JPH09102631A - Semiconductor light emitting module - Google Patents
Semiconductor light emitting moduleInfo
- Publication number
- JPH09102631A JPH09102631A JP7257896A JP25789695A JPH09102631A JP H09102631 A JPH09102631 A JP H09102631A JP 7257896 A JP7257896 A JP 7257896A JP 25789695 A JP25789695 A JP 25789695A JP H09102631 A JPH09102631 A JP H09102631A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- semiconductor light
- lens
- emitting element
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体発光モジュ
ール、特に小型・薄型且つ高出力の半導体発光モジュー
ルに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor light emitting module, and more particularly to a small, thin and high power semiconductor light emitting module.
【０００２】[0002]
【従来の技術】複数の半導体発光装置又は半導体発光素
子が単一の外囲体に組み込まれて成る半導体発光装置を
構成する所謂半導体発光モジュールは公知である。図９
に示す従来の半導体発光モジュールは、プリント基板
（１）と、プリント基板（１）に実装された複数個の発
光ダイオード（２）と、発光ダイオード（２）を包囲し
てプリント基板（１）に取り付けられた外囲体（３）か
ら成り、複数個の発光ダイオード（２）をそれぞれの配
光方向を揃えて一体に形成される。発光ダイオード
（２）は、外部リード（４）と、外部リード（４）の端
部に固定されたレンズ（５）とを有する。図示しない
が、外部リード（４）はヘッダ（皿状支持電極体）を備
え、レンズ（５）は外部リード（４）のヘッダに固着さ
れた発光ダイオード素子を封止する。2. Description of the Related Art A so-called semiconductor light emitting module which constitutes a semiconductor light emitting device in which a plurality of semiconductor light emitting devices or semiconductor light emitting elements are incorporated in a single envelope is known. FIG.
The conventional semiconductor light emitting module shown in FIG. 1 is a printed circuit board (1), a plurality of light emitting diodes (2) mounted on the printed circuit board (1), and a light emitting diode (2) surrounding the printed circuit board (1). A plurality of light emitting diodes (2) are formed integrally with each other, and each of the plurality of light emitting diodes (2) has an attached outer enclosure (3). The light emitting diode (2) has an outer lead (4) and a lens (5) fixed to the end of the outer lead (4). Although not shown, the external lead (4) includes a header (a dish-shaped supporting electrode body), and the lens (5) seals the light emitting diode element fixed to the header of the external lead (4).
【０００３】[0003]
【発明が解決しようとする課題】ところで、光通信を目
的として自動車に搭載される半導体発光モジュールにお
いては、モジュールが小面積（小型）であり且つ薄型で
あることが要求される。ここで、図９の半導体発光モジ
ュールでは、外部リード（４）を備え且つ個別に完成し
た樹脂封止型の発光ダイオード（２）を回路基板（１）
に配置した構成となっており、レンズ（５）の横幅Ｌ及
び高さＨが比較的大きいため、このような要求を満足す
ることができない。By the way, in a semiconductor light emitting module mounted on an automobile for the purpose of optical communication, the module is required to have a small area (small size) and a thin shape. Here, in the semiconductor light emitting module of FIG. 9, the resin-sealed light emitting diode (2) including the external lead (4) and individually completed is mounted on the circuit board (1).
Since the lateral width L and the height H of the lens (5) are relatively large, such requirements cannot be satisfied.
【０００４】これに対して、本願発明者は、図１０に示
すように、回路基板（１１）上に外部リードを有しない
表面実装型のチップ型発光ダイオード（１２）を複数個
配置し、このチップ型発光ダイオード（１２）のレンズ
（２４）に対向させて板状のアウタレンズ（１５）を設
けた半導体発光モジュールの製作を試みた。この半導体
発光モジュールによれば、チップ型の発光ダイオード
（１２）を使用するため、モジュールの小型化・薄型化
を図ることができる。しかしながら、図１０に示す半導
体発光モジュールは、この種の半導体発光モジュールに
おける重要なポイントである高出力及び鋭い光指向性を
十分に実現することができなかった。On the other hand, the inventor of the present application, as shown in FIG. 10, arranges a plurality of surface mount type chip type light emitting diodes (12) having no external leads on the circuit board (11), and An attempt was made to manufacture a semiconductor light emitting module in which a plate-shaped outer lens (15) was provided so as to face the lens (24) of the chip type light emitting diode (12). According to this semiconductor light emitting module, since the chip type light emitting diode (12) is used, the size and thickness of the module can be reduced. However, the semiconductor light emitting module shown in FIG. 10 could not sufficiently realize high output and sharp light directivity, which are important points in this type of semiconductor light emitting module.
【０００５】そこで、本発明は、前記の問題を解決でき
る新規な半導体発光モジュールを提供することを目的と
する。Therefore, an object of the present invention is to provide a novel semiconductor light emitting module which can solve the above problems.
