JPH089968Y2 - Image reading illuminator - Google Patents

Image reading illuminator

Info

Publication number
JPH089968Y2
JPH089968Y2 JP1988062281U JP6228188U JPH089968Y2 JP H089968 Y2 JPH089968 Y2 JP H089968Y2 JP 1988062281 U JP1988062281 U JP 1988062281U JP 6228188 U JP6228188 U JP 6228188U JP H089968 Y2 JPH089968 Y2 JP H089968Y2
Authority
JP
Japan
Prior art keywords
substrate
led
image reading
illumination device
glass plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988062281U
Other languages
Japanese (ja)
Other versions
JPH01171168U (en
Inventor
英雄 近藤
芳弘 武田
多計夫 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP1988062281U priority Critical patent/JPH089968Y2/en
Publication of JPH01171168U publication Critical patent/JPH01171168U/ja
Application granted granted Critical
Publication of JPH089968Y2 publication Critical patent/JPH089968Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Facsimile Heads (AREA)
  • Facsimile Scanning Arrangements (AREA)

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、ファクシミリ,複写機等の画像読取り用照
明装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an image reading illumination device such as a facsimile or a copying machine.

〔従来の技術〕[Conventional technology]

従来、ファクシミリ,複写機等において、原稿面上の
画像を読み取る場合、原稿を相対的に一方向に移動させ
ながら、この原稿に対してその移動方向に直交する走査
方向に沿って、例えば発光ダイオードアレイまたは発光
ダイオードチップ(以下、LEDという。)を利用した画
像読取り用照明装置により、ライン状の照明光を照射
し、該原稿により反射された反射光をセルフォックレン
ズ等を介して受光装置、例えばCCDによって走査方向に
走査しながら読み取ることにより、原稿の移動に従って
順次上記読取り操作を繰り返して、原稿面上の画像を読
み取るようにしている。
2. Description of the Related Art Conventionally, when reading an image on a document surface in a facsimile, a copying machine, or the like, while moving the document relatively in one direction, for example, a light emitting diode is provided along a scanning direction orthogonal to the moving direction of the document. An image reading illumination device using an array or a light emitting diode chip (hereinafter, referred to as an LED) irradiates a linear illumination light, and the reflected light reflected by the document is received by a light receiving device via a SELFOC lens or the like. For example, by reading while scanning in the scanning direction with a CCD, the above-described reading operation is sequentially repeated in accordance with the movement of the document to read the image on the document surface.

上述の画像読取り用照明装置は、例えば第5図に示す
ように構成されている。即ち、画像読取り用照明装置1
は、長手方向に延びており且つLEDのための所定の配線
パターンを備えた平坦な基板2上に、その長手方向に沿
って一例に取り付けられたLED3と、その上方に配設され
たガラス板(または凸レンズ)4と、該LED3からの光が
側方に洩れることを阻止するランプハウス5とから構成
されている。
The above-mentioned image reading illumination device is configured, for example, as shown in FIG. That is, the image reading illumination device 1
Is an LED 3 mounted as an example along the longitudinal direction on a flat substrate 2 extending in the longitudinal direction and provided with a predetermined wiring pattern for the LED, and a glass plate arranged above the LED 3. (Or a convex lens) 4 and a lamp house 5 that prevents light from the LED 3 from leaking laterally.

〔考案が解決しようとする問題点〕[Problems to be solved by the invention]

しかしながら、上述のように構成された画像読取り用
照明装置1は、LED3を構成する各LEDのチップと基板2
上に備えられた配線パターンとの間にワイヤボンディン
グが行なわれ、このワイヤが基板2上に突出しているこ
とから、その後にガラス板4等を載置する際に、その作
業中にワイヤを切断してしまうことがある。
However, the image reading illumination device 1 configured as described above includes the LED chips and the substrate 2 that form the LED 3.
Since wire bonding is performed between the wiring pattern and the wiring pattern provided above, and this wire projects above the substrate 2, when the glass plate 4 or the like is subsequently placed, the wire is cut during the work. I may end up doing it.

