JPH05166973A - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
JPH05166973A
JPH05166973A JP3336482A JP33648291A JPH05166973A JP H05166973 A JPH05166973 A JP H05166973A JP 3336482 A JP3336482 A JP 3336482A JP 33648291 A JP33648291 A JP 33648291A JP H05166973 A JPH05166973 A JP H05166973A
Authority
JP
Japan
Prior art keywords
semiconductor element
showing
view
transfer
resin molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3336482A
Other languages
Japanese (ja)
Inventor
Ryoji Ogata
良二 尾形
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3336482A priority Critical patent/JPH05166973A/en
Publication of JPH05166973A publication Critical patent/JPH05166973A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Abstract

PURPOSE:To enable a semiconductor element to be positioned and transferred concurrently by a method wherein at least two or more cutout grooves are provided on the resin molded part of the semiconductor element confronting each other. CONSTITUTION:Transfer pawls 3 which transfer a semiconductor element l and two cutout grooves 4 provided on the resin molded part of the semiconductor element 1 confronting each other so as to serve as a positioning and fixing means which enables the transfer pawls 3 to be engaged with the semiconductor element 1 are provided. For instance, the cutout grooves 4 provided on both sides of the semiconductor element 1 are engaged with the transfer pawls 3 which are made to move in the direction of an arrow A by a first drive device, whereby the semiconductor element 1 is positioned and fixed. Then, the semiconductor element l is transferred to a device of a following stage by second drive device which fixes the semiconductor element 1. By this setup, the semiconductor element 1 can be positioned and transferred concurrently without using a suction device.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、搬送爪で、位置決めと
搬送が行われる半導体素子に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device which is positioned and conveyed by a conveying claw.

【0002】[0002]

【従来の技術】図5は従来の半導体素子を示す斜視図
で、図6(a),(b)は、図5の保持動作を示す側面
図である。これらの図において、1は半導体素子、2は
リード、5は半導体素子1の樹脂成形部、7は前記半導
体素子1を真空吸着する吸着パッド、8は前記半導体素
子1を保持するための開閉動作を行う位置決め具であ
る。
2. Description of the Related Art FIG. 5 is a perspective view showing a conventional semiconductor device, and FIGS. 6 (a) and 6 (b) are side views showing the holding operation of FIG. In these figures, 1 is a semiconductor element, 2 is a lead, 5 is a resin molded portion of the semiconductor element 1, 7 is a suction pad for vacuum-sucking the semiconductor element 1, and 8 is an opening / closing operation for holding the semiconductor element 1. It is a positioning tool for performing.

【0003】次に、動作について説明する。半導体素子
1を搬送する場合は、図示しない吸引装置により真空吸
引する吸着パッド7が樹脂成形部5を吸着して取り出さ
れ、かつ図示しない駆動装置により位置決め具8が図6
(a)の矢印A方向に移動して、図6(b)に示すよう
に、半導体素子1を正確に位置決めしたのち次段の装置
へ搬送していた。
Next, the operation will be described. When the semiconductor element 1 is transported, the suction pad 7 which is vacuum-sucked by the suction device (not shown) sucks the resin molding portion 5 and is taken out, and the positioning tool 8 is moved by the driving device (not shown) to move the positioning tool 8 to the position shown in FIG.
6A, the semiconductor element 1 was accurately positioned and then conveyed to the next-stage device as shown in FIG. 6B.

【0004】[0004]

【発明が解決しようとする課題】従来の半導体素子1の
位置決め搬送では、吸着パッド7で樹脂成形部5を真空
吸着していたので、半導体素子1に静電気が帯電した
り、また、位置決めのため、吸着パッド7の他に位置決
め具8を必要とするなどの問題点があった。
In the conventional positioning and transporting of the semiconductor element 1, since the resin molding portion 5 is vacuum-sucked by the suction pad 7, the semiconductor element 1 is charged with static electricity and is used for positioning. However, there is a problem that a positioning tool 8 is required in addition to the suction pad 7.

【0005】本発明は、上記のような問題点を解消する
ためになされたもので、半導体素子を吸着することな
く、位置決めと取り出しとができる半導体素子を得るこ
とを目的とする。
The present invention has been made to solve the above problems, and an object thereof is to obtain a semiconductor element which can be positioned and taken out without adsorbing the semiconductor element.

【0006】[0006]

【課題を解決するための手段】本発明に係る半導体素子
は、半導体素子の樹脂成形部に搬送爪を係合する手段と
して切欠溝またはテーパ穴を対向する位置に少なくとも
2個所設けたものである。
A semiconductor element according to the present invention is provided with at least two notch grooves or tapered holes at positions facing each other as means for engaging a carrying claw with a resin molding portion of the semiconductor element. ..

