JPH09500236A - 薄膜太陽電池用の統合集積化レーザ構造化方法 - Google Patents
薄膜太陽電池用の統合集積化レーザ構造化方法Info
- Publication number
- JPH09500236A JPH09500236A JP7504856A JP50485695A JPH09500236A JP H09500236 A JPH09500236 A JP H09500236A JP 7504856 A JP7504856 A JP 7504856A JP 50485695 A JP50485695 A JP 50485695A JP H09500236 A JPH09500236 A JP H09500236A
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- Prior art keywords
- electrode
- semiconductor layer
- laser
- solar cell
- irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims description 64
- 239000004065 semiconductor Substances 0.000 claims abstract description 77
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 230000008859 change Effects 0.000 claims abstract description 13
- 238000010521 absorption reaction Methods 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 13
- 230000008021 deposition Effects 0.000 claims description 10
- 239000007789 gas Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 229910000676 Si alloy Inorganic materials 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910000927 Ge alloy Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 31
- 210000004027 cell Anatomy 0.000 description 80
- 230000008569 process Effects 0.000 description 11
- 230000006378 damage Effects 0.000 description 8
- 238000002679 ablation Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 3
- 229910052951 chalcopyrite Inorganic materials 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- AKUCEXGLFUSJCD-UHFFFAOYSA-N indium(3+);selenium(2-) Chemical compound [Se-2].[Se-2].[Se-2].[In+3].[In+3] AKUCEXGLFUSJCD-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000013532 laser treatment Methods 0.000 description 2
- 238000010297 mechanical methods and process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 description 2
- 229940065287 selenium compound Drugs 0.000 description 2
- 150000003343 selenium compounds Chemical class 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 229910000878 H alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- RPPBZEBXAAZZJH-UHFFFAOYSA-N cadmium telluride Chemical compound [Te]=[Cd] RPPBZEBXAAZZJH-UHFFFAOYSA-N 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- -1 indium metal oxide Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000002688 persistence Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
- H01L31/0463—PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/202—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic Table
- H01L31/204—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic Table including AIVBIV alloys, e.g. SiGe, SiC
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.薄膜太陽電池の直列形相互接続(インターコネクション)方法において、 下記の方法ステップを有し、 a)透明基板(S)上に透明なフロント(前面)電極(FE)を面全体に亘って 堆積(デポジション)するステップ: b)電極層(FE)をn形電極ストリップ(FE1,2...n)に細分化する ストリップ、( c)光起電力効果的にアクティブな薄膜半導体層(HL)を面全体に亘り堆積( デポジション)するステップ、 d)バッキング(後方)電極(RE)に前面全体に亘り堆積(デポジション)す るステップ e)サブストレート(基体)(S)及び電極ストリップ(FE1,2...)を 通して半導体層(HL)へレーザ照射を実施するステップであって、ここで、上 記のレーザ照射は、所定の波長(λ1)のもとで電極ストリップ(FE1,2. ..)の縁(EK)に対してパラレル(並行)な方向に、そして、それの付近に て実施され、上記の所定の波長に対して半導体層は強い吸収を呈し、ここにおい て、第1の領域(D1)にて半導体層(HL)の狭幅のストリップがその上方に あるバッキング(後方)電極(RE)と共にアブレー ション除去され、半導体層のストリップ状の構造化(リボン状のパターニング) が電極ストリップ(FE1,..n)に相応して得られるようにしたステップ、 f)第2領域(D2)にて半導体層への第2の照射(W2)を実施するステップ であって、上記第2領域にてバッキング電極(RE)はフロント(前面)電極の それぞれ隣接する電極ストリップと重なっており(オーバーラップしており)、 ここで、半導体層における相変化により低オーム領域(NB)が形成されるよう にしたことを特徴とする薄膜太陽電池用の統合集積化レーザ構造化方法。 2.上記の第2の照射(W2)の実施の際半導体層(HL)では第一レーザ照 射(W1)におけるよりわずかな吸収度が得られるように構成されている請求の 範囲1記載の方法。 3.第1及び第2(レーザ)照射を異なった波長(λ1,λ2)のもとで実施 し、ここで半導体層(HL)はλ1に対してはλ2に対するよりも高い吸収度を 有する請求のはに1又は2記載の方法。 4.第1及び第2照射(W1,W2)は1つの作動工程にて、そして非対称的 なビームプロフアィルを有するレーザを以て実施される請求の範囲1又は2記載 の方法。 5.方法ステップc)にてアモルファスの水素含有のシリコン/ゲルマニウム 合金a−Si1-xG eX:H(1 >x≦0)を半導体層(HL)として被着し、そして、第2のレーザ照射(W2 )を実施するに際して、ガス飛散のもとで相変化にによりマイクロ(微細)結晶 のシリコン/ゲルマニウム合金Sil-xG eXが生ぜしめられるようにした請求の 範囲1から4までのうちいずれか1項記載の方法。 6.半導体層(HL)として組成CuIn1-xG axS1-yS ey(0≦x ,y≦1)のカルコパイライト(chalkpyrite)(酸素族−硫化物) が生ぜしめられ、そして第2レーザ照射を実施するに際して、揮発性のセレン化 合物のガス飛散により、2元のCu2S e又はCu2Sが半導体層(HL)の低 オーム領域(NE)の形成下で濃厚化されるようにした請求の範囲1から4まで のうちいずれか1項記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4324318.5 | 1993-07-20 | ||
