JPH09127541A - Liquid crystal display device - Google Patents
Liquid crystal display deviceInfo
- Publication number
- JPH09127541A JPH09127541A JP30042095A JP30042095A JPH09127541A JP H09127541 A JPH09127541 A JP H09127541A JP 30042095 A JP30042095 A JP 30042095A JP 30042095 A JP30042095 A JP 30042095A JP H09127541 A JPH09127541 A JP H09127541A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- liquid crystal
- crystal display
- chip
- reinforcing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、液晶表示装置に関
し、特に、液晶表示装置駆動用ＩＣの実装構造に関する
ものである。[0001] 1. Field of the Invention [0002] The present invention relates to a liquid crystal display device, and more particularly to a mounting structure of a liquid crystal display device driving IC.
【０００２】[0002]
【従来の技術】従来、液晶表示装置の実装構造は、液晶
表示パネルをシャーシに取り付けると共に、表示パネル
とリジットな配線基板との間を、表示パネルを駆動する
ための駆動用ＩＣを可撓性配線基板に搭載してなるＴＣ
Ｐ（Ｔａｐｅ ＣａｒｒｉｅｒＰａｃｋａｇｅ）で電気
的に接続するものであった。図６は、この種従来の実装
構造を示す断面図である。2. Description of the Related Art Conventionally, a mounting structure of a liquid crystal display device has a structure in which a liquid crystal display panel is mounted on a chassis and a driving IC for driving the display panel is flexible between the display panel and a rigid wiring board. TC mounted on a wiring board
It was electrically connected by P (Tape Carrier Package). FIG. 6 is a sectional view showing a conventional mounting structure of this kind.
【０００３】この従来の液晶表示装置においては、シャ
ーシ２２の上面に液晶表示パネル２１、下面に配線基板
２４を配置し、液晶表示パネル１と配線基板２４をシャ
ーシ２の形状に沿って折り曲げられたＴＣＰ２３で電気
的に接続する構造となっている。しかし、この液晶表示
装置の実装構造では、ＴＣＰ２３に搭載された駆動用Ｉ
Ｃチップ２３ａが配線基板２４の下面に配置されるの
で、駆動用ＩＣチップ２３ａの厚みの分だけ液晶表示装
置全体が厚くなり、充分な薄型化を図ることができない
という問題があった。In this conventional liquid crystal display device, a liquid crystal display panel 21 is disposed on an upper surface of a chassis 22 and a wiring board 24 is disposed on a lower surface, and the liquid crystal display panel 1 and the wiring substrate 24 are bent along the shape of the chassis 2. It is structured to be electrically connected by TCP23. However, in the mounting structure of the liquid crystal display device, the driving I / O mounted on the TCP 23 is used.
Since the C chip 23a is disposed on the lower surface of the wiring board 24, the entire liquid crystal display device becomes thicker by the thickness of the driving IC chip 23a, and there has been a problem that the thickness cannot be sufficiently reduced.
【０００４】そこで、上述した液晶表示装置の実装構造
の改善策として、特開平３−２７９９２４号公報では、
配線基板にＩＣチップを収容するための開口を設けるこ
とが提案されている。すなわち、図７に示されるよう
に、シャーシ２２の表裏面に液晶表示パネル２１と配線
基板２４を配置し、それらをＴＣＰ２３で接続するもの
において、配線基板２４に開口部を設け、その中に駆動
用ＩＣチップ２３ａを収容する。In order to improve the mounting structure of the liquid crystal display device, Japanese Patent Laid-Open Publication No. 3-279924 discloses
It has been proposed to provide an opening for accommodating an IC chip in a wiring board. That is, as shown in FIG. 7, when the liquid crystal display panel 21 and the wiring board 24 are arranged on the front and back surfaces of the chassis 22 and they are connected by the TCP 23, an opening is provided in the wiring board 24 and the drive is provided therein. IC chip 23a.
【０００５】[0005]
【発明が解決しようとする課題】しかし、図７に示され
る改良型の液晶表示装置の実装構造では、配線基板２４
にＴＣＰ２３に搭載されたＩＣチップ２３ａを収容する
ための開口部を設けているために、配線基板２４のパタ
ーンの引き回しに制限が加わり、また開口分程度基板面
積が増加するため、基板面積の縮小が困難となり、液晶
表示装置の軽量・小型化ができなくなる。さらに、駆動
用ＩＣチップ２３ａとシャーシ２２との間に隙間２５が
あるために、ＩＣチップ２３ａの下面より外圧が加わる
と、ＩＣチップ２３ａがＴＣＰ２３より剥がれる可能性
があった。However, in the mounting structure of the improved liquid crystal display device shown in FIG.