【０００６】[0006]
【課題を解決するための手段】本発明による半導体発光
モジュールは、一方の主面（１１ａ）に複数の接続用配
線導体（１６）を形成した回路基板（１１）と、回路基
板（１１）の一方の主面（１１ａ）側に配置され且つ接
続用配線導体（１６）により互いに電気的に接続された
複数の半導体発光装置（１２）と、複数の半導体発光装
置（１２）の上方に取り付けられ且つ複数の半導体発光
装置（１２）から発生した光を集光するアウタレンズ
（１５）とを備えている。複数の半導体発光装置（１
２）の各々は、それぞれ接続用配線導体（１６）に電気
的に接続され且つ互いに離間した２つの発光素子配線導
体（２５）（２６）を形成した発光素子基板（２２）
と、発光素子基板（２２）の一方の主面（２２ａ）に固
着された半導体発光素子（２３）と、発光素子配線導体
（２５）（２６）の一方と半導体発光素子（２３）とを
電気的に接続するリード細線（２７）と、半導体発光素
子（２３）及びリード細線（２７）を封止する光透過性
樹脂から成る発光素子レンズ（２４）とを備えている。
発光素子レンズ（２４）のアウタレンズ（１５）側の主
面には球面状のインナレンズ（２４ｄ）が形成される。
回路基板（１１）の一方の主面（１１ａ）には複数の半
導体発光装置（１２）に近接して反射壁（１３）が垂設
される。複数の半導体発光装置（１２）から発生した光
は反射壁（１３）によってアウタレンズ（１５）側に反
射される。さらに、発光素子レンズ（２４）のアウタレ
ンズ（１５）側の主面には環状の平坦部（２４ｅ）が形
成され、平坦部（２４ｅ）の内縁からインナレンズ（２
４ｄ）の底部へ向かって縮径する環状の傾斜面（２４
ｇ）が形成される。A semiconductor light emitting module according to the present invention comprises a circuit board (11) having a plurality of connection wiring conductors (16) formed on one main surface (11a), and a circuit board (11). A plurality of semiconductor light emitting devices (12) arranged on one main surface (11a) side and electrically connected to each other by a connecting wiring conductor (16), and mounted above the plurality of semiconductor light emitting devices (12). Moreover, the outer lens (15) for condensing the light generated from the plurality of semiconductor light emitting devices (12) is provided. A plurality of semiconductor light emitting devices (1
Each of 2) has a light emitting element substrate (22) in which two light emitting element wiring conductors (25) and (26) electrically connected to the connection wiring conductor (16) and separated from each other are formed.
A semiconductor light emitting element (23) fixed to one main surface (22a) of the light emitting element substrate (22), one of the light emitting element wiring conductors (25) and (26) and the semiconductor light emitting element (23). And a light emitting element lens (24) made of a light transmissive resin for sealing the semiconductor light emitting element (23) and the lead thin wire (27).
A spherical inner lens (24d) is formed on the main surface of the light emitting element lens (24) on the outer lens (15) side.
A reflection wall (13) is vertically provided on one main surface (11a) of the circuit board (11) in proximity to the plurality of semiconductor light emitting devices (12). Light emitted from the plurality of semiconductor light emitting devices (12) is reflected toward the outer lens (15) by the reflection wall (13). Furthermore, an annular flat portion (24e) is formed on the main surface of the light emitting element lens (24) on the outer lens (15) side, and the inner lens (2) is formed from the inner edge of the flat portion (24e).
4d) an annular inclined surface (24
g) is formed.
【０００７】本発明では、外部リードを必要としないチ
ップ型発光ダイオード（１２）を用いるためモジュール
全体の小型化・薄型化が可能となる。また、チップ型発
光ダイオード（１２）にインナレンズ（２４ｄ）を形成
したため、インナレンズ（２４ｄ）とアウタレンズ（１
５）との組み合わせにより、鋭い光指向性が実現される
と共に、光出力の増大が達成される。平坦部（２４ｅ）
は、チップ型発光ダイオード（１２）を回路基板（１
１）の一方の主面（１１ａ）上に実装する際に、吸着治
具がチップ型発光ダイオード（１２）を吸着するための
面として作用する。また、傾斜面（２４ｇ）を設けるこ
とにより、チップ型発光ダイオード（１２）の製造工程
において、トランスファモールド法等によって発光素子
レンズ（２４）を金型成形した後、発光素子レンズ（２
４）を金型から容易に離脱できる。さらに、発光素子
（２３）から発生してインナレンズ（２４ｄ）の側部を
通過する光の一部は、図５に示すように傾斜面（２４
ｇ）において反射された結果、上方、即ちアウタレンズ
（１５）側に光路Ａを変えるので、半導体発光モジュー
ルの高輝度化を図ることができる。In the present invention, since the chip type light emitting diode (12) which does not require external leads is used, it is possible to reduce the size and thickness of the entire module. Further, since the chip type light emitting diode (12) is formed with the inner lens (24d), the inner lens (24d) and the outer lens (1) are formed.
In combination with 5), sharp light directivity is realized and an increase in light output is achieved. Flat part (24e)
Includes a chip type light emitting diode (12) on a circuit board (1
1) When mounted on one main surface (11a) of one, the suction jig functions as a surface for sucking the chip type light emitting diode (12). Further, by providing the inclined surface (24g), in the manufacturing process of the chip type light emitting diode (12), the light emitting element lens (24) is molded by a transfer molding method or the like, and then the light emitting element lens (2
4) can be easily separated from the mold. Further, a part of the light generated from the light emitting element (23) and passing through the side portion of the inner lens (24d) is, as shown in FIG.
