JPS637867A - Apparatus for preparing electronic parts - Google Patents

Abstract

PURPOSE:To prevent the breakage of a work or the coating defect of a coating agent, by providing a means for engaging the work in the contact direction of the work and a roller between the work and a work holding means such as a clamper. CONSTITUTION:A substrate piece 8 divided from a substrate along a lateral dividing line is fed to the vicinity of an electronic part manufacturing apparatus and sucked by a vacuum chuck nozzle 2 to be sent between the upper ends of fixed and movable clampers 3a, 3b. Next, the movable clamper 3b is driven toward the fixed clamper 3a to hold the substrate piece 8 between the upper ends of said clampers. At this time, the engaging pieces 4a, 4b of the fixed and movable clampers 3a, 3b are respectively engaged with the engaging parts 9 of the substrate piece on both sides thereof and, therefore, the substrate piece 8 is not shifted in the contact direction by roller contact pressure and the holding force of the substrate piece 8 by both clampers 3a, 3b can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to an electronic component manufacturing apparatus for applying a coating agent such as a paste to a workpiece such as a piece of a substrate of a chip resistor.

(Example) Conventional technology Conventionally, for example, when forming electrodes on chip resistors, the chip resistors are arranged in a continuous strip in a vertical row (matrix and rows are broken into each row). After applying paste to the side surfaces of the board pieces, electrodes are formed, and then they are divided into individual chip resistors to produce products.The equipment for applying paste to the board pieces is shown in Figure 4. Such electronic component manufacturing equipment is known.

In FIG. 4, reference numerals 13a and 13b are clampers, and the substrate piece 18 is conveyed and held between the clampers 13a and 13b by a pair of vacuum chuck nozzles 12 and 12, which are workpiece conveyance means.

The roller 15 is provided facing the clampers 13a and 13b, is rotated by a rotary drive shaft 16, and has a paste adhered to its surface by a coating agent applying means (not shown).

The roller 15 is moved in the contact direction C so that the surface of the roller 15 comes into contact with the side surface 18b of the substrate piece 18 held between the clampers 13a and 13b, and the paste is applied. (c) Problems to be Solved by the Invention The substrate piece 18 to which the paste is applied by the above-mentioned conventional electronic component manufacturing apparatus becomes smaller as chip resistors become smaller, particularly in width and thickness. Clamper 13
Since there is a risk that the board piece may break due to the clamping force of a and 13b, it was necessary to reduce this clamping force compared to the conventional one. For reference, the dimensions of a conventional chip resistor are 3.2mm long, 1.6n+m wide, and 0.5mm thick, or 2.0mm long and 1.6mm wide. 25mm, thickness 0.5
mm long has been commonly used, but now, for example, lengths of 1 mm. 6mm, width 0.8mm, thickness 0.3m
A chip resistor of size m is required (note that
The length and thickness of the chip resistor are the width b of the board piece,
(corresponds to the thickness t). As mentioned above, the clamper 13a,
When the clamping force of 13b is reduced, the pressure when bringing the surface of roller 15 into contact with the side surface 18b of substrate piece l8 causes
Since the substrate piece 1 may be misaligned in the contact direction C, the adjustment of the contact pressure of the roller 15 against the substrate piece 18 becomes delicate and difficult. For this reason, there have been problems such as an insufficient amount of paste adhering to the side surface 18b of the board piece 18, or an excessive amount of paste adhering. In particular, if the amount of paste applied is too large, the vacuum chuck nozzles 12, 12 will suck the board piece 18, and the clamper 13a,
When the workpiece is removed from the workpiece 13b, the excess paste is sucked into the vacuum chuck nozzles 12 and 12, clogging the vacuum chuck nozzle 12, resulting in poor conveyance of the workpiece.

The present invention was made in view of the above-mentioned disadvantages, and an object of the present invention is to provide an electronic component manufacturing apparatus that does not cause breakage of workpieces such as circuit board pieces, failure to apply coating agents such as paste to workpieces, and failure to transport workpieces. It is said that

(2) Means for Solving the Problems As a means for solving the above-mentioned disadvantages, the electronic component manufacturing apparatus of the present invention provides a means for solving the above-mentioned problems.
A workpiece locking means is provided for locking the workpiece in the contact direction of the rollers.

