JP2002134586A - Substrate holding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate holding apparatus which can grip a substrate at its edge and convey it. SOLUTION: A hand 3 of a robot has an arm mounting part 10 and a substrate holding part 20. A clamping cylinder 15 is mounting to the arm mounting part 10 to move a pusher 17. A tip receiving part 22 for receiving a wafer W and a base receiving part 28 are formed in the substrate holding part 20 and have gentle slopes 221, 281. The tip receiving part 22 also has a steep slope 222. When the pusher 17 pushes one edge WE of the wafer W, another edge WE of the wafer W temporarily held by the gentle slopes 221, 281, moves from the gentle slope 221 to the steep slope 222, stops at a clamping part 223, and is clamped and held in the horizontal state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a substrate holding apparatus for holding and transporting an edge of a substrate such as a wafer or glass.

[0002]

2. Description of the Related Art Conventionally, when a substrate such as a wafer or glass is held and transported, the substrate is usually held by sucking the lower surface of the substrate with a robot hand and holding the substrate by moving the hand. In this state, it was conveyed to the next process. In general, the substrates are stored in a cassette in a plurality of stages in a vertical direction, and the robot hand approaches the substrate stored in the cassette, sucks the lower surface of the substrate, and takes out the substrate from the cassette. .
Further, since the substrates are placed in a random state when stored in the cassette, the position of the substrate taken out of the cassette is usually corrected while being transported to the next step.

[0003] However, since substrates such as wafers and glass dislike particles, there has been a demand for a method of holding substrates in a state where particles are not generated.
In the conventional method of suctioning the lower surface of the substrate, the suction surface is easily damaged or particles are easily generated. Therefore, recently, a hand has been configured to hold the edge of the substrate.

As a conventional device 30 for holding an edge of a substrate, as shown in FIG.
A pair of substrate receiving portions 31 and 32 are arranged along the outer peripheral surface of the substrate. FIG. 16 (a) is of a surface receiving clamp type, in which a pair of substrate receiving portions 31 and 32 are formed with horizontal holding portions 31a and 32a for supporting the lower surface of the substrate W, and one of the substrate receiving portions 31 is provided. A movable clamp 33 for pressing and clamping the substrate W is disposed, and a vertical surface portion 32b for receiving and clamping the substrate W pressed by the movable clamp 33 is formed in the other substrate receiving portion 32. Note that the substrate pressing surface 33a of the movable clamp 33 was formed as a vertical surface.

FIG. 16 (b) shows an example of a surface receiving drop-in method, in which a pair of substrate receiving portions 31, 32 are formed with inclined surfaces 31c, 32c which are inclined downward toward the inside of the substrate W. In addition, horizontal holding portions 31d and 32d are formed horizontally from the lower ends of the inclined surfaces 31c and 32c and support the lower surface of the edge of the substrate W.

FIG. 16 (c) shows an edge receiving method, in which each of the substrate receiving portions 31 shown in FIG.
32 is arranged so that the distance between the lower ends of the inclined surfaces 31c and 32c is smaller than the outer diameter of the substrate W. As a result, the substrate W is placed on the inclined surfaces 31 of the substrate receiving portions 31 and 32.
The edge WE was to be supported between c and 32c.

[0007]

However, FIG. 16 (a)
And (b) shows the lower surface of the substrate as the horizontal holding portions 31a, 31
Since the substrate W was slid in the direction of d, 32a, and 32d, the lower surface of the substrate W was easily damaged and particles were easily generated.

In FIG. 1C, the edge WE of the substrate W is formed by the inclined surfaces 31c of the pair of substrate receiving portions 31 and 32.
Since the stop position is not regulated by the dropped state because it is supported by a part of the substrate 32c, it is difficult for the horizontality of the substrate W to come out, and when the position of the substrate W is corrected, it is accurately corrected. Could not.

Further, when there is no substrate W clamping mechanism as shown in FIGS. 16 (b) and 16 (c), the substrate W is displaced due to an inertial force acting during high-speed conveyance. Was.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and provides a substrate holding apparatus which can hold an edge of a substrate, can follow high-speed conveyance, and can improve repetition accuracy when storing a substrate. With the goal.

