JP2000174108A - Work grasping device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a work from falling in an unstable posture by fixing a plate spring with a grasping member at the upper, by installing the lower so flexible as to be bent by a load of the work during grasping operation, and by grasping the work by the elasticity of the plate spring and nails of the grasping member. SOLUTION: A grasping chip 10 forms a horizontal nail 12 facing the inside and supporting a ball grid array(BGA) package 13 at the lower terminal, and forms a notch 15 for clearance of a plate spring 11 at a lower central part of the grasping chip 10 where the plate spring 11 is bent by a load of grasping operation. Additionally, the plate spring 11 is so fixed with the grasping chip 10 by fixing bolts 14 at the upper part as the terminal to locate at about same position of terminal of nails 12 in an unloaded state, and the lower part is installed so flexible as to be bent by a load form the BGA package 13 as a work during grasping operation to grasp the BGA package 13 by the elasticity of the plate spring 11 and the nails 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a work holding device, and was developed mainly for a work holding device such as a BGA (ball grid array) package in a ball mount device.

[0002]

2. Description of the Related Art At present, with the speeding up of a ball mounting apparatus, the speed at which a work is conveyed is also increasing, and it has become necessary to securely grip the work in pick and place of the work. However, in the conventional work gripping device, the work is not fixed in the vertical direction only by gripping the work with the claw, and when the cycle speed is increased, the work is moved by the clearance between the left and right claws and the work when the movement starts or stops. Move,
This has caused the displacement of the solder balls on the work.

[0003] In addition, there is a variation (0
When the workpiece gripping member is opened, the workpiece falls off the claw of one of the workpiece gripping members, causing the workpiece to drop in an unstable posture. There was sometimes. Therefore, it is necessary to provide a guide in order to prevent the work from remaining on the claws of the one gripping member and dropping in an unstable posture.

[0004]

SUMMARY OF THE INVENTION According to the present invention, when a leaf spring is attached to a pawl of a workpiece gripping member of a workpiece gripping device, when the workpiece is clamped by the workpiece gripping member, the leaf spring deflects to move the workpiece downward. Provided is a work gripping device capable of preventing a work from falling in an unstable posture when a work holding member is opened by applying a holding gripping force and a leaf spring functions as a conventional guide when the work holding member is opened. It is intended for.

[0005]

SUMMARY OF THE INVENTION The present invention relates to a work gripping device comprising left and right gripping members formed at opposing ends with horizontal claws for supporting the workpiece so as to be able to grip the workpiece. The leaf spring is fixed to the holding member at the upper part, and the lower part is installed so as to be bent by the load from the work at the time of the holding operation, and the work is held by the elasticity of the leaf spring and the claw of the holding member. A work holding device is provided.

[0006]

Embodiments of the present invention will be described below with reference to the illustrated embodiments. FIG. 1 is an explanatory view showing the entirety of a ball mounting apparatus to which the present invention is applied. In the illustrated embodiment, the ball mounting device is a BGA solder ball mounting device.

The BGA solder ball mounting device includes a flux supply unit 1 for transferring a flux to a BGA package 13 serving as a work, a ball mount unit 2 for mounting a solder ball on the BGA package 13, and a proper ball mounting. A mount inspection unit 3 for inspecting whether or not the BGA package 13 has been inspected, a transport device 4 for transporting the BGA package 13 from the flux supply unit 1 to the ball mount unit 2 and the mount inspection unit 3, and unloading the BGA package 13 after the inspection is completed. And an unloading section 5.

[0008] The BGA package 13 is supplied onto a conveyor (not shown) of the transport device 4 by a loading device (not shown). Conveyor is BGA package 1
3 is conveyed to the flux supply unit 1. After transferring the flux, the BGA package 13 is transported to the ball mount 2.

When the ball mounting is completed, the BGA package 13 is sent to the mount inspection section 3. The mount inspection unit 3 determines whether or not mounting has been correctly performed by the CCD camera. After the inspection, the BGA package 13 is unloaded by the unloading section 5. The above is the outline of the BGA solder ball mounting device.

[0010] A work holding device 8 to which the present invention is applied appears at the unloading section 5 of the BGA solder ball mounting device.
The unloading section 5 includes a work holding device 8 and a Y-axis driving mechanism thereof. In the embodiment shown in FIG. 1, a carry-out motor 6 and a carry-out guide 7 are provided in the Y-axis drive mechanism. The work holding device 8 of the BGA package 13 is
It is mounted so that it can reciprocate from the pick point (mount inspection unit 3) to the place point.

