KR20060069739A - Package for light emitting device - Google Patents

Abstract

Disclosed is a light emitting device package having a structure in which a beam can be illuminated on an upper surface or both sides of a substrate.

The disclosed light emitting device package includes a mount; One or a plurality of light emitting elements provided on the mount to irradiate a beam having a predetermined wavelength; A common electrode formed on at least one side of the bottom of the mount and electrically connected to one or more light emitting devices; An address electrode that is electrically distinguished from the common electrode and is formed over at least one side of the bottom of the mount and is electrically connected to each of the one or more light emitting devices; and is located at the bottom of the mount with respect to the external circuit board. A portion of the common electrode and the address electrode, or a portion of the common electrode and the address electrode positioned on the side of the mount may be bonded to implement the top view and the side view.

Description

Light emitting device package {Package for light emitting device}

1 is a schematic cross-sectional view showing a conventional light emitting device package.

2 is a perspective view showing a light emitting device package according to an embodiment of the present invention.

3 is a cross-sectional view taken along line III-III of FIG. 2;

4 is a cross-sectional view taken along the line IV-IV of FIG. 2.

5 is a cross-sectional view taken along the line VV of FIG. 2.

6A to 6D each illustrate a process of forming a common electrode and an address electrode on a mount.

Figure 7 is a perspective view showing a top view embodiment of a light emitting device package according to an embodiment of the present invention.

Figure 8 is a perspective view showing a side view embodiment of a light emitting device package according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

20 ... mount 30 ... light emitting element

31, 33, 35 ... first to third light emitting elements 40 ... common electrode

41, 43, 45 ... first to third bonding pads 47 ... common electrode portion

49 Electrical connection 50 Address electrode

51a, 52a, 53a ... fourth to sixth bonding pads

51b, 52b, 53b ... seventh to ninth bonding pads

54a, 55a, 56a ... first to third address electrode portions

54b, 55b, 56b ... fourth to sixth address electrode portions

61 ... conductive adhesive 65 ... wire

67 Spacer 70 Reflector

71 ... reflective 75 ... nano silver layer

80 ... focusing lens 100 ... light emitting device package

200 ... Circuit Board

The present invention relates to a light emitting device package for packaging a light emitting device that emits light by an applied electric signal, and more particularly, to a light emitting device package having a structure in which a beam can be illuminated on an upper surface or both sides of a substrate.

In general, a light emitting diode (LED) is a semiconductor device made of a compound material such as GaAs, AlGaAs, InGaAs, GaN, InGaN, etc., and illuminates beams of various colors according to selected compound material properties. The light emitting device is mainly used in the form of a package, and the light emitting device package may be used as a light source of a flat panel display using a liquid crystal display device or the like.

When the light emitting device package is mounted on a substrate of an electronic device, the light emitting device package is divided into a top view and a side view according to a light emission direction of a beam illuminated from the light emitting device on the substrate. Here, the top view means that the beam is emitted to the surface of the substrate, the side view means that the beam is emitted to the side of the substrate.

On the other hand, the conventional light emitting device package is manufactured by dividing the top view only and side view only. Therefore, the top view light emitting device package cannot be used for the side view, and conversely, the side view light emitting device package cannot be used for the top view. Accordingly, since the light emitting direction of the conventional light emitting device package is determined, compatibility is reduced.

1 is a cross-sectional view illustrating a conventional surface mount top view light emitting device package. Referring to the drawings, a conventional light emitting device package includes a mount 1, a light emitting device 5 mounted on a conductive adhesive 3 applied to a part of the mount 1, and an electrical connection to the outside. It includes an electrode structure. The electrode structure includes a bonding pad 7 provided on the mount 1, a wire 9 connecting the bonding pad 7 and the upper electrode 6 of the light emitting element 5, first and Second external electrodes 11 and 13 are included. The first external electrode 11 is electrically connected to the bonding pad 7 and is formed over the sidewall and the lower portion of the mount 1. The second external electrode 13 penetrates through the mount 1 and is electrically connected to the conductive adhesive 3, and an end thereof is positioned below the mount 1. Here, a molding resin 15 for focusing the diverging beam irradiated from the light emitting element 5 is formed on the mount 1 in a state of wrapping the light emitting element 5, the bonding pad 7, and the wire 9. All.

The light emitting device package thus constructed is mounted on the surface of the main circuit board 17 of the electronic device and used only for the top view for illuminating light in a direction perpendicular to the surface of the main circuit board 17. That is, it cannot be used for side view due to its structural limitation.

