JPH09507510A - 高いTgを有する溶融加工用ポリイミド - Google Patents
高いTgを有する溶融加工用ポリイミドInfo
- Publication number
- JPH09507510A JPH09507510A JP51755695A JP51755695A JPH09507510A JP H09507510 A JPH09507510 A JP H09507510A JP 51755695 A JP51755695 A JP 51755695A JP 51755695 A JP51755695 A JP 51755695A JP H09507510 A JPH09507510 A JP H09507510A
- Authority
- JP
- Japan
- Prior art keywords
- dianhydride
- phenylenediamine
- resin
- mol
- well
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Reinforced Plastic Materials (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.本質的に構造単位 及び 式中、Zは 及び であり、そして Qは 及び である、 からなる高いガラス転移温度を有するコポリイミド。 2.ビフェニル二無水物及び随時ピロメリト酸二無水物を1,4−ビス(4− アミノ−フェノキシ)−2−フェニルベンゼン及びm−フェニレンジアミンまた はp−フェニレンジアミンのいずれか、並びにエンド−キャッピング剤と反応さ せ、その際に少なくとも2%のモル過剰に二無水物またはジアミンが存在し、該 ピロメリト酸二無水物が0〜60モル%の二無水物を構成し、m−フェニレンジ アミンが存在すれば20〜75モル%のジアミン混合物を構成し、そしてp−フ ェニレンジアミンが存在すれば20〜70モル%のジアミン混合物を構成するこ とからなる、高いガラス転移温度及び減少された溶融粘度を有するポリイミドの 製造方法。 3.本質的に 及び 式中、Zは 及び であり、そして Qは 及び である、 からなり、ここに該AまたはB単位が少なくとも2%のモル過剰であり、そして 該モル過剰物が部分的にか、または十分に反応性もしくは非反応性エンド−キャ ッピング剤でエンド−キャッピングされる高いガラス転移温度及び減少された溶 融粘度のポリイミド。 4.請求の範囲第1または3項のいずれかに記載のポリイミドを含浸させた繊 維状強化基体からなる複合組成物。 5.二無水物成分としてのビフェニル二無水物及び随時ピロメリト酸二無水物 、ジアミン成分としての1,4−ビス(4−アミノ−フェノキシ)−2−フェニ ルベンゼン及びm−フェニレンジアミンまたはp−フェニレンジアミンのいずれ か、並びにエンド−キャッピング剤からなり、その際に少なくとも2%のモル過 剰の二無水物またはジアミン成分のいずれかが存在し、該ピロメリト酸二無水物 が0〜60モル%の二無水物成分を構成し、該m−フェニレンジアミンが存在す れば20〜75モル%のジアミン混合物を構成し、そして該p−フェニレンジア ミンが存在すれば20〜70モル%のジアミン混合物を構成する、請求の範囲第 3 項記載のポリイミドを含む溶液を製造するための先駆体組成物。 6.本質的に請求の範囲第5項記載の先駆体組成物を含浸させた繊維状強化基 体からなるプレプレグ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17233693A | 1993-12-22 | 1993-12-22 | |
US08/172,336 | 1993-12-22 | ||
US08/297,960 | 1994-08-31 | ||
US08/297,960 US5478913A (en) | 1993-12-22 | 1994-08-31 | Melt-processible polyimides with high Tg |
PCT/US1994/014678 WO1995017449A1 (en) | 1993-12-22 | 1994-12-20 | MELT-PROCESSIBLE POLYIMIDES WITH HIGH Tg |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004364720A Division JP4007991B2 (ja) | 1993-12-22 | 2004-12-16 | 高いTgを有する溶融加工用ポリイミド |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09507510A true JPH09507510A (ja) | 1997-07-29 |
Family
ID=26867985
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51755695A Withdrawn JPH09507510A (ja) | 1993-12-22 | 1994-12-20 | 高いTgを有する溶融加工用ポリイミド |
JP2004364720A Expired - Lifetime JP4007991B2 (ja) | 1993-12-22 | 2004-12-16 | 高いTgを有する溶融加工用ポリイミド |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004364720A Expired - Lifetime JP4007991B2 (ja) | 1993-12-22 | 2004-12-16 | 高いTgを有する溶融加工用ポリイミド |
Country Status (8)
Country | Link |
---|---|
US (1) | US5478913A (ja) |
EP (1) | EP0736057B1 (ja) |
JP (2) | JPH09507510A (ja) |
KR (1) | KR100235422B1 (ja) |
AU (1) | AU1553395A (ja) |
CA (1) | CA2177568C (ja) |
DE (1) | DE69406555T2 (ja) |
WO (1) | WO1995017449A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010027020A1 (ja) * | 2008-09-03 | 2010-03-11 | 株式会社カネカ | 2-フェニル-4,4’-ジアミノジフェニルエーテル類を用いた可溶性末端変性イミドオリゴマー、およびワニス、およびその硬化物、およびそのイミドプリプレグ、および耐熱性に優れる繊維強化積層板 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3389718B2 (ja) * | 1994-12-16 | 2003-03-24 | ジェイエスアール株式会社 | 液晶配向剤 |
