JP2012069487A - Lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting fixture capable of preventing mutual thermal deterioration of an LED package and an electronic component and preventing formation of shadows.SOLUTION: The lighting fixture 10 is provided with a mounting board 13, an LED package 12 and an electronic component 15 arranged on the same surface side of the mounting board 13, and a cover part 16 having a housing face part 27 on which the LED package 12 is housed, a reflection face part, and a connection part 30 to be connected to an opening edge 28 of the reflection face part. The electronic component 15 is arranged in a space surrounded by the housing face part 27 and the connection part 30.

Description

  The present invention relates to a luminaire applied to a downlight or the like that is installed in a buried hole in a ceiling surface.

  Conventionally, there has been known a lighting fixture in which an LED package, an electronic component such as a lighting circuit component, and a connector are arranged on a component mounting surface of a substrate (for example, see Patent Document 1).

JP 2009-218192 A (FIG. 1, claim 1)

The lighting fixture described in Patent Document 1 described above can improve the light distribution by the LED package mounted on the component mounting surface of the substrate.
However, in the lighting apparatus described in Patent Document 1 described above, when the LED package and the electronic component are covered with a cover portion serving as a reflecting mirror, the LED package and the electronic component are close to each other in a single space, so that each other is heated. to degrade. In particular, the electrolytic capacitor, which is a lighting circuit component, has low heat resistance, and the LED element included in the LED package is also markedly accelerated in deterioration and reduced in efficiency as the temperature rises.

By the way, as shown in FIG. 12, the LED package 102 is mounted on the central portion of the substrate 101 and the electronic circuit such as the lighting circuit component is mounted on the peripheral portion of the LED package 102, as in the lighting apparatus described in Patent Document 1 described above. A lighting fixture 100 on which a component 103 is mounted has been proposed.
In such a conventional lighting device 100, the entire substrate 101 is covered with a cover 104 such as milky white, so that the LED package 102 and the electronic component 103 are not directly viewed from the floor by the cover 104.

  However, in such a conventional lighting apparatus 100, since the LED package 102 and the electronic component 103 are arranged in the same space, the shadow of the electronic component 103 is caused by the light component from the LED package 102 on the cover 104. Projected.

  The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a lighting apparatus that can prevent mutual heat deterioration of an LED package and an electronic component and can prevent shadows.

  The luminaire according to the present invention includes a mounting substrate, an LED package and an electronic component arranged on the same surface side of the mounting substrate, an accommodation surface portion in which the LED package is accommodated, a reflection surface portion, and an opening edge of the reflection surface portion. A cover portion having a continuous connection portion, and the electronic component is disposed in a space surrounded by the accommodation surface portion and the connection portion.

  In the lighting fixture according to the present invention, a surface facing the LED package among the accommodation surface portion is a reflection surface.

  According to the lighting fixture of the present invention, there is an effect that the LED package and the electronic component can be prevented from being thermally deteriorated and shadows can be prevented.

The partially broken side view of the lighting fixture of one Embodiment which concerns on this invention Top view of the lighting fixture of FIG. The disassembled perspective view of the cover part and mounting board of the lighting fixture of FIG. Bottom view of FIG. 1 is a vertical cross-sectional view of the main part of the lighting apparatus of FIG. The bottom view of the cover part and mounting board of the modification of the lighting fixture of FIG. FIG. 6 is a vertical sectional view of the main part of the lighting apparatus of FIG. The disassembled perspective view of the cover part and mounting board | substrate of the other modification of the lighting fixture of FIG. FIG. 8 is a vertical sectional view of the main part of the lighting apparatus of FIG. The principal part vertical sectional view of the other modification of the lighting fixture of FIG. FIG. 10 is an external perspective view of the lens of the lighting apparatus of FIG. Cross-sectional view of a conventional lighting fixture

Hereinafter, a lighting apparatus according to an embodiment of the present invention will be described with reference to the drawings.
As shown in FIGS. 1 and 2, a lighting fixture 10 according to an embodiment of the present invention includes a fixture main body 11 that is a cylindrical casing, a plurality of LED packages 12 mounted on a mounting board 13, and heat dissipation insulation. The embedded hole in the ceiling surface 1 includes a sheet 14, a plurality of electronic components 15 mounted on the mounting substrate 13 around the plurality of LED packages 12, a cover portion 16, and a lens 17 attached to the cover portion 16. 2 is a downlight that is embedded in 2 and installed.

  The instrument body 11 is formed in a cylindrical shape by press-molding a metal plate member or molding it using a hard resin material. The instrument main body 11 has a partition plate 18 arranged in the center of the inside, and a power supply unit 19 is attached on the partition plate 18. A top plate 20 is attached to the upper end of the instrument body 11, and a power terminal block 21 is attached to the top board 20 outside the instrument body 11. The power supply terminal block 21 is electrically connected to the power supply unit 19 while being electrically connected to an external power supply circuit. The power supply unit 19 is electrically connected to a printed circuit (not shown) on the mounting board 13 through an instrument wiring (not shown).

