JP2006100196A - Lighting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting device capable of reflecting light efficiently and capable of radiating excellently the heat emitted by a light-emitting diode. <P>SOLUTION: The lighting device comprises a light-emitting diode 1 composed of a light emitting element 13 and a package 11 of housing a terminal 14 for connecting to this light emitting element 13 and a hard substrate 2 which has a base member 21 made of metal, an insulating layer 22 formed on the side of installing the light-emitting diode 1 of this base member 21, and a pad 23 that is formed on this insulating layer 22 and connected electrically to the terminal 14. An aperture 32 for transmitting light from the light-emitting diode 1 is provided on the side of installing the light-emitting diode 1 of the hard substrate 2 and a heat radiating member 3 which reflects the light to the opposite side to the hard substrate 2 side and radiates the heat of the light-emitting diode 1 is provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an illuminating device, and more particularly to an illuminating device that favorably dissipates heat generated by the light emitting diode.

In the conventional lighting device, the terminal of the package connected to the light emitting element is electrically connected to the pad of the substrate (for example, see Patent Document 1).
JP-A-9-270537 (FIG. 2)

  When a conventional lighting device is used to illuminate a liquid crystal display element or the like through a light guide made of a light-transmitting synthetic resin, the light entering the light guide may leak to the lighting device side. . In this case, in the conventional illuminating device, it is difficult to reflect light to the light guide again, and the luminance for illuminating the liquid crystal display element is reduced.

  In recent years, light emitting diodes have been applied to backlight devices for liquid crystal display panels, for example. A light emitting diode used in such a backlight device needs to pass a large amount of current in order to obtain a light amount. However, a light emitting diode generates a large amount of heat when flowing a large amount of current, and emits light by heat generated by itself. There is a possibility that problems such as deterioration of the element may occur. For this reason, it is conceivable to increase the number of light emitting diodes in order to improve the amount of light, but this leads to an increase in cost.

  Therefore, the present invention has been made in view of this point, and the main purpose thereof is an illuminating device that can efficiently reflect light and can efficiently dissipate heat generated by a light emitting diode. Is to provide.

  In order to achieve the above object, the present invention provides a light emitting diode comprising a package that houses a light emitting element and a terminal connected to the light emitting element, a metal base member, and a side of the base member on which the light emitting diode is provided. In a lighting device comprising a hard substrate having an insulating layer to be formed and a pad formed on the insulating layer and electrically connected to the terminal, the light emission is provided on a side of the hard substrate on which the light emitting diode is provided. An opening for transmitting light from the diode is provided, and a heat dissipating member for reflecting the light to the side opposite to the hard substrate side and dissipating the heat of the light emitting diode is provided.

  In addition, a light emitting diode including a package that houses a light emitting element and a terminal connected to the light emitting element, a flexible insulating base, and a terminal formed on the insulating base and electrically connected to the terminal In a lighting device comprising a flexible substrate having a pad and a metal reinforcing member provided behind the flexible substrate, the light emitting diode is provided on a side of the flexible substrate on which the light emitting diode is provided. An opening for transmitting light from the light source is provided, and a heat dissipating member for reflecting light to the side opposite to the flexible substrate side and dissipating heat of the light emitting diode is provided.

  Further, a positioning part for determining the mutual position of the heat dissipation member and the hard substrate is provided on the heat dissipation member and the hard substrate.

  Further, a positioning portion that determines the mutual position of the heat dissipation member and the flexible substrate is provided on the heat dissipation member and the flexible substrate.

  Further, the heat radiating member is provided with a recess for housing the light emitting diode.

  In addition, a light guide that guides light of the light emitting diode is provided, and the heat radiating member is disposed in contact with the light guide.

  As described above, according to the present invention, it is possible to provide an illuminating device that can achieve the initial purpose, can reflect light efficiently, and can efficiently dissipate heat generated by the light emitting diode. Can do.

