JPH08757Y2 - 半導体装置の樹脂封止装置 - Google Patents

半導体装置の樹脂封止装置

Info

Publication number
JPH08757Y2
JPH08757Y2 JP1987120540U JP12054087U JPH08757Y2 JP H08757 Y2 JPH08757 Y2 JP H08757Y2 JP 1987120540 U JP1987120540 U JP 1987120540U JP 12054087 U JP12054087 U JP 12054087U JP H08757 Y2 JPH08757 Y2 JP H08757Y2
Authority
JP
Japan
Prior art keywords
block
heater block
mold clamping
heater
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987120540U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6424836U (enrdf_load_stackoverflow
Inventor
康次 堤
豊 森田
英明 末崎
弘道 山田
末吉 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1987120540U priority Critical patent/JPH08757Y2/ja
Publication of JPS6424836U publication Critical patent/JPS6424836U/ja
Application granted granted Critical
Publication of JPH08757Y2 publication Critical patent/JPH08757Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1987120540U 1987-08-05 1987-08-05 半導体装置の樹脂封止装置 Expired - Lifetime JPH08757Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987120540U JPH08757Y2 (ja) 1987-08-05 1987-08-05 半導体装置の樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987120540U JPH08757Y2 (ja) 1987-08-05 1987-08-05 半導体装置の樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS6424836U JPS6424836U (enrdf_load_stackoverflow) 1989-02-10
JPH08757Y2 true JPH08757Y2 (ja) 1996-01-10

Family

ID=31366740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987120540U Expired - Lifetime JPH08757Y2 (ja) 1987-08-05 1987-08-05 半導体装置の樹脂封止装置

Country Status (1)

Country Link
JP (1) JPH08757Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4969328B2 (ja) * 2007-06-13 2012-07-04 住友重機械工業株式会社 圧縮成形金型及び圧縮成形金型装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226827A (ja) * 1985-07-27 1987-02-04 Mitsubishi Electric Corp 半導体素子の樹脂封止方法及びその装置

Also Published As

Publication number Publication date
JPS6424836U (enrdf_load_stackoverflow) 1989-02-10

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