Is provided with an opening for accommodating the IC chip 23a mounted on the TCP 23, so that the layout of the pattern of the wiring board 24 is restricted, and the substrate area is increased by the amount of the opening, so that the substrate area is reduced. This makes it difficult to reduce the weight and size of the liquid crystal display device. Further, since there is a gap 25 between the driving IC chip 23a and the chassis 22, when an external pressure is applied from the lower surface of the IC chip 23a, the IC chip 23a may be peeled from the TCP 23.
【０００６】本発明は、上述した従来例の問題点に鑑み
てなされたものであって、その目的は、液晶表示装置の
軽量・小型・薄型化ができ、かつ信頼性の高い液晶表示
装置を提供できるようにすることである。The present invention has been made in view of the above-mentioned problems of the conventional example, and an object of the present invention is to provide a liquid crystal display device which can be lightened, miniaturized and thinned and has high reliability. It is to be able to provide.
【０００７】[0007]
【課題を解決するための手段】上記の目的を達成するた
めの本発明による液晶表示装置は、可撓性配線基板に駆
動用ＩＣチップを搭載してなるＴＣＰの一方の端部に形
成された端子が液晶表示パネルの接続端子に接続され、
他方の端部に形成された端子がリジット配線基板の接続
端子と接続されているものであって、前記リジット配線
基板には補強板が接着されており、前記駆動用ＩＣチッ
プは前記補強板に開孔されたチップ収容部内に収容され
ていることを特徴としている。そして、より好ましく
は、前記液晶表示パネルがシャーシの一方の面に固着さ
れ、前記リジット配線基板が前記シャーシの他方の面に
固着され、かつ、前記駆動用ＩＣチップが前記リジット
配線基板と前記シャーシとの間に収容されるように構成
される。In order to achieve the above object, a liquid crystal display device according to the present invention is formed at one end of a TCP in which a driving IC chip is mounted on a flexible wiring board. Terminal is connected to the connection terminal of the LCD panel,
A terminal formed at the other end is connected to a connection terminal of a rigid wiring board, a reinforcing plate is bonded to the rigid wiring board, and the driving IC chip is attached to the reinforcing plate. It is characterized in that it is accommodated in a chip accommodating portion having a hole. More preferably, the liquid crystal display panel is fixed to one surface of the chassis, the rigid wiring board is fixed to the other surface of the chassis, and the driving IC chip is the rigid wiring board and the chassis. It is configured to be housed between.
【０００８】[0008]
【発明の実施の形態】図１（ａ）〜（ｄ）は、本発明の
実施の形態を説明するための断面図である。。図１に示
されるように、液晶表示パネル１は上側ガラス基板１ａ
と下側ガラス基板１ｂとを有しており、下側ガラス基板
１ｂ上には駆動用ＩＣチップと接続するための接続端子
１ｃが形成されている。この接続端子１ｃには、異方性
導電フィルム（ＡＣＦ）２を介してＴＣＰ３の一方の端
部に形成された端子が接続される。1A to 1D are cross-sectional views for explaining an embodiment of the present invention. . As shown in FIG. 1, the liquid crystal display panel 1 has an upper glass substrate 1a.
And a lower glass substrate 1b. On the lower glass substrate 1b, connection terminals 1c for connecting to a driving IC chip are formed. A terminal formed at one end of the TCP 3 is connected to the connection terminal 1c via an anisotropic conductive film (ACF) 2.