  The lighting device of the present invention includes a light emitting diode 1 including a package 11 that houses a light emitting element 13 and a terminal 14 connected to the light emitting element 13, a metal base member 21, and the light emitting diode 1 of the base member 21. In a lighting device comprising a hard substrate 2 having an insulating layer 22 formed on the side where the electrode is provided and a pad 23 formed on the insulating layer 22 and electrically connected to the terminal 14, a light emitting diode of the hard substrate 2 1 is provided with an opening 32 that transmits light from the light emitting diode 1, and a heat radiating member 3 that reflects light to the side opposite to the hard substrate 2 side and dissipates heat from the light emitting diode 1. is there. With such a configuration, it is possible to provide an illuminating device that can efficiently reflect light and can radiate heat generated by a light emitting diode.

  Further, the light emitting diode 1 including the package 11 that houses the light emitting element 13 and the terminal 14 connected to the light emitting element 13, a flexible insulating base 71, and terminals formed on the insulating base 71. 14 is a lighting device including a flexible substrate 7 having a pad 72 electrically connected to the substrate 14 and a metal reinforcing member 74 provided behind the flexible substrate 7. An opening 32 that transmits light from the light emitting diode 1 is provided on the side where the light emitting diode 1 is provided, and a heat dissipating member 3 that reflects light to the side opposite to the flexible substrate 7 side and dissipates heat from the light emitting diode 1 is provided. It is provided. With such a configuration, it is possible to provide an illuminating device that can efficiently reflect light and can radiate heat generated by a light emitting diode.

  Further, positioning portions 25 and 34 for determining the mutual positions of the heat dissipation member 3 and the hard substrate 2 are provided on the heat dissipation member 3 and the hard substrate 2. With such a configuration, it is possible to provide an illuminating device that can efficiently reflect light and can radiate heat generated by a light emitting diode.

  Further, a positioning portion that determines the mutual position of the heat dissipation member 3 and the flexible substrate 7 is provided on the heat dissipation member 3 and the flexible substrate 7. With such a configuration, it is possible to provide an illuminating device that can efficiently reflect light and can radiate heat generated by a light emitting diode.

  Further, the heat radiating member 3 is provided with a recess 31 for housing the light emitting diode 1. With such a configuration, it is possible to provide an illuminating device that can efficiently reflect light and can radiate heat generated by a light emitting diode.

  Moreover, the light guide 4 which guides the light of the light emitting diode 1 is provided, and the heat radiating member 3 is arrange | positioned so that this light guide 4 may contact. With such a configuration, it is possible to provide an illuminating device that can efficiently reflect light and can radiate heat generated by a light emitting diode.

  The first embodiment of the present invention will be described below with reference to FIGS.

  The illuminating device according to the present embodiment transmits and illuminates a liquid crystal display element (not shown). The light emitting diode 1, the hard substrate 2 on which the light emitting diode 1 is mounted, and a heat dissipation member that covers a part of the light emitting diode 1 , A light guide 4 on which light from the light emitting diode 1 is incident, and a case 5 that houses the above components.

  The light emitting diode 1 includes a rectangular parallelepiped package 11 made of ceramic having good thermal conductivity. The package 11 includes a recess 12, and a light emitting element 13 is provided at the bottom of the recess 12. The package 11 includes a terminal 14 to which the light emitting element 13 is connected. A part of the terminal 14 is exposed on the back surface 15 of the package 11. Further, a translucent protective body 16 made of a translucent part such as an epoxy resin is provided in the recess 12 of the package 11.

  The hard substrate 2 is made of metal and made of aluminum in this embodiment, an insulating layer 22 formed on the side of the base member 21 where the light emitting diode 1 is provided, and a terminal 14 formed on the insulating layer 22. And a wiring pattern not shown, and a resist layer 24 formed on the insulating layer 22 so as to expose the pad 23 and cover the wiring pattern.

  The light emitting diode 1 is mounted on the hard substrate 2 by bonding the terminals 14 of the light emitting diode 1 to the pads 23 of the hard substrate 2 with solder 6.

  The cover 3 is made of metal in consideration of heat dissipation, and is made of aluminum in this embodiment. The cover 3 includes a recess 31 that accommodates the light emitting diode 1. The light emitting diode 1 is in contact with the cover 3 at the recess 31. The heat generated in the light emitting element 13 of the light emitting diode 1 is transmitted to the cover 3 through the package 11 and radiated. Further, since the light from the light emitting element 13 is emitted upward in the light emitting diode 1, an opening 32 made of a through hole is provided in the recess 31 of the cover 3 so as to transmit the light from the light emitting element 13. .

