JPH089968Y2 - 画像読取り用照明装置 - Google Patents

画像読取り用照明装置

Info

Publication number
JPH089968Y2
JPH089968Y2 JP1988062281U JP6228188U JPH089968Y2 JP H089968 Y2 JPH089968 Y2 JP H089968Y2 JP 1988062281 U JP1988062281 U JP 1988062281U JP 6228188 U JP6228188 U JP 6228188U JP H089968 Y2 JPH089968 Y2 JP H089968Y2
Authority
JP
Japan
Prior art keywords
substrate
led
image reading
illumination device
glass plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988062281U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01171168U (enrdf_load_stackoverflow
Inventor
英雄 近藤
芳弘 武田
多計夫 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP1988062281U priority Critical patent/JPH089968Y2/ja
Publication of JPH01171168U publication Critical patent/JPH01171168U/ja
Application granted granted Critical
Publication of JPH089968Y2 publication Critical patent/JPH089968Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Facsimile Heads (AREA)
  • Facsimile Scanning Arrangements (AREA)
JP1988062281U 1988-05-12 1988-05-12 画像読取り用照明装置 Expired - Lifetime JPH089968Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988062281U JPH089968Y2 (ja) 1988-05-12 1988-05-12 画像読取り用照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988062281U JPH089968Y2 (ja) 1988-05-12 1988-05-12 画像読取り用照明装置

Publications (2)

Publication Number Publication Date
JPH01171168U JPH01171168U (enrdf_load_stackoverflow) 1989-12-04
JPH089968Y2 true JPH089968Y2 (ja) 1996-03-21

Family

ID=31287905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988062281U Expired - Lifetime JPH089968Y2 (ja) 1988-05-12 1988-05-12 画像読取り用照明装置

Country Status (1)

Country Link
JP (1) JPH089968Y2 (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6083463A (ja) * 1983-10-13 1985-05-11 Nec Corp 原稿読み取り用光源

Also Published As

Publication number Publication date
JPH01171168U (enrdf_load_stackoverflow) 1989-12-04

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