[0011]

Means for Solving the Problems A substrate holding apparatus according to the present invention has the following configuration to solve the above-mentioned problems. That is, in order to hold and transport a substrate, a substrate holding device having a substrate receiving portion capable of supporting an edge of the substrate and a substrate gripping portion capable of gripping the edge of the substrate, wherein the substrate receiving portion Has a front end receiving portion disposed on the front end side with the substrate therebetween, and a base receiving portion disposed at a position facing the front end receiving portion, wherein the front end receiving portion and the base portion are provided. The receiving portion is formed to have a gentle slope inclined downward toward the axis of the substrate, and the upper end of the gentle slope of the base receiving portion is the upper end of the gentle slope of the tip receiving portion. The substrate gripping portion is formed higher, and holds one of the edges of the substrate, and a fixed clamp portion disposed on the tip receiving portion side, and near the base receiving portion side with the substrate interposed therebetween. A movable clamp portion disposed on the fixed clamp portion and the movable clamp portion. The ramp portion is formed to have a steep slope portion that is inclined so as to spread upward with a substrate to be gripped therebetween, and the movable clamp presses the substrate toward the fixed clamp to clamp the substrate. At this time, one edge of the substrate is
The substrate is supported by the base receiving portion such that the substrate is maintained in a horizontal state.

[0012] Preferably, a gentle slope portion of the substrate receiving portion may be formed below the steep slope portion in the fixed clamp portion.

[0013] More preferably, the steep slope portion of the fixed clamp portion and the steep slope portion of the movable clamp portion are more preferably formed at substantially the same angle in the direction opposite to the vertical direction.

[0014]

According to the substrate holding apparatus of the present invention, when the substrate is taken out, the substrate is once received at the gentle slopes of the leading end receiving portion and the base receiving portion while the lower portion of the edge is supported. The movable clamp presses the edge of the substrate and moves the substrate placed on the distal end receiving portion and the base receiving portion toward the fixed clamp. At this time, the substrate placed on the tip receiving portion and the base receiving portion is positioned such that the edge portion supported on the base receiving portion side is higher than the edge portion supported on the tip receiving portion side before clamping. As the movable clamp presses the edge of the substrate, the edge of the substrate supported on the tip receiving portion is moved upward while being guided along the gentle slope portion, and comes into contact with the wall portion of the steep slope portion. The substrate is stopped and clamped while maintaining a horizontal state without being moved any further.

Thus, since the substrate can grip the edge without sliding the lower surface, the substrate can be held without damaging the lower surface of the substrate and generating no particles. Moreover, since the substrate can be transported in a clamped state, the substrate is not displaced even if the substrate holding device operates at high speed.

When the movable clamp is separated from the edge of the substrate when storing the substrate, one edge of the substrate is brought into contact with the wall of the steep slope portion of the fixed clamp portion, and the other edge is connected to the original edge. After being placed in a horizontal position after being supported on the gentle slope portion of the receiving portion, it is stored in a predetermined position, so when the substrate is separated from the clamped position, the edge of the substrate is formed by a steep slope portion. Can be separated without sliding on the wall, and no particles are generated between them. In addition, since the substrate is supported by the gentle slope portion even when the clamp is released, the substrate can be maintained in a horizontal state without slipping and falling, thereby improving the transfer accuracy.

Further, if the steep slope portion of the fixed clamp and the gentle slope portion of the distal end receiving portion are formed so as to be integrally connected, the substrate guided by the gentle slope portion is immediately moved on the steep slope portion. It can be stopped and can be clamped at the edge without sliding on the lower surface of the substrate. Further, since the distal end receiving portion and the fixed clamp can be formed by one component, the number of components can be reduced and cost can be reduced.

If the angle of the steep slope portion of the fixed clamp and the steep slope portion of the movable clamp are substantially the same, when the substrate is gripped and clamped between the fixed clamp and the movable clamp, both edges of the substrate are clamped. Since the component forces are the same, the components are applied in a direction to maintain the horizontal state of the substrate.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. The substrate holding device according to the embodiment is shown in FIG.
2 shows a hand 3 of the robot 1 which holds and transports a thin substrate such as a wafer or glass.

The hand 3 includes an arm connecting portion 10 rotatably connected to an arm (not shown), and a substrate holding portion 20 for holding a substrate (hereinafter, described as a wafer W). The arm connecting part 10 is a robot 1 (not shown).
And a clamp cylinder 15 supported by the machine frame 11 and pivotally connected to the shaft 5 protruding from the turning arm. In the embodiment, an air cylinder equipped with a two-point position sensor is used as the clamp cylinder 15, and a pusher 17 as a movable clamp is attached to the tip of a piston rod 16 that reciprocates in the cylinder. The pusher 17 is pivotally supported by the piston rod 16 and is connected to a detent pin 18 protruding from the cylinder 15 in parallel with the axis to prevent the piston rod 16 from rotating.