  Further, a reflection portion 33 is formed on the upper surface of the cover 3 (that is, the surface of the cover 3 opposite to the side on which the hard substrate 2 is provided). The reflection portion 33 is a reflection layer formed by aluminum vapor deposition, silver vapor deposition, or the like, and efficiently reflects light leaking from the light guide 4 to the light guide 4 side (that is, the side opposite to the hard substrate 2). To do. Since the cover 3 is made of metal, the reflection layer 33 may be formed by polishing the reflection portion 33 of the cover 3 to have a mirror surface without forming the reflection layer. By doing in this way, the cost for providing the said reflection layer can also be reduced.

  Further, as a positioning part for determining the mutual position of the hard substrate 2 and the cover 3, a hole 25 is provided in the hard substrate 2 and a protrusion 34 is provided in the cover 3. By inserting the protrusion 34 of the cover 3 into the hole 25, the positions of the hard substrate 2 and the cover 3 can be determined.

  The light guide 4 is made of a light-transmitting synthetic resin or the like. In this embodiment, as shown in FIG. 2, the cross-sectional shape is a wedge shape, and a light receiving portion that receives light from the light emitting diode 1. 41, an emission unit 42 that emits light to a liquid crystal display element (not shown), and a reflection unit 43 that reflects light that has entered the light receiving unit 41 to the emission unit 42. In addition, since the light receiving portion 41 of the light guide 4 is in contact with the reflecting portion 33 of the cover 3, light loss is reduced as compared with the case where a space is provided between the light receiving portion 41 and the reflecting portion 33. It can suppress and can reflect well.

  In this embodiment, the case 5 is made of metal such as aluminum in consideration of heat dissipation and light reflection, and houses the light emitting diode 1, the hard substrate 2, the cover 3, and the light guide 4.

  Next, the manufacturing method of a present Example is demonstrated. First, the light emitting diode 1 is inserted into the recess 31 of the cover 3. Second, cream solder is formed on the pads 23 of the hard substrate 2 by screen printing or the like. Third, the protrusion 34 of the cover 3 is inserted into the hole 25 of the hard substrate 2 so that the terminal 14 of the light emitting diode 1 contacts the pad 23 to determine the position. Fourth, the cream solder is melted and the light emitting diode 1 is fixed to the hard substrate 2 by a reflow process. Thus, the light emitting diode 1 is mounted on the hard substrate 2.

  With this configuration, an illumination device that can efficiently reflect light by the reflecting portion 33 and can efficiently radiate heat by transmitting heat generated by the light-emitting diode 1 to the cover 3. Can be provided.

  Further, in this embodiment, the cover 3 is provided with the concave portion 31 for storing the upper side of the light emitting diode 1, so that the position of the light emitting diode 1 can be determined by the cover 3, and the light emitting diode 1 is moved during reflow or the like. Therefore, the mounting position accuracy of the light emitting diode 1 can be improved.

  Further, in the present embodiment, the opening 32 is provided in the recess 31, but the present invention is not limited to this embodiment, and as in the modification of the first embodiment shown in FIG. The opening 35 may not be provided in the recess 31 of the first embodiment, but may be formed so as to match the side surface 17 of the package 11 of the light emitting diode 1. In this modification, a space 8 is provided between the light emitting diode 1 and the light guide 4, but the light emitting diode 1 and the light guide 4 are brought into contact with each other so that the space 8 is not provided. It may be.

  Next, a second embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the same and equivalent part as the said 1st Example, The detailed description is abbreviate | omitted.

  The difference from the first embodiment of the illuminating device of this embodiment is that a flexible substrate 7 is employed instead of the hard substrate 2 of the first embodiment as a circuit board.

