JP3767298B2 - Fixing method of electronic component mounting board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting substrate fixing method for holding a substrate and fixing its position in an electronic component mounting apparatus.
[0002]
[Prior art]
In an apparatus that handles an electronic component mounting board, such as an electronic component mounting apparatus or a solder printing apparatus, it is necessary to perform operations such as holding the board when the board is transported or fixing the position of the board during positioning. For example, when transported by a conveyor, the lower surface of the substrate is held by the upper surface of the conveyor, and the end surface of the substrate is sandwiched from the upper and lower surfaces when the position is fixed by a clamp. For this reason, in general, a margin portion for handling such as a clamping margin at the time of holding and fixing is set outside the original functional range of the substrate at the end portion of the substrate. Then, before the substrate is completed and before shipping as a product, the margin portion at the end is broken off from the substrate.
[0003]
[Problems to be solved by the invention]
However, since this margin portion is set for almost all types of substrates and over the entire circumference of the substrate, a huge amount of substrate edge material is generated. Since these substrate scraps are discarded as industrial waste, there is a problem that the promotion of resource saving is hindered against the request of the times for effective use of resources.
[0004]
SUMMARY OF THE INVENTION An object of the present invention is to provide a method for fixing an electronic component mounting board that can prevent the generation of substrate edge material and effectively use resources.
[0005]
[Means for Solving the Problems]
The electronic component mounting substrate fixing method according to claim 1 is a method for fixing an electronic component mounting substrate that holds a substrate on which the electronic component is mounted and fixes the position thereof, and is provided with an advancing / retracting drive mechanism on both sides of the work station. A plurality of holding members having a tapered surface with a plurality of taper surfaces are provided, and the taper surfaces of the holding members on both sides are arranged facing each other inward, and the plurality of holding members are advanced and retracted independently of each other. The substrate held in a horizontal position by the transfer arm is lowered with respect to the work station, and the side end of the substrate is brought into contact with the taper surface from above, thereby pressing the taper surface against both end surfaces of the substrate. Thus, the vertical and / or horizontal position of the substrate is fixed.
[0007]
According to the present invention, the side edge portion of the substrate in a horizontal posture is brought into contact with the tapered surface provided on the holding member from above to fix the vertical and horizontal positions of the substrate, thereby The substrate can be held without bringing the upper and lower surfaces into contact with the holding member, and the handling margin can be eliminated.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting board transfer device according to an embodiment of the present invention. FIGS. 2 and 3 are partial cross-sectional views of the electronic component mounting board transfer device according to an embodiment of the present invention. FIG. 4 is a plan view of a conventional electronic component mounting board.
[0009]
First, referring to FIG. 1, the structure of the electronic component mounting substrate transfer apparatus will be described. This transfer device is used for an apparatus that performs an operation on an electronic component mounting board, such as an electronic component mounting apparatus or a cream solder printing apparatus, and has a function of transferring and fixing the position of the board. .
[0010]
In FIG. 1, two rail members 2 a constituting a conveyance path 2 are arranged in parallel on a conveyance device 1 for an electronic component mounting board. Between the rail members 2 a, an electronic component mounting board 3 (hereinafter simply referred to as “board 3”) is conveyed in a horizontal posture, and a work station 7 is provided in the middle of the conveyance path 2. In the work station 7, the position of the substrate 3 is fixed for various operations such as an electronic component mounting operation.
[0011]
The substrate 3 shown on the upstream side (left side in FIG. 1) of the conveyance path shows a state in the middle of conveyance, and the substrate 3 is held by four conveyance claw members 5 (first holding members). FIG. 2A shows the AA cross section of FIG. 1, and the substrate 3 has two opposing side end portions on the tapered surface 5 a of the transport claw member 5 attached to the lower end portion of the transport arm 6. It is held in a state of contacting from above. The transfer arm 6 moves in the downstream direction along the transfer path 2 by a moving means (not shown). That is, the board | substrate 3 is conveyed to the work station 7, and the board | substrate 3 of completion | finish of work is carried out downstream.
[0012]
Next, fixing of the position of the substrate 3 in the work station 7 will be described. As shown in FIG. 1, a plurality of substrate fixing claw members 4 (second holding members) each having an advance / retreat drive mechanism 8 are disposed on the rail members 2 a on both sides in the work station 7. As shown in FIG. 2B, the substrate fixing claw member 4 has a shape with a tapered surface 4a, and the tapered surfaces 4a of two paired substrate fixing members 4 are directed toward the inside of the conveyance path 2. Are arranged to face each other. By driving the advance / retreat drive mechanism 8, the plurality of substrate fixing claw members 4 advance and retract independently from each other in the direction orthogonal to the transport path 2, thereby changing the interval between the two tapered surfaces 4a facing each other. It is supposed to be.