As a result of being reflected in g), the optical path A is changed to the upper side, that is, to the outer lens (15) side, so that the brightness of the semiconductor light emitting module can be increased.
【０００８】[0008]
【発明の実施の形態】以下、発光ダイオードモジュール
に適用した本発明による半導体発光モジュールの実施の
形態を図１〜図８について説明する。図１に示す発光ダ
イオードモジュールは、回路基板（１１）、半導体発光
装置としてのチップ型発光ダイオード（表面実装型発光
ダイオード）（１２）、反射壁（１３）、外枠体（１
４）及びアウタレンズ（１５）から構成される。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a semiconductor light emitting module according to the present invention applied to a light emitting diode module will be described below with reference to FIGS. The light emitting diode module shown in FIG. 1 includes a circuit board (11), a chip type light emitting diode (surface mounting type light emitting diode) (12) as a semiconductor light emitting device, a reflection wall (13), an outer frame (1
4) and the outer lens (15).
【０００９】回路基板（１１）は例えばエポキシ樹脂等
から成る。図２に示すように、回路基板（１１）の一方
の主面（１１ａ）には複数本の帯状の接続用配線導体
（１６）と電極端子（１７）とが形成され、両者は連絡
配線導体（１７ａ）で電気的に接続される。また、図３
に示すように、回路基板（１１）の他方の主面（１１
ｂ）には屈曲した帯状の接続用配線導体（１８）が形成
される。一方の主面（１１ａ）側に形成された接続用配
線導体（１６）は、回路基板（１１）の一方の側面（１
１ｃ）から他方の側面（１１ｄ）の方向に向う第１の方
向に延伸し、延伸方向の途中に複数の間欠部（１９）が
設けられる。複数本の接続用配線導体（１６）の間には
反射板（１３）が垂設される。回路基板（１１）の一方
の側面（１１ｃ）の近傍には貫通孔（２０）が穿設さ
れ、接続用配線導体（１６）は貫通孔（２０）を通じて
一方の主面（１１ａ）から他方の主面（１１ｂ）に達す
る。電極端子（１７）の一方端は一方の主面（１１ａ）
上を第１の方向と直交する第２の方向に回路基板（１
１）の側面まで延伸し、更に基板の側壁に形成された切
り欠き部（２１）を通じて回路基板（１１）の他方の主
面（１１ｂ）側まで達する。接続用配線導体（１６）の
一方端と電極端子（１７）の一方端とは、回路基板（１
１）の他方の主面（１１ｂ）に形成された接続用配線導
体（１８）によって電気的に接続されている。The circuit board (11) is made of, for example, epoxy resin. As shown in FIG. 2, a plurality of strip-shaped connecting wiring conductors (16) and electrode terminals (17) are formed on one main surface (11a) of the circuit board (11), and both are connecting wiring conductors. It is electrically connected at (17a). FIG.
As shown in, the other main surface of the circuit board (11) (11
A bent strip-shaped connecting wiring conductor (18) is formed in b). The connecting wiring conductor (16) formed on the one main surface (11a) side is provided on one side surface (1) of the circuit board (11).
1c) extends in a first direction toward the other side surface (11d), and a plurality of intermittent portions (19) are provided in the middle of the extending direction. A reflector (13) is vertically provided between the plurality of connecting wiring conductors (16). A through hole (20) is formed in the vicinity of one side surface (11c) of the circuit board (11), and the connecting wiring conductor (16) passes from the one main surface (11a) to the other through the through hole (20). Reach the main surface (11b). One end of the electrode terminal (17) has one main surface (11a)
The circuit board (1
It extends to the side surface of 1) and further reaches the other main surface (11b) side of the circuit board (11) through the notch (21) formed in the side wall of the board. One end of the connection wiring conductor (16) and one end of the electrode terminal (17) are connected to the circuit board (1
They are electrically connected by the connecting wiring conductor (18) formed on the other main surface (11b) of 1).
【００１０】チップ型発光ダイオード（１２）は、図５
に示すように、発光素子基板（２２）と、この一方の主
面に固着された半導体発光素子としての発光ダイオード
素子（２３）と、光透過性樹脂から成る角錐台形状の発
光素子レンズ（２４）とを備える。発光素子基板（２
２）の一方の主面（２２ａ）には互いに離間した２つの
発光素子配線導体（２５）（２６）が形成され、一方の
配線導体（２５）の主面には発光ダイオード素子（２
３）の裏面に形成された電極が固着される。他方の配線
導体（２６）にはリード細線（２７）を介して発光ダイ
オード素子（２３）の上面に形成された電極が電気的に
接続される。図６に示すように、発光素子基板（２２）
の長手方向の両端には切り欠き部（２８）（２９）が形
成される。発光素子配線導体（２５）（２６）の一方端
はそれぞれ切り欠き部（２８）及び（２９）を通じて発
光素子基板（２２）の他方の主面まで延伸する。発光素
子基板（２２）の他方の主面には互いに離間した２つの
接続電極（３０）（３１）が形成され、それぞれ一方又
は他方の発光素子配線導体（２５）（２６）の一方端に
繋っている。発光素子レンズ（２４）は周知のトランス
ファモールドで形成され、発光ダイオード素子（２３）
及びリード細線（２７）を封止する。図１及び図３に示
すように、反射壁（１３）に対向しない発光素子レンズ
（２４）の第１の側面（２４ａ）は回路基板（１１）の
一方の主面（１１ａ）に対して第１の角度で傾斜し、反
射壁（１３）に対向する発光素子レンズ（２４）の第２
の側面（２４ｂ）は、回路基板（１１）の一方の主面
（１１ａ）に対して第１の角度よりも大きい第２の角度
で傾斜する。The chip type light emitting diode (12) is shown in FIG.