そのためワイヤの部分を前以て樹脂モールドしておき
作業中にワイヤに触れることがないようにする必要があ
る。また、各LEDのチップから射出する光が側方に洩れ
ないようにするためランプハウス5が必要であるので、
組立て工程が多くなり生産コストが高くなっていた。
Therefore, it is necessary to resin-mold the wire portion beforehand so that the wire is not touched during the work. Also, since the lamp house 5 is necessary to prevent the light emitted from each LED chip from leaking to the side,
The number of assembling steps was large and the production cost was high.

本考案は、以上の点に鏡み、ガラス板等を載置する際
にLEDのチップと基板の配線パターンとの間のワイヤが
切断されることがなく、しかも簡単な構成により生産コ
ストが低減せしめられる、画像読取り用照明装置を提供
することを目的としている。
The present invention does not cut the wire between the LED chip and the wiring pattern of the substrate when mirroring the glass plate and mounting the glass plate etc. on the above points, and the production cost is reduced by the simple configuration. It is an object of the present invention to provide a lighting device for reading an image.

〔問題点を解決するための手段及び作用〕[Means and Actions for Solving Problems]

上記目的は、本考案によれば、相対的に一方向に移動
せしめられる原稿に対して、その移動方向に直交する長
手方向に延びた基板と、この基板の上面でその一側に沿
って取り付けられたLEDとを有しており、上記原稿の表
面に走査方向に延びるライン状の照明光を照射するよう
にした画像読取り用照明装置において、上記基板の長手
方向に沿って、該基板のLEDを取り付けるべき部分が、
該LEDを収容し得るように基板の他の部分よりも低く凹
型に一体的に形成され、該凹型部分にLEDが実装されて
いると共に、凹型部分の内壁に位置するように配線パタ
ーンが形成されており、少なくとも下側が平坦であるガ
ラス板またはレンズを上記基板の他の部分に当接させる
ことにより該LEDをカバーするようにした画像読取り用
照明装置によって達成される。
According to the present invention, the above-mentioned object is to mount an original, which is relatively moved in one direction, on a substrate extending in a longitudinal direction orthogonal to the moving direction and on the upper surface of the substrate along one side thereof. An image reading illuminating device that irradiates a line-shaped illumination light extending in the scanning direction onto the surface of the original, and the LED of the substrate along the longitudinal direction of the substrate. The part that should be attached is
The LED is mounted integrally in a concave shape lower than the other parts of the substrate so as to accommodate the LED, the LED is mounted in the concave part, and the wiring pattern is formed so as to be located on the inner wall of the concave part. This is achieved by an image reading illumination device in which a glass plate or a lens having a flat bottom surface is brought into contact with another portion of the substrate to cover the LED.

この考案によれば、基板のLEDを取り付けるべき部分
において、他の部分よりも低く凹型に形成されており、
この凹型部分にLEDを取り付けるようにしたから、該LED
を構成する各LEDのチップに対してボンディングされた
ワイヤが該基板の凹型部分内に収容されることになる。
そのため、LEDが基板上に突出していないので、ガラス
板または凸レンズを載置する際には、該ガラス板等の下
面を基板の上記他の部分に当接させればよいので、この
とき該ワイヤを切断するおそれは全くなくなり、これに
よりワイヤ部分の樹脂モールドが不要になる。さらに、
上記基板の凹型部分の内壁に配線パターンが形成されて
いるから、内壁面が出射光を上方へ導くための反射面に
なっており、LEDを構成する各LEDのチップから側方に射
出する光をカットし、上方に反射させることになるの
で、ランプハウスが不要になると共に、本画像読取り用
照明装置の発光効率が改善されることとなる。しかも基
板の凹型部分は基板打抜きの際に同時に成形され得るの
で、工程数が増えることもなく作業性が良好となる。
According to this invention, in the portion where the LED of the substrate is to be attached, it is formed in a concave shape lower than other portions,
Since the LED is attached to this concave part, the LED
The wires bonded to the chips of the LEDs constituting the above will be accommodated in the concave portion of the substrate.
Therefore, since the LED does not project onto the substrate, when mounting the glass plate or the convex lens, the lower surface of the glass plate or the like may be brought into contact with the other portion of the substrate. There is no possibility of cutting the wire, which eliminates the need for resin molding of the wire portion. further,
Since the wiring pattern is formed on the inner wall of the concave portion of the substrate, the inner wall surface is a reflection surface for guiding the emitted light upward, and the light emitted laterally from the LED chips constituting the LED. Since the light is cut and the light is reflected upward, the lamp house is not required and the luminous efficiency of the image reading illumination device is improved. Moreover, since the concave portion of the substrate can be formed simultaneously with the punching of the substrate, the workability is improved without increasing the number of steps.