【０００９】ＴＣＰ３は、液晶表示パネル１を駆動する
駆動用ＩＣチップ３ａとこれを搭載するための可撓性配
線基板３ｂとから構成される。図２（ａ）、（ｂ）、
（ｃ）は、駆動用ＩＣチップ３ａの可撓性配線基板３ｂ
への搭載方式を示す断面図である。可撓性配線基板３ｂ
は、ポリイミドフィルムなどからなる可撓性基板３ｂ1
に銅箔からなる配線パターン３ｂ2 を形成したものであ
る。駆動用ＩＣチップ３ａの可撓性配線基板３ｂへの搭
載は、そのバンプ３ａ1 を配線パターン３ｂ2 にボンデ
ィングすることにより行う。駆動用ＩＣチップ３ｂは、
図２（ａ）に示すように、基板上の配線パターンにフ
ェースダウン方式で搭載する、図２（ｂ）に示すよう
に、基板にデバイスホールを設けデバイスホール上に搭
載する、図２（ｃ）に示すように、基板にデバイスホ
ールを設けデバイスホール内に搭載する、のいずれかの
方式により可撓性配線基板に搭載される。The TCP 3 comprises a driving IC chip 3a for driving the liquid crystal display panel 1, and a flexible wiring board 3b for mounting the driving IC chip 3a. 2 (a), (b),
(C) is a flexible wiring board 3b of the driving IC chip 3a
FIG. 4 is a cross-sectional view showing a method of mounting the camera on a vehicle. Flexible wiring board 3b
Is a flexible substrate 3b 1 made of a polyimide film or the like.
It is obtained by forming a wiring pattern 3b 2 made of copper foil. Mounted on the flexible wiring board 3b of the driving IC chip 3a is carried out by bonding the bump 3a 1 to the wiring pattern 3b 2. The driving IC chip 3b
As shown in FIG. 2A, the device is mounted on a wiring pattern on the substrate in a face-down manner. As shown in FIG. 2B, a device hole is provided in the substrate and mounted on the device hole. As shown in (1), a device hole is provided in the substrate and mounted in the device hole.
【００１０】図１に戻って、ＴＣＰ３の他の端部の端子
を配線基板４の接続端子４ａに半田付けにて接続する。
本発明に従って駆動用ＩＣチップ３ａは、配線基板４に
接着される補強板５のＩＣ収容孔５ａ内に収容される
が、ＴＣＰ３が補強板上に配置される場合〔図１
（ａ）、（ｂ）〕には、配線基板へのＴＣＰの接続に先
立って補強板５は予め配線基板４に接着される。図１
（ｃ）、（ｄ）に示すように、ＴＣＰ３が、配線基板４
と補強板５との間に配置される場合には、補強板５はＴ
ＣＰを挟み込んだ状態で紙面の前後で配線基板４に接着
される。Returning to FIG. 1, the terminal at the other end of the TCP 3 is connected to the connection terminal 4a of the wiring board 4 by soldering.
According to the present invention, the driving IC chip 3a is accommodated in the IC accommodation hole 5a of the reinforcing plate 5 bonded to the wiring board 4, but when the TCP 3 is arranged on the reinforcing plate [FIG.
(A), (b)], before connecting the TCP to the wiring board, the reinforcing plate 5 is bonded to the wiring board 4 in advance. FIG.
As shown in (c) and (d), the TCP 3 is
When disposed between the reinforcing plate 5 and the reinforcing plate 5, the reinforcing plate 5
The CP is sandwiched and adhered to the wiring board 4 before and after the paper surface.
【００１１】図１（ａ）、（ｄ）に示した接続方式で
は、可撓性配線基板の配線パターン側が配線基板４の接
続端子４ａに対向しているが、図１（ｂ）、（ｃ）に示
した接続方式では、可撓性配線基板の基板側が配線基板
と対向する。可撓性配線基板の配線パターン側が配線基
板４に対向している場合には、図３（ａ）に示すよう
に、可撓性基板３ｂ1 上の配線パターン３ｂ2 を配線基
板の接続端子４ａに接続する。可撓性配線基板の基板側
が配線基板４に対向している場合には、図３（ｂ）に示
すように、配線パターン３ｂ2 を可撓性基板３ｂ1 から
片持ち梁状に突出させて接続端子４ａに接続する。可撓
性配線基板の基板側が配線基板４に対向している場合に
は、図３（ｂ）に示す方式に代え、可撓性配線基板を折
り返して半田付けするようにしてもよい。In the connection method shown in FIGS. 1A and 1D, the wiring pattern side of the flexible wiring board is opposed to the connection terminal 4a of the wiring board 4, but FIGS. In the connection method shown in (1), the board side of the flexible wiring board faces the wiring board. If the wiring pattern side of the flexible wiring substrate faces the wiring board 4, as shown in FIG. 3 (a), the connection terminal 4a of the wiring board a wiring pattern 3b 2 on a flexible substrate 3b 1 Connect to When the substrate side of the flexible wiring substrate faces the wiring board 4, as shown in FIG. 3 (b), the wiring pattern 3b 2 is protruded from the flexible substrate 3b 1 cantilevered Connect to connection terminal 4a. When the board side of the flexible wiring board faces the wiring board 4, the flexible wiring board may be folded back and soldered instead of the method shown in FIG.
