JPH087645Y2 - 面実装用ｉｃパッケージ - Google Patents

面実装用ｉｃパッケージ

Info

Publication number
JPH087645Y2
JPH087645Y2 JP1989074014U JP7401489U JPH087645Y2 JP H087645 Y2 JPH087645 Y2 JP H087645Y2 JP 1989074014 U JP1989074014 U JP 1989074014U JP 7401489 U JP7401489 U JP 7401489U JP H087645 Y2 JPH087645 Y2 JP H087645Y2
Authority
JP
Japan
Prior art keywords
lead
bonding pad
large current
solder
small signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989074014U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0313753U (US06815460-20041109-C00097.png
Inventor
利之 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1989074014U priority Critical patent/JPH087645Y2/ja
Publication of JPH0313753U publication Critical patent/JPH0313753U/ja
Application granted granted Critical
Publication of JPH087645Y2 publication Critical patent/JPH087645Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1989074014U 1989-06-23 1989-06-23 面実装用ｉｃパッケージ Expired - Lifetime JPH087645Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989074014U JPH087645Y2 (ja) 1989-06-23 1989-06-23 面実装用ｉｃパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989074014U JPH087645Y2 (ja) 1989-06-23 1989-06-23 面実装用ｉｃパッケージ

Publications (2)

Publication Number Publication Date
JPH0313753U JPH0313753U (US06815460-20041109-C00097.png) 1991-02-12
JPH087645Y2 true JPH087645Y2 (ja) 1996-03-04

Family

ID=31613336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989074014U Expired - Lifetime JPH087645Y2 (ja) 1989-06-23 1989-06-23 面実装用ｉｃパッケージ

Country Status (1)

Country Link
JP (1) JPH087645Y2 (US06815460-20041109-C00097.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3003617B2 (ja) * 1997-03-14 2000-01-31 日本電気株式会社 樹脂封止型半導体パッケージ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161851A (ja) * 1983-03-07 1984-09-12 Hitachi Tokyo Electronics Co Ltd 電子部品
JPS6441140U (US06815460-20041109-C00097.png) * 1987-09-07 1989-03-13
JPH01133339A (ja) * 1987-11-18 1989-05-25 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPH0313753U (US06815460-20041109-C00097.png) 1991-02-12

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