As shown in FIG. 2, a light emitting element substrate (22), a light emitting diode element (23) as a semiconductor light emitting element fixed to one main surface of the light emitting element substrate, and a truncated pyramidal light emitting element lens (24) made of a light transmissive resin. ) And. Light emitting element substrate (2
2) Two light emitting element wiring conductors (25) and (26) separated from each other are formed on one main surface (22a) of the light emitting diode element (2) on the main surface of one wiring conductor (25).
The electrode formed on the back surface of 3) is fixed. An electrode formed on the upper surface of the light emitting diode element (23) is electrically connected to the other wiring conductor (26) via a lead thin wire (27). As shown in FIG. 6, the light emitting device substrate (22)
Notches (28) and (29) are formed at both ends in the longitudinal direction. One ends of the light emitting element wiring conductors (25) and (26) extend to the other main surface of the light emitting element substrate (22) through the notches (28) and (29), respectively. Two connection electrodes (30) and (31) spaced from each other are formed on the other main surface of the light emitting element substrate (22) and connected to one end of one or the other light emitting element wiring conductor (25) (26). ing. The light emitting element lens (24) is formed by a well-known transfer mold, and the light emitting diode element (23)
And the lead wire (27) is sealed. As shown in FIG. 1 and FIG. 3, the first side surface (24a) of the light emitting element lens (24) that does not face the reflection wall (13) is located opposite to the one main surface (11a) of the circuit board (11). The second of the light emitting element lens (24) which is inclined at an angle of 1 and faces the reflection wall (13)
Side surface (24b) is inclined at a second angle larger than the first angle with respect to one main surface (11a) of the circuit board (11).
【００１１】更に、発光素子レンズ（２４）のアウタレ
ンズ（１５）側の主面（以下、発光素子レンズの上面と
いう）にはインナレンズ（２４ｄ）が形成される。即
ち、発光素子レンズ（２４）の上面の外縁に沿って平坦
部（２４ｅ）が形成され、平坦部（２４ｅ）の内側に環
状の溝部（２４ｆ）が形成され、溝部（２４ｆ）の内側
にその底部から半球状に突出する球面状のインナレンズ
（２４ｄ）が設けられる。インナレンズ（２４ｄ）の頂
部は平坦部（２４ｅ）とほぼ同一の平面上に位置する。
また、溝部（２４ｆ）は平坦部（２４ｅ）の内縁からイ
ンナレンズ（２４ｄ）の底部へ傾斜する環状の傾斜面
（２４ｇ）を有する。傾斜面（２４ｇ）はインナレンズ
（２４ｄ）の側部と対向する。平坦部（２４ｅ）は、チ
ップ型発光ダイオード（１２）を回路基板（１１）の一
方の主面（１１ａ）上に実装する際に、吸着治具がチッ
プ型発光ダイオード（１２）を吸着するための面として
作用する。また、傾斜面（２４ｇ）を設けることによ
り、チップ型発光ダイオード（１２）の製造工程におい
て、トランスファモールド法等によって発光素子レンズ
（２４）を金型成形した後、発光素子レンズ（２４）を
金型から容易に離脱できる。さらに、発光素子（２３）
から発生してインナレンズ（２４ｄ）の側部を通過する
光の一部は、図５に示すように傾斜面（２４ｇ）におい
て反射された結果、上方、即ちアウタレンズ（１５）側
に光路Ａを変えるので、半導体発光モジュールの高輝度
化を図ることができる。Further, an inner lens (24d) is formed on the main surface of the light emitting element lens (24) on the outer lens (15) side (hereinafter referred to as the upper surface of the light emitting element lens). That is, a flat portion (24e) is formed along the outer edge of the upper surface of the light emitting element lens (24), an annular groove portion (24f) is formed inside the flat portion (24e), and an annular groove portion (24f) is formed inside the groove portion (24f). A spherical inner lens (24d) protruding from the bottom in a hemispherical shape is provided. The top of the inner lens (24d) is located on substantially the same plane as the flat part (24e).
Further, the groove portion (24f) has an annular inclined surface (24g) inclined from the inner edge of the flat portion (24e) to the bottom portion of the inner lens (24d). The inclined surface (24g) faces the side portion of the inner lens (24d). The flat portion (24e) is for the suction jig to adsorb the chip type light emitting diode (12) when the chip type light emitting diode (12) is mounted on one main surface (11a) of the circuit board (11). Acts as a surface. Further, by providing the inclined surface (24g), in the manufacturing process of the chip type light emitting diode (12), the light emitting element lens (24) is molded by a transfer molding method or the like, and then the light emitting element lens (24) is molded. Can be easily removed from the mold. Furthermore, the light emitting element (23)
A part of the light generated from and passing through the side portion of the inner lens (24d) is reflected by the inclined surface (24g) as shown in FIG. 5, and as a result, the optical path A is directed upward, that is, toward the outer lens (15) side. Since it is changed, the brightness of the semiconductor light emitting module can be increased.
