KR20080087405A - Light emitting diode package and method for fabricating the same diode - Google Patents

Abstract

An LED package and a manufacturing method thereof are provided to enhance optical efficiency by forming a reflecting body around a sealing member. An LED chip is mounted on a base(10). A lens type sealing member(30) is formed to cover the LED chip. A reflecting body(40) is formed on the base to surround a periphery of the sealing member. The base has an electrode pattern to be electrically connected with the LED chip. The base is a substrate having a lead frame. The reflecting body includes a reflecting surface of a predetermined angle to adjust a directional angle of the light emitted from the LED chip. The reflecting body is formed by molding an epoxy material including a reflecting material.

Description

LED package and its manufacturing method {LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME DIODE}

1 is a perspective view showing an LED package according to an embodiment of the present invention.

2 is a plan view showing a LED package according to an embodiment of the present invention.

3 is a cross-sectional view taken along the line II of FIG. 2;

Figure 4 is an exploded perspective view of the LED package according to an embodiment of the present invention.

5 is a graph showing the orientation angle of the LED package to which the present invention is applied.

Figure 6 is a perspective view of the LED package according to another embodiment of the present invention.

7 is a transmission plan view showing an LED package according to another embodiment of the present invention.

8 is a cross-sectional view taken along the line J-J of FIG.

9 is an exploded perspective view of an LED package according to another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: base 20: LED chip

30 sealing member 40 reflector

42: reflecting surface

The present invention relates to an LED package, and more particularly, to a LED package capable of obtaining a desired directivity angle and increasing light efficiency by forming a reflector around the sealing member while forming a lens-shaped sealing member.

A light emitting diode (LED) is a device in which electrons and holes meet and emit light at a PN semiconductor junction by applying a current, and the LED emits light continuously at low voltage and low current. It has many advantages over existing light sources such as possible and low power consumption.

Such LEDs are usually manufactured in a package structure, and among them, LED packages having a structure in which an LED chip is mounted on a printed circuit board (PCB) and the LED chip is sealed with a transparent resin are known. This LED package is called a "PCB type LED package" and is configured to emit light generated from the LED chip to the outside only through the encapsulant of the printed circuit board. In addition, other LED packages having a structure in which an LED chip is mounted on a lead frame supported by ceramic or polyphthalamide (PPA) resin instead of a printed circuit board are also configured to emit light through an encapsulant formed to cover the LED chip. do.

Conventional LED packages as described above has a limitation that the light efficiency is not high because the light emitted from the LED chip through the encapsulation material can be emitted to the upper surface, both sides because the light efficiency is not high.

In order to overcome this limitation, there is a method of increasing the brightness by forming a lens-shaped encapsulation member high, but the direction angle is narrowed instead of increasing the brightness. In addition, since the height of the encapsulation member is high, the height of the LED element is also high, there is a limit to the product application. On the other hand, when the lens-shaped sealing member is lowered, the orientation angle becomes wider, and there is a limit in obtaining the orientation angle suitable for the purpose of the product. In particular, the conventional rectangular encapsulation has a problem that the path of light is limited and the direction angle is narrow.

In particular, a package having a structure in which an LED chip is mounted on a lead frame has a difficult reflector because a predetermined reflector is installed around the LED chip.

The technical problem to be achieved by the present invention is to provide a LED package that can increase the light efficiency while maintaining a predetermined orientation angle by forming a lens-shaped sealing member low and a reflector with good reflection efficiency around the sealing member. .

In addition, another technical problem to be achieved by the present invention is to provide a LED package that can finely adjust the orientation angle according to the use of the product by further forming a reflector on the reflecting surface of the reflector facing the sealing member.

In order to achieve the above technical problem, the LED package according to an embodiment of the present invention is a base mounted LED chip; A lens-type sealing member formed to cover the LED chip; And a reflector formed on the base and surrounding the periphery of the encapsulation member. In this case, the base is a PCB having an electrode pattern electrically connected to the LED chip or a substrate having a lead frame.

According to an embodiment of the invention, the reflector includes a reflecting surface of a predetermined angle for adjusting the orientation angle of the light emitted from the LED chip. In addition, the reflector is formed by molding an epoxy material containing a reflective material. More preferably, the reflector is formed by forming a reflector on a surface facing the encapsulation member. At this time, the height of the reflector is greater than the height of the sealing member.

Furthermore, the encapsulation member contains at least one phosphor.

