JPH0919882A - Work suction pad - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a suction pad which can attract a work with no risk of sideways dislocation. SOLUTION: A suction pad 1 for work concerned has a pad body 2 equipped with a suction mouth 4 to attract by vacuum the surface of a work and a work fixing rib 6 which is provided in the central part of the suction mouth 4 as protruding from the sucking plane S of the mouth 4 and arranged as displaceable inward from the sucking plane S. The rib 6 is supported by a support arm 5 extended from the pad body 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique effectively applied to a work suction pad capable of sucking a work without displacement.

[0002]

2. Description of the Related Art Nowadays, when automation in a factory is promoted, a work such as a semiconductor package is carried by an automatic carrying device, for example, from a tray to an inspection socket or from a tray to a mounting board. As an example that describes such a work transfer technique in detail, for example,
Published by Industrial Research Institute, "Electronic Materials Separate Volume, VLSI Manufacturing, Test Equipment Guidebook", 1995 edition (issued November 25, 1994),
There are P141 to P145.

Here, a work suction pad called an IC handler is used for transportation in the case of a semiconductor package. This IC handler vacuum-sucks the surface of a semiconductor package with a suction port and conveys it. The semiconductor package is conveyed to a destination such as an inspection socket while being sucked by the IC handler, and is sucked after being mounted. The force is released, which completes the series of transfer processes.

[0004]

However, such an I
In the C-handler, the work is momentarily hit and picked up. This is an IC when the work is lightweight.
It will be adsorbed in a state in which the handler is laterally offset.

In the case where a work must be accurately positioned and mounted at the destination such as a semiconductor package, even if the lateral displacement is slight, it causes a big problem. For example, when the work is inserted into an inspection socket, If the semiconductor package is inserted in a misaligned state, the corners of the semiconductor package may come into contact with the socket guide, or the leads may ride on the contact pins of the inspection socket.
This problem becomes more serious because the positioning becomes delicate as the fine pitch is promoted in accordance with the tendency of the semiconductor package to have more pins.

Further, in the case of transporting from tray to tray, there is a situation in which the semiconductor package rides on a rib for fixing the lead due to a positional deviation at the time of suction, which adversely affects the quality of the semiconductor package itself such as lead bending. is assumed.

In order to solve the problem caused by such positional displacement, it is possible to use a CCD camera or the like to perform positioning at the time of mounting by image processing technology, or to introduce highly accurate equipment by a transport system. However, a large amount of investment is required, which leads to higher costs.

Therefore, an object of the present invention is to provide a work suction pad capable of suctioning a work without lateral displacement.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0010]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the work suction pad according to the present invention is provided with a pad body having a suction port for vacuum-sucking the surface of the work, and a central portion of the suction port protruding from the suction surface of the suction port. The work fixing rib is provided so as to be displaceable inward from the suction surface.
The work fixing rib is supported by a support arm that extends from the pad body.

In this case, the work fixing rib may be spherical. Further, the work suction pad can be made of rubber.

A semiconductor package can be applied to the work to be attracted.

[0014]

According to the work suction pad having the above-mentioned structure, the work fixing rib prevents the work from being sucked at once in such a manner that the work is struck. It can be adsorbed and held.

If the work fixing rib is spherical, the work and the work fixing rib are in point contact with each other, so that the lateral deviation can be prevented more effectively.

[0016]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for explaining the embodiments, the same members are designated by the same reference numerals, and the repeated description thereof will be omitted.

(Embodiment 1) FIG. 1 is a perspective view showing a work suction pad which is an embodiment of the present invention, and FIG. 2 is a line II-II in FIG.
3 to 5 are cross-sectional views along the line, and FIGS. 3 to 5 are explanatory views successively showing the suction operation by the work suction pad of FIG.

As shown in FIG. 1, a work suction pad 1 according to this embodiment is integrally formed of rubber, for example, and a pad body 2 has a suction port for vacuum-sucking the surface of a work such as a semiconductor package 3. 4 spreads outward and is formed in a cup shape. From the inner wall of the pad body 2, for example, three support arms 5 are formed to extend toward the center, and a work fixing rib 6 is provided at the center of the suction port 4 so as to be supported by the support arms 5. positioned.

As shown in the figure, the work fixing rib 6 has a cylindrical shape, and the support arm 5 is integrally attached to the peripheral surface of the work fixing rib 6. As shown in FIG. 2, the work fixing rib 6 is formed so as to protrude from the suction surface S of the suction port 4 by the protrusion amount D. Therefore, when the work suction pad 1 approaches the work,
The tip end surface of the work fixing rib 6 comes into contact with the work first. The work fixing rib 6 can be displaced inwardly of the suction surface S by the support arm 5.

One end of a bendable metal tube 10 connected to a vacuum pump 9 is inserted into a tube connection port 8 formed in the base portion 7 of the pad body 2 and communicating with the suction port 4. . When the work is attracted to the suction surface S by the vacuum pump 9, the protruding work fixing rib 6 is displaced inward by the pressing force generated by the suction of the work.

The work suction operation by the work suction pad 1 will be described with reference to FIGS. In the present embodiment, the semiconductor package 3 is used for the work that is the attracted member.