  The flexible substrate 7 includes a flexible insulating base 71 such as polyimide, a pad 72 formed on the insulating base 71 and electrically connected to the terminal 14, a wiring pattern (not shown), and a pad. 72 and a cover film 73 having flexibility such as polyimide formed on an insulating base 71 so as to cover the wiring pattern. In addition, behind the flexible substrate 7, a plate-like reinforcing member 74 made of a metal such as aluminum is provided. The flexible substrate 7 is fixed to the reinforcing member 74 with an adhesive.

  The light emitting diode 1 is mounted on the flexible substrate 7 by bonding the terminal 14 of the light emitting diode 1 to the pad 72 of the flexible substrate 7 with the solder 3.

  Further, although not shown as a positioning portion for determining the mutual position between the cover 3 and the flexible substrate 7, the protrusion 34 is formed on the cover 3 as in the first embodiment, and the flexible substrate 7 is formed on the flexible substrate 7. A through hole is also provided in the reinforcing member 74. The positions of the cover 3 and the flexible substrate 7 can be determined by inserting the protrusions 34 of the cover 3 into the holes of the flexible substrate 7 and the holes of the reinforcing member 74.

  Next, the manufacturing method of a present Example is demonstrated. First, the light emitting diode 1 is inserted into the recess 31 of the cover 3. Second, cream solder is formed on the pads 72 of the flexible substrate 7 by screen printing or the like. Third, the protrusion 34 of the cover 3 is inserted into the hole of the flexible substrate 7 and the hole of the reinforcing member 74 so that the terminal 14 of the light emitting diode 1 contacts the pad 72. Decide. Fourth, the cream solder is melted and the light emitting diode 1 is fixed to the flexible substrate 7 by a reflow process. Thus, the light emitting diode 1 is mounted on the flexible substrate 7.

  With this configuration, even if the circuit board is changed to the hard board 2 and the flexible board 7 having flexibility is used, the same operational effects as those of the first embodiment can be obtained.

Sectional drawing of 1st Example of this invention. Sectional drawing of the AA line in FIG. The principal part expanded sectional view of the Example. The principal part expanded sectional view of the modification of 1st Example of the same invention. The principal part expanded sectional view of 2nd Example of this invention.

Explanation of symbols

1 Light Emitting Diode 2 Hard Substrate 3 Cover (Heat Dissipation Member)
4 Light guide 7 Flexible substrate 11 Package 12 Recess 13 Light emitting element 14 Terminal 21 Base member 22 Insulating layer 23 Pad 25 Hole (positioning part)
31 Concave portion 32, 35 Opening 33 Reflecting portion 34 Protruding portion (positioning portion)
71 Insulating base material 72 Pad 74 Reinforcing member

Claims (6)

A light emitting diode comprising a package for housing a light emitting element and a terminal connected to the light emitting element, a metal base member, an insulating layer formed on the side of the base member on which the light emitting diode is provided, and the insulating layer An illumination device comprising a hard substrate having a pad formed thereon and having a pad electrically connected to the terminal, wherein an opening for transmitting light from the light emitting diode is provided on the side of the hard substrate on which the light emitting diode is provided. An illuminating device comprising a heat dissipating member that reflects light to the side opposite to the hard substrate side and dissipates heat of the light emitting diode. A light emitting diode comprising a package for housing a light emitting element and a terminal connected to the light emitting element; a flexible insulating base; and a pad formed on the insulating base and electrically connected to the terminal In a lighting apparatus comprising a flexible substrate having a metal substrate and a metal reinforcing member provided behind the flexible substrate, the light emitting diode is provided on the side of the flexible substrate on which the light emitting diode is provided. An illuminating device comprising: an opening that transmits light; and a heat dissipating member that reflects light on a side opposite to the flexible substrate side and dissipates heat of the light emitting diode. The lighting device according to claim 1, wherein a positioning portion for determining a mutual position between the heat dissipation member and the hard substrate is provided in the heat dissipation member and the hard substrate. The lighting device according to claim 2, wherein a positioning portion that determines a mutual position of the heat dissipation member and the flexible substrate is provided on the heat dissipation member and the flexible substrate. The lighting device according to claim 1, wherein the heat radiating member is provided with a recess for housing the light emitting diode. The lighting device according to claim 1, further comprising: a light guide that guides light of the light emitting diode, wherein the heat radiating member is in contact with the light guide.

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