CN1244879A (zh) * | 1996-12-05 | 2000-02-16 | 纳幕尔杜邦公司 | 具有高Tg、高TOS和低回潮率的聚酰亚胺 |
US5886131A (en) * | 1997-05-30 | 1999-03-23 | China Textile Institute | Method for preparing 1,4-Bis(4-aminophenoxy)naphthalene and its polymers |
US6222007B1 (en) * | 1998-05-29 | 2001-04-24 | The United States Of America As Represented By The National Aeronautics And Space Administration | Films, preimpregnated tapes and composites made from polyimide “Salt-like” Solutions |
US6197920B1 (en) * | 1999-07-21 | 2001-03-06 | China Textile Institute | Formulation for the production of 1, 3-bis (4-aminophenoxy) naphthalene and its polymer |
US6469126B1 (en) | 2000-12-21 | 2002-10-22 | E. I. Du Pont De Nmeours And Company | Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes |
US6476177B2 (en) | 2000-12-21 | 2002-11-05 | E. I. Du Pont De Nemours And Company | Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes |
US6444783B1 (en) | 2000-12-21 | 2002-09-03 | E. I. Du Pont De Nemours And Company | Melt-processible semicrystalline block copolyimides |
US6476182B1 (en) | 2000-12-21 | 2002-11-05 | E. I. Du Pont De Nemours And Company | Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes |
US6916544B2 (en) * | 2002-05-17 | 2005-07-12 | E. I. Du Pont De Nemours And Company | Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto |
JP2005340761A (ja) * | 2004-04-27 | 2005-12-08 | Seiko Epson Corp | 半導体装置の実装方法、回路基板、電気光学装置並びに電子機器 |
US7335608B2 (en) | 2004-09-22 | 2008-02-26 | Intel Corporation | Materials, structures and methods for microelectronic packaging |
US20070265417A1 (en) * | 2006-05-12 | 2007-11-15 | General Electric Company | Crosslinked polyimide copolymer material |
US20070265420A1 (en) * | 2006-05-12 | 2007-11-15 | General Electric Company | fiber reinforced gas turbine engine component |
US20070265422A1 (en) * | 2006-05-12 | 2007-11-15 | General Electric Company | Method for making copolymeric polyimide resins |
US20070265416A1 (en) * | 2006-05-12 | 2007-11-15 | General Electric Company | Polyimide blend with tailorable properties |
US20070265421A1 (en) * | 2006-05-12 | 2007-11-15 | General Electric Company | Method for making a prepolymer polyimide resin blend |
US8633284B2 (en) * | 2006-05-12 | 2014-01-21 | General Electric Company | Tailorable polyimide prepolymer blends, crosslinked polymides and articles formed therefrom |
US20080006970A1 (en) | 2006-07-10 | 2008-01-10 | General Electric Company | Filtered polyetherimide polymer for use as a high heat fiber material |
US9416465B2 (en) | 2006-07-14 | 2016-08-16 | Sabic Global Technologies B.V. | Process for making a high heat polymer fiber |
US9045597B2 (en) | 2013-03-18 | 2015-06-02 | Unimicron Technology Corp. | Polyimide compound having side chain and manufacturing method thereof |
KR101536398B1 (ko) * | 2013-04-24 | 2015-07-13 | 유니마이크론 테크놀로지 코퍼레이션 | 측쇄기를 갖는 디아민 단량체, 측쇄기를 갖는 폴리이미드 및 그 제조 방법 |
