JPH0464296A - Board holding and securing device - Google Patents

Abstract

PURPOSE:To effectively hold and secure pins and a plate for mounting the pins without altering even if the thickness, size, and type of a board are varied by driving pins capable of pressing the board at one ends and a plate for mounting a spring capable of absorbing the thickness of an article at a constant stroke. CONSTITUTION:After any of boards 22, 30, 31, 32, 34 is stopped at predetermined positions of a stationary and movable side conveying rails 28, 29, a driver 27 raises a plate 24 provided with pins 21 and springs 25 at a constant stroke to hold fixedly any of the boards 22, 30, 32, 34, the spring 25 absorbs the thicknesses of the board, an electronic component and the movable side rail, then drives a plate 23 by a driver 24 to secure the pin 21 in a holding and securing position. Thus, even if the thickness, type and size of the board are varied, the board can effectively be held and secured to prevent malfunctions in a cream solder printing step, an adhesive coating step and a chip component mounting step.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a substrate holding and fixing device for holding and fixing a substrate at a predetermined position on a substrate transport rail.

BACKGROUND OF THE INVENTION In recent years, electronic component mounting apparatuses have been viewed as important in high-mix, low-volume production due to their ability to shorten board changeover time, improve work efficiency, and reduce costs.

Hereinafter, a conventional board holding and fixing device for an electronic component mounting apparatus will be described with reference to the drawings. Figure 6(a)(b)
), FIG. 7, FIG. 8, FIG. 9 (aj (t)), and FIG. This figure shows the operation and state of a board in the case where it is held and fixed with the upper surface of the transport surface of the transport rail as a reference.

FIGS. 6(a) and 6(b) are a front view and a front view showing the structure of the substrate holding and fixing device when the substrate is held and fixed at a predetermined position on the substrate transport rail. Figure 6(a)
In (b), ■ is a fixed side transport rail that transports the board, 2 is a board held and fixed at a predetermined position on the transport rail, and 3
4 is a moving side transport rail that moves according to the width of the board;
Reference numeral 5 indicates a pin for pressing and holding the substrate 2; 5, a plate to which pins 4 are attached at regular intervals; and 6, a drive unit capable of vertically driving the plate 5 and holding and fixing the substrate 2 via the pins 4.

FIGS. 7 and 8 show a case where the pin 4 is held without changing the substrate, which is thinner or thicker than the substrate 2. As shown in FIG. 7, reference numeral 7 indicates a substrate thinner than the substrate 2, and the pins 4 cannot hold and fix the thin substrate 7 completely. Further, as shown in FIG. 8, 8 is a board that is thicker than the board 2, and the pin 4 presses down the thick board to deform the board 8.

FIGS. 9(a) and 9(fb) are a plan view and a front view of the board holding and fixing device, and show that the board 9 after single-sided mounting is installed with pins 4 through holes or plates 5 with equally spaced holes that interfere with chip components 10. This figure shows the case where the pin 4 is attached to hold and fix the board 9 to prevent it from happening. Figure 10 (a+ (bj) shows the mounting of the pin 4 on the board 9 using a plate 11 with a hole so as not to interfere with the chip component 10 in accordance with the board 9 after single-sided mounting in Figures 9 (a) and (b). This shows the case where it is held and fixed.

Problems to be Solved by the Invention In the conventional configuration described above, as shown in FIGS. 7 and 8, when the thickness of the board changes, the length of the pin 4 for holding and fixing the board is adjusted to the thickness of the board. If it is not replaced as the drive unit changes, the stroke of the drive unit is constant, so if the board is thin, it will not be able to hold and fix the board, and if the board is thick, it will warp and be damaged. in this way,
Pin 4 for holding and fixing the board according to the thickness of the board
There is a problem with having to replace it. In addition, with single-sided mounting boards, it is possible to attach pins at equal intervals to hold and fix the board, but with double-sided mounting boards, the pins must be installed so that they do not interfere with the chip components after mounting. When the board is held and fixed, the board may warp or bend; in the cream solder printing process, it may cause blurring, blurring, or printing defects; In addition to coating defects, there is also the problem that chip components may be misaligned or poorly mounted during the chip component mounting process. Furthermore, as shown in FIG. 10(a) (bl), in order to securely hold and fix the board, a plate with different hole positions must be made to attach the pin 4 to each board.

The present invention solves the above-mentioned conventional problems, and even if the thickness, size, or type of the board changes, the board can be reliably held and fixed without changing the pins or the plate on which the pins are attached. The object of the present invention is to provide a substrate holding and fixing device.

Means for Solving the Problems In order to solve the above problems, a substrate holding and fixing device of the present invention includes a substrate holding and fixing device for holding and fixing a substrate at a predetermined position on a substrate transport rail. a pin that can be pressed at one end; a spring that is provided at the other end of the pin and can absorb the thickness of the article at one end of the pin; a plate to which the pin and spring are attached; and a plate that drives the plate with a constant stroke. and a fixing means for fixing the pressing position of the holding and fixing pin of the substrate.

Effect With the above configuration, the spring provided at the other end of the pin absorbs the thickness of the article at one end of the pin, and the fixing means fixes the pressing position of the pin after holding and fixing the substrate, so that the thickness of the substrate is reduced. Even if the size and type change, the board can be reliably held and fixed without replacing the pins or the plate on which the pins are attached, as in the past, making it possible to shorten replacement time and reduce costs.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.