In addition, since the light emitting device package having the above structure does not include a configuration for packaging a plurality of light emitting devices, there is a disadvantage in that a light emitting device package must be provided in each pixel unit. In addition, since it has a structure that focuses the illumination beam through the molding resin has a disadvantage that it is difficult to change the orientation angle.

Accordingly, the present invention has been made in view of the above-described points, and can be used not only for the top view but also for the side view by changing the mounting direction of the main circuit board. The purpose of the present invention is to provide a light emitting device package having a structure in which a package can be mounted and a slice can be sliced, and an orientation angle of light illuminated from the light emitting device can be easily changed.

In order to achieve the above object, a light emitting device package according to the present invention includes a mount; One or a plurality of light emitting elements installed on the mount to irradiate a beam having a predetermined wavelength; A common electrode formed on at least one side of the bottom of the mount and electrically connected to the one or more light emitting devices; An address electrode that is electrically distinguished from the common electrode and is formed over at least one side of the bottom surface of the mount and electrically connected to each of the one or more light emitting devices;

A top view and a side view may be realized by bonding a portion of the common electrode and the address electrode positioned on the bottom surface of the mount to the external circuit board, or a portion of the common electrode and the address electrode disposed on the side of the mount. .

More preferably provided on the mount, the cavity is formed on the light emitting element, the reflection having a reflecting surface for reflecting the diverging beam irradiated from the light emitting element on the inner surface of the cavity to change its direction Absence; And a spacer interposed between the mount and the reflective member.

Hereinafter, a light emitting device package according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view illustrating a light emitting device package according to an exemplary embodiment of the present invention, and FIGS. 3 to 5 are cross-sectional views of FIG. 2.

Referring to the drawings, a light emitting device package according to an embodiment of the present invention is a mount 20, at least one light emitting device 30 installed on the mount 20, and the bottom surface 21 of the mount 20 And a common electrode 40 and an address electrode 50 for applying a current to the light emitting device 30 formed over the first side surface 23a and / or the second side surface 23b. It is possible to mount both on the bottom surface 21 and the first and / or second side surfaces 23a and 23b with respect to the circuit board 100 of the electronic device. Therefore, as one light emitting device package, both a top view and a side view can be implemented.

The mount 20 constitutes a base of the package, and at least a portion of the mount 20 is made of an insulator material. The light emitting device 30 is installed on the mount 20, and the common electrode 40 and the address electrode 50 are formed.

The light emitting device 30 is mounted on the mount 20, and illuminates visible light of various colors according to the properties of the semiconductor compound material used. The light emitting device 30 may be composed of one or a plurality of light emitting beams of a predetermined wavelength. FIG. 2 illustrates an example in which the light emitting device 30 includes first to third light emitting devices 31, 33, and 35. The first to third light emitting devices 31 and 33 and 35 respectively illuminate visible light having different wavelengths, for example, light of red, blue, and green wavelengths. Accordingly, the light emitting device package according to the present invention independently drives the first to third light emitting devices 31, 33 and 35, and combinations thereof as well as monochromatic light of a predetermined color illuminated at each of them. Can provide full color light.

The common electrode 40 is formed over at least one side surface 23a and / or 23b and the bottom surface 21 of the mount 20, and is electrically connected to the light emitting device 30. To this end, the common electrode 40 includes first to third bonding pads 41, 43, 45 mounted on each of the first to third light emitting devices 31, 33, and 35. And a common electrode portion 47 formed over the bottom surface 21 and the side surfaces 23a and 23b of the mount 20.

The first to third bonding pads 41 and 43 and 45 are positioned above the mount 20, and electrical connections 49 are provided between the first to third bonding pads 41 and 43 and 45 to be electrically connected to each other. The common electrode 47 is a lead frame electrically connected to the first to third bonding pads 41, 43, and 45, and preferably at least one side of the bottom surface 21 of the mount 20. Is formed on both sides 23a and 23b. Therefore, when the light emitting device package of the present invention is to be mounted on the circuit board 100 of the external electronic device, any part of the bottom surface 21 and the side surfaces 23a and 23b of the mount 20 is the circuit board 100. The common electrode 47 may be electrically connected to the circuit board 100 even when facing the common board 47.

Here, the conductive adhesive 61 may be further included between the common electrode 40 and the light emitting device 30. The conductive adhesive 61 bonds the light emitting element 30 onto the common electrode 40. Therefore, a separate electrical connection is electrically connected and mutually bonded to the light emitting element 30 and the common electrode 40 without a wire.