KR101503997B1 (ko) | 2013-04-24 | 2015-03-18 | 유니마이크론 테크놀로지 코퍼레이션 | 측쇄기를 갖는 폴리이미드 및 그 제조 방법 |
US10487177B2 (en) | 2016-08-04 | 2019-11-26 | Tetramer Technologies, Inc. | Copolymers exhibiting improved thermo-oxidative stability |
CN115521457A (zh) * | 2022-08-30 | 2022-12-27 | 宁波领科新材料科技有限公司 | 一种聚酰亚胺树脂 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4576857A (en) * | 1983-03-14 | 1986-03-18 | E. I. Du Pont De Nemours And Company | Melt-fusible polyimides |
US4725642A (en) * | 1985-04-29 | 1988-02-16 | E. I. Du Pont De Nemours And Company | Melt-fusible co-polyimide from diamine mixture |
US4913759A (en) * | 1987-04-13 | 1990-04-03 | Ethyl Corporation | Polyimide precursor and pseudo hot-melt prepregging process employing same |
US4960824A (en) * | 1988-09-26 | 1990-10-02 | General Electric Company | Storage stable polyimide precursor solutions and method of preparation |
US5059273A (en) * | 1989-10-26 | 1991-10-22 | E. I. Du Pont De Nemours And Company | Process for preparing polyimide composites |
US5177180A (en) * | 1990-08-07 | 1993-01-05 | General Electric Company | High temperature mixed polyimides and composites formed therefrom |
US5328979A (en) * | 1992-11-16 | 1994-07-12 | The University Of Akron | Thermoplastic copolyimides and composites therefrom |
-
1994
- 1994-08-31 US US08/297,960 patent/US5478913A/en not_active Expired - Lifetime
- 1994-12-20 KR KR1019960703327A patent/KR100235422B1/ko not_active IP Right Cessation
- 1994-12-20 JP JP51755695A patent/JPH09507510A/ja not_active Withdrawn
- 1994-12-20 WO PCT/US1994/014678 patent/WO1995017449A1/en active IP Right Grant
- 1994-12-20 CA CA 2177568 patent/CA2177568C/en not_active Expired - Fee Related
- 1994-12-20 EP EP19950907235 patent/EP0736057B1/en not_active Expired - Lifetime
- 1994-12-20 DE DE1994606555 patent/DE69406555T2/de not_active Expired - Lifetime
- 1994-12-20 AU AU15533/95A patent/AU1553395A/en not_active Abandoned
-
2004
- 2004-12-16 JP JP2004364720A patent/JP4007991B2/ja not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010027020A1 (ja) * | 2008-09-03 | 2010-03-11 | 株式会社カネカ | 2-フェニル-4,4’-ジアミノジフェニルエーテル類を用いた可溶性末端変性イミドオリゴマー、およびワニス、およびその硬化物、およびそのイミドプリプレグ、および耐熱性に優れる繊維強化積層板 |
JP5522479B2 (ja) * | 2008-09-03 | 2014-06-18 | 株式会社カネカ | 2−フェニル−4,4’−ジアミノジフェニルエーテル類を用いた可溶性末端変性イミドオリゴマー、およびワニス、およびその硬化物、およびそのイミドプリプレグ、および耐熱性に優れる繊維強化積層板 |
US8846552B2 (en) | 2008-09-03 | 2014-09-30 | Kaneka Corporation | Soluble terminally modified imide oligomer using 2-phenyl-4, 4′-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistance |
Also Published As
Publication number | Publication date |
---|---|
KR100235422B1 (ko) | 1999-12-15 |
CA2177568A1 (en) | 1995-06-29 |
EP0736057B1 (en) | 1997-10-29 |
CA2177568C (en) | 2005-07-05 |
DE69406555T2 (de) | 1998-05-07 |
JP2005089766A (ja) | 2005-04-07 |
JP4007991B2 (ja) | 2007-11-14 |
AU1553395A (en) | 1995-07-10 |
DE69406555D1 (de) | 1997-12-04 |
US5478913A (en) | 1995-12-26 |
EP0736057A1 (en) | 1996-10-09 |
WO1995017449A1 (en) | 1995-06-29 |
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