The substrate holding section 20 is provided at the edge WE of the wafer W.
And has a fork portion 21 formed in a bifurcated shape and a base portion 25 attached to the arm connecting portion 10. The fork portion 21 is formed on the circumference of the wafer W. In order to hold the edge WE, a pair of tip receiving portions 22, 22 protruding upward are provided. Former part 25
Has a pair of mounting seats 27, 27 bifurcated with a space 26 interposed therebetween in order to secure a movement stroke of the pusher 17 mounted on the cylinder 15, and has a space at a position for supporting the wafer W. A pair of base receiving portions 28, 28 are arranged so as to protrude upward with 26 interposed therebetween.

The tip receiving portion 22 and the base receiving portion 28 do not support the lower surface of the wafer W but support the edge WE, but each have a gentle inclined surface (hereinafter referred to as a gentle incline) that inclines inward and downward. 221 and 281 are formed. As shown in FIGS. 2 and 3, a steep slope portion 222 is formed above the gentle slope portion 221 of the distal end receiving portion 22 so as to be connected to the gentle slope portion 221, and is configured as a fixed clamp. Further, a connecting portion between the gentle slope portion 221 and the steep slope portion 222 is formed as a clamp portion 223 that grips a lower end portion of the edge WE of the wafer W.

In the base receiving portion 28, the upper surface of the gentle slope portion 281 is formed as a horizontal surface 282.
The height of 82 is formed at the upper end of the gentle slope portion 221 of the distal end receiving portion 22, that is, at a position higher than the clamp portion 223.
The edge of the wafer W is WE while the wafer W is clamped.
Is supported at one end by the clamp portion 223 of the distal end receiving portion 22 and the other end is supported at the same height position as the clamp portion 223 of the gentle slope portion 281 of the original portion receiving portion 28 (that is, the horizontal state is maintained). (As possible), the position of the base receiving portion 28 is set.

The gentle slope portion 221 of the distal end receiving portion 22 and the gentle slope portion 281 of the base portion receiving portion 28
When the pusher 17 presses one end of the wafer W, the pusher 17 is set at 45 ° with respect to the horizontal plane to facilitate movement of the wafer W.
In order to prevent the wafer W from slipping and falling when the pusher 17 is released from the clamp, the gentle slope portion 221 of the front end receiving portion 22 supporting the both end edges WE of the wafer W is preferable. And the former receiving part 28
Are desirably formed at the same angle.

Further, the steep slope portion 28 of the tip receiving portion 22
Means that the movement of the moved wafer W is restricted, and the edge WE of the wafer W slides on the wall of the fixed clamp (steep slope portion 222) during the Z movement of the wafer W (vertical direction in FIG. 3). In order not to perform this, it is desirable to form at least 45 ° or more and as close to 90 ° as possible.

Further, the gentle slope portion 22 of the tip receiving portion 22
1. Steep slope portion 222 and gentle slope portion 281 of base receiving portion 28
As shown in FIG. 1, is formed in an arc shape along the circumferential surface of the wafer W in plan view, or in a linear shape along the circumferential surface.

As shown in FIG. 4, the pusher 17 as a movable clamp is formed with an inclined surface 171 that is inclined downward toward the wafer W to hold the edge WE of the wafer W. Since the inclined surface 171 is formed at the same angle as the steeply inclined surface portion 222 of the distal end receiving portion 22, when the wafer W is clamped, both edges WE of the wafer W are gripped with the same component force. Desirable to maintain state.

Then, the distal end receiving portion 22 is
By pressing the wafer W placed on the base portion and the base receiving portion 28 from one end, the other end edge of the wafer W is moved from the gentle slope portion 221 along the steep slope portion 222 as a fixed clamp, and the clamp portion 223. Is stopped and clamped.

As shown in FIG. 1, a clamp origin confirmation auto switch 151 and a wafer clamp position confirmation auto switch 152 are mounted on the clamp cylinder 15, and as shown in FIG.
Before pushing out (the clamp origin position P
1) a position (wafer clamp position P2) where the wafer W is pressed by the pusher 17 and one end is stopped at the position of the clamp portion 223 of the distal end receiving portion 22 and clamped and held by the pusher 17; Can be confirmed. Therefore, when the wafer W reaches a predetermined position beyond the wafer clamping position P2, the overstroke position P3 is reached, and the wafer W is not placed on the hand 3, so that a new substrate presence / absence confirmation sensor needs to be installed. It is unnecessary.