【００１２】本発明によれば、配線基板４には開口部は
設けられていないので、配線の引き回しに制限を受ける
ことがなく、基板面全体を配線領域に使用することがで
きるため配線基板の面積を増加させなくても済む。ま
た、本発明によれば、配線基板は補強板によって補強さ
れ、機械的強度が高くなっているので、配線基板自体の
厚さを薄くすることができる。すなわち、配線基板と補
強板との合計の厚さを元の配線基板の厚さと同程度とす
ることができる。したがって、本発明により、駆動用Ｉ
Ｃチップの厚さ分程度あるいはそれ以上の液晶表示装置
の薄型化が可能になる。例えば、従来、配線基板の厚さ
は、ある程度の強度を確保する必要から１．４ｍｍ程度
のものが使用されていたが、本発明においては、ＩＣチ
ップの厚さを０．５ｍｍ、補強板の厚さを０．８ｍｍと
したとき、配線基板の厚さを０．４〜０．８ｍｍ程度と
することができるため、全体の薄型化が実現できる。According to the present invention, since the wiring board 4 is not provided with an opening, there is no restriction on the routing of the wiring, and the entire substrate surface can be used for the wiring area. It is not necessary to increase the area. Further, according to the present invention, since the wiring board is reinforced by the reinforcing plate and has a high mechanical strength, the thickness of the wiring board itself can be reduced. That is, the total thickness of the wiring board and the reinforcing plate can be made substantially equal to the thickness of the original wiring board. Therefore, according to the present invention, the driving I
It is possible to make the liquid crystal display device thinner by about the thickness of the C chip or more. For example, in the past, the thickness of the wiring board was about 1.4 mm because it was necessary to secure a certain level of strength, but in the present invention, the thickness of the IC chip was 0.5 mm, and the thickness of the reinforcing plate was 0.5 mm. When the thickness is set to 0.8 mm, the thickness of the wiring board can be set to about 0.4 to 0.8 mm, so that the overall thickness can be reduced.
【００１３】[0013]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。 ［第１の実施例］図４は、本発明の第１の実施例の液晶
表示装置の実装構造を示したものであって、図４（ａ）
は断面図、図４（ｂ）は分解斜視図である。本発明によ
る液晶表示装置は、シャーシ１２と、その上面に取り付
けられた液晶表示パネル１１と、シャーシ１２の下面に
取り付けられた配線基板１４と、液晶表示パネル１１と
配線基板１４との間を接続するＴＣＰ１３と、配線基板
１４に接着された補強板１５を含んで構成されている。Next, embodiments of the present invention will be described with reference to the drawings. First Embodiment FIG. 4 shows a mounting structure of a liquid crystal display device according to a first embodiment of the present invention.
Is a sectional view, and FIG. 4B is an exploded perspective view. The liquid crystal display device according to the present invention includes a chassis 12, a liquid crystal display panel 11 mounted on an upper surface thereof, a wiring board 14 mounted on a lower surface of the chassis 12, and a connection between the liquid crystal display panel 11 and the wiring board 14. And a reinforcing plate 15 adhered to the wiring board 14.
【００１４】液晶表示パネル１１は、上側ガラス基板１
１ａと下側ガラス基板１１ｂとを貼り合わせ基板間に液
晶を充填したものであり、下側ガラス基板１１ｂの端部
にはＴＣＰ１３を接続するための接続端子１１ｃが形成
されている。また、シャーシ１２には、上面に液晶表示
パネル１１を実装できるようにパネル接着面１２ａが設
けられ、下面には配線基板取り付け部１２ｂが設けられ
てる。The liquid crystal display panel 11 includes the upper glass substrate 1
1a and a lower glass substrate 11b are bonded together and a liquid crystal is filled between the substrates. A connection terminal 11c for connecting the TCP 13 is formed at an end of the lower glass substrate 11b. The chassis 12 has a panel bonding surface 12a on the upper surface so that the liquid crystal display panel 11 can be mounted, and a wiring board mounting portion 12b on the lower surface.