【００１２】図１及び図３に示すように、チップ型発光
ダイオード（１２）は、回路基板（１１）上の接続用配
線導体（１６）に対してその間欠領域（１９）を架橋す
るように固着される。即ち、チップ型発光ダイオード
（１２）の一方の接続電極（３０）と他方の接続電極
（３１）は、それぞれ間欠領域（１９）の一方の側の接
続用配線導体（１６）と他方の側の接続用配線導体（１
６）に固着される。図１の発光ダイオードモジュールで
は、１本の接続用配線導体（１６）に間欠領域（１９）
に対応してそれぞれ４個のチップ型発光ダイオードが固
着されて互いに直列に電気的に接続され、５本の接続用
配線導体（１６）に合計２０個のチップ型発光ダイオー
ドが配設されている。As shown in FIGS. 1 and 3, the chip type light emitting diode (12) bridges the intermittent region (19) with respect to the connecting wiring conductor (16) on the circuit board (11). It is fixed. That is, one connection electrode (30) and the other connection electrode (31) of the chip type light emitting diode (12) are connected to the connection wiring conductor (16) on one side and the other side of the intermittent region (19), respectively. Wiring conductor for connection (1
It is fixed to 6). In the light emitting diode module of FIG. 1, the intermittent region (19) is formed in one connecting wiring conductor (16).
Corresponding to, each of the four chip type light emitting diodes is fixed and electrically connected in series with each other, and a total of 20 chip type light emitting diodes are arranged on the five connection wiring conductors (16). .
【００１３】反射壁（１３）は、反射性に優れた白色の
樹脂等から成る板材であり、回路基板（１１）の接続用
配線導体（１６）の間に垂直に固着される。図４に示す
ように、反射壁（１３）は、その上端が発光ダイオード
（１２）の発光素子レンズ（２４）の上面とほぼ同等か
それよりも上方に且つ接続用配線導体（１６）の延伸す
る方向に沿って配置される。外枠体（１４）は白色の樹
脂等から成り、図２に示すように、複数の発光ダイオー
ド（１２）を包囲するように回路基板（１１）の一方の
主面（１１ａ）に固着される。The reflection wall (13) is a plate material made of white resin or the like having excellent reflectivity, and is vertically fixed between the connection wiring conductors (16) of the circuit board (11). As shown in FIG. 4, the reflection wall (13) has an upper end that is substantially equal to or above the upper surface of the light emitting element lens (24) of the light emitting diode (12) and extends the connection wiring conductor (16). It is arranged along the direction. The outer frame body (14) is made of white resin or the like, and is fixed to one main surface (11a) of the circuit board (11) so as to surround the plurality of light emitting diodes (12), as shown in FIG. .
【００１４】アウタレンズ（１５）は光透過性に優れた
樹脂等から成り、図７に示すように、一方の主面（１５
ａ）に発光ダイオード（１２）に対応する２０個の楕円
球面部（３３）が形成される。図４に示すように、アウ
タレンズ（１５）の他方の主面（１５ｂ）は平面となっ
ており、反射壁（１３）の上面に固着されている。楕円
球面部（３３）は、図１に示すように、発光素子レンズ
（２４）の第１の側面（２４ａ）を介して光が通過する
部分は曲率が大きく、図４に示すように、発光素子レン
ズ（２４）の第２の側面（２４ｂ）を介して光が通過す
る部分は曲率が小さく形成される。楕円球面部（３３）
は、平面的に見て、接続用配線導体（１６）の延伸方向
（第１の方向）に長く、これに直交する第２の方向に短
く形成されている。The outer lens (15) is made of a resin or the like having an excellent light-transmitting property, and as shown in FIG.
20 ellipsoidal spherical parts (33) corresponding to the light emitting diodes (12) are formed in a). As shown in FIG. 4, the other main surface (15b) of the outer lens (15) is a flat surface and is fixed to the upper surface of the reflection wall (13). As shown in FIG. 1, the ellipsoidal spherical portion (33) has a large curvature in a portion through which light passes through the first side surface (24a) of the light emitting element lens (24), and as shown in FIG. A portion where light passes through the second side surface (24b) of the element lens (24) is formed to have a small curvature. Elliptical spherical surface (33)
Is long in the extending direction (first direction) of the connecting wiring conductor (16) and short in the second direction orthogonal to the extending direction (first direction) of the connecting wiring conductor (16).
【００１５】本発明の実施の形態では、外部リードを必
要としないチップ型発光ダイオード（１２）を用いるた
めモジュール全体の小型化・薄型化が可能となる。ま
た、チップ型発光ダイオード（１２）にインナレンズ
（２４ｄ）を形成したため、インナレンズ（２４ｄ）と
アウタレンズ（１５）との組み合わせにより、鋭い光指
向性が実現されると共に、光出力の増大が達成される。
発光素子レンズ（２４）の第２の側面（２４ｂ）から導
出された光は反射壁（１３）によってアウタレンズ（１
５）側に向きを変えられるので、発光ダイオード素子
（２３）から放出された光を有効にモジュールの外部に
導出できる点においても光出力の増大が図れる。In the embodiment of the present invention, since the chip type light emitting diode (12) which does not require the external lead is used, the size and thickness of the entire module can be reduced. In addition, since the chip type light emitting diode (12) is formed with the inner lens (24d), the combination of the inner lens (24d) and the outer lens (15) realizes sharp light directivity and increases the light output. To be done.
