JPH09501016A - 馴染み性の良好な伝熱性界面材料 - Google Patents

馴染み性の良好な伝熱性界面材料

Info

Publication number
JPH09501016A
JPH09501016A JP7504659A JP50465995A JPH09501016A JP H09501016 A JPH09501016 A JP H09501016A JP 7504659 A JP7504659 A JP 7504659A JP 50465995 A JP50465995 A JP 50465995A JP H09501016 A JPH09501016 A JP H09501016A
Authority
JP
Japan
Prior art keywords
heat
metal mesh
expanded metal
heat conductive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7504659A
Other languages
English (en)
Japanese (ja)
Inventor
ソーントン，スティーブン・エル
Original Assignee
コメリクス・インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コメリクス・インコーポレーテッド filed Critical コメリクス・インコーポレーテッド
Publication of JPH09501016A publication Critical patent/JPH09501016A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/04—Inorganic
    • B32B2266/045—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP7504659A 1993-07-14 1994-07-11 馴染み性の良好な伝熱性界面材料 Pending JPH09501016A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9149793A 1993-07-14 1993-07-14
US08/091,497 1993-07-14
PCT/US1994/007793 WO1995002505A1 (en) 1993-07-14 1994-07-11 Conformal thermally conductive interface material

Publications (1)

Publication Number Publication Date
JPH09501016A true JPH09501016A (ja) 1997-01-28

Family

ID=22228091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7504659A Pending JPH09501016A (ja) 1993-07-14 1994-07-11 馴染み性の良好な伝熱性界面材料

Country Status (5)

Country Link
EP (1) EP0710178A4 (online.php)
JP (1) JPH09501016A (online.php)
KR (1) KR960703723A (online.php)
TW (1) TW257887B (online.php)
WO (1) WO1995002505A1 (online.php)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012029560A1 (ja) * 2010-08-31 2012-03-08 ポリマテック株式会社 熱伝導性シート
US20250098116A1 (en) * 2023-09-18 2025-03-20 Tclad Technology Corporation Thermally conductive board

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6143076A (en) * 1996-06-21 2000-11-07 Thermalloy Inc. Applicator head
US6059116A (en) * 1996-06-21 2000-05-09 Thermalloy, Inc. Heat sink packaging devices
WO1997048957A1 (en) * 1996-06-21 1997-12-24 Thermalloy, Inc. Pre-application of grease to heat sinks with a protective coating
KR19990036429A (ko) * 1996-06-21 1999-05-25 마크 씨. 멜링거 보호코팅으로 열싱크에 그리스를 예비적용하는 방법
AU2051001A (en) * 1999-12-01 2001-06-12 Chip Coolers, Inc Structural frame of thermally conductive material
AU2002229042A1 (en) 2000-12-12 2002-06-24 Shri Diksha Corporation Lightweight circuit board with conductive constraining cores
US6512295B2 (en) 2001-03-01 2003-01-28 International Business Machines Corporation Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses
JP4062994B2 (ja) * 2001-08-28 2008-03-19 株式会社豊田自動織機 放熱用基板材、複合材及びその製造方法
CN100370210C (zh) * 2002-11-06 2008-02-20 徐惠群 填满热传导件间间隙的方法及其热传导件结构
USRE45637E1 (en) 2005-08-29 2015-07-28 Stablcor Technology, Inc. Processes for manufacturing printed wiring boards
US7730613B2 (en) 2005-08-29 2010-06-08 Stablcor, Inc. Processes for manufacturing printed wiring boards
US8203080B2 (en) 2006-07-14 2012-06-19 Stablcor Technology, Inc. Build-up printed wiring board substrate having a core layer that is part of a circuit
DE102008047649B4 (de) * 2008-09-15 2011-03-31 Gerhard Menninga Platte zum Ausgleichen von Wärme in einer Leiterplatte und zum Abführen von Wärme von einer Leiterplatte und Anordnung einer solchen Platte mit einer Leiterplatte
JP2013220652A (ja) * 2012-04-19 2013-10-28 Three M Innovative Properties Co 遮熱シート
DE102013208653A1 (de) * 2013-05-10 2014-11-13 Sts Spezial-Transformatoren-Stockach Gmbh & Co. Kg Induktives Bauteil
US9332632B2 (en) 2014-08-20 2016-05-03 Stablcor Technology, Inc. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards
WO2020211930A1 (en) * 2019-04-16 2020-10-22 Huawei Technologies Co., Ltd. A device for transferring heat between a first unit and a second unit
EP4024589A1 (en) * 2020-12-31 2022-07-06 3M Innovative Properties Company Thermal barrier assemblies containing insulation pastes