【００１５】ＴＣＰ１３は、液晶表示パネル１１および
配線基板の接続端子と接続するための端子および配線パ
ターンを有する可撓性配線基板１３ｂに液晶表示パネル
を駆動するための駆動用ＩＣチップ１３ａを搭載してな
るものである。また、ＴＣＰ１３は、シャーシ１２上面
に実装された液晶表示パネル１１と、シャーシ１２下面
に実装される配線基板１４を接続するために、シャーシ
側縁部に沿って”コ”の字型に折り曲げられた構造とな
る。The TCP 13 has a driving IC chip 13a for driving the liquid crystal display panel mounted on a flexible wiring board 13b having terminals and wiring patterns for connecting to the connection terminals of the liquid crystal display panel 11 and the wiring board. It is. Further, the TCP 13 is bent in a U-shape along the side edge of the chassis to connect the liquid crystal display panel 11 mounted on the upper surface of the chassis 12 and the wiring board 14 mounted on the lower surface of the chassis 12. Structure.
【００１６】配線基板１４は、従来使用していたものよ
りも薄いものを使用して形成され、所定個所にＴＣＰ１
３に搭載された駆動用ＩＣチップ１３ａを収容するチッ
プ収容孔１５ａが形成された補強板１５が貼り付けられ
ている。また、補強板１５は、ガラス布基材エポキシ樹
脂積層板などの材料によって作られ、平板形状を有する
ものである。The wiring substrate 14 is formed by using a thinner substrate than conventionally used, and a TCP 1
A reinforcing plate 15 having a chip accommodation hole 15a for accommodating the driving IC chip 13a mounted on 3 is attached. Further, the reinforcing plate 15 is made of a material such as a glass cloth base epoxy resin laminate and has a flat plate shape.
【００１７】次に、上述した各構成要素の実装方法につ
いて説明する。予め、補強板１５を配線基板１４に接着
しておき、まず、ＴＣＰ１３の一方の端部を液晶表示パ
ネル１１の接続端子１１ｃ接続し、他端部を補強板１５
の貼り付けられた配線基板１４に接続する。そして、液
晶表示パネル１１をシャーシ１２のパネル接着面１２ａ
に接着し、ＴＣＰ１３をシャーシ１２の側縁部に沿って
折り曲げることにより、配線基板１４をシャーシ１２下
面側に案内しその配線基板取付け部１２ｂに配線基板１
４を接着する。Next, a method of mounting the above-described components will be described. The reinforcing plate 15 is bonded to the wiring board 14 in advance. First, one end of the TCP 13 is connected to the connection terminal 11c of the liquid crystal display panel 11, and the other end is connected to the reinforcing plate 15.
The wiring board 14 is attached. Then, the liquid crystal display panel 11 is attached to the panel bonding surface 12 a of the chassis 12.
The wiring board 14 is guided to the lower surface side of the chassis 12 by bending the TCP 13 along the side edge of the chassis 12 so that the wiring board 1 is attached to the wiring board mounting portion 12b.
4 is adhered.
【００１８】この時、駆動用ＩＣチップ１３ａは、配線
基板１４によって覆われ、下側から加わる負荷に対して
は、配線基板１４によって保護されるので、ＩＣチップ
１３ａの割れ、ＴＣＰ１３からの剥がれを防ぐことがで
き、接続の信頼性を高めることができる。At this time, the driving IC chip 13a is covered with the wiring board 14 and is protected by the wiring board 14 against a load applied from the lower side. Therefore, the IC chip 13a is not cracked or peeled off from the TCP 13. It can be prevented and the reliability of the connection can be improved.