【0007】[0007]

【作用】本発明においては、半導体素子の樹脂成形部に
切欠溝またはテーパ穴が形成され、この切欠溝またはテ
ーパ穴に係合した搬送爪により半導体素子の位置決めと
搬送が行われる。
In the present invention, a notch groove or a tapered hole is formed in the resin molding portion of the semiconductor element, and the semiconductor element is positioned and conveyed by the conveying claw engaged with the notch groove or the tapered hole.

【0008】[0008]

【実施例】以下、本発明の一実施例を図について説明す
る。図1は本発明の一実施例を示す斜視図、図2
(a),(b)はいずれも図1の動作を示す一部破断側
面図である。これらの図において、図5,図6と同一符
号は同一部分を示し、3は前記半導体素子1を搬送する
搬送爪、4は前記半導体素子1に搬送爪3を係合するこ
とにより位置決め固定する手段として樹脂成形部5の対
向する位置に2個所形成した切欠溝である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 is a perspective view showing an embodiment of the present invention, FIG.
(A), (b) is a partially broken side view showing the operation of FIG. In these drawings, the same reference numerals as those in FIGS. 5 and 6 indicate the same parts, 3 is a conveying claw for conveying the semiconductor element 1, and 4 is positioning and fixed by engaging the conveying claw 3 with the semiconductor element 1. As a means, it is a notch groove formed at two positions at opposite positions of the resin molding portion 5.

【0009】次に、動作について説明する。半導体素子
1の樹脂成形部5の両側面に形成された切欠溝4に、図
示されない第1の駆動装置より搬送爪3が矢印A方向に
移動して係合することにより位置決め固定され、次い
で、半導体素子1を固定する図示しない第2の駆動装置
により半導体素子1を次段の装置へ搬送する。
Next, the operation will be described. The first driving device (not shown) moves and engages the transfer claw 3 in the notch grooves 4 formed on both side surfaces of the resin molded portion 5 of the semiconductor element 1 to position and fix it. The semiconductor element 1 is conveyed to the next-stage device by a second driving device (not shown) that fixes the semiconductor element 1.

【0010】なお、上記実施例では、樹脂成形部5の左
右両辺に切欠溝4を設けたものについて説明したが、樹
脂成形部5の各辺に切欠溝4を設けてもよい。
In the above embodiment, the cutout grooves 4 are provided on both the left and right sides of the resin molding portion 5, but the cutout grooves 4 may be provided on each side of the resin molding portion 5.

【0011】図3は本発明の第2の実施例を示す斜視
図、図4は、図3の動作を示す断面図である。これらの
図において、図1,図2と同一符号は同一部分を示し、
6は前記樹脂成形部5の表面部分に半導体素子1を位置
決め固定する手段として形成したテーパ穴で、2個所以
上設けてもよい。また、図4に示す搬送爪3の下方部分
にはテーパ穴6に対応したテーパ部3aが形成されてい
る。
FIG. 3 is a perspective view showing a second embodiment of the present invention, and FIG. 4 is a sectional view showing the operation of FIG. In these figures, the same reference numerals as those in FIGS. 1 and 2 indicate the same parts,
Reference numeral 6 denotes a tapered hole formed as a means for positioning and fixing the semiconductor element 1 on the surface portion of the resin molding portion 5, and two or more holes may be provided. Further, a tapered portion 3a corresponding to the tapered hole 6 is formed in the lower portion of the transport claw 3 shown in FIG.

【0012】次に、動作について説明する。搬送爪3は
図4の矢印B方向に下降すると、テーパ部3aがテーパ
穴6に挿入される。次いで、矢印A方向に移動すること
により、半導体素子1が位置決めされ固定される。ま
た、この第2の実施例の場合も第1の実施例を同様の効
果を奏する。
Next, the operation will be described. When the conveying claw 3 descends in the direction of arrow B in FIG. 4, the tapered portion 3 a is inserted into the tapered hole 6. Then, by moving in the direction of arrow A, the semiconductor element 1 is positioned and fixed. Also, in the case of the second embodiment, the same effect as that of the first embodiment can be obtained.