〔実施例〕〔Example〕

以下、図面に示した実施例に基づいて本考案を詳細に
説明する。
Hereinafter, the present invention will be described in detail based on the embodiments shown in the drawings.

第1図は、本考案による画像読取り用照明装置の一実
施例を示しており、この画像読取り用照明装置10は、相
対的に一方向に移動せしめられる図示しない原稿に対し
て、その移動方向に直交する長手方向に延びており後述
のように形成された基板11を有している。そして、この
基板11の上面の長手方向に沿ってLED12が取り付けられ
ていて、その上方にはガラス板13が配設されて成ってい
る。
FIG. 1 shows an embodiment of an image reading illuminating device according to the present invention. The image reading illuminating device 10 moves in a moving direction with respect to a document (not shown) which is relatively moved in one direction. It has a substrate 11 extending in the longitudinal direction orthogonal to the substrate and formed as described below. The LED 12 is attached along the longitudinal direction of the upper surface of the substrate 11, and the glass plate 13 is arranged above the LED 12.

上記基板11は、第2図に示すように、容易に加工可能
な材料、例えばアルミニウム等の材料から成る板材21の
表面にエポキシ樹脂等の絶縁層22を形成し、さらにその
上に銅の薄膜を付着させエッチングにより所定の配線パ
ターン23を形成することにより構成されている。
As shown in FIG. 2, the substrate 11 has an insulating layer 22 such as an epoxy resin formed on the surface of a plate material 21 made of a material that can be easily processed, for example, a material such as aluminum, and further a thin copper film thereon. Is formed and a predetermined wiring pattern 23 is formed by etching.

この基板11は、平坦な板材21に対して上記作業を行な
った後、図示のように基板11のLED12を取り付けるべき
長手方向に沿った領域を他の部分よりも低く、LED12を
収容し得る充分な深さの凹型部分11aとして、例えばプ
レス成形により成形される。この際、LED12を構成する
各LEDのチップに対する配線パターンが該凹型部分11a内
に位置するようになっている。また、基板11は、大きな
一枚の板材21から複数枚の基板11を打ち抜くようにし
て、この基板11の打抜きと同時に上記凹型部分11aの成
形を行なうようにすれば、工程数が増えることもなく、
非常に簡単に凹型部分11aが形成されることとなる。
After performing the above operation on the flat plate member 21, the substrate 11 has a lower region along the longitudinal direction where the LED 12 of the substrate 11 should be attached as shown in the figure than other portions, and is sufficient to accommodate the LED 12. The concave portion 11a having various depths is formed by, for example, press molding. At this time, the wiring pattern for the chips of each LED that constitutes the LED 12 is positioned within the concave portion 11a. Further, if the substrate 11 is formed by punching out a plurality of substrates 11 from a single large plate material 21 and the concave portion 11a is formed simultaneously with the punching of the substrate 11, the number of steps may increase. Without
The concave portion 11a will be formed very easily.

上記基板11の凹型部分11a内にLED12を取り付けて該LE
D12を構成する各LEDのチップに対して必要なワイヤボン
ディングを行なった後、基板11上にガラス板13を載置し
固定する。この場合、基板11の凹型部分11aにLED12を実
装したとき、該LED12は完全に該凹型部分11a内に収容さ
れ得るので、ガラス板13を基板11の他の部分の上面に当
接させた場合、該ガラス板13の下面がLED12を構成する
各LEDのチップに対してボンディングされたワイヤに触
れるようなことがなく、従って該ワイヤが作業中に切断
されることもない。このため少なくともボンディングさ
れたワイヤの周辺を樹脂モールドする必要は全くない。
The LED 12 is mounted in the concave portion 11a of the substrate 11 and the LE
After performing necessary wire bonding on the chips of each LED constituting D12, a glass plate 13 is placed and fixed on the substrate 11. In this case, when the LED 12 is mounted on the concave portion 11a of the substrate 11, the LED 12 can be completely accommodated in the concave portion 11a, so that the glass plate 13 is brought into contact with the upper surface of the other portion of the substrate 11. Moreover, the lower surface of the glass plate 13 does not touch the wires bonded to the chips of the LEDs constituting the LED 12, and therefore the wires are not cut during the operation. Therefore, it is not necessary to mold at least the periphery of the bonded wire with resin.