  The instrument body 11 has a plurality of attachment springs 22 attached around the lower side, and has a flange 23 at the lower end. The attachment spring 22 is elastically deformed along the instrument body 11 when the instrument body 11 is inserted into the embedded hole 2 from below, and the outer diameter of each of the attachment springs 22 is increased after the instrument body 11 is inserted into the embedded hole 2. The instrument body 11 is held in the embedded hole 2 by being elastically restored. The flange 23 positions the instrument body 11 on the ceiling surface 1 by contacting the ceiling surface 1 when the instrument body 11 is inserted into the embedded hole 2.

  As shown in FIGS. 3 and 4, the cover portion 16 is formed in a bottomed cylindrical shape and is assembled to cover the disc-shaped mounting substrate 13. The cover 16 has a bottom plate 24, a peripheral plate 25, and an opening 26 at the upper end. The bottom plate 24 includes an accommodation surface portion 27 disposed at the center, a hole-like opening edge 28 for attaching the lens 17 attached to the accommodation surface portion 27, an outer plate portion 29 disposed outside the accommodation surface portion 27, and accommodation. A step portion is formed between the surface portion 27 and the outer plate portion 29 and is connected to the opening edge 28, and has a connecting portion 30 for disposing the receiving surface portion 27 above the outer plate portion 29.

  The mounting substrate 13 is made of paper phenol or glass epoxy, and a plurality of LED packages 12 are mounted on the central portion of the mounting surface 31 on the cover portion 16 side. The plurality of LED packages 12 are arranged corresponding to the lenses 17 attached to the cover portion 16. Around the LED package 12 on the mounting surface 31 of the mounting substrate 13, a smoothing capacitor (electrolytic capacitor) 32, a diode bridge 33, an inrush current protection capacitor 34, an inrush current protection choke 35, a rectifying capacitor 36, An electronic component 15 that is a chopper IC 37, a resistor 38, a resistor 39, and a lightning surge countermeasure diode 40 is mounted.

As shown in FIG. 5, the heat radiation insulating sheet 14 is thermally connected and attached to the upper surface which is the back surface of the mounting substrate 13 and the lower surface of the partition plate 18 of the instrument body 11.
The cover portion 16 has a lens 17 attached to an opening edge 28 of the accommodation surface portion 27. The lens 17 is made of transparent polycarbonate and is formed in a hemispherical shape, and accommodates the LED package 12 at the top of the upper end. Usually, the height of the LED package 12 is about several mm, but the electronic component 15 is often large. In particular, the smoothing capacitor 32 has a height dimension exceeding 20 mm.

In the cover portion 16, the LED package 12 is accommodated in the accommodation surface portion 27. The electronic component 15 is disposed in a space 41 surrounded by the accommodation surface portion 27 and the connecting portion 30. The accommodation surface portion 27 has a reflection surface 42 on the surface facing the LED package 12.
Accordingly, the LED package 12 and the electronic component 15 are separated from each other by disposing the electronic component 15 in the space 41 surrounded by the receiving surface portion 27 and the connecting portion 30 in the cover portion 16. 12 and the electronic component 15 can be prevented from being thermally deteriorated.

Moreover, since the light component from the LED package 12 is not directly irradiated to the electronic component 15, a shadow can be prevented.
And since the surface which faces the LED package 12 among the accommodation surface parts 27 is the reflective surface 42, since the reflective surface 42 can be installed in the instrument main body 11 only by mounting | wearing with the cover part 16, assembly property can be improved. .

  Generally, in the lighting fixture, both the LED package and the electronic component generate heat. The proportion of the heat generation is 10 to 20% for electronic components and 90 to 80% for LED packages. Therefore, it is possible to prevent the electronic component 15 from being exposed to high heat by the heat of the LED package 12 by spatially blocking the LED package 12 and the electronic component 15.

  Therefore, the heat generated when the LED package 12 emits light is transmitted from the mounting substrate 13 to the heat dissipation insulating sheet 14 to which the mounting substrate 13 is thermally connected, and the heat dissipation insulating sheet 14 is thermally transferred from the heat dissipation insulating sheet 14. Since the heat is transmitted from the device body 11 to the connected device body 11 and radiated from the device body 11, the electronic component 15 is not exposed to high heat by the heat of the LED package 12, and can be radiated efficiently.

