KR101031957B1 - Package for Light emitting diode - Google Patents

Abstract

The present invention relates to a package for a light emitting diode.

In the LED package 100 according to the first embodiment of the present invention, the LED chip 100 is installed therein and the metal housing 20 for guiding light emitted from the LED chip 100 to the outside and one side of the metal housing ( 20 is a junction that is connected to the lead frame 40 and the metal housing 20 and the lead frame 40 which is disposed inside the electrical connection to the LED chip 100 and the other side is disposed outside the metal housing 20. And a ceramic layer 20b formed on the surface of any one of the metal housing 20 and the lead frame 40 so as to insulate a portion where the metal housing 20 and the lead frame 40 are in contact with each other. do.

Light Emitting Diode, Package, LED, Lighting, Heat Dissipation, Metal Layer, Insulation Layer, MAO

Description

Package for Light emitting diodes

The present invention relates to a package for a light emitting diode, and more particularly, to a package for a light emitting diode in which a light emitting diode (LED) chip is installed so that an LED assembly can be configured.

In general, a light emitting diode (LED) may be used as a light source element, and as a more specific application example, is installed in various electric and electronic products, industrial machines, and the like to illuminate an instrument panel and an operation panel. It can be easily and quickly noticed, or it can be used as a pure luminaire by replacing a lamp (fluorescent lamp, incandescent lamp, street lamp, etc.).

However, LEDs emit a lot of heat while emitting light, and especially high-power LEDs generate heat up to very high temperatures, which can reduce the LED's own life or reduce its efficiency, as well as other factors installed around the LED. There is also a problem that adversely affects the accessories.

In addition, conventionally, the housing in which the LED is installed is provided with a material of synthetic resin. Such a resin has a problem that the efficiency of heat radiation is extremely low.

In order to solve the above problems, LED heat dissipation devices are being researched and developed to more quickly and effectively dissipate heat generated from LEDs.

Conventional technology regarding heat dissipation of LEDs is disclosed in Korean Patent No. 10-0688626 "Light Emitting Diode Package and Backlight Unit Using the Same".

The package described above is configured to form a through hole in the lower side of the housing, arrange a metal lead in the through hole, and arrange a heat sink under the housing.

In addition, the LED is installed inside the housing, and the above-described LED and the metal lead are wire bonded to electrically conduct electricity.

That is, the heat generated from the LED is conducted through the housing and the conducted heat is cooled by the heat sink.

The above-mentioned conventional package needs to insulate the housing and the metal lead as a conductor, and is made of glass or an insulating polymer which is a non-conductor as a means for insulation.

That is, the glass or insulating polymer is disposed in the form of wrapping the end of the metal lead, and the glass or insulating polymer is filled in the through-hole of the housing described above and fixed.

However, the above-mentioned conventional package uses glass or insulating polymer to make the housing and the metal lead integral with each other but is not energized. In this case, in order for the glass or insulating polymer to fill the through hole tightly, the glass or insulating polymer is liquid or semisolid. The high temperature heat is applied to achieve a state change in a state, and the high temperature applied is 1000 ° C. or more.

That is, the conventional package has a problem that the manufacturing process is very complicated because the equipment and the process and time for applying a high temperature of more than 1000 ℃ is required.

In addition, the high temperature as described above may deform the mechanical properties of the housing, there is a problem that the lifetime or efficiency of the LED is reduced.

Therefore, the technical problem to be achieved by the present invention is to form a ceramic layer in any one of the housing and the lead frame in the package for the light emitting diode to be insulated between the housing and the lead frame by efficiently dissipating heat generated from the LED An object of the present invention is to provide a package for a light emitting diode that can simplify the bonding process of the lead frame.

The technical problem to be achieved by the present invention is not limited to the technical problem mentioned above, another technical problem that is not mentioned can be clearly understood by those skilled in the art from the following description. There will be.

Package for a light emitting diode according to the present invention for achieving the technical problem, the LED chip is installed inside and the metal housing for guiding the light emitted from the LED chip to the outside; and one side is disposed inside the metal housing A lead frame electrically connected to the LED chip and having a second side disposed outside the metal housing; And a joining member for joining the metal housing and the lead frame, wherein a ceramic layer is formed on a surface of any one of the metal housing and the lead frame to insulate a portion where the metal housing and the lead frame contact each other. Include.

In addition, the bonding member may be a molten metal member disposed between the metal housing and the lead frame and melted and then cured to bond the metal housing to the lead frame.

In addition, the bonding member may be a resin that is cured after being injected into the metal housing and the lead frame to bond the metal housing and the lead frame.