For example, a QFP (Quad Flat Packa) mounted at a predetermined position on the tray 11 by the positioning protrusion 11a.
When the workpiece suction pad 1 is approached to the ge) type semiconductor package 3 with the suction port 4 facing, as shown in FIG. Contact the surface. Therefore, the semiconductor package 3 is pressed against the tray 11 by the work fixing rib 6. Then, the work fixing rib 6
When the semiconductor package reaches the semiconductor package, the vacuum pump 9
The suction operation by (FIG. 2) is started. The semiconductor package 3 to be transported is not limited to the QFP type and can be applied to various other types of semiconductor packages.

When the approach is further continued, the semiconductor package 3 is kept pressed by the work fixing ribs 6 toward the tray 11, while the work fixing ribs 6 are displaced inward. . And, as shown in FIG.
When the semiconductor package 3 is finally sucked by the work suction pad 1, the work fixing rib 6 is located inside the suction surface S (FIG. 2). Here, since the semiconductor package 3 is being pressed toward the tray 11 side by the work fixing rib 6 until it is adsorbed, the semiconductor package 3 is
Is not sucked to the work suction pad 1 at once, as it is hit by the vacuum suction force. The pressing force of the work fixing rib 6 against the semiconductor package 3 can be freely adjusted by changing the number, thickness, or shape of the support arms 5.

The semiconductor package 3 sucked by the work suction pad 1 rises as shown in FIG. 5, and the suction force is released when the semiconductor package 3 reaches a predetermined destination such as an inspection socket. It should be noted that the transport destination is, for example, the tray 11.
In the case where the semiconductor package 3 is to be placed as in the above, the pressing force of the work fixing rib 6 that presses the semiconductor package 3 against the tray 11 side is generated again by the release of the suction force. Displacement is prevented.

As described above, according to the work suction pad 1 of the present embodiment, it is possible to prevent a light work such as the semiconductor package 3 from being struck by the action of the work fixing rib 6 to cause lateral displacement. The work can be accurately positioned and mounted at the destination.

(Embodiment 2) FIG. 6 is a perspective view showing a work suction pad according to another embodiment of the present invention, and FIG. 7 is an explanatory view showing a suction operation by the work suction pad of FIG.

As shown in FIG. 6, in the work suction pad 21 of the present embodiment, the work fixing rib 26 located at the center of the suction port 24 of the pad body 22 is spherical, and the work suction pad 21 in the first embodiment described above. It is different from the one.

In such a work suction pad 21, as shown in FIG. 7, the work such as the semiconductor package 3 and the work fixing rib 26 come into point contact with each other at the time of suction, so that the lateral displacement is prevented more effectively. Become so.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the work suction pads 1 and 21 in this embodiment are made of rubber, but the work fixing ribs 6 and 2 are used.
Support arm 5 to the extent that 6 can be displaced inward
Does not have to be made of rubber as long as it has an elastic force and the pad bodies 2 and 22 can adhere to the work.

Further, in the present embodiment, the work suction pads 1 and 21 are used as a part of the transport system of the semiconductor package 3, but they can be applied to various other devices that handle the semiconductor package 3, such as a handler. You can

Further, in the above description, the case where the invention mainly made by the present inventor is applied to the adsorption of the semiconductor package 3 which is the field of application which is the background of the invention has been described, but the invention is not limited thereto. The present invention can be applied to various other work transfer fields that require precise positioning such that even slight lateral deviation is a problem. Therefore, the work need not be the semiconductor package 3.

[0033]

The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows.

(1) That is, according to the work suction pad of the present invention, the work fixing ribs prevent the work from being sucked at once so that the work can be laterally displaced even if it is a light work. Instead, it can be held by suction on the work suction pad. This makes it possible to accurately position and mount the work.

(2). And the accurate positioning of the work
Since it can be realized with an extremely simple structure of forming a protruding work fixing rib on the work suction pad,
There is no need for expensive investment such as positioning due to the introduction of image processing technology, and there is no increase in cost.

(3) If the work fixing rib is spherical, the work and the work fixing rib are in point contact with each other, so that the lateral deviation can be prevented more effectively.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a work suction pad according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along the line II-II of FIG.

FIG. 3 is an explanatory view showing a part of a suction operation by the work suction pad of FIG.

FIG. 4 is an explanatory diagram showing a suction operation subsequent to FIG. 3 by the work suction pad of FIG. 1.

5 is an explanatory view showing a suction operation subsequent to FIG. 4 by the work suction pad of FIG.

FIG. 6 is a perspective view showing a work suction pad according to a second embodiment of the present invention.

FIG. 7 is an explanatory view showing a suction operation by the work suction pad of FIG.

[Explanation of symbols]

 1 Work Adsorption Pad 2 Pad Body 3 Semiconductor Package 4 Adsorption Port 5 Support Arm 6 Work Fixing Rib 7 Base 8 Tube Connection Port 9 Vacuum Pump 10 Tube 11 Tray 11a Positioning Protrusion 21 Work Adsorption Pad 22 Pad Body 24 Adsorption Port 26 Work Fixing Rib D Projection amount S Suction surface

Claims (4)

[Claims] 1. A pad body having a suction port for vacuum-sucking the surface of a work, and a central portion of the suction port, which is provided so as to project from a suction surface of the suction port and is displaced inward from the suction surface. A work suction pad comprising: a work fixing rib that is provided so as to be possible; and a support arm that extends from the pad body and supports the work fixing rib. 2. The work suction pad according to claim 1, wherein the work fixing rib has a spherical shape. 3. The work suction pad according to claim 1 or 2, wherein the work suction pad is made of rubber. 4. The work suction pad according to claim 1, 2 or 3, wherein the work is a semiconductor package.