第3図は本考案の他の実施例を示したもので、基板11
に複数の凹型部分11bを直線状に形成し、それぞれの凹
部11b内にLEDを収容する構成としたものである。なお、
この凹部11b内には先の実施例と同様に絶縁層22を介し
て配線パターン23が設けてある(第4図参照)。
FIG. 3 shows another embodiment of the present invention, which is a substrate 11
A plurality of concave portions 11b are formed in a straight line on the inner surface of each of the concave portions 11b, and LEDs are housed in the respective concave portions 11b. In addition,
A wiring pattern 23 is provided in the recess 11b via an insulating layer 22 as in the previous embodiment (see FIG. 4).

本考案による画像読取り用照明装置は以上のように構
成されており、画像読取り用照明装置10は、第5図に示
した従来の画像読取り用照明装置1と同様に動作すると
共に、LED12が基板11の長手方向に沿って形成された凹
型部分11a内に完全に収容された状態で基板11に対して
実装されているので、このLED12を構成する各LEDのチッ
プから側方に射出する光は、上記基板11の凹型部分11a
の側壁により遮断されることになり、側方に洩れること
はなく、逆に該側壁によって反射されて図示のように上
方に進むことになるため、図示しない原稿の照明に寄与
することとなり、本画像読取り用照明装置10の照明効率
を向上させることになる。
The image reading illumination device according to the present invention is constructed as described above. The image reading illumination device 10 operates in the same manner as the conventional image reading illumination device 1 shown in FIG. Since it is mounted on the substrate 11 in a state that it is completely accommodated in the concave portion 11a formed along the longitudinal direction of 11, the light emitted laterally from the LED chips constituting this LED 12 is , The concave portion 11a of the substrate 11
It will be blocked by the side wall of the document and will not leak to the side, but on the contrary it will be reflected by the side wall and proceed upward as shown in the figure, which will contribute to the illumination of the original document not shown. The illumination efficiency of the image reading illumination device 10 is improved.

〔考案の効果〕[Effect of device]

以上述べたように本考案によれば、基板の凹型部分に
LEDが取り付けられることから、該LEDを構成する各LED
のチップに対してボンディングされたワイヤが該基板の
凹型部分内に収容されることとなり、基板上に突出しな
いですむ。
As described above, according to the present invention, the concave portion of the substrate is
Since the LEDs are attached, each LED that makes up the LED
The wire bonded to the chip is housed in the concave portion of the substrate, and does not need to protrude onto the substrate.

従って、ガラス板または凸レンズを載置する際には、
該ガラス板等の下面を基板の上記他の部分に当接させれ
ばよいので、このとき該ワイヤを切断するおそれは全く
なくなる。これによりワイヤ部分の樹脂モールドが不要
になる。
Therefore, when placing a glass plate or convex lens,
Since it suffices to bring the lower surface of the glass plate or the like into contact with the other portion of the substrate, there is no possibility of cutting the wire at this time. This eliminates the need for resin molding of the wire portion.

さらに、上記基板の凹型部分の内壁がLEDを構成する
各LEDのチップから側方に射出する光カットし、上方に
反射させることになるので、ランプハウスが不要になる
と共に、本画像読取り用照明装置の発光効率が改善され
ることになる。しかも基板の凹型部分は基板打抜きの際
に同時に成形され得るので、工程数が増えることもなく
作業性が良い等の利点がある。
Furthermore, since the inner wall of the concave portion of the substrate cuts light emitted laterally from each LED chip that constitutes the LED and reflects it upward, a lamp house is not required and the image reading illumination is used. The luminous efficiency of the device will be improved. Moreover, since the concave portion of the substrate can be formed simultaneously with the punching of the substrate, there is an advantage that the number of steps is not increased and the workability is good.