In addition, a hole may be formed at one side of the lead frame such that the molten resin flows between the metal housing and the lead frame.

In addition, the ceramic layer is formed on the surface of the lead frame, a portion of the ceramic layer is removed, the first ceramic layer removing portion is formed on one side of the lead base to be electrically connected to the LED chip, the pattern formed on the substrate The second ceramic layer removing unit may be formed on one side of the lead plate so as to be electrically connected to the lead plate.

In addition, the ceramic layer may be a magnesium oxide (MgO) layer or an aluminum oxide (Al ₂ O ₃ ) layer.

In addition, the ceramic layer may be formed by plasma electrolytic oxidation.

Specific details of other embodiments are included in the detailed description and the drawings.

In the package for a light emitting diode according to the present invention made as described above, a ceramic layer is formed on either of the housing and the lead frame, so that the part where the housing and the lead frame contact is insulated by the ceramic layer, thereby housing the bonding member. And the lead frame can be joined to selectively select an optimal bonding member among the insulating bonding member or the non-insulating bonding member, thereby simplifying the bonding process.

In addition, the LED package according to the present invention heat is generated from the LED chip is conducted to the metal housing of the metal material, so that excellent heat dissipation prevents the life of the LED chip is abnormally shortened to further increase the high efficiency of the LED chip Can be maintained for hours.

In addition, the package for the light emitting diode according to the present invention is to join the housing and the lead frame using a molten metal member, the present invention is melted at a relatively low temperature of 400 ℃ compared to the conventional high temperature of 1000 ℃ Joining the housing and the leadframe simplifies the joining process and saves time and money.

In addition, the light emitting diode package according to the present invention is to join the housing and the lead frame by using a resin to inject a liquid resin to insert the injection can be produced by factory automation, so that the conventional light emitting diode It may be possible to mass-produce compared to the package.

In addition, the package for the light emitting diode according to the present invention is formed through the lead frame can be circulated through the hole in the bonding member in the liquid state, the bonding member can be more closely bonded to the metal housing and the lead frame.

In addition, the package for a light emitting diode according to the present invention can reduce the cost and time of forming a ceramic layer by forming a ceramic layer in a lead frame with a narrow surface area compared to the housing, and the ceramic layer in the electrically connected portion By eliminating the electrical conductivity is not lowered can reduce the electrical resistance.

In addition, in the LED package according to the present invention, the ceramic layer is formed by plasma electrolytic oxidation, thereby improving heat dissipation performance.

Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings.

Like reference numerals refer to like elements throughout.

Hereinafter, a light emitting diode package according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 4.

1 is a partial cross-sectional view illustrating a light emitting diode package according to a first embodiment of the present invention. FIG. 2 is a detailed view of portion “A” of FIG. 1, and FIG. Exemplary drawings for explaining a light emitting diode package according to a first embodiment of the present invention is a view showing a housing and a lead frame separated, Figure 4 is a description of a light emitting diode package according to a first embodiment of the present invention It is an example sectional surface for the following.

In the light emitting diode package 10 according to the first embodiment of the present invention, as shown in FIGS. 1, 3, and 4, the metal housing 20 and the plurality of lead frames 40 are integrally bonded by a bonding member. It may be configured.

In the metal housing 20 described above, a plurality of mounting holes 24 are formed in the base 22 as shown in FIGS. 1, 3, and 4.

In addition, a sheet 26 may be formed at each of the outer end portions of the plurality of installation holes 24 described above, and the cross-sectional area of the sheet 26 may be wider than that of the plurality of installation holes 24.

In addition, an opening 28 may be further formed on one side of the metal housing 20, and the opening 28 may be in communication with the sheet 26 described above.

In addition, in the metal housing 20 described above, a ceramic layer 20b may be formed on the surface of the metal layer 20a.

In particular, the above-described ceramic layer 20b may be formed by forming a ceramic film by plasma electrolytic oxidation.

Here, the plasma electrolytic oxidation treatment is a coating method, also referred to as MAO (Micro-Arc Oxidation), induces a plasma discharge to the metal surface in the electrolyte solution to the metal surface such as aluminum (Al), titanium (Ti), magnesium (Mg) The method of transferring to ceramic.

In addition, the above-mentioned plasma electrolytic oxidation treatment is a technique of obtaining a new function by coating ceramics on the surface of light metals such as aluminum or magnesium to combine the characteristics of aluminum and ceramics. The film is formed on the surface, and the film is locally destroyed by the supplied energy, and the precipitates around it solidify and ceramicize.As this process is repeated, the film is gradually grown and the complete ceramic film layer is formed at the end of electrolysis. It is formed.