DE4324318A DE4324318C1 (de) | 1993-07-20 | 1993-07-20 | Verfahren zur Serienverschaltung einer integrierten Dünnfilmsolarzellenanordnung |
PCT/DE1994/000803 WO1995003628A1 (de) | 1993-07-20 | 1994-07-12 | Integriertes laserstrukturierungsverfahren für dünnfilmsolarzellen |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09500236A true JPH09500236A (ja) | 1997-01-07 |
JP3414738B2 JP3414738B2 (ja) | 2003-06-09 |
Family
ID=6493264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50485695A Expired - Fee Related JP3414738B2 (ja) | 1993-07-20 | 1994-07-12 | 薄膜太陽電池用の集積化レーザパターニング方法 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0710402B1 (ja) |
JP (1) | JP3414738B2 (ja) |
DE (2) | DE4324318C1 (ja) |
FI (1) | FI117608B (ja) |
WO (1) | WO1995003628A1 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6184058B1 (en) | 1997-10-24 | 2001-02-06 | Sharp Kabushiki Kaisha | Integrated thin film solar battery and method for fabricating the same |
JP2001274446A (ja) * | 2000-03-23 | 2001-10-05 | Kanegafuchi Chem Ind Co Ltd | 集積型ハイブリッド薄膜太陽電池の製造方法 |
WO2007043219A1 (ja) * | 2005-10-13 | 2007-04-19 | Honda Motor Co., Ltd. | 太陽電池およびその製造方法 |
WO2007049384A1 (ja) * | 2005-10-27 | 2007-05-03 | Honda Motor Co., Ltd. | 太陽電池 |
WO2007086521A1 (ja) * | 2006-01-30 | 2007-08-02 | Honda Motor Co., Ltd. | 太陽電池およびその製造方法 |
US20080216895A1 (en) * | 2006-05-25 | 2008-09-11 | Honda Motor Co., Ltd. | Chalcopyrite solar cell and method of manufacturing the same |
JP2010282998A (ja) * | 2009-06-02 | 2010-12-16 | Seiko Epson Corp | 太陽電池、太陽電池の製造方法 |
JPWO2009150980A1 (ja) * | 2008-06-09 | 2011-11-17 | 三菱電機株式会社 | 薄膜光電変換装置およびその製造方法 |
KR101425890B1 (ko) * | 2007-12-26 | 2014-08-04 | 주성엔지니어링(주) | 박막형 태양전지 및 그 제조방법 |
CN113707546A (zh) * | 2021-08-16 | 2021-11-26 | 成都莱普科技有限公司 | 一种选择性激光退火形成半导体器件欧姆接触的方法 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10017610C2 (de) | 2000-03-30 | 2002-10-31 | Hahn Meitner Inst Berlin Gmbh | Verfahren zur Herstellung eines Solarmoduls mit integriert serienverschalteten Dünnschicht-Solarzellen und Verwendung davon |
TWI226139B (en) | 2002-01-31 | 2005-01-01 | Osram Opto Semiconductors Gmbh | Method to manufacture a semiconductor-component |
DE10203795B4 (de) * | 2002-01-31 | 2021-12-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Halbleiterbauelements |
US8524573B2 (en) | 2003-01-31 | 2013-09-03 | Osram Opto Semiconductors Gmbh | Method for separating a semiconductor layer from a substrate by irradiating with laser pulses |
TWI426615B (zh) * | 2007-12-21 | 2014-02-11 | Jusung Eng Co Ltd | 薄膜型太陽能電池及其製造方法 |
US20100078064A1 (en) * | 2008-09-29 | 2010-04-01 | Thinsilicion Corporation | Monolithically-integrated solar module |
WO2010086042A1 (en) * | 2009-01-29 | 2010-08-05 | Applied Materials Inc. | Scribing device and method of producing a thin-film solar cell module |
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- 1994-07-12 DE DE59410443T patent/DE59410443D1/de not_active Expired - Lifetime
- 1994-07-12 EP EP94920402A patent/EP0710402B1/de not_active Expired - Lifetime
- 1994-07-12 JP JP50485695A patent/JP3414738B2/ja not_active Expired - Fee Related
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WO2007049384A1 (ja) * | 2005-10-27 | 2007-05-03 | Honda Motor Co., Ltd. | 太陽電池 |
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JPWO2009150980A1 (ja) * | 2008-06-09 | 2011-11-17 | 三菱電機株式会社 | 薄膜光電変換装置およびその製造方法 |
JP5174900B2 (ja) * | 2008-06-09 | 2013-04-03 | 三菱電機株式会社 | 薄膜光電変換装置およびその製造方法 |
US9711669B2 (en) | 2008-06-09 | 2017-07-18 | Mitsubishi Electric Corporation | Thin-film photoelectric converter |
JP2010282998A (ja) * | 2009-06-02 | 2010-12-16 | Seiko Epson Corp | 太陽電池、太陽電池の製造方法 |
CN113707546A (zh) * | 2021-08-16 | 2021-11-26 | 成都莱普科技有限公司 | 一种选择性激光退火形成半导体器件欧姆接触的方法 |
Also Published As
Publication number | Publication date |
---|---|
EP0710402A1 (de) | 1996-05-08 |
FI960272A (fi) | 1996-01-19 |
EP0710402B1 (de) | 2006-10-18 |
DE59410443D1 (de) | 2006-11-30 |
FI117608B (fi) | 2006-12-15 |
DE4324318C1 (de) | 1995-01-12 |
JP3414738B2 (ja) | 2003-06-09 |
FI960272A0 (fi) | 1996-01-19 |
WO1995003628A1 (de) | 1995-02-02 |
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