かくして、本考案によれば、ガラス板等を載置する際
にLEDのチップと基板の配線パターンとの間のワイヤが
切断されることがなく、しかも簡単な構成により生産コ
ストが低減せしめられ得る極めて優れた画像読取り用照
明装置が提供され得ることになる。
Thus, according to the present invention, the wire between the LED chip and the wiring pattern of the substrate is not cut when the glass plate or the like is placed, and the production cost can be reduced by the simple configuration. An excellent image reading illumination device can be provided.

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案による画像読取り用照明装置の一実施例
を示す概略側面図、第2図は第1図の実施例における基
板の拡大断面図である。 第3図は本考案装置の他の実施例の一部省略した外観
図、第4図は第3図のIV-IV線断面図である。 第5図は従来の画像読取用照明装置の一例を示す概略側
面図である。 10……画像読取用照明装置;11……基板;11a,11b……凹
型部分;12……LEDアレイ;13……ガラス板;21……板材;2
2……絶縁層;23……配線パターン。
1 is a schematic side view showing an embodiment of an image reading illumination device according to the present invention, and FIG. 2 is an enlarged sectional view of a substrate in the embodiment of FIG. FIG. 3 is a partially omitted external view of another embodiment of the device of the present invention, and FIG. 4 is a sectional view taken along line IV-IV of FIG. FIG. 5 is a schematic side view showing an example of a conventional image reading illumination device. 10 ... Image reading illumination device; 11 ... Substrate; 11a, 11b ... Recessed part; 12 ... LED array; 13 ... Glass plate; 21 ... Plate material; 2
2 ... Insulating layer; 23 ... Wiring pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】相対的に一方向に移動せしめられる原稿に
対して、その移動方向に直交する長手方向に延びた基板
と、該基板の上面でその一端に沿って取り付けられたLE
Dを含んでおり、該原稿の表面に走査方向に延びるライ
ン状の照明光を照射する画像読取り用照明装置におい
て、 上記基板の長手方向に沿って、該基板のLEDを取り付け
るべき部分が、該LEDを収容し得るように上記基板の他
の部分よりも低く凹型に一体的に形成され、該凹型部分
にLEDが実装されていると共に、該凹型部分の内壁に位
置するように配線パターンが形成されており、少なくと
も下側が平坦であるガラス板またはレンズを上記基板の
他の部分に当接させることにより該LEDをカバーするよ
うにしたことを特徴とする画像読取り用照明装置。
1. A substrate extending in a longitudinal direction orthogonal to a moving direction of a document which is relatively moved in one direction, and an LE mounted on one surface of the substrate along one end thereof.
In the image reading illumination device that includes D and irradiates the surface of the original document with linear illumination light extending in the scanning direction, along the longitudinal direction of the substrate, a portion to which the LED of the substrate is to be attached is It is integrally formed in a concave shape lower than the other parts of the substrate so as to accommodate the LED, the LED is mounted in the concave part, and a wiring pattern is formed so as to be located on the inner wall of the concave part. An image reading illumination device, characterized in that a glass plate or a lens having a flat bottom surface is brought into contact with another portion of the substrate to cover the LED.
JP1988062281U 1988-05-12 1988-05-12 Image reading illuminator Expired - Lifetime JPH089968Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988062281U JPH089968Y2 (en) 1988-05-12 1988-05-12 Image reading illuminator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988062281U JPH089968Y2 (en) 1988-05-12 1988-05-12 Image reading illuminator

Publications (2)

Publication Number Publication Date
JPH01171168U JPH01171168U (en) 1989-12-04
JPH089968Y2 true JPH089968Y2 (en) 1996-03-21

Family

ID=31287905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988062281U Expired - Lifetime JPH089968Y2 (en) 1988-05-12 1988-05-12 Image reading illuminator

Country Status (1)

Country Link
JP (1) JPH089968Y2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6083463A (en) * 1983-10-13 1985-05-11 Nec Corp Light source for original reading

Also Published As

Publication number Publication date
JPH01171168U (en) 1989-12-04

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