The ceramic layer 20b by the ceramic film described above has an insulating property, so that the metal layer 20a of the metal housing 20 is insulated by the ceramic layer 20b and is not energized even when the conductor contacts.

When the metal housing 20 is made of magnesium (MgO), the ceramic layer (20b) is composed of a magnesium oxide (MgO) layer transitioned to ceramic by plasma electrolytic oxidation of magnesium (Mg), When one metal housing 20 is made of aluminum (Al), the ceramic layer 20b described above is composed of an aluminum oxide (Al ₂ O ₃ ) layer transferred to ceramic by plasma electrolytic oxidation of aluminum (Al). Can be.

In addition, the reflective surface 30 may be formed on the upper side of the base 22 described above, and the lens mounting portion 32 may be formed on the periphery of the reflective surface 30.

The above-described reflective surface 30 guides the light emitted from the LED chip 100, and may be formed in the upper and lower narrow upper light narrowing shapes, and thus the LED chip 100 on the base 22. After the mounting, the light emitted from the LED chip 100 may be diffusely reflected in all directions.

The configuration of the plurality of lead frames 40 described above will be described in more detail with reference to FIGS. 3 and 4.

3 and 4, the lead frame 40 is multiplely bent to form a lead base 42 and a lead plate 46, and the above-described lead base 42 and lead plate 46 are connected and bent. It can be connected by means 44.

In addition, a through hole 45 may be further formed on one side of the above-described connection bent portion 44, and an end bent portion 48 may be further formed on the other side of the above-described lead base 42.

The lead frame 40 described above may be inserted into and installed in the plurality of installation holes 24 described above, as shown in FIGS. 1 and 4, where the lead base 42 is at the same level as the surface of the base 22. The lead plate 46 may be disposed to protrude to the outside of the metal housing 20.

In this case, the above-described lead plate 46 may pass through the opening 28 formed in one side of the metal housing 20, whereby the bottom surface of the metal housing 20 and the bottom surface of the lead plate 46 are disposed at the same level. May be

In addition, the above-described lead plate 46 may be bonded after being mounted on a printed circuit board. In particular, the bottom surface of the metal housing 20 may directly contact the printed circuit board.

The bonding member described above may be, for example, a bonding by a brazing bonding method.

That is, the above-described joining member may be formed by melting the molten metal member 50 having a melting point of 400 ° C. or less without melting the metal housing 20 and the lead frame 40 as the base materials.

In the molten metal member 50 described above, an insertion hole 52 is formed in the center as shown in FIG. 3, and the lead base 42 of the lead frame 40 described above is fitted into the insertion hole 52. At this time, it can be coupled in the form to be mounted on the above-described connection bent portion 44 or the end bent portion (48).

In addition, the above-described molten metal member 50 may be seated on the sheet 26 of the metal housing 20 described above.

For example, the molten metal member 50 may include lead, tin alloy, or the like.

Therefore, in the embodiment of the present invention can be bonded at a relatively low temperature of 400 ℃ without applying a high temperature of more than 1000 ℃ to melt the glass or the like as in the conventional example is equipped with equipment for realizing a high temperature of 1000 ℃ This can simplify the manufacturing process and save time and money.

Accordingly, as shown in FIGS. 1 and 4, the LED chip 100 is bonded to the base 22 in a state in which the metal housing 20 and the lead frame 40 are integrally formed, and the plurality of lead frames 40 are attached. When the silver is applied to the LED chip 100 and the wire bonding 102 is applied through the lead frame 40, the electricity is supplied to the LED chip 100.

In addition, the above-described metal housing 20 is a ceramic layer 20a is formed on the surface of the metal housing 20, even if the direct contact with the lead frame 40 is not through the electricity.

On the other hand, in the above-described first embodiment of the present invention, the metal housing 20 is insulated, but the lead frame 40 may be insulated, which will be described with reference to FIGS. 5 and 6. .

5 is a diagram illustrating a light emitting diode package according to a second embodiment of the present invention, in which a housing and a lead frame are separated from each other. FIG. 6 is a view illustrating a light emitting diode package according to a second embodiment of the present invention. An exemplary cross-sectional view for explaining a package for a light emitting diode.

5 and 6, in the package 10 according to the second embodiment of the present invention, a plurality of mounting holes 24 are formed in the metal housing 20, and a plurality of lead frames are formed in the mounting holes 24. 40 is installed, and the lead frame 40 may be insulated.

In this case, the insulation treatment in the second embodiment of the present invention is the same as that of forming the ceramic layer 20b described in the first embodiment of the present invention.