The address electrode 50 is formed over at least one side surface 23a, 23b and the bottom surface 21 of the mount 20, and is electrically connected to the light emitting device 30. To this end, the address electrodes 50 are formed through the fourth to sixth bonding pads 51a, 52a, 53a, and the first to the first electrodes formed on the bottom surface 21 and the side surfaces 23a of the mount 20. And three address electrode portions 54a, 55a, 56a. Here, each of the fourth to sixth bonding pads 51a, 52a, and 53a is electrically connected to the first to third light emitting devices 31, 33, 35 by a wire 65. . In addition, the fourth to sixth bonding pads 51a, 52a, and 53a are electrically separated from each other at the upper and lower positions of the mount 20, and the first to the first to fifth bonding pads 51a, 52a, and 53a may be electrically separated from each other. The three light emitting elements 31, 33, 35 can emit light independently. The first to third address electrode portions 54a, 55a, 56a are integrally formed with each of the fourth to sixth bonding pads 51a, 52a, 53a, and a current is applied thereto. The first to third light emitting devices 31, 33, 35 are transferred to the first to third light emitting devices 31 through the fourth to sixth bonding pads 51a, 52a, and 53a. 33 and 35 may be emitted. Therefore, when the light emitting device package of the present invention is to be mounted on the circuit board 100 of the external electronic device, any part of the bottom surface 21 and the first side surface 23a of the mount 20 may be connected to the circuit board 100. The first to third address electrode parts 54a, 55a, 56a may be electrically connected to the circuit board 100 even when facing each other.

In this case, the address electrode 50 may include the seventh to ninth bonding pads 51b in preparation of installing the light emitting device package such that the second side surface 23b of the mount 20 faces the circuit board 100. (52b) 53b and the fourth to sixth address electrode portions 54b, 55b and 56b. The seventh to ninth bonding pads 51b, 52b, and 53b are electrically connected to each of the first to third light emitting devices 31, 33, 35 through wires 65, and mutually. The liver is electrically distinguished. The fourth to sixth address electrode parts 54b, 55b, and 56b are formed on the bottom surface 21 and the second side surface 23b of the mount 20, and the seventh to ninth bonding pads. It is formed integrally with (51b) 52b and 53b.

Here, the process of forming the common electrode 40 and the address electrode 50 with respect to the mount 20 will be described later.

In addition, the light emitting device package according to the present invention preferably further includes a reflecting member 70 for changing the directivity by reflecting the diverging beam emitted from the light emitting device 30. To this end, the reflective member 70 is provided on the mount 20 and has a cavity 70b through which the beam irradiated from the light emitting device 30 is transmitted. In addition, the inner surface of the cavity 70b has a reflecting surface 71 which reflects a part of the firing beam irradiated from the light emitting element 30 and changes its traveling direction. The reflective surface 71 is formed in a direction perpendicular to the upper surface of the mount 20, and reflects a part of the diverging light emitted from the light emitting device 20, thereby being perpendicular to or perpendicular to the upper surface of the mount 20. Make it face in the close direction. Here, the reflective surface 71 is preferably coated with a high reflectivity nano silver layer 75 having a nano-scale to increase the reflectance.

Here, a spacer 67 is interposed between the mount 20 and the reflective member 70. The spacer 67 prevents the common electrode 40 and the address electrode 50 formed on the mount 20 from being in electrical contact with the reflective member 70.

In addition, it is preferable that the light emitting device package according to the present invention further includes a focusing lens 80 on the reflective member 70. The focusing lens 80 has a cylindrical shape as shown in FIG. 2, so that the focusing angle can be narrowed by focusing the light illuminated by the light emitting device 30.

6A through 6D, a process of forming a common electrode and an address electrode on a mount will be described.

First, as shown in FIG. 6A, the base material 81 which comprises a mount is prepared, and the electrically conductive material 83 is formed in the whole outer periphery of this base material 81. FIG. Here, the base material 81 is a material having excellent thermal conductivity, for example, aluminum or medium carbon steel material to electrically dissipate heat generated when the light is emitted from the light emitting device, and for electrically distinguishing from the conductive material 83. It is comprised including an insulating layer.

Subsequently, the conductive material 83 is patterned into a shape as shown in FIGS. 6B and 6C through a lithography process using a mask. Through this patterning, the common electrode shape 85 and the address electrode shape 87 can be provided. However, since the side surface of the base material 81 is thin, it is difficult to pattern through the above-described lithography process. Since the portions are not etched, they are electrically connected to each other.