Next, the operation of taking out the wafer W stored in the cassette by the hand 3 will be described with reference to FIGS.
It is explained along.

First, the hand 3 takes out the wafer W stored in a cassette (not shown) according to a command from the robot 1. As shown in FIG. 5, the hand 3 is moved so as to be located on the lower surface side of the wafer W. At this point, as shown in FIG. 6, the edge WE of the wafer W is positioned so as to have a gap H between the wafer W and the clamp portion 223 of the front end receiving portion 22. That is, the wafer 3 is set in advance so that it can be placed on the gentle slope portion 221 of the distal end receiving portion 22 of the hand 3 and the gentle slope portion 281 of the base receiving portion 28.

When the hand 3 is lifted to place the wafer 3 on the gentle slopes 221 and 281, the wafer W has the edge WE of the wafer W and the tip receiving portion 22, as shown in FIG. It is temporarily held by the base receiving portion 28. At this position, the base side edge WE of the wafer 3 is at a position higher than the front end side edge WE, and the gentle slope 28
Supported by 1. However, in this state, the pusher 17 is at the clamp origin position P1 (see FIG. 2) at a position away from the edge WE of the wafer W, and the wafer W is not clamped.

Next, the clamp cylinder 15 is actuated to move the pusher 17 toward the wafer W. When the wafer W is stored in the cassette, there is a cassette inner wall. Since the wafer W cannot be advanced to the back of the cassette by being pressed by the pusher 17, as shown in FIG. 8, the wafer W is temporarily changed from the state of FIG. 7 (the state in which the wafer W is temporarily held by the hand 3). A predetermined amount (at least,
The operation of returning the hand 3 by an amount equal to or more than the movement amount of the wafer W pressed by the pusher 17 (corresponding to the above-described gap H) is performed by the teaching of the control device.

Then, at the position where the hand 3 has returned by the movement amount H, the pusher 17 is moved toward the wafer W as shown in FIG. When the pusher 17 comes into contact with the edge WE of the wafer W and presses it, the wafer W raises the front edge WE along the gentle slope 221 of the front receiving portion 22, and moves the base edge WE to the main receiving portion 28. Is gradually lowered along the gentle slope portion 281.

When the leading edge WE of the wafer W moves from the gentle slope portion 221 of the tip receiving portion 22 to the steep slope portion 222, the steep slope portion 222 is set at 45 ° or more. When the edge WE of W hits the wall formed by the steep slope portion 222, the gentle slope portion 221
The movement is stopped at the position of the clamp portion 223 at the connection portion between the steep slope portion 222 and the steep slope portion 222. The clamp unit 223 grips the edge WE of the wafer W as a fixed clamp, while the pusher 17 grips the edge WE as a movable clamp and clamps the hand wafer W. In this state, the wafer W is maintained in a horizontal state.

The inclined surface 171 of the pusher 17 is
Since the front end receiving portion 22 is formed at the same angle as the steep slope portion 222, the gripped wafer W receives the same component force at both edge portions and acts so as to maintain a horizontal state. The position of the pusher 17 at this time is at the wafer clamp position P2 (see FIG. 2).

Therefore, after confirming that the pusher 17 is at the clamp origin position P1 and then confirming that the pusher 17 stops at the wafer clamp position P2, the clamp cylinder 15 determines that the wafer W is present and that the wafer W is present. recognize. When information is transmitted to a control device (not shown), the hand 3 holding the wafer W is moved to the rotation center side of the robot 1 as shown in FIG.
Is taken out of the cassette and transported to the next step.

If the clamp cylinder 15 confirms the clamp origin position P1 of the pusher 17, the moved pusher 17 moves to the set wafer clamp position P1.
When the pusher 17 confirms that the wafer W has reached the overstroke position P3 beyond the position 2, the pusher 17 recognizes that the wafer W is not on the hand as not grasping the wafer W. When this information is transmitted to the control device, the hand 3 returns to the original position before the wafer was taken out. Then, the pusher 17 also returns to the original position, and is moved to take out the next wafer W anew.

Next, a description will be given of a case where the wafer W held by the fixed clamp (the steep slope portion 221 of the distal end receiving portion 22) and the movable clamp (the pusher 17) is stored in a cassette, a processing apparatus, an aligner, or the like, as shown in FIG. The description will be made along with Nos. 15 to 15.