【0013】[0013]

【発明の効果】以上説明したように、本発明は、半導体
素子の樹脂成形部に切欠溝またはテーパ穴を対向する位
置に少なくとも2個所設けたので、半導体素子の位置決
めと同時に搬送ができるので、搬送装置が簡略化され、
また、従来樹脂成形部に真空吸着を行った場合の静電気
の帯電による半導体素子の品質低下が防止できる等の利
点を有する。
As described above, according to the present invention, since at least two notch grooves or tapered holes are provided at opposite positions in the resin molding portion of the semiconductor element, the semiconductor element can be conveyed at the same time as the positioning. The transport device is simplified,
Further, there is an advantage that it is possible to prevent deterioration of the quality of the semiconductor element due to electrostatic charge when the resin molded part is vacuum-adsorbed.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例を示す斜視図である。FIG. 1 is a perspective view showing a first embodiment of the present invention.

【図2】図1の動作を示す一部破断側面図である。FIG. 2 is a partially cutaway side view showing the operation of FIG.

【図3】本発明の第2の実施例を示す斜視図である。FIG. 3 is a perspective view showing a second embodiment of the present invention.

【図4】図3の動作を示す一部破断側面図である。FIG. 4 is a partially cutaway side view showing the operation of FIG.

【図5】従来の半導体素子を示す斜視図である。FIG. 5 is a perspective view showing a conventional semiconductor device.

【図6】図5の保持動作を示す側面図である。FIG. 6 is a side view showing the holding operation of FIG.

【符号の説明】[Explanation of symbols]

1 半導体素子 2 リード 3 搬送爪 4 切欠溝 5 樹脂成形部 6 テーパ穴 1 Semiconductor Element 2 Lead 3 Transfer Claw 4 Notch Groove 5 Resin Molding Section 6 Tapered Hole

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 搬送爪の係合により位置決めされ、かつ
搬送される半導体素子の樹脂整形部に前記搬送爪を係合
する手段として切欠溝またはテーパ穴を対向する位置に
少なくとも2個所設けたことを特徴とする半導体素子。
1. A cutout groove or a tapered hole is provided at a position facing each other as means for engaging the carrying claw with a resin shaping portion of a semiconductor element which is positioned and carried by engagement of the carrying claw. A semiconductor device characterized by.
JP3336482A 1991-12-19 1991-12-19 Semiconductor element Pending JPH05166973A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3336482A JPH05166973A (en) 1991-12-19 1991-12-19 Semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3336482A JPH05166973A (en) 1991-12-19 1991-12-19 Semiconductor element

Publications (1)

Publication Number Publication Date
JPH05166973A true JPH05166973A (en) 1993-07-02

Family

ID=18299592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3336482A Pending JPH05166973A (en) 1991-12-19 1991-12-19 Semiconductor element

Country Status (1)

Country Link
JP (1) JPH05166973A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001085401A3 (en) * 2000-05-11 2002-03-28 Zyvex Corp Gripper and complementary handle for use with microcomponents
US7025619B2 (en) 2004-02-13 2006-04-11 Zyvex Corporation Sockets for microassembly
US7096568B1 (en) 2003-07-10 2006-08-29 Zyvex Corporation Method of manufacturing a microcomponent assembly
US7314382B2 (en) 2005-05-18 2008-01-01 Zyvex Labs, Llc Apparatus and methods of manufacturing and assembling microscale and nanoscale components and assemblies
US7605377B2 (en) 2006-10-17 2009-10-20 Zyvex Corporation On-chip reflectron and ion optics
WO2016181516A1 (en) * 2015-05-13 2016-11-17 三菱電機株式会社 Semiconductor module

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001085401A3 (en) * 2000-05-11 2002-03-28 Zyvex Corp Gripper and complementary handle for use with microcomponents
US6398280B1 (en) 2000-05-11 2002-06-04 Zyvex Corporation Gripper and complementary handle for use with microcomponents
US7096568B1 (en) 2003-07-10 2006-08-29 Zyvex Corporation Method of manufacturing a microcomponent assembly
US7025619B2 (en) 2004-02-13 2006-04-11 Zyvex Corporation Sockets for microassembly
US7314382B2 (en) 2005-05-18 2008-01-01 Zyvex Labs, Llc Apparatus and methods of manufacturing and assembling microscale and nanoscale components and assemblies
US7605377B2 (en) 2006-10-17 2009-10-20 Zyvex Corporation On-chip reflectron and ion optics
WO2016181516A1 (en) * 2015-05-13 2016-11-17 三菱電機株式会社 Semiconductor module
CN107615478A (en) * 2015-05-13 2018-01-19 三菱电机株式会社 Semiconductor module
EP3297020A4 (en) * 2015-05-13 2018-11-21 Mitsubishi Electric Corporation Semiconductor module
US10217683B2 (en) 2015-05-13 2019-02-26 Mitsubishi Electric Corporation Mounted semiconductor module with a mold resin portion

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