Here, the dotted line A represents a slice line that can be sliced. That is, in manufacturing the light emitting device package according to the present invention, in addition to the method of manufacturing a package having a structure as shown in FIG. 2 independently, as shown in FIG. Through the process of forming an electrode and an address electrode and forming a reflective member including a plurality of cavities, a plurality of light emitting device packages may be simultaneously manufactured and cut and used along the slice line A if necessary. When cutting along the slice line A illustrated, the first to third light emitting devices 31, 33, and 35 of FIG. 2 constitute a light source of one light emitting device package.

On the other hand, when the first to third light emitting elements are represented by one modification without cutting the slice line A, it is also possible to configure three sets of light emitting elements composed of nine light sources in one package.

Finally, as shown in FIG. 6D, the common electrode pattern and the address electrode formed by removing the boundary between the common electrode patterns connected to both sides of the base material and the address electrode pattern are formed. Formation of 50 is completed. By forming the common electrode 40 and the address electrode 50 through such a process, the electrodes may be formed on both sides as well as the bottom of the mount 20.

Since the light emitting device package configured as described above has an electrode pattern formed under the mount, the bottom surface of the light emitting device package 100 may be mounted on the main circuit board 200 as shown in FIG. have. In addition, since the electrode pattern is formed on the side of the mount, as shown in FIG. 8, one side of the mount of the light emitting device package 100 may be mounted on the main circuit board 200 to be used for side view.

In addition, the light emitting device package according to the present invention can be mounted a plurality of light emitting devices in a single package, it is possible to implement a flat backlight light using this light emitting device package. In addition, since the package can be sliced, the number of light emitting devices can be selected and used according to need, and thus can be applied to various fields.

In addition, by reflecting and focusing a part of the diverging light illuminated from the light emitting device through the nano silver coating formed on the reflecting member and the reflecting surface, it is possible to narrow the directivity angle of the illumination light and increase the luminous efficiency.

The above embodiments are merely exemplary, and various modifications and equivalent other embodiments are possible from those skilled in the art. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the invention described in the claims below.

Claims (10)

A mount; One or a plurality of light emitting elements installed on the mount to irradiate a beam having a predetermined wavelength; A common electrode formed on at least one side of the bottom of the mount and electrically connected to the one or more light emitting devices; An address electrode that is electrically distinguished from the common electrode and is formed over at least one side of the bottom surface of the mount and electrically connected to each of the one or more light emitting devices; A top view and a side view may be implemented by bonding a portion of the common electrode and the address electrode positioned on the bottom surface of the mount to the external circuit board or a portion of the common electrode and the address electrode disposed on the side of the mount. Light emitting device package. The method of claim 1, And the address electrode and the light emitting device are electrically connected to each other by a wire. The method of claim 1, And a conductive adhesive applied between the common electrode and the light emitting device to bond the common electrode and the light emitting device. The method of claim 1, The light emitting device, A light emitting device package comprising a first to a third light emitting device for irradiating visible light of different wavelengths, respectively. The method of claim 4, wherein The common electrode, First to third bonding pads electrically connected to each other and having the first to third light emitting devices mounted thereon; And a common electrode part electrically connected to the first to third bonding pads and formed on the bottom and side surfaces of the mount. The method of claim 4, wherein The address electrode, Fourth to sixth bonding pads formed to be electrically separated from each other at an upper predetermined position of the mount, and electrically connected to each of the first to third light emitting devices; And a first to third address electrode part electrically connected to each of the fourth to sixth bonding pads, the first and third address electrode parts being formed on the bottom and one side of the mount. The method of claim 6, The address electrode, A seventh to ninth bonding pads formed to be electrically separated from each other on top of the mount, and electrically connected to each of the first to third light emitting devices; And a fourth to sixth address electrode part electrically connected to each of the seventh to ninth bonding pads and formed on the bottom surface and the other side of the mount. The method according to any one of claims 1 to 7, A reflection member provided on the mount, the cavity being formed on the light emitting element, the reflecting member having a reflecting surface on the inner surface of the cavity reflecting the diverging beam irradiated from the light emitting element to change its direction; The light emitting device package further comprises a spacer interposed between the mount and the reflective member. The method of claim 8, The reflective surface is formed in a direction perpendicular to the upper surface of the mount, the light emitting device package, characterized in that the nano-silver layer is formed on the coating. The method of claim 8, And a focusing lens formed on the cavity of the reflective member to focus the light illuminated by the light emitting device.

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