The light emitted from the second side surface (24b) of the light emitting element lens (24) is reflected by the reflection wall (13) to the outer lens (1).
Since the direction can be changed to the 5) side, the light output can be increased in that the light emitted from the light emitting diode element (23) can be effectively guided to the outside of the module.
【００１６】また、本発明の実施の形態によれば、チッ
プ型発光ダイオード（１２）の発光素子基板（２２）と
発光素子レンズ（２４）との接合面積が比較的小さいた
め、多数の温度サイクルが加わるような厳しい環境下で
使用しても、発光素子基板（２２）と発光素子レンズ
（２４）との線膨張係数差に起因して界面剥離等が生じ
ることがない。また、チップ型発光ダイオード（１２）
は、回路基板（１１）に組み込む前に特性を検査して不
良品を選別・除去できるため、チップ自体は勿論ワイヤ
ボンディングに起因する特性のばらつき及び歩留まりの
低下も回避できる。更に、特殊・複雑な製造工程を経ず
に製作できるのでコストの低減が可能である。このよう
に、本発明の実施の形態によれば、小型・薄型化、高出
力化が可能なばかりでなく、特性のばらつきを防止で
き、信頼性も高く且つ低コストの半導体発光モジュール
が得られる。Further, according to the embodiment of the present invention, since the bonding area between the light emitting element substrate (22) and the light emitting element lens (24) of the chip type light emitting diode (12) is relatively small, a large number of temperature cycles are performed. Even when used in a harsh environment in which the light emitting element is added, interface separation or the like does not occur due to the difference in linear expansion coefficient between the light emitting element substrate (22) and the light emitting element lens (24). In addition, chip type light emitting diode (12)
Since the characteristics can be inspected before being incorporated into the circuit board (11) to select and remove defective products, it is possible to avoid variations in characteristics and reduction in yield due to wire bonding as well as the chip itself. Further, since it can be manufactured without going through a special and complicated manufacturing process, the cost can be reduced. As described above, according to the embodiments of the present invention, a semiconductor light-emitting module that is not only small-sized and thin, and has high output, but also can prevent variations in characteristics, is highly reliable, and has low cost can be obtained. .
【００１７】本発明の実施の形態は前記の例に限定され
ず、種々の変更が可能である。例えば、反射壁（１３）
に対向する発光素子レンズ（２４）の第２の側面（２４
ｂ）の回路基板（１１）の一方の主面（１１ａ）に対す
る傾斜角度（第２の角度）を、図４に示す形状よりも小
さくすることができる。しかし、発光素子レンズ（２
４）の第２の側面（２４ｂ）から横方向に放射される光
は反射壁（１３）によって上方向に導き出されるから、
第２の角度を小さくしなくても発光出力は十分に高いレ
ベルで達成される。むしろ、モジュールの小型化の点で
は、第２の角度を大きく（垂直に近く）することによっ
て発光ダイオード（１２）の横幅を狭くする方が有利で
ある。The embodiment of the present invention is not limited to the above example, and various modifications can be made. For example, a reflective wall (13)
The second side surface (24) of the light emitting element lens (24) facing the
The inclination angle (second angle) with respect to the one main surface (11a) of the circuit board (11) of b) can be made smaller than that of the shape shown in FIG. However, the light emitting element lens (2
Since the light emitted laterally from the second side surface (24b) of 4) is guided upward by the reflection wall (13),
The light emission output is achieved at a sufficiently high level without reducing the second angle. Rather, in terms of miniaturization of the module, it is advantageous to narrow the lateral width of the light emitting diode (12) by increasing the second angle (close to vertical).
【００１８】また、アウタレンズ（１５）の一方の主面
（１５ａ）を球面に形成してもよい。但し、モジュール
の小型化のためには、楕円球面即ち接続用配線導体（１
６）の延伸方向（第１の方向）に長手に形成する図７に
示す形態が望ましい。第２の方向に長手に形成すると、
反射壁（１３）で上方に偏位されにくい発光素子レンズ
（２４）の第１の側面（２４ａ）を介して導出される光
を上方に導く効果が損なわれるからである。また、イン
ナレンズ（２４ｄ）の頂部を平坦部（２４ｅ）より下方
に形成してもよい。尚、インナレンズ（２４ｄ）の頂部
を平坦部（２４ｅ）より上方に形成することもできる
が、装置の薄型化の点では不利となるので、平坦部（２
４ｅ）と同一平面上又は下方に形成するのが望ましい。Further, one main surface (15a) of the outer lens (15) may be formed into a spherical surface. However, in order to miniaturize the module, an elliptic spherical surface, that is, a wiring conductor for connection (1
It is desirable that the configuration shown in FIG. 7 is formed so as to be long in the stretching direction (first direction) of 6). When formed longitudinally in the second direction,
This is because the effect of guiding the light, which is guided through the first side surface (24a) of the light emitting element lens (24) that is difficult to be displaced upward by the reflection wall (13), is impaired. Further, the top of the inner lens (24d) may be formed below the flat portion (24e). The top portion of the inner lens (24d) may be formed above the flat portion (24e), but this is disadvantageous in terms of thinning the device, so the flat portion (2
It is desirable to form it on the same plane as or below 4e).