【００１９】［第２の実施例］次に、本発明の第２の実
施例について説明する。図５は、本発明の第２の実施例
を説明するための分解斜視図である。同図に示されるよ
うに、この第２の実施例は、ＴＣＰ１３を配線基板１４
と補強板１５との挟み込むものである。この液晶表示装
置は次のように組み立てられる。駆動用ＩＣチップ１３
ａを補強板のチップ収容孔１５ａに収容し、ＴＣＰ１３
を配線基板１４と補強板１５の間に挟み補強板１５を配
線基板１４上に貼り付ける。ＴＣＰ１３の一方の端部の
端子を配線基板上の接続端子に接続する。そして、配線
基板１４を、上面に液晶表示パネル１１の接着されたシ
ャーシ１２の裏面に接着する。ＴＣＰ１３の他方の端部
の端子を液晶表示パネル上の接続端子に接続する。ＴＣ
Ｐの接続は、第１の実施例の場合と同様に、液晶表示パ
ネル側を先に行うようにしてもよい。本実施例において
は、ＴＣＰ１３と配線基板１４との間に補強板１５が存
在していないので、ＴＣＰ１３と配線基板１４との接続
にストレスが加わらなくなり、接続の信頼性をさらに高
めることができる。[Second Embodiment] Next, a second embodiment of the present invention will be described. FIG. 5 is an exploded perspective view for explaining a second embodiment of the present invention. As shown in the figure, in the second embodiment, the TCP 13 is connected to the wiring board 14.
And the reinforcing plate 15. This liquid crystal display device is assembled as follows. Driving IC chip 13
a into the chip receiving hole 15a of the reinforcing plate,
Is sandwiched between the wiring board 14 and the reinforcing board 15, and the reinforcing board 15 is attached on the wiring board 14. A terminal at one end of the TCP 13 is connected to a connection terminal on the wiring board. Then, the wiring board 14 is bonded to the rear surface of the chassis 12 to which the liquid crystal display panel 11 is bonded on the upper surface. The terminal at the other end of the TCP 13 is connected to a connection terminal on the liquid crystal display panel. TC
The connection of P may be made first on the liquid crystal display panel side as in the case of the first embodiment. In the present embodiment, since the reinforcing plate 15 does not exist between the TCP 13 and the wiring board 14, no stress is applied to the connection between the TCP 13 and the wiring board 14, and the reliability of the connection can be further improved.
【００２０】[0020]
【発明の効果】以上説明したように、本発明による液晶
表示装置の実装構造は、配線基板をＩＣチップを収容す
る収容部を設けた補強板を貼り付けることによって補強
するものであるので、配線基板と補強板の合計の厚さを
従来の配線基板の厚さと同程度とすることができ、駆動
用ＩＣチップの厚さ分だけ全体の厚さを薄くすることが
できる。また、配線基板に開口を設けるものではないの
で、基板上でのパターン配線が楽になる外、配線基板の
占有面積全体を配線の引き回しに使うことができるの
で、配線基板の大型化を招くことなく、薄型化を図るこ
とができる。また、ＩＣチップを配線基板にて覆う実施
例によれば、直接ＩＣチップに負荷がかからないように
することができ、ＩＣチップの破損を防ぎ、接続の信頼
性向上を図ることができる。As described above, the mounting structure of the liquid crystal display device according to the present invention reinforces the wiring board by attaching the reinforcing plate provided with the accommodating portion for accommodating the IC chip. The total thickness of the substrate and the reinforcing plate can be made approximately the same as the thickness of the conventional wiring substrate, and the overall thickness can be reduced by the thickness of the driving IC chip. In addition, since an opening is not provided in the wiring substrate, pattern wiring on the substrate is facilitated, and the entire area occupied by the wiring substrate can be used for routing the wiring, so that the size of the wiring substrate is not increased. In addition, the thickness can be reduced. Further, according to the embodiment in which the IC chip is covered with the wiring substrate, it is possible to prevent a load from being directly applied to the IC chip, to prevent damage to the IC chip, and to improve connection reliability.
【図１】本発明の実施の形態を説明するための断面図。FIG. 1 is a cross-sectional view illustrating an embodiment of the present invention.
【図２】本発明の実施の形態を説明するためのＴＣＰに
おける駆動用ＩＣチップの接続状態を示す断面図。FIG. 2 is a cross-sectional view showing a connection state of a driving IC chip in TCP for describing an embodiment of the present invention.
【図３】本発明の実施の形態を説明するための、ＴＣＰ
と配線基板との接続状態を示す断面図。FIG. 3 is a diagram illustrating a TCP according to an embodiment of the present invention;
Sectional drawing which shows the connection state of a wiring board.
【図４】本発明の第１の実施例を示す断面図と分解斜視
図。FIG. 4 is a sectional view and an exploded perspective view showing a first embodiment of the present invention.
【図５】本発明の第２の実施例を示す分解斜視図。FIG. 5 is an exploded perspective view showing a second embodiment of the present invention.
【図６】従来例の断面図。FIG. 6 is a sectional view of a conventional example.