After the ceramic layer is formed on the surface of the lead frame 40 as described above, as shown in FIGS. 5 and 6, portions of the lead base 42 and the lead plate 46 are respectively removed from the first, Second ceramic layer removal parts 42a and 46a may be formed.

That is, as shown in FIG. 6, even when the lead frame 40 is bonded to the metal housing 20, the metal housing 20 and the lead frame 40 do not conduct electricity.

In addition, the first ceramic layer removing portion 42a formed in the lead base 42 may be an LED chip 100 and a wire bonding 102, and the second ceramic layer removing portion 42a formed in the lead plate 46 may be formed. ) May be supplied to the pattern 130 of the substrate 120 or the printed circuit board.

Therefore, the package 10 for a light emitting diode according to the second embodiment of the present invention can be quickly bonded by a more simplified procedure in joining the metal housing 20 and the lead frame 40 as compared with the conventional technology. It becomes possible.

In addition, by forming an insulating layer on the surface of the lead frame 40, the surface area of the lead frame 40 is relatively smaller than that of the metal housing 20, thereby reducing the cost and time for forming the insulating layer.

On the other hand, the above-described bonding member may bond the metal housing 20 and the lead frame 40 by resin, which will be described with reference to FIGS. 7 to 9.

7 is a partial cross-sectional view illustrating a light emitting diode package according to a third embodiment of the present invention, and FIG. 8 is a view illustrating a light emitting diode package according to a third embodiment of the present invention. FIG. 9 is a view illustrating the housing and the lead frame separated from each other, and the accompanying drawings. FIG. 9 is an exemplary cross-sectional view illustrating a light emitting diode package according to a third embodiment of the present invention.

As shown in FIG. 7 and FIG. 9, the resin housing 60 is injected into the installation hole 24 and the sheet 26 in the state where the metal housing 20 and the lead frame 40 are assembled, and the metal housing 20 is cured. And the lead frame 40 are integrated.

In particular, as shown in FIG. 8, it can be seen that in the package 10 according to the third embodiment of the present invention, the molten metal member 50 is excluded in the first and second embodiments.

The resin 60 described above may be non-conductive and curable, and the resin 60 may be injected into the plurality of installation holes 24 or the sheet 26 automatically in a liquid state by a factory automation process. .

On the other hand, the above-described resin 60 may be injected by hand using an injection syringe or an injection gun.

On the other hand, the metal housing 20 and the lead frame 40 described above may be integrally formed by an insert injection machine for injecting the resin 60 into the mold after it is put into the mold.

In addition, the above-described resin 60 may be distributed through the through-hole 45 formed in the lead frame 40, wherein the resin 60 further comprises the above-described metal housing 20 and the above-described lead frame 40. It can be closely bonded.

Therefore, the package 10 for a light emitting diode according to the third embodiment of the present invention does not have to implement a high temperature of 1000 ℃ compared to the prior art it is possible to reduce the process and time and cost accordingly, in particular the resin (60) ) Can be automatically injected by factory automation, which enables automation of the manufacturing process.

In the light emitting diode package 10 according to the first, second, and third embodiments of the present invention configured as described above, the metal housing 20 and the lead frame 40 are joined to each other. The package 10 may be post-processed to be suitable for the finished product or machine and such application will be described with reference to the accompanying drawings.

In addition, the LED chip 100 may be die-bonded 102 and fixed to the upper surface of the base 22 in a later process.

10 to 12 are exemplary views for explaining an application example of the package 10 for a light emitting diode according to the first, second, and third embodiment of the present invention.

Although light emitted from the LED chip 100 may be used directly, the lens 110 may be further disposed as shown in FIG. 10 to obtain the effect of illumination.

The above-described lens 110 may be to scatter or filter the light emitted from the LED chip 100, or may be scattered by refracting the irradiation direction of the light.

In addition, when the package 10 is installed on the substrate 120, the bottom surface of the metal housing 20 may directly contact the substrate 120, and when the LED chip 100 emits heat to generate heat, the heat may be removed from the metal housing ( 20 may be directly heated to the substrate 120.

That is, the heat generated from the LED chip 100 is transferred by the metal housing 20 of the metal material, so that the heat is radiated more quickly, thereby preventing the LED chip 100 from abnormally shortening its lifespan.

As shown in FIG. 11, a plurality of LED chips 100 may be disposed in a single metal housing 20.

In particular, since the metal housing 20 has excellent heat dissipation performance as a metal material, it is possible to effectively dissipate heat generated even when a plurality of LED chips 100 are arranged, thereby converging a larger number of LED chips 100. will be.

In addition, as described above, by arranging the plurality of LED chips 100 in a single metal housing 20, more bright and high brightness light can be realized. For example, the LED chip 100 can be used as a light source in a display device such as an LCD. .