FIGS. 1(a), 1(b), and 1(c) are a plan view of a substrate holding and fixing device showing one embodiment of the present invention, a front view showing the substrate fixed state, and a front view showing the structure. In Figure 1, 2
1 is a pin for pressing and holding the board 22 surface at one end;
23 is a plate that holds the board 22 and then fixes the pin 21;
24 is a drive unit as a fixing means for driving the plate 23 as shown by the two-dot chain line and fixing the pin 21 in the pressed position;
A spring 25 biases the end surface of the pin 21 outward, and absorbs the thickness of the board, the electronic components, the moving conveyance rail, etc. 26 is a plate to which the pin 21 and spring 25 are attached, 27 is a drive part of the plate 26, which drives the plate 26 up and down with a constant stroke;
The substrate 22 can be held and fixed via pins 21 and springs 25. Reference numeral 28 denotes a fixed-side transport rail for transporting the substrate 22, and 29 represents a movable-side transport rail movable to the width of the board 22.

FIG. 2 shows a case where a substrate 30 which is thinner than the substrate 22 in FIG. 1 is held and fixed.The spring 25 absorbs the thinner substrate 30, and the substrate 30 is pressed by the pin 21 and is held and fixed. Furthermore, FIG. 3 shows a case where a board 31 that is thicker than the board 22 in FIG. No more force than necessary is applied to the substrate 31 as it is pressed through the substrate 31. Furthermore, FIG. 4 shows a case where the double-sided mounting board 32 is held and fixed, and the thickness of the electronic component 33 is absorbed by the spring 25, and the electronic component 33 is pushed against the pin 21 by the biasing force of the spring 25. electronic component 33 and double-sided mounting board 32
Do not apply more force than necessary. Furthermore, FIG. 5 shows a narrower substrate 34 of a different size than the substrate 22 of FIG.
is held and fixed, the thickness of the movable conveyor rail 29 is absorbed by the spring 25, and the movable conveyor rail 29 is pressed via the pin 21 by the biasing force of the spring 25, and the movable conveyor rail 29 Also, no more force than necessary is applied to the substrate 34.

The operation of the above configuration will be described below.

First, after any one of the boards 22, 30, 31, 32, 34 stops at a predetermined position on the fixed side conveyance rail 28 and the movable side conveyance rail 29, the drive unit 27 or the plate 22 provided with the pin 21 and the spring 25 is raised by a certain stroke to hold and fix one of the boards 22, 30, 32, and 34, and after the spring 25 absorbs the thickness of the board, electronic components, and moving side conveyor rail, the plate 23 is driven by the drive unit 24. to fix the pin 21 at the holding and fixing position. As a result, even if the thickness, type, and size of the board changes, the board can be held and fixed securely, and defects in the solder printing process, adhesive application process, and chip component mounting process can be prevented.

Effects of the Invention As described above, according to the present invention, even if the thickness, type, and size of the board change, the thickness of the article, such as the thickness of the board, electronic components, and moving side conveyor rail, can be absorbed by the spring. Since it is possible to securely hold and fix the board, there is no need to change the pins or plates as in the conventional method, and it is possible to shorten replacement time and reduce costs.

[Brief explanation of the drawing]

Figures 1 (a), (b), and (C) are a plan view of a substrate holding and fixing device according to an embodiment of the present invention, a front view showing the substrate fixing state, and a front view showing the configuration; Figure 3 showing the holding and fixing state of the thin substrate in the fixing device.
The figure shows the state in which a thick board is held and fixed in the same board holding and fixing device. Figure 4 shows the state in which a double-sided mounting board is held and fixed in the same board holding and fixing device. Figure 5 shows the size in the same board holding and fixing device. Figure 6(a) is a diagram showing the holding and fixing states of narrow substrates with different widths (bl is a front view showing the board fixing state in a conventional board holding and fixing device, and a front view showing the configuration; FIG. 8 is a diagram showing a state in which a thin substrate is held and fixed in the substrate holding and fixing device; FIG. 8 is a diagram showing a state in which a thick substrate is held and fixed in the same substrate holding and fixing device;
FIG. 9(b) is a plan view and a front view showing the state of holding and fixing the double-sided mounting board in the same board holding and fixing device;
FIGS. 10(a) and 10(b) are a plan view and a front view of the board holding and fixing device in which the board is held and fixed by a plate to which pins are attached in accordance with the double-sided mounting board. 21...pin, 22.30, 31.32.34
...Substrate, 23...Plate, 24...
Drive unit, 25... Spring, 26... Plate, 27... Drive unit, 28... Fixed side conveyance rail, 29... Moving side conveyance rail.

Claims (1)

[Claims] 1. A board holding and fixing device for holding and fixing a board at a predetermined position on a board transport rail, the device comprising: a pin capable of pressing the board at the predetermined position at one end; and a pin provided on the other end side of the pin and provided at one end side of the pin. a spring capable of absorbing the thickness of the article; a plate to which the pin and the spring are attached; a driving means for driving the plate in a constant stroke to hold and fix the substrate via the pin; A substrate holding and fixing device comprising a fixing means for fixing a pressing position of a pin.