(E) Function In the electronic component manufacturing apparatus of the present invention, the workpiece is locked to the workpiece holding means by the locking means, so even if a lateral force is applied to the workpiece due to contact with the rollers, the workpiece will not be held by the rollers. The clamping force with which the workpiece clamping means clamps the workpiece can be reduced without shifting in the contact direction.

Further, the contact pressure of the roller with respect to the workpiece can be easily adjusted.

(f) Example An example of this invention will be described based on FIGS. 1 to 3.
This will be explained below.

FIG. 1 shows an external perspective view of an electronic component manufacturing apparatus 1 according to an embodiment of the present invention. 3a and 3b are columnar fixed clampers and movable clampers, respectively, and both clampers 3a and 3
At the upper end of b, locking pieces 4a, 4 are provided so as to face each other.
b is provided protrudingly.

The movable clamper 3b is moved by a movement mechanism such as a cam mechanism.
It is moved toward the fixed clamper 3a and is configured to be able to clamp a substrate piece 8, which will be described later.

Between the fixed clamper 3a and the movable clamper 3b,
The substrate piece 8 attracted to the vacuum chuck nozzles 2, 2 is conveyed. The board piece 8 is, for example, as shown in FIG.
Resistor elements 8 a s... in a grid pattern except for both sides.
, 8a are formed, and engaging portions 9, . . . are formed on both sides.
. . , the board B on which 9 is arranged in a row is the horizontal dividing line H, . . .
・, is constructed by dividing along H. The fixed clamper 3a and the movable clamper 3 are attached to the board piece 8 so that the locking pieces 4a and 4b are inserted into the engaging parts 9 and 9 at both ends thereof.
It is held by b.

The roller 5 includes the fixed clamper 3a and the movable clamper 3b.
It is set opposite to. The roller 5 is attached to a rotary drive shaft 6 that is connected to a rotary drive source (not shown), and a paste container 7 is provided behind the roller 5 as a means for applying paste to the surface of the roller 5. This paste container 7 is
As shown in FIG. 2, a paste reservoir 7b is provided on the surface that contacts the roller 5, excluding the bottom 7a. When the roller 5 is rotated clockwise by the rotary drive shaft 6, the paste P in the paste reservoir 7b is adhered to the surface of the roller 5. At this time, the bottom portion 7a acts as a scraper, and the paste P is deposited on the surface of the roller 5 in a uniform thickness.

Next, the operation of this electronic component manufacturing apparatus 1 will be explained below.

The board pieces 8 divided from the board B along the horizontal dividing line H are as follows:
It is transported to the vicinity of the electronic component manufacturing apparatus 1 by a transport means (not shown) such as a belt, is attracted to the vacuum chuck nozzles 2, 2, and is transported between the upper ends of the fixed clamper 3a and the movable clamper 3b.

Next, the movable clamper 3b is driven toward the fixed clamper 3a, and the upper end of the fixed clamper 3a and the movable clamper 3b
Both ends of the board piece 8 are held between the upper end and the upper end. At this time, the locking pieces 4a and 4b of the fixed clamper 3a and the movable clamper 3b are respectively engaged with the engaging parts 9 and 9 at both ends of the board piece 8.

The clamping force applied by the fixed clamper 3a and the movable clamper 3b to clamp the board piece 8 is sufficient to prevent the board piece 8 from sliding downward. The board piece 8 is attached to both clampers 3a, 3
When sandwiched between the substrate pieces 8, the vacuum chuck nozzles 2, 2 temporarily stop suction and support, and move away from the substrate piece 8, as shown in FIG.

Next, the roller 5 is driven in the contact direction C by a drive mechanism (not shown) and comes into contact with the side surface 8b of the substrate piece 8, and the paste adhering to the surface of the roller 5 is transferred to the side surface 8b of the substrate piece 8.
b. At this time, since the locking pieces 4a and 4b are locked to the engaging portions 9 and 9 of the board piece 8, the board piece 8 is not displaced by the contact pressure of the roller 5. When the application of the paste to the sideways surface 8b of the substrate piece 8 is completed, the roller 5 retreats in the opposite direction to the contact direction C, and is rotated by an arbitrary angle by the rotary drive shaft 6 in preparation for the next paste application. In addition, roller 5
Instead of moving, the fixed clamper 3a and the movable clamper 3b
It may be configured to move.

