V-cut confirmation circuit formed on preparative wiring plates EXPLANATION OF REFERENCE NUMERALS
DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Individual printed wiring board 3 Collected printed wiring board 4, 4a Outer frame 5, 5a V cut groove 6, 6a, 6b V cut processing area 7 Conductor circuit 8a-8e V cut confirmation circuit 9 Terminal 10 Solder resist 11 Transport chucking section 12 perforations

Claims (6)

An outer frame for chucking, an outer frame that is not chucked, a V-cut groove, at least two terminals for continuity inspection, and a wiring connection between the terminals via a V-cut processing region, and V-cut groove processing A V-cut confirmation circuit that is electrically disconnected at the time of
An insulating film formed in the V-cut processing region including the V-cut confirmation circuit, and the terminal for continuity inspection is formed on the outer frame for chucking,
A V-cut confirmation circuit wired between the terminals for continuity inspection is formed on the outer frame that is not chucked,
The printed wiring board, wherein the V-cut confirmation circuit is covered with the insulating film so that solder does not adhere except for the terminal for continuity inspection.   The printed wiring board according to claim 1, wherein the insulating coating is a solder resist.   The printed wiring board according to claim 1, wherein the printed wiring board is a multi-piece collective printed wiring board having a plurality of individual printed wiring boards.   The printed wiring board of Claim 3 which has a V cut groove | channel between adjacent individual printed wiring boards.   The printed wiring board according to claim 4, wherein a second V-cut confirmation circuit is formed between adjacent individual printed wiring boards via a V-cut processing region.   The printed wiring board according to claim 5, wherein a land pattern in the individual printed wiring board is used as a terminal of a V-cut confirmation circuit.

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