【００１９】[0019]
【実施例】回路基板（１１）の一方の主面（１１ａ）に
図８の点線Ａ部分に相当する発光回路部を形成し、他方
の主面（１１ｂ）に図８の点線Ｂ部分に相当するスイッ
チング回路等の部分を形成する形態とすることにより、
更に小型化・高集積化が達成できる。図８において、４
１はＦＥＴ、４２はトランジスタ、４３はツェナダイオ
ード、４４はコンデンサ、４５は電解コンデンサ、４６
はダイオード、４７〜４９は抵抗を示す。EXAMPLE A light emitting circuit portion corresponding to a dotted line A portion of FIG. 8 is formed on one main surface (11a) of a circuit board (11), and another light emitting circuit portion corresponding to a dotted line B portion of FIG. 8 is formed on the other main surface (11b). By forming a part such as a switching circuit,
Further miniaturization and high integration can be achieved. In FIG. 8, 4
1 is FET, 42 is transistor, 43 is Zener diode, 44 is capacitor, 45 is electrolytic capacitor, 46
Is a diode, and 47 to 49 are resistors.
【００２０】[0020]
【発明の効果】前記の通り、本発明によれば、小型且つ
高輝度で、加えて鋭い光指向性及び光出力の増大が達成
できる半導体発光モジュールが得られる。As described above, according to the present invention, it is possible to obtain a semiconductor light emitting module which is small in size, has high brightness, and can achieve sharp light directivity and increase in light output.
【図１】 本発明による半導体発光モジュールの断面図FIG. 1 is a sectional view of a semiconductor light emitting module according to the present invention.
【図２】 図１のＡ−Ａ線断面図FIG. 2 is a sectional view taken along line AA of FIG. 1;
【図３】 図１の底面図FIG. 3 is a bottom view of FIG. 1;
【図４】 図２のＢ−Ｂ線断面図FIG. 4 is a sectional view taken along line BB of FIG. 2;
【図５】 図１の半導体発光モジュールに適用される半
導体発光装置の断面図FIG. 5 is a sectional view of a semiconductor light emitting device applied to the semiconductor light emitting module of FIG. 1;
【図６】 図５の平面図FIG. 6 is a plan view of FIG. 5;
【図７】 アウタレンズの平面図FIG. 7 is a plan view of an outer lens.
【図８】 本発明の実施例を示す回路図FIG. 8 is a circuit diagram showing an embodiment of the present invention.
【図９】 従来の半導体発光モジュールの断面図FIG. 9 is a sectional view of a conventional semiconductor light emitting module.
【図１０】 従来の他の半導体発光モジュールの断面図FIG. 10 is a sectional view of another conventional semiconductor light emitting module.
１１．．回路基板、 １１ａ．．一方の主面、 １１
ｂ．．他方の主面、 １２．．発光ダイオード（半導体
発光装置）、 １３．．反射壁、 １５．．アウタレン
ズ、 １５ａ．．一方の主面、 １５ｂ．．他方の主
面、 １６．．接続用配線導体、 １７．．電極端子、
２２．．発光素子基板、 ２２ａ．．一方の主面、
２３．．発光ダイオード素子（半導体発光素子）、 ２
４．．発光素子レンズ、 ２４ａ．．第１の側面、 ２
４ｂ．．第２の側面、 ２４ｃ．．接合部、 ２４
ｄ．．インナレンズ、 ２４ｅ．．平坦部、 ２４
ｇ．．傾斜面、２５,２６．．発光素子配線導体、 ２
７．．リード細線、 ３３．．楕円球面部11. . Circuit board, 11a. . One main surface, 11
b. . The other main surface, 12. . Light emitting diode (semiconductor light emitting device), 13. . Reflective wall, 15. . Outer lens, 15a. . One major surface, 15b. . The other main surface, 16. . 15. Wiring conductor for connection, . Electrode terminal,
22. . Light emitting device substrate, 22a. . One major side,
23. . Light emitting diode element (semiconductor light emitting element), 2
4. . Light emitting element lens, 24a. . First side, 2
4b. . Second aspect, 24c. . Joint, 24
d. . Inner lens, 24e. . Flat part, 24
g. . Inclined surface, 25, 26. . Light emitting element wiring conductor, 2
7. . Thin lead wire, 33. . Elliptical spherical surface
Claims (3)
成した回路基板と、該回路基板の前記一方の主面側に配
置され且つ前記接続用配線導体により互いに電気的に接
続された複数の半導体発光装置と、該複数の半導体発光
装置の上方に取り付けられ且つ前記複数の半導体発光装
置から発生した光を集光するアウタレンズとを備え、 前記複数の半導体発光装置の各々は、それぞれ前記接続
用配線導体に電気的に接続され且つ互いに離間した２つ
の発光素子配線導体を形成した発光素子基板と、該発光
素子基板の一方の主面に固着された半導体発光素子と、
前記発光素子配線導体の一方と前記半導体発光素子とを
電気的に接続するリード細線と、前記半導体発光素子及
び前記リード細線を封止する光透過性樹脂から成る発光
素子レンズとを備え、 該発光素子レンズの前記アウタレンズ側の主面に球面状
のインナレンズが形成されたことを特徴とする半導体発
光モジュール。1. A circuit board having a plurality of connection wiring conductors formed on one main surface, and a circuit board arranged on the one main surface side of the circuit board and electrically connected to each other by the connection wiring conductors. A plurality of semiconductor light emitting devices; and an outer lens that is mounted above the plurality of semiconductor light emitting devices and condenses light generated from the plurality of semiconductor light emitting devices, each of the plurality of semiconductor light emitting devices includes: A light emitting element substrate having two light emitting element wiring conductors electrically connected to the connecting wiring conductor and separated from each other; and a semiconductor light emitting element fixed to one main surface of the light emitting element substrate.