【図７】他の従来例の断面図。FIG. 7 is a sectional view of another conventional example.
１、１１、２１ 液晶表示パネル １ａ、１１ａ 上側ガラス基板 １ｂ、１１ｂ 下側ガラス基板 １ｃ、１１ｃ 接続電極 ２ 異方性導電フィルム（ＡＣＦ） １２、２２ シャーシ １２ａ パネル接着面 １２ｂ 配線基板取り付け部 ３、１３、２３ ＴＣＰ ３ａ、１３ａ、２３ａ 駆動用ＩＣチップ ３ａ1 バンプ ３ｂ、１３ｂ 可撓性配線基板 ３ｂ1 可撓性基板 ３ｂ2 配線パターン ４、１４、２４ 配線基板 ４ａ 接続端子 ５、１５ 補強板 ５ａ、１５ａ チップ収容孔 ２５ 隙間1, 11, 21 Liquid crystal display panel 1a, 11a Upper glass substrate 1b, 11b Lower glass substrate 1c, 11c Connection electrode 2 Anisotropic conductive film (ACF) 12, 22 Chassis 12a Panel bonding surface 12b Wiring board mounting part 3, 13, 23 TCP 3a, 13a, 23a Driving IC chip 3a 1 Bump 3b, 13b Flexible wiring board 3b 1 Flexible board 3b 2 Wiring pattern 4, 14, 24 Wiring board 4a Connection terminal 5, 15 Reinforcement plate 5a , 15a Chip receiving hole 25 gap
Claims (4)
載してなるＴＣＰ（Tape Carrier Package）の一方の端
部に形成された端子が液晶表示パネルの接続端子に接続
され、他方の端部に形成された端子がリジット配線基板
の接続端子と接続されている液晶表示装置において、前
記リジット配線基板には補強板が接着されており、前記
駆動用ＩＣチップは前記補強板に開孔されたチップ収容
部内に収容されていることを特徴とする液晶表示装置。1. A terminal formed at one end of a TCP (Tape Carrier Package) in which a driving IC chip is mounted on a flexible wiring board is connected to a connection terminal of a liquid crystal display panel, and the other end thereof is connected. In a liquid crystal display device in which a terminal formed in the portion is connected to a connection terminal of a rigid wiring board, a reinforcing plate is bonded to the rigid wiring board, and the driving IC chip is opened in the reinforcing plate. A liquid crystal display device characterized by being housed in a chip housing part.
面に固着され、前記リジット配線基板が前記シャーシの
他方の面に固着され、前記可撓性配線基板が“コ”の字
状に折り返されていることを特徴とする請求項１記載の
液晶表示装置。2. The liquid crystal display panel is fixed to one surface of a chassis, the rigid wiring board is fixed to the other surface of the chassis, and the flexible wiring board is folded back in a "U" shape. The liquid crystal display device according to claim 1, wherein
配線基板と前記シャーシとの間に収容されていることを
特徴とする請求項２記載の液晶表示装置。3. The liquid crystal display device according to claim 2, wherein the driving IC chip is housed between the rigid wiring board and the chassis.