As shown in FIG. 12, the packages 10 may be arranged in a row on a single substrate 120.

Therefore, it is possible to shine brighter light in a wider range, for example can be used in lighting equipment such as street lights.

That is, by arranging the LED assembly to which the several packages 10 are applied, the brightness of the light and the area of the light can be widened, and this application example can be applied to various lighting devices such as street lamps, traffic lights, lighting lamps, and the like.

On the other hand, although not specifically shown, the package 10 may be installed on a circuit board made of metal, and may also be combined with a heat sink, in which case the effect of heat radiation may be further maximized.

On the other hand, the package 10 according to the first, second and third embodiments of the present invention is not too large or small in size, so that the production process can be automated by the factory automation facility, thereby improving productivity. .

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains can understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. will be.

Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is represented by the following detailed description, and the meaning and scope of the claims and All changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

The light emitting diode package according to the first, second, and third embodiments of the present invention may be used to illuminate and be installed in electrical and electronic products, lighting equipment, industrial machinery, etc., in which LEDs are used.

1 is a partial cross-sectional view illustrating a light emitting diode package according to a first embodiment of the present invention.

FIG. 2 is a detailed view of portion “A” of FIG. 1.

FIG. 3 is an exemplary view illustrating a light emitting diode package according to a first embodiment of the present invention, in which the housing and the lead frame are separated.

4 is an exemplary cross-sectional view illustrating a light emitting diode package according to a first embodiment of the present invention.

FIG. 5 is a diagram illustrating a light emitting diode package according to a second embodiment of the present invention, in which a housing and a lead frame are separated.

6 is an exemplary cross-sectional view illustrating a light emitting diode package according to a second embodiment of the present invention.

7 is a partial cross-sectional view illustrating a light emitting diode package according to a third embodiment of the present invention.

FIG. 8 is an exemplary view illustrating a package for a light emitting diode according to a third embodiment of the present invention, in which the housing and the lead frame are separated.

9 is an exemplary cross-sectional view illustrating a light emitting diode package according to a third embodiment of the present invention.

10 to 12 are exemplary views for explaining an application example of a light emitting diode package according to the first, second, and third embodiment of the present invention.

(Explanation of symbols for the main parts of the drawing)

10: Package

20: metal housing 20a: metal layer

20b: ceramic layer 22: base

24: mounting hole 26: sheet

28: opening

30: reflecting surface 32: lens mounting portion

40, 40a: lead frame 42: lead base

44: connection bent portion 45: through hole

46: lead plate 48: end bent portion

42a and 46a: first and second ceramic layer removing portions

50: molten metal member 60: resin

100: LED chip 102: wire bonding

110: lens 120: substrate

130: pattern

Claims (7)

A metal housing 20 having an LED chip 100 installed therein and guiding the light emitted from the LED chip 100 to the outside; A lead frame 40 having one side disposed inside the metal housing 20 to be electrically connected to the LED chip 100 and the other side disposed outside the metal housing 20; And It includes a joining member for bonding the metal housing 20 and the lead frame 40, The ceramic layer 20b is formed on the surface of any one of the metal housing 20 and the lead frame 40 so that the contact portion between the metal housing 20 and the lead frame 40 is insulated. Package for light emitting diodes. According to claim 1, The joining member, The molten metal member 50 is disposed between the metal housing 20 and the lead frame 40 and then melted and cured to bond the metal housing 20 and the lead frame 40 to each other. Package for light emitting diodes. The method of claim 1, The joining member, And a resin (60) which is cured after being injected into the metal housing (20) and the lead frame (40) to bond the metal housing (20) to the lead frame (40). The method of claim 3, On one side of the lead frame 40, a package for a light emitting diode, characterized in that the through hole (45) is formed so that the molten resin (60) flows between the metal housing (20) and the lead frame (40). The method of claim 1, The ceramic layer is formed on the surface of the lead frame 40, A first ceramic layer removing portion 42a is formed on one side of the lead base 42 so that a portion of the ceramic layer is removed to be electrically connected to the LED chip 100. The package for light emitting diodes, characterized in that the second ceramic layer removing portion (46a) is formed on one side of the lead plate 46 to be electrically connected to the pattern 130 formed on the substrate (120). The method according to any one of claims 1 to 5, The ceramic layer is a package for light emitting diodes, characterized in that the magnesium oxide (MgO) layer or aluminum oxide (Al ₂ O ₃ ) layer. The method of claim 6, The ceramic layer, Package for light emitting diodes, characterized in that formed by plasma electrolytic oxidation (Plasma Electrolytic Oxidation).

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