The light emitting element wiring conductor is provided with a lead thin wire for electrically connecting the semiconductor light emitting element and one of the light emitting element wiring conductors, and a light emitting element lens made of a light-transmitting resin for sealing the semiconductor light emitting element and the lead thin wire. A semiconductor light emitting module, wherein a spherical inner lens is formed on a main surface of the element lens on the outer lens side.
の半導体発光装置に近接して反射壁が垂設され、前記複
数の半導体発光装置から発生した光を前記反射壁によっ
て前記アウタレンズ側に反射する請求項１に記載の半導
体発光モジュール。2. A reflection wall is vertically provided on one main surface of the circuit board so as to be close to the plurality of semiconductor light emitting devices, and light generated from the plurality of semiconductor light emitting devices is directed to the outer lens side by the reflection wall. The semiconductor light emitting module according to claim 1, which is reflected by the light.
側の主面には環状の平坦部が形成され、該平坦部の内縁
から前記インナレンズの底部へ向かって縮径する環状の
傾斜面が形成された請求項１に記載の半導体発光モジュ
ール。3. A ring-shaped flat portion is formed on a main surface of the light-emitting element lens on the outer lens side, and a ring-shaped inclined surface whose diameter is reduced from an inner edge of the flat portion toward a bottom portion of the inner lens is formed. The semiconductor light emitting module according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7257896A JP2921451B2 (en) | 1995-10-04 | 1995-10-04 | Semiconductor light emitting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7257896A JP2921451B2 (en) | 1995-10-04 | 1995-10-04 | Semiconductor light emitting module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09102631A true JPH09102631A (en) | 1997-04-15 |
| JP2921451B2 JP2921451B2 (en) | 1999-07-19 |
Family
ID=17312701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7257896A Expired - Fee Related JP2921451B2 (en) | 1995-10-04 | 1995-10-04 | Semiconductor light emitting module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2921451B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7029147B2 (en) | 2003-02-28 | 2006-04-18 | Toyoda Gosei Co., Ltd. | Light emitting apparatus |
| KR100599013B1 (en) * | 2005-06-30 | 2006-07-12 | 서울옵토디바이스주식회사 | Light emitting device having a plurality of light emitting cells and method of fabricating the same |
| JP2009506559A (en) * | 2005-08-31 | 2009-02-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Light emitting module, for example, light emitting module and optical projection device for use in an optical projection device |
| US7938559B2 (en) * | 2003-01-24 | 2011-05-10 | Fraen Corporation S.R.L. | Multiple optical assembly for a LED lighting device, and red lighting device comprising such an optical assembly |
| US7989825B2 (en) | 2003-06-26 | 2011-08-02 | Fuji Xerox Co., Ltd. | Lens-attached light-emitting element and method for manufacturing the same |
| US8089077B2 (en) * | 2006-04-04 | 2012-01-03 | Fuji Xerox Co., Ltd. | Light-emitting element array with micro-lenses and optical writing head |
-
1995
- 1995-10-04 JP JP7257896A patent/JP2921451B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7938559B2 (en) * | 2003-01-24 | 2011-05-10 | Fraen Corporation S.R.L. | Multiple optical assembly for a LED lighting device, and red lighting device comprising such an optical assembly |
| US8469544B2 (en) | 2003-01-24 | 2013-06-25 | Fraen Corporation S.R.L. | Multiple optical assembly for a LED lighting device, and LED lighting device comprising such an optical assembly |
| US7029147B2 (en) | 2003-02-28 | 2006-04-18 | Toyoda Gosei Co., Ltd. | Light emitting apparatus |
| US7989825B2 (en) | 2003-06-26 | 2011-08-02 | Fuji Xerox Co., Ltd. | Lens-attached light-emitting element and method for manufacturing the same |
| KR100599013B1 (en) * | 2005-06-30 | 2006-07-12 | 서울옵토디바이스주식회사 | Light emitting device having a plurality of light emitting cells and method of fabricating the same |
| JP2009506559A (en) * | 2005-08-31 | 2009-02-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Light emitting module, for example, light emitting module and optical projection device for use in an optical projection device |
| US8089077B2 (en) * | 2006-04-04 | 2012-01-03 | Fuji Xerox Co., Ltd. | Light-emitting element array with micro-lenses and optical writing head |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2921451B2 (en) | 1999-07-19 |
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