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4037009A (en) * 1976-08-11 1977-07-19 Metex Corporation Conductive elastomeric elements
JPS5724456Y2 (online.php) * 1977-09-09 1982-05-27
US4685987A (en) * 1983-09-02 1987-08-11 The Bergquist Company Method of preparing interfacings of heat sinks with electrical devices
US4900877A (en) * 1987-01-13 1990-02-13 Raychem Corporation Shielding and sealing gaskets
US4869954A (en) * 1987-09-10 1989-09-26 Chomerics, Inc. Thermally conductive materials
JPH01173514A (ja) * 1987-12-25 1989-07-10 Shin Etsu Chem Co Ltd 熱伝導性電気絶縁シート及びその製造方法
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012029560A1 (ja) * 2010-08-31 2012-03-08 ポリマテック株式会社 熱伝導性シート
JP5933441B2 (ja) * 2010-08-31 2016-06-08 ポリマテック・ジャパン株式会社 熱伝導性シート
JP2016154264A (ja) * 2010-08-31 2016-08-25 ポリマテック・ジャパン株式会社 熱伝導性シート
US20250098116A1 (en) * 2023-09-18 2025-03-20 Tclad Technology Corporation Thermally conductive board

Also Published As

Publication number Publication date
TW257887B (online.php) 1995-09-21
EP0710178A1 (en) 1996-05-08
WO1995002505A1 (en) 1995-01-26
KR960703723A (ko) 1996-08-31
EP0710178A4 (en) 1997-06-11

Similar Documents

Publication Publication Date Title
US4869954A (en) Thermally conductive materials
US4602678A (en) Interfacing of heat sinks with electrical devices, and the like
AU723258B2 (en) Conformal thermal interface material for electronic components
US4471837A (en) Graphite heat-sink mountings
KR100852070B1 (ko) 유도된 결합성을 갖는 상 변화 열 인터페이스 조성물
US4685987A (en) Method of preparing interfacings of heat sinks with electrical devices
US5213868A (en) Thermally conductive interface materials and methods of using the same
CN100402626C (zh) 导热性组合物及使用其的腻子状散热片和散热结构体
JP3498823B2 (ja) 放熱スペーサーおよびその用途
TW200409246A (en) Thermal interconnect and interface systems, methods of production and uses thereof
US20020012762A1 (en) Double-side thermally conductive adhesive tape for plastic-packaged electronic components
EP1389801A2 (en) Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
US20040226707A1 (en) Method of manufacturing an elastomeric heat sink with a pressure sensitive adhesive backing
EP0710178A1 (en) Conformal thermally conductive interface material
JP3182257B2 (ja) 放熱シート
TWI224384B (en) Heat-dissipating member, manufacturing method and installation method
WO2003064148A1 (en) Thermal interface materials
JP2001089756A (ja) 相変化熱仲介材料
JP2009524246A (ja) 熱相互接続及びインターフェースのシステムと、その製造法及び使用法
KR20020070449A (ko) 열 전도성 시이트 및 이 시이트의 제조 방법
JP2020002236A (ja) 熱伝導性シリコーン組成物、熱伝導性シリコーンシート及びその製造方法
JP2004311577A (ja) 熱伝導性複合シートおよびその製造方法
JP2002003830A (ja) 高熱伝導性組成物とその用途
JP2001203313A (ja) 熱伝導基板およびその製造方法
JP2002164481A (ja) 熱伝導性シート