基板と前記補強板との間に挟み込まれていることを特徴
とする請求項１または２記載の液晶表示装置。4. The liquid crystal display device according to claim 1, wherein the flexible wiring board is sandwiched between the rigid wiring board and the reinforcing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7300420A JP2776344B2 (en) | 1995-10-26 | 1995-10-26 | Liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7300420A JP2776344B2 (en) | 1995-10-26 | 1995-10-26 | Liquid crystal display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09127541A true JPH09127541A (en) | 1997-05-16 |
| JP2776344B2 JP2776344B2 (en) | 1998-07-16 |
Family
ID=17884594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7300420A Expired - Fee Related JP2776344B2 (en) | 1995-10-26 | 1995-10-26 | Liquid crystal display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2776344B2 (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1282169A2 (en) * | 2001-07-30 | 2003-02-05 | Fujitsu Hitachi Plasma Display Limited | IC chip mounting structure and display device |
| KR100533717B1 (en) * | 1998-06-25 | 2006-04-06 | 엘지.필립스 엘시디 주식회사 | Slim Type Liquid Crystal Display |
| KR100547238B1 (en) * | 1998-07-29 | 2006-04-14 | 삼성전자주식회사 | LCD Module |
| KR100589399B1 (en) * | 2003-10-16 | 2006-06-13 | 삼성에스디아이 주식회사 | Plasma display apparatus having heat dissipating structure for driver ic |
| KR100627259B1 (en) * | 2003-10-23 | 2006-09-22 | 삼성에스디아이 주식회사 | Plasma display apparatus having tape carrier package |
| KR100648715B1 (en) * | 2004-04-29 | 2006-11-23 | 삼성에스디아이 주식회사 | Plasma display device |
| KR100669368B1 (en) * | 2003-10-23 | 2007-01-15 | 삼성에스디아이 주식회사 | Plasma display apparatus having heat dissipating structure for driver ic |
| EP1762888A1 (en) * | 2004-06-29 | 2007-03-14 | Matsushita Electric Industrial Co., Ltd. | Liquid crystal display |
| KR100666137B1 (en) * | 1998-10-20 | 2007-06-04 | 삼성전자주식회사 | Tiled liquid crystal display device and heat seal mounting method |
| JP2007148439A (en) * | 2001-07-30 | 2007-06-14 | Fujitsu Hitachi Plasma Display Ltd | Plasma display device and flat display device |
| CN100377631C (en) * | 2003-10-29 | 2008-03-26 | 三星Sdi株式会社 | Display device and heat dissipating means therefor |
| CN115953953A (en) * | 2023-01-17 | 2023-04-11 | 武汉天马微电子有限公司 | Display module, manufacturing method thereof and display device |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS60169617U (en) * | 1984-04-18 | 1985-11-11 | シャープ株式会社 | LCD display unit |
| JPH04281430A (en) * | 1991-03-11 | 1992-10-07 | Sanyo Electric Co Ltd | Liquid crystal display device |
| JPH04281431A (en) * | 1991-03-11 | 1992-10-07 | Sanyo Electric Co Ltd | Liquid crystal display device |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100533717B1 (en) * | 1998-06-25 | 2006-04-06 | 엘지.필립스 엘시디 주식회사 | Slim Type Liquid Crystal Display |
| KR100547238B1 (en) * | 1998-07-29 | 2006-04-14 | 삼성전자주식회사 | LCD Module |
| KR100666137B1 (en) * | 1998-10-20 | 2007-06-04 | 삼성전자주식회사 | Tiled liquid crystal display device and heat seal mounting method |
| EP1282169A2 (en) * | 2001-07-30 | 2003-02-05 | Fujitsu Hitachi Plasma Display Limited | IC chip mounting structure and display device |
| JP4528795B2 (en) * | 2001-07-30 | 2010-08-18 | 日立プラズマディスプレイ株式会社 | Plasma display device and flat display device |
| JP2007148439A (en) * | 2001-07-30 | 2007-06-14 | Fujitsu Hitachi Plasma Display Ltd | Plasma display device and flat display device |
| KR100589399B1 (en) * | 2003-10-16 | 2006-06-13 | 삼성에스디아이 주식회사 | Plasma display apparatus having heat dissipating structure for driver ic |
| KR100669368B1 (en) * | 2003-10-23 | 2007-01-15 | 삼성에스디아이 주식회사 | Plasma display apparatus having heat dissipating structure for driver ic |
| KR100627259B1 (en) * | 2003-10-23 | 2006-09-22 | 삼성에스디아이 주식회사 | Plasma display apparatus having tape carrier package |
| CN100377631C (en) * | 2003-10-29 | 2008-03-26 | 三星Sdi株式会社 | Display device and heat dissipating means therefor |
| US7414204B2 (en) | 2003-10-29 | 2008-08-19 | Samsung Sdi Co., Ltd. | Display device and heat dissipating means therefor |
| KR100648715B1 (en) * | 2004-04-29 | 2006-11-23 | 삼성에스디아이 주식회사 | Plasma display device |
| EP1762888A1 (en) * | 2004-06-29 | 2007-03-14 | Matsushita Electric Industrial Co., Ltd. | Liquid crystal display |
| EP1762888A4 (en) * | 2004-06-29 | 2008-01-23 | Matsushita Electric Ind Co Ltd | Liquid crystal display |
| CN115953953A (en) * | 2023-01-17 | 2023-04-11 | 武汉天马微电子有限公司 | Display module, manufacturing method thereof and display device |
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|---|---|
| JP2776344B2 (en) | 1998-07-16 |
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