Finally, the vacuum chuck nozzles 2, 2 suck and support the substrate piece 8 again, the movable clamper 3b separates from the fixed clamper 3a, and the clamping of the substrate piece 8 is released.

The board piece 8 is transported by the vacuum channel nozzles 2, 2 to another electronic component manufacturing apparatus completely similar to this electronic component manufacturing apparatus 1, and is placed on a sideways surface 8 on which paste has already been applied.
Paste is applied to the side surface 8c opposite to b. The board piece 8 with the paste applied to the horizontally inclined surfaces 8b and 8c is transported to the next step, and after electrodes are formed on the horizontally inclined surfaces 8b and 8C, the vertical dividing line ■, . . . (2) It is divided along the lines (see Figure 3) and becomes a chip resistor.

In the above embodiment, a pair of columnar clampers are used as the workpiece clamping means, and the locking pieces protruding from the clampers are locked to the engaging portions provided on the substrate, which is the workpiece. However, the present invention is not limited to this. For example, the clamper may be provided with an engaging portion, and the work piece may be provided with a locking piece.

Further, the workpiece holding means, workpiece conveyance means, coating agent application means, etc. are not limited to those shown in the above embodiments, and can be changed in design as appropriate.The workpiece is not limited to the substrate piece of a chip resistor; Since paints and the like can be used in addition to pastes, the electronic component manufacturing apparatus of the present invention is widely applicable to manufacturing various electronic components.

(g) Effects of the Invention The electronic component manufacturing apparatus of the present invention is provided with a workpiece locking means for locking the workpiece in the contact direction of the rollers between the workpiece and the workpiece holding means. Even when the workpiece held by the workpiece holding means has a small workpiece holding force, the workpiece does not shift in the contact direction of the rollers. Therefore, breakage due to the clamping force of the workpiece can be effectively prevented, and the contact pressure of the roller to the workpiece can be easily adjusted, and the amount of coating agent applied to the workpiece can be maintained at a predetermined amount. It has the advantage of effectively preventing defects.

Additionally, when a vacuum chuck is used as a means of transporting the workpiece, an excessive amount of coating material may be applied to the workpiece.
It also has the advantage of preventing poor conveyance of the workpiece caused by the vacuum chuck nozzle being blocked by the coating agent.

[Brief explanation of the drawing]

FIG. 1 is an external perspective view of an electronic component manufacturing apparatus according to an embodiment of the present invention, FIG. 2 is a vertical sectional view of the electronic component manufacturing apparatus, and FIG. 3 is a plan view of a chip resistor substrate. , FIG. 4 is an external perspective view of a conventional electronic component manufacturing apparatus. 2, 2: Vacuum chuck nozzle, 3a: Fixed clamper, 3b: Movable clamper, 4a, 4b
: Locking piece, 5: Roller, 7: Paste container, 8: Substrate piece, 9, 9: Engagement piece, C: Contact direction. Patent applicant Agent of Ku-mu Co., Ltd.
Patent Attorney Shigeru Nakamura Figure 2

Claims (2)

[Claims] (1) a workpiece clamping means for clamping a work; a roller facing the workpiece clamping means and provided so that its surface can come into contact with the workpiece clamped by the workpiece clamping means;
In an electronic component manufacturing apparatus comprising a coating agent applying means for applying a coating agent to the surface of the roller, and a work conveying means for conveying the work and attaching and detaching the work to the work clamping means, the workpiece and the workpiece clamping means are provided. An electronic component manufacturing apparatus characterized in that a workpiece locking means for locking the workpiece in the contact direction of the roller is provided between the device and the roller. (2) The work clamping means is a pair of opposing clampers, and the work locking means includes a locking piece provided on the clamper and an engaging portion provided at both ends of the workpiece. The electronic component manufacturing apparatus according to item 1.