  The lens 17 is for controlling the light distribution of the LED package 12 and generally has a height of about 10 mm. The lens 17 is required to have a minimum height dimension because the inner light attenuation increases and the efficiency decreases as the height dimension increases. The lens 17 is designed with a minimum size because the light is attenuated if the internal optical path is longer than necessary. Since the height of the light exit surface of the lens 17 is a minimum size, it is better to cause a difference from the electronic component 15.

  As shown in FIG. 6 and FIG. 7, in the lighting fixture 10 of this modification, in the cover portion 16, the reflecting plate 43 is connected to the opening edge 28 of the accommodation surface portion 27 so as to cover the LED package 12. The reflection plate 43 has a reflection surface portion 44, and the light distribution can be sufficiently controlled if the height dimension is about 10 mm. When the height dimension of the reflector 43 increases, attenuation when reflected is increased, and a minimum dimension is required. Thereby, the height of the light emitting surface of the reflecting plate 43 is generally about 10 mm, and the height dimension of the portion covering the electronic component 15 is set to 20 mm or more.

  The reflection plate 43 has less loss in the emitted light component when the reflection area is smaller. When the reflection plate 43 has a shallow depth dimension, secondary reflection and the like on the inside are reduced, and the efficiency is increased. In particular, since the LED package 12 has a low height dimension, the reflector 43 does not require a great depth for receiving light. Therefore, the reflection plate 43 is likely to have a difference in height between the opening and the electronic component 15.

In order to accommodate the electronic component 15 having a high height, the lighting fixture 10 of the present modified example has a large step on the outer plate 29 with respect to the accommodating surface portion 27, and the connecting portion 30 emits light from the LED package 12. It is arranged in a chamfered shape so as not to cause scuffing due to components.
Therefore, according to the lighting fixture 10 of this modification, even if the electronic component 15 having a high height is provided, the light can be distributed without causing the light component from the LED package 12 to be damaged.

  As shown in FIGS. 8 and 9, the lighting fixture 10 of the present modification has a heat radiation hole 45 for heat radiation in a part of the peripheral plate 25 of the cover portion 16. The heat radiation hole 45 is disposed near the smoothing capacitor 32 that is the electronic component 15 that generates a large amount of heat during energization.

In the lighting fixture 10 of this modification, the heat radiation hole 45 is disposed near the smoothing capacitor 32 that is the electronic component 15 that generates a large amount of heat during energization.
Therefore, according to the lighting fixture 10 of this modification, in addition to the heat radiation via the heat radiation insulating sheet 14, heat can be efficiently radiated from the heat radiation holes 45.

  As shown in FIGS. 10 and 11, the lighting fixture 10 of the present modification has a stepped lens mounting portion 47 at the opening edge 28 of the cover portion 16, and the lens 46 has a lens mounting portion at the lower edge. 47 has a collar portion 48 that is detachably attached to 47.

In the lighting fixture 10 of this modification, the lens 46 is detachably attached to the cover portion 16.
Therefore, according to the luminaire 10 of the present modified example, the lens 46 having different optical characteristics can be easily recombined in the manufacturing process. Can easily handle variations.

  As described above, according to the lighting apparatus 10 of the embodiment described above, the electronic component 15 is arranged in the space 41 surrounded by the housing surface portion 27 and the connecting portion 30 in the cover portion 16, so that the LED package 12 and the electronic device 15 are arranged. Since the component 15 is spaced apart, the thermal deterioration of the LED package 12 and the electronic component 15 can be prevented. Moreover, according to the lighting fixture 10 of one Embodiment, since the optical component from the LED package 12 is not irradiated to the electronic component 15, a shadow can be prevented.

  Moreover, according to the lighting fixture 10 of one Embodiment, since the surface which faces the LED package 12 among the accommodation surface parts 27 is the reflective surface 42, the reflective surface 42 can be installed only by mounting | wearing with the cover part 16. FIG. Therefore, assemblability can be improved.

  In the lighting fixture of the present invention, the fixture body, the LED package, the mounting substrate and the like are not limited to the above-described embodiments, and appropriate modifications and improvements can be made.

DESCRIPTION OF SYMBOLS 10 Lighting fixture 12 LED package 13 Mounting board 15 Electronic component 16 Cover part 27 Housing surface part 28 Opening edge 30 Connection part 41 Space 42 Reflecting surface 44 Reflecting surface part

Claims (2)

A mounting board;
An LED package and an electronic component disposed on the same side of the mounting substrate;
A cover surface having a housing surface portion in which the LED package is housed, a reflective surface portion, and a connecting portion connected to an opening edge of the reflective surface portion;
The said electronic component is a lighting fixture arrange | positioned in the space enclosed by the said storage surface part and the said connection part. The lighting fixture according to claim 1,
The lighting fixture whose surface which faces the said LED package among the said accommodating surface parts is a reflective surface.

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