As shown in FIGS. 11 to 12, the wafer W
The X-axis movement of the hand 3 when the wafer W moves to the vicinity of the cassette, the processing device, the aligner, or the like from the Y-axis movement of the robot (the direction orthogonal to the X-axis direction of the hand taking out the wafer). Thereby, the wafer W is moved to a position where the wafer W is stored.

When the wafer W is moved to the position where the wafer W is stored, as shown in FIG.
Is moved away from the edge WE of the clamp cylinder 15. Pusher 17 is at wafer clamp position P2
To the clamp origin position P1. The base side edge WE of the unclamped wafer W is connected to the base receiving section 28.
Is supported at the same height position as the clamp portion 223 of the distal end receiving portion 22. And
Since the gentle slope portion 221 of the front end receiving portion 22 and the gentle slope portion 281 of the base portion receiving portion 28 are formed at substantially the same angle, the wafer W may be displaced so as to slide down to one side. No, and maintain a horizontal state.

When the hand 3 is lowered at this position, as shown in FIG. 14, the wafer W is supported by a cassette, a processing unit or an aligner or the like, and is separated from the hand 3. When the wafer W separates from the steep slope portion 222 of the front end receiving portion 22 and the gentle slope portion 281 of the original zero portion receiving portion 28, the steep slope portion 222 and the gentle slope portion 281 are inclined so as to spread upward.
The edge WE of the wafer W has a steep slope portion 222 and a gentle slope portion 2.
The particles can be instantaneously separated without rubbing against 81, thereby preventing generation of particles.

Then, as shown in FIG. 15, the hand 3 that has left the wafer W returns to the original position, and one cycle is completed.

As described above, when the wafer W is taken out, the wafer W is once supported by the gentle slopes 221 and 281 of the leading end receiving portion 22 and the base receiving portion 28 while the lower portion of the edge WE is supported. The movable clamp 17 presses the edge WE of the wafer W and moves the wafer W received and placed on the gentle slope portions 221 and 281 of the tip receiving portion 22 and the base receiving portion 28 to the fixed clamp 223 side. . At this time, the gentle slope portions 221 and 28 of the distal end receiving portion 22 and the base receiving portion 28, respectively.
Before clamping the wafer W mounted on the front clamp 1, the edge WE supported by the base receiving portion 28 is at a higher position than the edge WE supported by the distal end receiving portion 22. As the edge WE of the wafer W is pressed, the edge W of the wafer W supported on the tip receiving portion 22 side
When E moves upward while being guided along the gentle slope portion 221, and comes into contact with the wall portion of the steep slope portion 222, the wafer W is stopped and clamped while maintaining a horizontal state without being further moved.

As a result, since the wafer W can grip the edge WE without sliding the lower surface, the wafer W can be held without damaging the lower surface of the wafer W and generating no particles. . In addition, since the wafer W can be transported in a clamped state, even if the hand 3 is operated at a high speed, the wafer W
Does not shift.

When the movable clamp 17 is separated from the edge WE of the wafer W when the wafer W is stored, one of the wafers W is brought into contact with the wall of the steep slope portion 222 of the tip receiving portion 22, and the other. Is a gentle slope portion 281 of the base portion receiving portion 28.
Since the wafer W is supported at a horizontal position and then stored in a predetermined position, when the wafer W is separated from the clamped position, the edge WE of the wafer W is steeply inclined 222
Can be separated without sliding on the wall formed by the above, and no particles are generated between them. In addition, since the wafer W is supported by the gentle slope portion 281 even when the clamp is released, the horizontal state can be maintained without the wafer W sliding down, and the transfer accuracy can be improved.

If the steep slope portion 222 of the tip receiving portion 22 is formed as a fixed clamp and is formed so as to be integrally connected to the gentle slope portion 221, the gentle slope portion 221 is formed.
Can be immediately stopped at the steep slope portion 222, and can be clamped at the edge WE without the need for sliding on the lower surface of the wafer W. Further, since the distal end receiving portion 22 and the fixing clamp can be formed by one component, the number of components can be reduced and cost can be reduced.

Further, the tip receiving portion 2 as a fixed clamp
If the angle between the steep slope portion 222 of FIG. 2 and the slope portion 171 of the pusher 17 as the movable clamp is substantially the same, when the wafer W is gripped and clamped between the fixed clamp and the movable clamp, both sides of the wafer W are clamped. Since the component force applied to the edge WE becomes the same, the wafer W is applied in a direction for maintaining the horizontal state.