In addition, the LED package manufacturing method according to an embodiment of the present invention comprises the steps of mounting an LED chip on the base; Forming a lenticular encapsulation member to cover the LED chip; And forming a reflector surrounding the periphery of the encapsulation member on the base. In this case, the base is a PCB having an electrode pattern electrically connected to the LED chip or a substrate having a lead frame.

Preferably, after the forming of the reflector, a reflector is formed on a surface facing the encapsulation member.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a perspective view showing an LED package according to an embodiment of the present invention, Figure 2 is a transparent plan view showing an LED package according to an embodiment of the present invention, Figure 3 is a cross-sectional view taken along II of FIG. 4 is an exploded perspective view of the LED package according to an embodiment of the present invention.

As shown in FIGS. 1 to 3, the LED package 1 according to the present embodiment includes a base 10, an LED chip 20, an encapsulation member 30, and a reflector 40. In this case, the base 10 is a printed circuit board (hereinafter, referred to as PCB) having first and second electrodes 12 and 14 electrically connected to the LED chip 20. The first and second electrodes 12 and 14 are spaced apart from each other. The first and second electrodes 12 and 14 may be formed by, for example, forming a conductive thin film metal such as a copper thin film through plating, printing, or other methods.

The LED chip 20 is mounted on the PCB 10, the encapsulation member 30 is formed to cover the LED chip 20, and the reflector 40 surrounds the encapsulation member 30. It is formed on the PCB 10 to wrap.

In the present embodiment, as shown in Figure 3 is described that the three LED chip 20 is mounted on the PCB 10, the present invention is not limited to this, the LED package 1 is In consideration of the conditions of the object to be illuminated may be designed with at least one LED chip (20).

The reflector 40 has a reflecting surface 42 of a predetermined angle for adjusting the directing angle of the light generated from the LED chip 20. The reflector 40 is spaced apart from the encapsulation member 30 at predetermined intervals. In addition, the reflector 40 is formed of an epoxy resin containing a reflective material. In addition, the reflector 40 is preferably formed by forming a reflector (not shown) on the reflective surface 42 facing the encapsulation member 30.

In the formation of the reflecting portion, a thermosetting adhesive or a UV adhesive is used for the reflecting surface 42. The reflector is preferably made of a material with good reflection efficiency.

Here, the reflector 40 reflects the light generated from the LED chip 20 and passed through the encapsulation member 30 to be emitted to the outside. As a result, the light passing through the lens-shaped sealing member 30 is reflected by the reflector 40, so that a desired directivity angle (for example, approximately 120 degrees) can be obtained.

The reflector 40 is formed larger than the height of the encapsulation member 30, the height of the encapsulation member 30 having such a lens is preferably formed to be 0.9mm. In addition, the height of the reflector 40 is preferably formed to be 1.1mm higher than the height of the sealing member 30.

Although the directivity angle becomes wider because the height of the encapsulation member 30 is low, in order to narrow the directivity angle, a directivity angle is formed by forming a reflector 40 and / or a reflector having good reflection efficiency around the encapsulation member 30. Fine adjustment is possible. Accordingly, the orientation angle can be adjusted according to the use of the product.

In addition, since the encapsulation member 30 is formed in a lens shape, the light efficiency is increased. Molding process for the formation of such a sealing member 30 is a known technique and has a low direct relationship with the present invention, so a detailed description thereof will be omitted.

The encapsulation member 30 preferably contains at least one phosphor, and light emitted from the LED chip 20 and light excited by the phosphor may be mixed to create various colors.

FIG. 4 is a view illustrating a manufacturing process of the LED package 1 described above. Referring to FIG. 4, three LED chips 20 are attached to the first electrode 12 formed on the PCB 10. The encapsulation member 30 is formed by molding in a primary transfer molding method using an epoxy mold compound (EMC) to cover the attached LED chips 20. The LED package 1 may be manufactured by forming a reflector 40 around the encapsulation member 30. At this time, the reflector 40 is formed by molding in a secondary transfer molding method using an epoxy resin higher than the height of the lens-shaped encapsulation member 30 in order to obtain a directivity angle for the purpose.

The LED package manufactured as described above has a direction angle of 111 degrees and light efficiency of 83.2112%, as shown in the graph of FIG. 5C. On the other hand, the conventional LED package formed with a reflective cup, as shown in Figure 5 (a) has a directivity of 127 degrees, the light efficiency is 68.29%. In addition, the conventional LED package in which the hemispherical sealing member is formed has a directing angle of 154 degrees and an optical efficiency of 87.991%, as shown in FIG.

Therefore, the light efficiency of the LED page 1 according to the present invention is approximately 10% or more higher than that of the conventional LED package in which the reflective cup is formed, and a desired directivity angle can be obtained.