The work holding device 8 includes a pair of right and left holding members 9 and a clamp mechanism (not shown).
As shown in FIG. 3, the gripping member 9 is symmetrical on the left and right sides, and includes a gripping piece 10 having a horizontal claw 12, a mounting member 16 of the gripping piece 10, a leaf spring 11, and a connecting portion 17 to a clamp mechanism.
Having.

The gripping piece 10 has a horizontal claw 12 for supporting the BGA package 13 at the lower end toward the inside. The horizontal claws 12 have a positional relationship facing each other in the gripping pieces 10 of the left and right gripping members 9.

As shown in FIG. 3, a notch 15 is provided in the gripping piece 10 at a position below the center of the gripping piece 10 so that the leaf spring 11 bends due to the load of the gripping operation. Are formed.

The leaf spring 11 is fixed to the gripping piece 10 of the gripping member 9 at an upper portion with a fixing screw 14 so that the distal end is located at substantially the same position as the distal end of the claw 12 of the gripping member 9 in a no-load state.
The lower part is a BGA package 1 that becomes a work during the gripping operation.
It is installed to bend under the load from 3. The BGA package 13 is gripped by the elasticity of the leaf spring 11 and the claws 12 of the gripping member 9.

The gripping piece 10 is mounted on the mounting member 16 by bolts 18. As shown in FIG. 2, in the present embodiment, four gripping pieces 10 are provided on one side of the mounting member 16, and four gripping pieces (not shown) are provided at positions facing the other side. 10 are provided.

The position where the gripping piece 10 is mounted on the mounting member 16 corresponds to the length of the BGA package 13. In the present embodiment, the gripping pieces 10 are a BGA package 13 having a length corresponding to the three gripping pieces 10 on the left side in FIG. 2, and a BGA package having a length corresponding to the three gripping pieces 10 on the right side in FIG.
GA package 13, all (four) gripping pieces 10 in FIG. 2
Can be grasped.

The left and right gripping members 9 are the BGA package 1
3 is attached to a clamp device (not shown) by a connecting portion 17 so as to be grippable. The BGA package 13 is gripped by the left and right grip members 9 moving inward by the clamp device, and the grip of the BGA package 13 is released by the left and right grip members 9 moving outward.

As shown in FIG. 4, when the work gripping device 8 clamps the BGA package 13, the leaf spring 11 bends, and the elastic force of the leaf spring 11 grips the BGA package 13 from both sides. At the same time, B
The GA package 13 is urged downward and fixed with the claw 12. That is, when the leaf spring 11 grips the BGA package 13, the leaf spring 11 exerts a gripping force for pressing the BGA package 13 downward in the vertical direction.
3 is urged downward, and is fixed between the claw 12.

As shown in FIG. 5, when the work gripping device 8 releases the clamp of the BGA package 13, the leaf spring 11 returns to the bent state, and becomes vertical. It serves as a guide.

[0020]

Since the present invention is configured as described above, the following effects are exhibited. First, a simple configuration in which a leaf spring is installed in a gripping device having left and right gripping members formed so that horizontal claws supporting a work are opposed to each other at the end, and the work is moved relative to the horizontal claws. The work is securely held because it is urged and held to hold down.
This is a work gripping device that can perform high-speed handling without ball displacement. As a result, the work can be stably transported at a high speed.

Second, by installing a leaf spring in the work holding device, the leaf spring performs the conventional guide function even when the work is released, and the work drops in an unstable posture. It became a work holding device without any.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing an entire ball mounting device.

FIG. 2 is an explanatory view showing the inside of a gripping member.

FIG. 3 is an explanatory sectional view showing a relationship between a gripping member and a work.

FIG. 4 is an explanatory cross-sectional view of a work holding device at the time of work clamping.

FIG. 5 is an explanatory sectional view of a work holding device at the time of a work place;

[Explanation of symbols]

 1. . . . . . Flux supply unit 2. . . . . . Ball mount part 3. . . . . . Mount inspection unit 4. . . . . . Transfer device 5. . . . . . Unloading section 6. . . . . . Unloading motor 7. . . . . . 7. Unloading guide . . . . . Work holding device 9. . . . . . Gripping member 10. . . . . Gripping piece 11. . . . . Leaf spring 12. . . . . Nails 13. . . . . BGA package 14. . . . . Fixed screw 15. . . . . Notch 16. . . . . Mounting member 17. . . . . Connection part 18. . . . . bolt

Claims (1)

[Claims] 1. A workpiece gripping device comprising: left and right gripping members formed at opposite ends with horizontal claws for supporting the workpiece so as to face each other;
A work wherein a leaf spring is fixed to a gripping member at an upper portion, and a lower portion is installed so as to be bent by a load from the work during a gripping operation, and the work is gripped by the elasticity of the leaf spring and a claw of the gripping member. Gripping device.