The substrate holding device in the above-described embodiment is configured as a robot hand 3, but is not limited to this. For example, the substrate holding device is used for a wafer holding portion of an orientation flat device for aligning wafers. can do.

The clamp cylinder 15 is not limited to an air cylinder, but may be a hydraulic cylinder.
If one end of the wafer can be pressed and clamped,
For example, a mechanical configuration using a rack and a pinion may be used.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a configuration of a hand according to one embodiment of the present invention.

FIG. 2 is a longitudinal sectional view in FIG.

FIG. 3 is an enlarged view showing a front end receiving portion and a base receiving portion of the hand in FIG. 1;

FIG. 4 is a partially enlarged view showing a pusher.

FIG. 5 is an operation view showing a state in which the hand goes to pick up a wafer.

FIG. 6 is an operation diagram showing a state in which the hand has moved to the distal end side.

FIG. 7 is an operation view showing a state in which the hand is raised to temporarily hold the wafer.

FIG. 8 is an operation diagram showing a state in which the hand has returned a predetermined amount H.

FIG. 9 is an operation diagram showing a state in which a temporarily held wafer is clamped by a pusher.

FIG. 10 is an operation diagram showing a state in which the hand holding the wafer conveys the wafer to the next step.

FIG. 11 is an operation diagram showing a state in which a hand holding a wafer moves to a storage destination.

FIG. 12 is an operation diagram showing a state in which the hand holding the wafer has moved to the storage destination.

FIG. 13 is an operation view showing a state in which the pusher returns and the clamp of the wafer is released.

FIG. 14 is an operation diagram showing a state in which the hand is lowered to release the wafer.

FIG. 15 is an operation diagram showing a state in which the hand from which the wafer has been detached returns to the original position.

FIG. 16 is a simplified diagram showing a conventional method of holding a wafer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 3 ... Hand 10 ... Arm connection part 15 ... Clamp cylinder 16 ... Piston rod 17 ... Pusher (movable clamp) 171 ... Inclined surface 20 ... Wafer holding part 22 ... Tip receiving part 221 ... Gentle slope part 222 ... Steep slope part (fixed clamp) 223: clamp part (fixed clamp) 25: base part 26: space part 28: base part receiving part 281: gentle slope part W: wafer WE: edge P1: clamp origin position P2: wafer clamp position P3: over stroke position

Continued on front page F term (reference) 3C007 DS01 ES03 ES04 ET08 EV06 EV12 EV23 EW03 HS12 NS09 3F061 AA01 BA03 BA04 BB08 BD01 BE06 BE22 BE43 BF04 DB04 5F031 CA02 CA05 GA06 GA07 GA10 GA13 GA14 GA15 PA20 PA26

Claims (3)

[Claims] 1. A substrate holding device having a substrate receiving portion capable of supporting an edge of the substrate and a substrate gripping portion capable of gripping an edge of the substrate, for holding and transporting the substrate, The substrate receiving portion has a distal end receiving portion disposed on the distal end side with the substrate therebetween, and a base receiving portion disposed at a position facing the distal end receiving portion, and the distal end receiving portion The base receiving portion is formed to have a gentle slope portion inclined downward toward the axis of the substrate, and the upper end of the gentle slope portion of the base receiving portion has a gentle slope of the tip receiving portion. Formed higher than the upper end of the portion, the substrate holding portion holds one of the edges of the substrate,
And a fixed clamp portion disposed on the tip receiving portion side,
A movable clamp portion arranged near the base portion receiving portion side with the substrate interposed therebetween, wherein the fixed clamp portion and the movable clamp portion are directed upward with the substrate to be gripped therebetween. Each of the movable clamps is formed to have a steep slope portion that is inclined so as to spread, and when the movable clamp presses the substrate toward the fixed clamp to clamp the substrate, one edge of the substrate is in a horizontal state. A substrate holding device supported by the base receiving portion so as to be maintained. 2. The substrate holding device according to claim 1, wherein the fixed clamp portion is formed such that a lower end of the steep slope portion and an upper end of the gentle slope portion of the substrate receiving portion are connected to each other. apparatus. 3. The steep slope portion of the fixed clamp portion and the steep slope portion of the movable clamp portion are formed at substantially the same angle in the direction opposite to the vertical direction. 3. The substrate holding device according to 1 or 2.