[0013]
As shown in FIG. 1 and FIG. 2B, the transfer arm 6 is moved in a state where the substrate fixing claw member 4 is advanced from both sides to a position where the side edges of the two opposing surfaces of the substrate 3 abut against the tapered surface 4a. By lowering the substrate 3 held in a horizontal posture with respect to the work station 7, the side end portion of the substrate 3 comes into contact with the tapered surface 4a from above. As a result, the vertical and horizontal positions of the substrate 3 are fixed.
[0014]
That is, if a mechanism capable of adjusting the position of the substrate fixing claw member 4 such as a linear motion mechanism combining a motor and a feed screw mechanism is employed as the advance / retreat drive mechanism 8 as shown in FIG. It is possible to accurately set the width direction interval W between the members 4. As a result, the substrate 3 having the width B is fixed in the left-right direction by the taper surface 4a of the substrate fixing claw member 4, and corresponds to the width B on the taper surface 4a by the pressing force of the substrate 3 by its own weight. The position is fixed at the height position h.
[0015]
Various operations are performed on the substrate 3 whose position is fixed in the work station 7 in this way. For example, as shown in FIG. 2B, the electronic component 12 is mounted on the substrate 3 by lowering the mounting head 10 that holds the electronic component 12 by suction with respect to the substrate 3. In the work station 7, not only the position is fixed by the substrate fixing claw member 4, but also position holding / load supporting means such as the substrate lower receiving pin 11 may be used together.
[0016]
As the forward / backward drive means, it is possible to use a type that does not perform position adjustment, for example, an air cylinder 8 'as shown in FIG. In this case, the taper surface 4a of the substrate fixing claw member 4 is made to be less susceptible to relative slip with respect to the side end portion of the substrate 3 so that the taper surface 4a is formed on the both end surfaces of the substrate 3 with an air cylinder. The position can be fixed in the vertical direction and the horizontal direction by pressing with 8 '. At this time, the conditions are set such that the substrate 3 is pressed with a predetermined load F so as not to cause warping or damage to the substrate 3.
[0017]
As described above, in the present embodiment, the holding member is brought into contact with the upper and lower surfaces of the edge of the board as conventionally used as a method for fixing the board for mounting electronic components for the purpose of transporting and holding the position. The intended holding and fixing purpose is achieved without using the method.
[0018]
As a result, as shown in FIG. 4, the outer edge of the substrate outer shape 3′a required for the original substrate function, such as a margin for clamping the edge inevitably generated in the conventional method of fixing the substrate 3 ′, is provided. It is not necessary to provide the additional portion 3′b that is simply set as a margin portion for handling. Therefore, the enormous amount of industrial waste generated by breaking off the additional portion 3′b after completion of the substrate, which has been conventionally generated, can be greatly reduced.
[0019]
【The invention's effect】
According to the present invention, the side end portion of the horizontal substrate is brought into contact with the tapered surface provided on the holding member from above to fix the vertical and horizontal positions of the substrate. The substrate can be held without contacting the upper and lower surfaces, and the industrial waste generated by removing the additional portion after the completion of the substrate can be reduced by eliminating the additional portion for handling.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting substrate transport apparatus according to an embodiment of the present invention. FIG. 2 is a partial cross-sectional view of an electronic component mounting substrate transport apparatus according to an embodiment of the present invention. FIG. 4 is a partial cross-sectional view of an electronic component mounting substrate transfer apparatus according to an embodiment of the present invention. FIG. 4 is a plan view of a conventional electronic component mounting substrate.
2 Conveying path 2a Rail member 3 Substrate 4 Substrate fixing claw member 4a Tapered surface 5 Conveying claw member 5a Tapered surface 6 Conveying arm 7 Work station 8 Advancing and retracting drive mechanism

Claims (1)

A method of fixing an electronic component mounting board for holding a board on which an electronic component is mounted and fixing the position, wherein a plurality of holding members having tapered surfaces provided with advancing and retracting drive mechanisms are arranged on both sides of the work station, The tapered surfaces of the holding members on both sides are arranged to face inward, the plurality of holding members are advanced and retracted independently of each other, and the substrate held in a horizontal posture by the transfer arm is operated on the work station. The side end portion of the substrate is brought into contact with the taper surface from above to press the taper surface against both end surfaces of the substrate to fix the vertical and / or horizontal position of the substrate. A method for fixing a substrate for mounting an electronic component, comprising:

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