6 is a perspective view illustrating an LED package according to another embodiment of the present invention, FIG. 7 is a transmissive plan view of the LED package according to another embodiment of the present invention, and FIG. 8 is a cross-sectional view taken along the JJ of FIG. 7. 9 is an exploded perspective view of an LED package according to another embodiment of the present invention.

The LED package 1 according to the embodiment illustrated in FIGS. 6 to 8 includes a base 10, an LED chip 20, an encapsulation member 30, and a reflector 40. In this case, the base 10 is a substrate having a lead frame.

The lens of the LED chip 20 is mounted on the first lead terminal 12 of the first and second lead terminals 12 and 14 formed on the lead frame 10 and covers the mounted LED chip 20. The encapsulation member 30 is formed, and the reflector 40 is formed to surround the encapsulation member 30. The LED chip 20 is connected to the second lead terminal 14 by a bonding wire (W).

Here, the number of lead terminals is determined by the type and number of LED chip 20 to be mounted and the bonding wire (W) connection method, but the lead frame 10 is a large number of leads to be used in various cases It is desirable to have terminals. In addition, a large number of lead terminals may be arranged in the lead frame 10 in the same direction.

The encapsulation member 30 is formed in a lens shape on the lead frame 10 so as to cover the LED chips 20 attached to the first lead terminals 12. At this time, the encapsulation member 30 is formed by molding an epoxy resin by a transfer molding method.

The reflector 40 forms a structure surrounding the encapsulation member 30 higher than the height of the encapsulation member 30. In this structure, although the height of the encapsulation member 30 is low, light passing through the encapsulation member 30 is widely emitted, but the light is reflected by the reflector 40 surrounding the encapsulation member 30. Since it is emitted to the outside, it contributes to adjusting the orientation angle. In addition, since the encapsulation member 30 is formed in the shape of a lens, it also contributes to increasing the light efficiency. In addition, since the lead frame 10 is used, the heat radiation effect is excellent.

9 is a view for explaining a manufacturing process of the LED package 1 according to another embodiment of the present invention described above, referring to FIG. 9, three on the first lead terminal 12 formed on the lead frame 10. Attaching the LED chip 20 and connecting the attached LED chip 20 to the second lead terminal 14 formed on the lead frame 10 by a bonding wire (W) and then the LED chip ( A lens-shaped sealing member 30 is formed of epoxy resin so as to cover 20). The LED package 1 may be manufactured by forming a reflector 40 on the lead frame 10 while surrounding the encapsulation member 30. At this time, the reflective portion made by using a pre-made mold is bonded to the reflective surface 42 by a thermosetting adhesive or UV adhesive to emit light generated from the LED chip 20 by the bonded reflective portion to the outside The direction angle can be finely adjusted.

According to the embodiment of the present invention, by lowering the lens-shaped encapsulation member and forming a reflector around the encapsulation member, it is possible to increase the light efficiency while maintaining a predetermined direction angle. In addition, since the height of the sealing member is low, it is possible to overcome the limitation due to the height of the sealing member when applying the product.

In addition, according to an embodiment of the present invention by forming a reflector to adjust the steering angle on the reflecting surface of the reflector formed around the encapsulation member, it is easy to adjust the orientation angle and can easily manufacture a LED package suitable for the purpose.

Claims (10)

A base on which an LED chip is mounted; A lens-type sealing member formed to cover the LED chip; And And a reflector formed on the base and surrounding a periphery of the encapsulation member. The method according to claim 1, The base is an LED package, characterized in that the PCB having an electrode pattern electrically connected with the LED chip. The method according to claim 1, The base is an LED package, characterized in that the substrate having a lead frame. The method according to claim 1, The reflector is a LED package, characterized in that it comprises a reflecting surface of a predetermined angle for adjusting the directivity of the light emitted from the LED chip. The method according to claim 1, The reflector is an LED package, characterized in that formed by molding an epoxy material containing a reflective material. The method according to claim 1, The reflector is an LED package, characterized in that formed by forming a reflector on the surface facing the sealing member. The method according to claim 1, The height of the reflector is LED package, characterized in that greater than the height of the sealing member. The method according to claim 1, The encapsulation member LED package, characterized in that it contains at least one phosphor. Mounting an LED chip on the base; Forming a lenticular encapsulation member to cover the LED chip; And And forming a reflector surrounding the periphery of the encapsulation member on the base. The method of claim 9, wherein after forming the reflector, The LED package manufacturing method, characterized in that for forming a reflecting portion on the surface facing the sealing member.

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